TWD229999S - Heat dissipation module - Google Patents

Heat dissipation module Download PDF

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Publication number
TWD229999S
TWD229999S TW112303108F TW112303108F TWD229999S TW D229999 S TWD229999 S TW D229999S TW 112303108 F TW112303108 F TW 112303108F TW 112303108 F TW112303108 F TW 112303108F TW D229999 S TWD229999 S TW D229999S
Authority
TW
Taiwan
Prior art keywords
heat dissipation
dissipation module
design
area
article
Prior art date
Application number
TW112303108F
Other languages
Chinese (zh)
Inventor
吳明政
李貽恆
Original Assignee
宏碁股份有限公司 新北市汐止區新台五路一段88號8樓 (中華民國)
宏碁股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 宏碁股份有限公司 新北市汐止區新台五路一段88號8樓 (中華民國), 宏碁股份有限公司 filed Critical 宏碁股份有限公司 新北市汐止區新台五路一段88號8樓 (中華民國)
Priority to TW112303108F priority Critical patent/TWD229999S/en
Priority to US29/921,695 priority patent/USD1096674S1/en
Publication of TWD229999S publication Critical patent/TWD229999S/en

Links

Abstract

【物品用途】;本設計物品是一種散熱模組，尤其是一種用於顯示卡散熱的散熱模組。;【設計說明】;圖式所揭露之虛線部分，為本案不主張設計之部分。;圖式中斜線陰影所在的區域表示該區域具有透光性。[Article Purpose];This design article is a heat dissipation module, in particular a heat dissipation module for display card heat dissipation. ;[Design Description];The dotted line part disclosed in the diagram is the part that this case does not claim to design. ;The area where the oblique line shadow is located in the diagram indicates that the area is light-transmissive.

Description

散熱模組Cooling module

本設計物品是一種散熱模組，尤其是一種用於顯示卡散熱的散熱模組。This design item is a heat dissipation module, especially a heat dissipation module used for graphics card heat dissipation.

圖式所揭露之虛線部分，為本案不主張設計之部分。The dotted line parts revealed in the diagram are the parts for which design is not advocated in this case.

圖式中斜線陰影所在的區域表示該區域具有透光性。The area shaded with diagonal lines in the diagram indicates that the area is light-transmissive.

TW112303108F 2023-06-20 2023-06-20 Heat dissipation module TWD229999S (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW112303108F TWD229999S (en) 2023-06-20 2023-06-20 Heat dissipation module
US29/921,695 USD1096674S1 (en) 2023-06-20 2023-12-19 Heat dissipation module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW112303108F TWD229999S (en) 2023-06-20 2023-06-20 Heat dissipation module

Publications (1)

Publication Number Publication Date
TWD229999S true TWD229999S (en) 2024-02-11

Family

ID=91333237

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112303108F TWD229999S (en) 2023-06-20 2023-06-20 Heat dissipation module

Country Status (2)

Country Link
US (1) USD1096674S1 (en)
TW (1) TWD229999S (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1096674S1 (en) * 2023-06-20 2025-10-07 Acer Incorporated Heat dissipation module

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD221432S (en) 2022-02-08 2022-10-01 宏碁股份有限公司 Heat dissipation module

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US5787971A (en) * 1996-03-25 1998-08-04 Dodson; Douglas A. Multiple fan cooling device
US6839233B2 (en) * 2003-01-02 2005-01-04 Dell Products L.P. Removable fan bay
US20120045325A1 (en) * 2010-08-18 2012-02-23 Alex Horng Fan Housing Module
USD673514S1 (en) * 2012-01-13 2013-01-01 Hon Hai Precision Industry Co., Ltd. Heat dissipation fan
USD681188S1 (en) * 2012-11-01 2013-04-30 Cooler Master Co., Ltd. Fan
USD681187S1 (en) * 2012-11-01 2013-04-30 Cooler Master Co., Ltd. Fan
USD681800S1 (en) * 2012-11-01 2013-05-07 Cooler Master Co., Ltd. Fan
TWD160896S (en) * 2013-10-09 2014-06-01 訊凱國際股份有限公司 Cooling fan (2)
CN111434930B (en) * 2019-01-11 2022-07-01 台达电子工业股份有限公司 Fan frame
USD977488S1 (en) * 2021-05-29 2023-02-07 Junbo Lin Heat sink
CN217129874U (en) * 2022-05-04 2022-08-05 微星科技股份有限公司 fan assembly
USD997109S1 (en) * 2022-10-31 2023-08-29 Dtg Neo Scientific Limited Graphics card GPU support cooler
TWD229037S (en) * 2023-04-14 2023-12-11 宏碁股份有限公司 Heat dissipation module
TWD229999S (en) * 2023-06-20 2024-02-11 宏碁股份有限公司 新北市汐止區新台五路一段88號8樓 (中華民國) Heat dissipation module
TWD229998S (en) * 2023-06-20 2024-02-11 宏碁股份有限公司 新北市汐止區新台五路一段88號8樓 (中華民國) Heat dissipation module
CN118482042A (en) * 2024-05-29 2024-08-13 北京市鑫全盛科技有限公司 Fan, serial structure of multiple fans and assembling method of fans

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD221432S (en) 2022-02-08 2022-10-01 宏碁股份有限公司 Heat dissipation module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1096674S1 (en) * 2023-06-20 2025-10-07 Acer Incorporated Heat dissipation module

Also Published As

Publication number Publication date
USD1096674S1 (en) 2025-10-07

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