TWD183005S - 半導體製造裝置之隔熱組件外罩 - Google Patents
半導體製造裝置之隔熱組件外罩Info
- Publication number
- TWD183005S TWD183005S TW105304350F TW105304350F TWD183005S TW D183005 S TWD183005 S TW D183005S TW 105304350 F TW105304350 F TW 105304350F TW 105304350 F TW105304350 F TW 105304350F TW D183005 S TWD183005 S TW D183005S
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor manufacturing
- article
- insulating component
- thermal insulation
- outer cover
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 238000009413 insulation Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 3
- 235000012431 wafers Nutrition 0.000 abstract 3
- 238000000034 method Methods 0.000 abstract 1
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2016-2843F JP1565116S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 2016-02-10 | 2016-02-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD183005S true TWD183005S (zh) | 2017-05-11 |
Family
ID=57482774
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105304350F TWD183005S (zh) | 2016-02-10 | 2016-07-28 | 半導體製造裝置之隔熱組件外罩 |
Country Status (3)
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11631567B2 (en) * | 2020-03-12 | 2023-04-18 | Applied Materials, Inc. | Ion source with single-slot tubular cathode |
| JP1706321S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 2021-06-28 | 2022-01-31 | ||
| JP1706320S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 2021-06-28 | 2022-01-31 | ||
| JP1733769S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 2022-08-10 | 2023-01-06 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD493873S1 (en) * | 2002-05-24 | 2004-08-03 | Tokyo Electron Limited | Heating gas supplier for semiconductor manufacturing equipment |
| USD522456S1 (en) * | 2002-11-29 | 2006-06-06 | Honda Giken Kogyo Kabushiki Kaisha | Capacitor cell |
| JP3845370B2 (ja) * | 2002-11-29 | 2006-11-15 | 本田技研工業株式会社 | 蓄電素子モジュール |
| US7440258B2 (en) * | 2005-03-14 | 2008-10-21 | Maxwell Technologies, Inc. | Thermal interconnects for coupling energy storage devices |
| JP5031611B2 (ja) * | 2008-02-18 | 2012-09-19 | 株式会社日立国際電気 | 基板処理装置、半導体装置の製造方法及び天井断熱体 |
| US8098479B1 (en) * | 2008-09-19 | 2012-01-17 | Cornell Dubilier Marketing, Inc. | Capacitor having zinc coated common edge with welded aluminum terminal |
| KR101049282B1 (ko) * | 2009-03-03 | 2011-07-13 | 주식회사 네스캡 | 전기에너지 저장장치 |
| US8456795B2 (en) * | 2009-11-13 | 2013-06-04 | American Radionic Company, Inc. | Hard start kit for multiple replacement applications |
| JP5645718B2 (ja) * | 2011-03-07 | 2014-12-24 | 東京エレクトロン株式会社 | 熱処理装置 |
| US8570767B2 (en) * | 2011-03-21 | 2013-10-29 | Deere & Company | Capacitor assembly |
| JP6247566B2 (ja) * | 2014-02-28 | 2017-12-13 | 東洋炭素株式会社 | 加熱処理容器、加熱処理容器集合体、及び、半導体素子製造装置 |
| JP1541104S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 2014-12-12 | 2016-01-12 |
-
2016
- 2016-02-10 JP JPD2016-2843F patent/JP1565116S/ja active Active
- 2016-07-28 TW TW105304350F patent/TWD183005S/zh unknown
- 2016-07-28 US US29/572,569 patent/USD818961S1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP1565116S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 2016-12-12 |
| USD818961S1 (en) | 2018-05-29 |