TWD229037S - Heat dissipation module - Google Patents

Heat dissipation module Download PDF

Info

Publication number
TWD229037S
TWD229037S TW112301767F TW112301767F TWD229037S TW D229037 S TWD229037 S TW D229037S TW 112301767 F TW112301767 F TW 112301767F TW 112301767 F TW112301767 F TW 112301767F TW D229037 S TWD229037 S TW D229037S
Authority
TW
Taiwan
Prior art keywords
heat dissipation
dissipation module
item
design
cooling module
Prior art date
Application number
TW112301767F
Other languages
Chinese (zh)
Inventor
賴威佑
李貽恆
Original Assignee
宏碁股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 宏碁股份有限公司 filed Critical 宏碁股份有限公司
Priority to TW112301767F priority Critical patent/TWD229037S/en
Publication of TWD229037S publication Critical patent/TWD229037S/en

Links

Abstract

【物品用途】;本設計物品是一種散熱模組。;【設計說明】;圖式所揭露之虛線部分，為本案不主張設計之部分。[Use of item];This designed item is a cooling module. ;[Design Description];The dotted line portion disclosed in the drawing is the part of this case that does not require design.

Description

散熱模組Cooling module

本設計物品是一種散熱模組。This design item is a cooling module.

圖式所揭露之虛線部分，為本案不主張設計之部分。The dotted line parts revealed in the diagram are the parts that are not designed in this case.

TW112301767F 2023-04-14 2023-04-14 Heat dissipation module TWD229037S (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW112301767F TWD229037S (en) 2023-04-14 2023-04-14 Heat dissipation module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW112301767F TWD229037S (en) 2023-04-14 2023-04-14 Heat dissipation module

Publications (1)

Publication Number Publication Date
TWD229037S true TWD229037S (en) 2023-12-11

Family

ID=89074766

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112301767F TWD229037S (en) 2023-04-14 2023-04-14 Heat dissipation module

Country Status (1)

Country Link
TW (1) TWD229037S (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD221432S (en) 2022-02-08 2022-10-01 宏碁股份有限公司 Heat dissipation module

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD221432S (en) 2022-02-08 2022-10-01 宏碁股份有限公司 Heat dissipation module

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