TWD221432S - Heat dissipation module - Google Patents

Heat dissipation module Download PDF

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Publication number
TWD221432S
TWD221432S TW111300616F TW111300616F TWD221432S TW D221432 S TWD221432 S TW D221432S TW 111300616 F TW111300616 F TW 111300616F TW 111300616 F TW111300616 F TW 111300616F TW D221432 S TWD221432 S TW D221432S
Authority
TW
Taiwan
Prior art keywords
heat dissipation
dissipation module
item
design
cooling module
Prior art date
Application number
TW111300616F
Other languages
Chinese (zh)
Inventor
賴威佑
李貽恆
Original Assignee
宏碁股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 宏碁股份有限公司 filed Critical 宏碁股份有限公司
Priority to TW111300616F priority Critical patent/TWD221432S/en
Publication of TWD221432S publication Critical patent/TWD221432S/en

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Abstract

【物品用途】;本設計物品是一種散熱模組。;【設計說明】;圖式所揭露之虛線部分，為本案不主張設計之部分。[Use of item];This designed item is a cooling module. ;[Design Description];The dotted line portion disclosed in the drawing is the part of this case that does not require design.

Description

散熱模組Cooling module

本設計物品是一種散熱模組。This design item is a cooling module.

圖式所揭露之虛線部分，為本案不主張設計之部分。The dotted line part disclosed in the drawing is the part not claimed in this case.

TW111300616F 2022-02-08 2022-02-08 Heat dissipation module TWD221432S (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW111300616F TWD221432S (en) 2022-02-08 2022-02-08 Heat dissipation module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW111300616F TWD221432S (en) 2022-02-08 2022-02-08 Heat dissipation module

Publications (1)

Publication Number Publication Date
TWD221432S true TWD221432S (en) 2022-10-01

Family

ID=88924535

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111300616F TWD221432S (en) 2022-02-08 2022-02-08 Heat dissipation module

Country Status (1)

Country Link
TW (1) TWD221432S (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD229037S (en) 2023-04-14 2023-12-11 宏碁股份有限公司 Heat dissipation module
TWD229998S (en) 2023-06-20 2024-02-11 宏碁股份有限公司 Heat dissipation module

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD229037S (en) 2023-04-14 2023-12-11 宏碁股份有限公司 Heat dissipation module
TWD229998S (en) 2023-06-20 2024-02-11 宏碁股份有限公司 Heat dissipation module
TWD229999S (en) 2023-06-20 2024-02-11 宏碁股份有限公司 Heat dissipation module
TWD230746S (en) 2023-09-27 2024-04-01 宏碁股份有限公司 Heat dissipation module
TWD230745S (en) 2023-09-27 2024-04-01 宏碁股份有限公司 Heat dissipation module

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