TWD221432S - Heat dissipation module - Google Patents

Heat dissipation module Download PDF

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Publication number
TWD221432S
TWD221432S TW111300616F TW111300616F TWD221432S TW D221432 S TWD221432 S TW D221432S TW 111300616 F TW111300616 F TW 111300616F TW 111300616 F TW111300616 F TW 111300616F TW D221432 S TWD221432 S TW D221432S
Authority
TW
Taiwan
Prior art keywords
heat dissipation
dissipation module
item
design
cooling module
Prior art date
Application number
TW111300616F
Other languages
Chinese (zh)
Inventor
賴威佑
李貽恆
Original Assignee
宏碁股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 宏碁股份有限公司 filed Critical 宏碁股份有限公司
Priority to TW111300616F priority Critical patent/TWD221432S/en
Priority to US29/834,940 priority patent/USD1051864S1/en
Publication of TWD221432S publication Critical patent/TWD221432S/en

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Abstract

【物品用途】;本設計物品是一種散熱模組。;【設計說明】;圖式所揭露之虛線部分,為本案不主張設計之部分。[Use of item];This designed item is a cooling module. ;[Design Description];The dotted line portion disclosed in the drawing is the part of this case that does not require design.

Description

散熱模組Cooling module

本設計物品是一種散熱模組。This design item is a cooling module.

圖式所揭露之虛線部分,為本案不主張設計之部分。The dotted line part disclosed in the drawing is the part not claimed in this case.

TW111300616F 2022-02-08 2022-02-08 Heat dissipation module TWD221432S (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW111300616F TWD221432S (en) 2022-02-08 2022-02-08 Heat dissipation module
US29/834,940 USD1051864S1 (en) 2022-02-08 2022-04-14 Heat dissipation module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW111300616F TWD221432S (en) 2022-02-08 2022-02-08 Heat dissipation module

Publications (1)

Publication Number Publication Date
TWD221432S true TWD221432S (en) 2022-10-01

Family

ID=88924535

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111300616F TWD221432S (en) 2022-02-08 2022-02-08 Heat dissipation module

Country Status (2)

Country Link
US (1) USD1051864S1 (en)
TW (1) TWD221432S (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD229037S (en) 2023-04-14 2023-12-11 宏碁股份有限公司 Heat dissipation module
TWD229998S (en) 2023-06-20 2024-02-11 宏碁股份有限公司 新北市汐止區新台五路一段88號8樓 (中華民國) Heat dissipation module
TWD229999S (en) 2023-06-20 2024-02-11 宏碁股份有限公司 新北市汐止區新台五路一段88號8樓 (中華民國) Heat dissipation module
TWD230746S (en) 2023-09-27 2024-04-01 宏碁股份有限公司 新北市汐止區新台五路一段88號8樓 (中華民國) Heat dissipation module
TWD230745S (en) 2023-09-27 2024-04-01 宏碁股份有限公司 新北市汐止區新台五路一段88號8樓 (中華民國) Heat dissipation module
TWD234016S (en) 2024-03-13 2024-10-01 宏碁股份有限公司 新北市汐止區新台五路一段88號8樓 (中華民國) Heat dissipation module

