CN204009732U - A kind of totally enclosed type laptop heat-dissipation structure - Google Patents

Abstract

The utility model belongs to the technical field of industrial control, and specifically relates to a fully enclosed notebook heat dissipation structure, comprising: a heat dissipation plate arranged outside the main body of the notebook to seal the notebook, a heat dissipation structure is arranged between the main body and the heat dissipation plate, and the heat dissipation The structure includes a bottom heat pipe and a U-shaped connecting heat pipe connected thereto. The two ends of the connecting heat pipe are respectively connected to the lower left rotating shaft and the lower right rotating shaft. The upper left rotating shaft and the upper right rotating shaft are respectively connected with the back heat pipe. This structure not only meets the heat dissipation requirements of ordinary notebooks, but also solves the problem of water and dust entering the heat dissipation structure of notebooks, and at the same time reduces noise and saves energy.

Description

A fully enclosed notebook cooling structure

technical field

The utility model belongs to the technical field of computer heat dissipation, and in particular relates to a fully enclosed notebook heat dissipation structure.

Background technique

The traditional notebook heat dissipation structure is to transfer the heat from the heat generating element to the fan through the heat pipe assembly, and dissipate the heat through the forced convection of the fan. There are also some patents that propose a new notebook heat dissipation structure. The following related patents, 1) heat dissipation structure of notebook computer, application number 200420036605.8, a heat dissipation structure of notebook computer, is characterized in that comprising: a first heat pipe, contacting the heat source of the notebook computer; a second heat pipe, contact On the back plate of the liquid crystal display of the notebook computer; a rotating shaft is arranged at the pivot joint between the liquid crystal display of the notebook computer and the computer host, and is connected with the first and second heat pipes. 2) A cooling system for a notebook computer and a notebook computer, application number 201320599509.3, a cooling system for a notebook computer, characterized in that the cooling system includes at least one set of Heat pipe heat dissipation module; the heat pipe heat dissipation module includes a first heat conduction sheet (4), a heat pipe (5) and a second heat conduction sheet (6); the second heat conduction sheet (6) passes through the heat pipe (5) and The first heat conducting sheets (4) are connected together. 3) An industrial notebook computer heat dissipation structure, application number: 201120185850.5, an industrial notebook computer heat dissipation structure, characterized in that one surface of the heat pipe (1) is closely attached to the onboard chip (4) of the main board (3) , the other side of the heat pipe (1) is closely attached to the inner wall of the metal casing (2) at the bottom of the industrial notebook computer, and the outer wall of the metal casing (2) is in the shape of a heat sink.

Traditional notebook cooling methods mainly use fans to dissipate heat, which can easily cause water and dust ingress, and the heat dissipation process consumes extra energy, affecting the life and work of notebooks. The above patents only use a single heat dissipation surface, and the heat dissipation effect must be unsatisfactory.

Utility model content

The purpose of this utility model is to provide a fully enclosed notebook heat dissipation structure for the defects and deficiencies of the existing technology. This structure solves the problem of water and ash entering the notebook heat dissipation structure while meeting the heat dissipation requirements of ordinary notebooks. Reduce noise and save energy.

In order to achieve the above object, the utility model adopts the following technical solutions: including: a heat dissipation plate arranged outside the notebook main body to seal the outside of the notebook, a heat dissipation structure is arranged between the main body and the heat dissipation plate, and the heat dissipation structure includes a bottom heat pipe and a The connected heat pipes are U-shaped, and the two ends of the connecting heat pipes are respectively connected to the lower left shaft and the lower right shaft. The lower left shaft and the lower right shaft are respectively movably connected to the upper left shaft and the upper right shaft. Connect to the back heat pipe respectively.

Further, the lower left rotating shaft and the lower right rotating shaft are provided with rotating shaft casings respectively.

Further, the gap between the heat dissipation structure and the heat dissipation plate is filled with heat conduction agent.

Further, the heat conducting agent is silicone grease.

Further, the heat dissipation plate is an aluminum plate.

Further, the back heat pipe includes a left back heat pipe connected to the left upper shaft, and a right back heat pipe connected to the right upper shaft.

Further, the bottom heat pipe and the connecting conduit are closely attached to the non-keyboard surface of the notebook host, and the back heat pipe is closely attached to the back of the notebook screen.

Compared with the prior art, the utility model has the following beneficial technical effects: by arranging a cooling plate outside the main body of the notebook, the notebook is sealed as a whole; The heat generated by the heat source is transferred to the cooling plate, and the cooling plate and the outside are naturally convected to dissipate heat. This structure cancels the fan of the traditional notebook structure and makes the notebook sealed, thereby ensuring the normal cooling requirements and solving the problem of water ingress in the notebook. gray problem. And because of the heat dissipation structure of the canceled fan, the noise is reduced, the power consumption of the notebook due to heat dissipation is reduced, and energy is saved.

