TWD211316S - Heat sink for memory modules - Google Patents

Heat sink for memory modules Download PDF

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Publication number
TWD211316S
TWD211316S TW109304311F TW109304311F TWD211316S TW D211316 S TWD211316 S TW D211316S TW 109304311 F TW109304311 F TW 109304311F TW 109304311 F TW109304311 F TW 109304311F TW D211316 S TWD211316 S TW D211316S
Authority
TW
Taiwan
Prior art keywords
heat sink
memory modules
design
memory module
none
Prior art date
Application number
TW109304311F
Other languages
Chinese (zh)
Inventor
鄭用奭
Original Assignee
香港商艾思科有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 香港商艾思科有限公司 filed Critical 香港商艾思科有限公司
Priority to TW109304311F priority Critical patent/TWD211316S/en
Publication of TWD211316S publication Critical patent/TWD211316S/en

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Abstract

【物品用途】;本設計係關於一記憶體模組散熱座。;【設計說明】;(無)【Item Usage】;This design is about a memory module cooling seat. ;[Design description];(none)

Description

記憶體模組散熱座 Memory module heat sink

本設計係關於一記憶體模組散熱座。 This design is about a memory module heat sink.

TW109304311F 2020-07-31 2020-07-31 Heat sink for memory modules TWD211316S (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW109304311F TWD211316S (en) 2020-07-31 2020-07-31 Heat sink for memory modules

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW109304311F TWD211316S (en) 2020-07-31 2020-07-31 Heat sink for memory modules

Publications (1)

Publication Number Publication Date
TWD211316S true TWD211316S (en) 2021-05-01

Family

ID=88972119

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109304311F TWD211316S (en) 2020-07-31 2020-07-31 Heat sink for memory modules

Country Status (1)

Country Link
TW (1) TWD211316S (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD220529S (en) 2021-11-30 2022-08-11 芝奇國際實業股份有限公司 Memory Module (2)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD698792S1 (en) 2012-01-05 2014-02-04 Kingston Digital, Inc. Memory module

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD698792S1 (en) 2012-01-05 2014-02-04 Kingston Digital, Inc. Memory module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD220529S (en) 2021-11-30 2022-08-11 芝奇國際實業股份有限公司 Memory Module (2)

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