TWD213118S

TWD213118S - Trim panel for motherboard heat sink

Info

Publication number: TWD213118S
Application number: TW110300325F
Authority: TW
Inventors: 彭婁威
Original assignee: 微星科技股份有限公司; 大陸商恩斯邁電子（深圳）有限公司
Priority date: 2021-01-20
Filing date: 2021-01-20
Publication date: 2021-08-01

Abstract

【物品用途】;本設計物品作為主機板散熱片之裝飾的部分，可同時兼顧主機板散熱片的散熱效能。;【設計說明】;圖式所揭露之虛線部分，為本案不主張設計之部分。;圖式所揭露之二點鍊線係表示本案所欲主張設計之部分與不主張設計之部分的邊界，為本案不主張設計之部分。;參考圖1以及參考圖2示意了本設計物品設置於主機板散熱片的上方。[Use of item]: This design item is used as a decorative part of the motherboard heat sink, and can also take into account the heat dissipation performance of the motherboard heat sink. ;[Design Description];The dotted line portion disclosed in the drawing is the part of this case that does not require design. ; The two-point chain line disclosed in the diagram represents the boundary between the part where design is claimed and the part where design is not claimed in this case, and is the part where design is not claimed in this case. ; Refer to Figure 1 and Figure 2, which illustrates that the design item is arranged above the heat sink of the motherboard.

Description

The trim of the motherboard heat sink

本設計物品作為主機板散熱片之裝飾的部分，可同時兼顧主機板散熱片的散熱效能。This design item is used as the decorative part of the motherboard heat sink, which can take into account the heat dissipation efficiency of the motherboard heat sink at the same time.

圖式所揭露之虛線部分，為本案不主張設計之部分。The dotted line exposed in the diagram is the part that is not recommended for design in this case.

圖式所揭露之二點鍊線係表示本案所欲主張設計之部分與不主張設計之部分的邊界，為本案不主張設計之部分。The two-dot chain line disclosed in the diagram indicates the boundary between the part that the case intends to claim for design and the part that does not advocate design, and the part that does not advocate design for this case.

參考圖1以及參考圖2示意了本設計物品設置於主機板散熱片的上方。Referring to Fig. 1 and Fig. 2, the article of this design is arranged above the heat sink of the motherboard.