Furthermore, by setting the heat conducting agent, the heat of the notebook can be better transferred to the heat dissipation plate, and the heat dissipation efficiency can be improved.

Description of drawings

Fig. 1 is a schematic diagram of the heat dissipation structure of the utility model;

Figure 2 is a partial enlarged view of the new type A used in this application;

Fig. 3 is a schematic diagram of assembly of the utility model;

Among them: 1 is the bottom heat pipe; 2 is the heat source; 3 is the connecting heat pipe; 4 is. 5 is the upper right shaft; 6 is the right back heat pipe; 7 is the left back heat pipe; 8 is the upper left shaft; 9 is the lower left shaft; 10 is the notebook host, 11 is the notebook screen, and 12 is the shaft jacket.

Detailed ways

Below in conjunction with accompanying drawing, the utility model is described in further detail.

Referring to Fig. 1 and Fig. 2, the utility model includes: a heat dissipation plate arranged outside the main body of the notebook to seal the notebook, the heat dissipation plate is processed from a thin aluminum plate, a heat dissipation structure is arranged between the main body and the heat dissipation plate, and the heat dissipation structure It includes a bottom heat pipe 1 and a U-shaped connecting heat pipe 3 connected thereto. The two ends of the connecting heat pipe 3 are respectively connected to the lower left rotating shaft 9 and the lower right rotating shaft 4, and the lower left rotating shaft 9 and the lower right rotating shaft 4 are respectively movably connected to the upper left Rotating shaft 8, upper right rotating shaft 5, the left back heat pipe 7 connected with the left upper rotating shaft 8, and the right back heat pipe 6 connected with the upper right rotating shaft 5. The lower left rotating shaft 9 and the lower right rotating shaft 4 are respectively provided with rotating shaft casings 12 . The gap between the heat dissipation structure and the heat dissipation plate is filled with heat conduction agent such as silicon grease. The lower left rotating shaft 9 and the lower right rotating shaft 4 are provided with chute respectively, and the connecting heat pipe 3 is embedded in the chute of the lower left rotating shaft 9 and the lower right rotating shaft 4 . The upper left rotating shaft 8 and the lower left rotating shaft 9, the upper right rotating shaft 5 and the lower right rotating shaft 4 are arranged tangentially respectively, so that the upper rotating shaft can rotate with the lower rotating shaft.

Referring to Fig. 3, when assembling, the bottom heat pipe 1 and the connecting pipe 3 are close to the non-keyboard surface of the notebook host 10, the heat source 2 such as the CPU is closely attached to the bottom heat pipe 1 and the connecting pipe 3, and the back heat pipe 6 is connected to the notebook screen 11. The back is tightly fitted, and the gap is filled with heat-conducting agents such as silica gel. The heat generated by the heat source is transferred to the heat sink through the bottom heat pipe 1, the connecting pipe 3, the back heat pipe 6 and the heat-conducting agent. Convection cooling makes a significant difference.

Claims (7)

1. a totally enclosed type laptop heat-dissipation structure, it is characterized in that, comprise: be arranged on notebook main body outside by the heat sink of the outer side seal of notebook, between described main body and heat sink, be provided with radiator structure, described radiator structure comprises bottom heat pipe (1) and coupled is U-shaped connection heat pipe (3), the two ends of described connection heat pipe (3) connect respectively lower-left rotating shaft (9), bottom right rotating shaft (4), described lower-left rotating shaft (9), bottom right rotating shaft (4) is flexibly connected respectively upper left rotating shaft (8), upper right rotating shaft (5), described upper left rotating shaft (8), upper right rotating shaft (5) is connected with back heat pipe (6) respectively.

2. a kind of totally enclosed type laptop heat-dissipation structure according to claim 1, is characterized in that, in described lower-left rotating shaft (9), bottom right rotating shaft (4), is respectively arranged with rotating shaft overcoat (12).

3. a kind of totally enclosed type laptop heat-dissipation structure according to claim 1, is characterized in that: the space between described notebook main body and heat sink is filled with thermal conducting agent.

4. a kind of totally enclosed type laptop heat-dissipation structure according to claim 3, is characterized in that: described thermal conducting agent is silicone grease.

5. a kind of totally enclosed type laptop heat-dissipation structure according to claim 1, is characterized in that: described heat sink is aluminium sheet.

6. a kind of totally enclosed type laptop heat-dissipation structure according to claim 1, is characterized in that: described back heat pipe comprises the left back heat pipe (7) being connected with upper left rotating shaft (8), the right back heat pipe (6) being connected with upper right rotating shaft (5).

7. according to a kind of totally enclosed type laptop heat-dissipation structure described in claim 1 to 6 any one, it is characterized in that: described bottom heat pipe (1), connecting duct (3) are close to the nonbonding card of notebook host (10), back heat pipe (6) fits tightly with the back side of notebook screen (11).