TWD166329S - 發光二極體晶片之部分 - Google Patents

發光二極體晶片之部分

Info

Publication number
TWD166329S
TWD166329S TW103303417F TW103303417F TWD166329S TW D166329 S TWD166329 S TW D166329S TW 103303417 F TW103303417 F TW 103303417F TW 103303417 F TW103303417 F TW 103303417F TW D166329 S TWD166329 S TW D166329S
Authority
TW
Taiwan
Prior art keywords
design
led chip
transparent layers
overlapping
project
Prior art date
Application number
TW103303417F
Other languages
English (en)
Inventor
Jing En Huang
Kuan Chieh Huang
Shao Ying Ting
Yi Ru Huang
Original Assignee
新世紀光電股份有限公司
Genesis Photonics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新世紀光電股份有限公司, Genesis Photonics Inc filed Critical 新世紀光電股份有限公司
Priority to TW103303417F priority Critical patent/TWD166329S/zh
Priority to US29/495,848 priority patent/USD731989S1/en
Publication of TWD166329S publication Critical patent/TWD166329S/zh
Priority to US29/528,298 priority patent/USD763805S1/en

Links

Abstract

【物品用途】;本設計是一種發光二極體晶片，用於提供照明。;【設計說明】;本設計之設計特點在於兩相互重疊的透明層的形狀和埋在下方透明層底部的元件的表面圖案。圖式所揭露之虛線部分是兩相互重疊的透明層的交界，為本案不主張設計之部分。
TW103303417F 2014-06-06 2014-06-06 發光二極體晶片之部分 TWD166329S (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW103303417F TWD166329S (zh) 2014-06-06 2014-06-06 發光二極體晶片之部分
US29/495,848 USD731989S1 (en) 2014-06-06 2014-07-04 Light emitting diode chip
US29/528,298 USD763805S1 (en) 2014-06-06 2015-05-28 Light emitting diode chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW103303417F TWD166329S (zh) 2014-06-06 2014-06-06 發光二極體晶片之部分

Publications (1)

Publication Number Publication Date
TWD166329S true TWD166329S (zh) 2015-03-01

Family

ID=53280233

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103303417F TWD166329S (zh) 2014-06-06 2014-06-06 發光二極體晶片之部分

Country Status (2)

Country Link
US (2) USD731989S1 (zh)
TW (1) TWD166329S (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD847102S1 (en) 2013-02-08 2019-04-30 Epistar Corporation Light emitting diode
TWD166329S (zh) * 2014-06-06 2015-03-01 新世紀光電股份有限公司 發光二極體晶片之部分
USD761215S1 (en) * 2015-05-06 2016-07-12 Xiamen Sanan Optoelectronics Technology Co., Ltd. Package for light-emitting diode
USD756942S1 (en) * 2015-05-06 2016-05-24 Xiamen Sanan Optoelectronics Technology Co., Ltd. Light-emitting diode package
USD831593S1 (en) * 2016-03-24 2018-10-23 Hamamatsu Photonics K.K Optical semiconductor element
JP1563908S (zh) * 2016-03-24 2016-11-21
USD826184S1 (en) * 2016-03-24 2018-08-21 Hamamatsu Photonics K.K. Optical semiconductor element
JP1563909S (zh) * 2016-03-24 2016-11-21

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3795248B2 (ja) * 1999-03-19 2006-07-12 ローム株式会社 チップ型発光装置
KR100772774B1 (ko) * 2000-04-24 2007-11-01 로무 가부시키가이샤 측면발광반도체 발광장치 및 그 제조방법
JP4357311B2 (ja) * 2004-02-04 2009-11-04 シチズン電子株式会社 発光ダイオードチップ
US7242076B2 (en) * 2004-05-18 2007-07-10 Fairchild Semiconductor Corporation Packaged integrated circuit with MLP leadframe and method of making same
US7049639B2 (en) * 2004-05-28 2006-05-23 Harvatek Corporation LED packaging structure
JP2006156668A (ja) * 2004-11-29 2006-06-15 Nichia Chem Ind Ltd 発光装置及びその製造方法
US7211882B2 (en) * 2005-03-22 2007-05-01 Harvatek Corporation LED package structure and method for making the same
USD576571S1 (en) * 2007-06-14 2008-09-09 Rohm Co., Ltd. Light emitting diode module
US20090278241A1 (en) * 2008-05-08 2009-11-12 Yong Liu Semiconductor die package including die stacked on premolded substrate including die
JP5440010B2 (ja) * 2008-09-09 2014-03-12 日亜化学工業株式会社 光半導体装置及びその製造方法
USD626097S1 (en) * 2009-10-16 2010-10-26 Kabushiki Kaisha Toshiba Light-emitting diode
USD624886S1 (en) * 2010-01-11 2010-10-05 Everlight Electronics Co., Ltd. Light emitting diode package
USD629767S1 (en) * 2010-03-19 2010-12-28 Kabushiki Kaisha Toshiba Light-emitting diode
USD653628S1 (en) * 2010-08-02 2012-02-07 Citizen Electronics Co., Ltd. Light-emitting diode
USD653629S1 (en) * 2010-08-02 2012-02-07 Citizen Electronics Co., Ltd. Light-emitting diode
JP2012114284A (ja) * 2010-11-25 2012-06-14 Toshiba Corp Ｌｅｄモジュール及び照明装置
USD676003S1 (en) * 2011-08-29 2013-02-12 Toyoda Gosei Co., Ltd. Light emitting diode
TWD166329S (zh) * 2014-06-06 2015-03-01 新世紀光電股份有限公司 發光二極體晶片之部分

Also Published As

Publication number Publication date
USD763805S1 (en) 2016-08-16
USD731989S1 (en) 2015-06-16

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