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USD400665S (en) * 1997-09-03 1998-11-03 Sunonwealth Electric Machine Industry Co., Ltd. Heat dissipation fan
USD408514S (en) * 1997-10-07 1999-04-20 Sunonwealth Electric Machine Industry Co., Ltd. Heat dissipation fan
USD398392S (en) * 1997-10-07 1998-09-15 Sunonwealth Electric Machine Industry Co. Ltd. Heat dissipation fan
USD399946S (en) * 1997-10-07 1998-10-20 Sunonwealth Electric Machine Industry Co., Ltd. Heat dissipation fan
USD398977S (en) * 1997-10-07 1998-09-29 Sunonwealth Electric Machine Industry Co., Ltd. Heat dissipation fan
USD418216S (en) * 1997-10-07 1999-12-28 Sunonwealth Electric Machine Industry Co., Ltd. Heat dissipation fan
USD396276S (en) * 1997-10-07 1998-07-21 Sunonwealth Electric Machine Industry Co., Ltd. Heat dissipation fan
USD398978S (en) * 1997-10-07 1998-09-29 Sunonwealth Electric Machine Industry Co., Ltd. Heat dissipation fans
USD401686S (en) * 1997-10-07 1998-11-24 Sunonwealth Electric Machine Industry Co., Ltd. Heat dissipitation fan
GB2330901B (en) * 1997-11-04 2001-05-09 Sunonwealth Electr Mach Ind Co Heat dissipation device
TW438215U (en) * 1998-02-10 2001-05-28 D Link Corp Heat sinks in an electronic production
JP3552559B2 (en) * 1998-03-11 2004-08-11 株式会社デンソー Heating element cooling device
JP3454707B2 (en) * 1998-03-31 2003-10-06 山洋電気株式会社 Electronic component cooling device
US6252770B1 (en) * 2000-08-02 2001-06-26 Ming-Chuan Yu Electronic apparatus cooling device
TWD121164S1 (en) * 2007-02-16 2008-01-21 建準電機工業股份有限公司 Blower type micro heat dissipation module
USD570794S1 (en) * 2007-02-16 2008-06-10 Sunonwealth Electric Machine Industry Co., Ltd. Mini blower heat sink module
USD570795S1 (en) * 2007-02-16 2008-06-10 Sunonwealth Electric Machine Industry Co., Ltd. Mini blower heat sink module
TW201024982A (en) * 2008-12-26 2010-07-01 Foxconn Tech Co Ltd Heat dissipation device
TWI517782B (en) * 2011-11-11 2016-01-11 華碩電腦股份有限公司 Heat dissipating module
TWM542170U (en) * 2017-01-06 2017-05-21 Evga Corp Heat dissipation structure for interface card
TWM542328U (en) * 2017-01-16 2017-05-21 Evga Corp Heat dissipation control device based on core parameters of display card
TWM545287U (en) * 2017-01-20 2017-07-11 艾維克科技股份有限公司 Staggered heat dissipation structure of interface card
US11586260B2 (en) * 2017-03-06 2023-02-21 Tapicu, Inc. Device holder and solar powered charger unit for smart device cooler
US20230205285A1 (en) * 2017-03-06 2023-06-29 Tapicu ,Inc. Device holder and solar powered charger unit for smart device cooler
USD928161S1 (en) * 2019-03-14 2021-08-17 Cambricon Technologies Corporation Limited Graphics card
USD979571S1 (en) * 2019-07-26 2023-02-28 Cambricon Technologies Corporation Limited Board card
TWI784820B (en) * 2021-11-30 2022-11-21 宏碁股份有限公司 Graphic card assembly
USD997109S1 (en) * 2022-10-31 2023-08-29 Dtg Neo Scientific Limited Graphics card GPU support cooler

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD229037S (en) 2023-04-14 2023-12-11 宏碁股份有限公司 Heat dissipation module
TWD229998S (en) 2023-06-20 2024-02-11 宏碁股份有限公司 新北市汐止區新台五路一段88號8樓 (中華民國) Heat dissipation module
TWD229999S (en) 2023-06-20 2024-02-11 宏碁股份有限公司 新北市汐止區新台五路一段88號8樓 (中華民國) Heat dissipation module
TWD230746S (en) 2023-09-27 2024-04-01 宏碁股份有限公司 新北市汐止區新台五路一段88號8樓 (中華民國) Heat dissipation module
TWD230745S (en) 2023-09-27 2024-04-01 宏碁股份有限公司 新北市汐止區新台五路一段88號8樓 (中華民國) Heat dissipation module
TWD234016S (en) 2024-03-13 2024-10-01 宏碁股份有限公司 新北市汐止區新台五路一段88號8樓 (中華民國) Heat dissipation module

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Publication number Publication date
USD1051864S1 (en) 2024-11-19

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