TWD229998S - Heat dissipation module - Google Patents

Heat dissipation module Download PDF

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Publication number
TWD229998S
TWD229998S TW112303107F TW112303107F TWD229998S TW D229998 S TWD229998 S TW D229998S TW 112303107 F TW112303107 F TW 112303107F TW 112303107 F TW112303107 F TW 112303107F TW D229998 S TWD229998 S TW D229998S
Authority
TW
Taiwan
Prior art keywords
heat dissipation
dissipation module
module
area
design
Prior art date
Application number
TW112303107F
Other languages
Chinese (zh)
Inventor
吳明政
李貽恆
Original Assignee
宏碁股份有限公司
Filing date
Publication date
Application filed by 宏碁股份有限公司 filed Critical 宏碁股份有限公司
Publication of TWD229998S publication Critical patent/TWD229998S/en

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Description

散熱模組Cooling module

本設計物品是一種散熱模組,尤其是一種用於顯示卡散熱的散熱模組。This design item is a heat dissipation module, especially a heat dissipation module used for graphics card heat dissipation.

圖式所揭露之虛線部分,為本案不主張設計之部分。The dotted line parts revealed in the diagram are the parts for which design is not advocated in this case.

圖式中斜線陰影所在的區域表示該區域具有透光性。The area shaded with diagonal lines in the diagram indicates that the area is light-transmissive.

TW112303107F 2023-06-20 Heat dissipation module TWD229998S (en)

Publications (1)

Publication Number Publication Date
TWD229998S true TWD229998S (en) 2024-02-11

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD221432S (en) 2022-02-08 2022-10-01 宏碁股份有限公司 Heat dissipation module

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD221432S (en) 2022-02-08 2022-10-01 宏碁股份有限公司 Heat dissipation module

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