TWD229998S - Heat dissipation module - Google Patents
Heat dissipation module Download PDFInfo
- Publication number
- TWD229998S TWD229998S TW112303107F TW112303107F TWD229998S TW D229998 S TWD229998 S TW D229998S TW 112303107 F TW112303107 F TW 112303107F TW 112303107 F TW112303107 F TW 112303107F TW D229998 S TWD229998 S TW D229998S
- Authority
- TW
- Taiwan
- Prior art keywords
- heat dissipation
- dissipation module
- design
- area
- article
- Prior art date
Links
- 230000017525 heat dissipation Effects 0.000 title abstract description 7
- 238000010586 diagram Methods 0.000 abstract description 4
Images
Abstract
【物品用途】;本設計物品是一種散熱模組，尤其是一種用於顯示卡散熱的散熱模組。;【設計說明】;圖式所揭露之虛線部分，為本案不主張設計之部分。;圖式中斜線陰影所在的區域表示該區域具有透光性。[Article Purpose];This design article is a heat dissipation module, in particular a heat dissipation module for display card heat dissipation. ;[Design Description];The dotted line part disclosed in the diagram is the part that this case does not claim to design. ;The area where the oblique line shadow is located in the diagram indicates that the area is light-transmissive.
Description
本設計物品是一種散熱模組，尤其是一種用於顯示卡散熱的散熱模組。This design item is a heat dissipation module, especially a heat dissipation module used for graphics card heat dissipation.
圖式所揭露之虛線部分，為本案不主張設計之部分。The dotted line parts revealed in the diagram are the parts for which design is not advocated in this case.
圖式中斜線陰影所在的區域表示該區域具有透光性。The area shaded with diagonal lines in the diagram indicates that the area is light-transmissive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW112303107F TWD229998S (en) | 2023-06-20 | 2023-06-20 | Heat dissipation module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW112303107F TWD229998S (en) | 2023-06-20 | 2023-06-20 | Heat dissipation module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD229998S true TWD229998S (en) | 2024-02-11 |
Family
ID=91333193
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW112303107F TWD229998S (en) | 2023-06-20 | 2023-06-20 | Heat dissipation module |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWD229998S (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWD221432S (en) | 2022-02-08 | 2022-10-01 | 宏碁股份有限公司 | Heat dissipation module |
-
2023
- 2023-06-20 TW TW112303107F patent/TWD229998S/en unknown
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWD221432S (en) | 2022-02-08 | 2022-10-01 | 宏碁股份有限公司 | Heat dissipation module |
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