TW584218U - Mounting device for heat sink - Google Patents

Mounting device for heat sink

Info

Publication number
TW584218U
TW584218U TW091208387U TW91208387U TW584218U TW 584218 U TW584218 U TW 584218U TW 091208387 U TW091208387 U TW 091208387U TW 91208387 U TW91208387 U TW 91208387U TW 584218 U TW584218 U TW 584218U
Authority
TW
Taiwan
Prior art keywords
heat sink
mounting device
mounting
sink
heat
Prior art date
Application number
TW091208387U
Other languages
English (en)
Inventor
Cheng-Tian Lai
Sheng-Hua Wang
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW091208387U priority Critical patent/TW584218U/zh
Priority to US10/301,974 priority patent/US6646881B1/en
Publication of TW584218U publication Critical patent/TW584218U/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T24/00—Buckles, buttons, clasps, etc.
    • Y10T24/44—Clasp, clip, support-clamp, or required component thereof
    • Y10T24/44017—Clasp, clip, support-clamp, or required component thereof with specific mounting means for attaching to rigid or semirigid supporting structure or structure-to-be-secured
    • Y10T24/44026—Clasp, clip, support-clamp, or required component thereof with specific mounting means for attaching to rigid or semirigid supporting structure or structure-to-be-secured for cooperating with aperture in supporting structure or structure-to-be-secured

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW091208387U 2002-06-06 2002-06-06 Mounting device for heat sink TW584218U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW091208387U TW584218U (en) 2002-06-06 2002-06-06 Mounting device for heat sink
US10/301,974 US6646881B1 (en) 2002-06-06 2002-11-21 Mounting assembly for heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW091208387U TW584218U (en) 2002-06-06 2002-06-06 Mounting device for heat sink

Publications (1)

Publication Number Publication Date
TW584218U true TW584218U (en) 2004-04-11

Family

ID=29398883

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091208387U TW584218U (en) 2002-06-06 2002-06-06 Mounting device for heat sink

Country Status (2)

Country Link
US (1) US6646881B1 (zh)
TW (1) TW584218U (zh)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003298912A (ja) * 2002-04-04 2003-10-17 Pentax Corp 電子制御回路基板を有する携帯型光学装置
TW536121U (en) * 2002-07-26 2003-06-01 Hon Hai Prec Ind Co Ltd Retaining device
US6948554B2 (en) * 2002-12-13 2005-09-27 Hon Hai Precision Ind. Co., Ltd. Heat dissipation assembly with resilient fastener
JP4281864B2 (ja) * 2003-04-30 2009-06-17 タイコエレクトロニクスアンプ株式会社 Ｉｃソケット組立体
TW572443U (en) * 2003-06-20 2004-01-11 Molex Taiwan Ltd Fastener for socket connector
US6829144B1 (en) * 2003-08-05 2004-12-07 International Business Machines Corporation Flip chip package with heat spreader allowing multiple heat sink attachment
TWM248229U (en) * 2003-10-31 2004-10-21 Hon Hai Prec Ind Co Ltd Heat sink assembly
CN2681217Y (zh) * 2004-01-14 2005-02-23 鸿富锦精密工业（深圳）有限公司 散热器扣合装置
US6976525B2 (en) * 2004-02-24 2005-12-20 Asia Vital Component Co., Ltd. Fastening device for a radiator
US7133288B2 (en) * 2004-05-19 2006-11-07 Tyco Electronics Corporation Processor heat sink retention module and assembly
US7218524B2 (en) * 2004-09-30 2007-05-15 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Locking device for heat dissipating device
US7324344B2 (en) * 2004-12-01 2008-01-29 Cisco Technology, Inc. Techniques for attaching a heatsink to a circuit board using anchors which install from an underside of the circuit board
US7321493B2 (en) * 2004-12-01 2008-01-22 Cisco Technology, Inc. Techniques for attaching a heatsink to a circuit board using anchors which install from an underside of the circuit board
US20060139890A1 (en) * 2004-12-23 2006-06-29 A-Sheng Liu Fastening device II
US20060196639A1 (en) * 2005-03-04 2006-09-07 Inventec Corporation Heatsink assembly
US7277293B2 (en) * 2005-04-11 2007-10-02 Inventec Corporation Heat sink conduction apparatus
TW200706098A (en) * 2005-07-26 2007-02-01 Asustek Comp Inc An electronic device with sliding type heatsink
US7068513B1 (en) 2005-10-05 2006-06-27 Foxconn Technology Co., Ltd. Fixing apparatus for mounting a heat sink to a printed circuit board
US20070121300A1 (en) * 2005-11-29 2007-05-31 Wan-Lin Xia Back plate assembly for mounting a heat sink assembly to a motherboard
JP4662361B2 (ja) * 2006-01-23 2011-03-30 株式会社小糸製作所 光源モジュール
US7388747B2 (en) * 2006-04-07 2008-06-17 Inventec Corporation Heat plate fixing structure
US7336496B1 (en) * 2006-09-14 2008-02-26 Inventec Corporation Fixing structure for computer mainboard
TWI345696B (en) * 2007-07-06 2011-07-21 Asustek Comp Inc Fixing structure
CN101377706B (zh) * 2007-08-31 2011-12-21 鸿富锦精密工业（深圳）有限公司 电脑散热器背板组合
TWI402660B (zh) * 2007-09-28 2013-07-21 Hon Hai Prec Ind Co Ltd 電腦散熱器背板組合及具有該背板組合之散熱模組
US20090201646A1 (en) * 2008-02-12 2009-08-13 Inventec Corporation Retaining device
TWM341243U (en) * 2008-04-25 2008-09-21 Asia Vital Components Co Ltd Backplate for heat sink
CN101937263A (zh) * 2009-07-01 2011-01-05 鸿富锦精密工业（深圳）有限公司 电脑散热器支架
CN101990390A (zh) * 2009-08-06 2011-03-23 富准精密工业(深圳)有限公司 扣具及应用该扣具的散热装置组合
US8542491B2 (en) * 2009-09-09 2013-09-24 Asia Vital Components Co., Ltd. Structure for fixing a backplate
US8139361B2 (en) * 2009-12-16 2012-03-20 International Business Machines Corporation Apparatus and method for attaching selected components to a printed circuit board
US8995132B2 (en) * 2010-06-18 2015-03-31 Tetsuji Kataoka Structure for mounting heat sink, and heat sink mounted using the structure
CN102591432A (zh) * 2011-01-13 2012-07-18 鸿富锦精密工业（深圳）有限公司 电子装置
TWI443299B (zh) * 2011-12-09 2014-07-01 Hon Hai Prec Ind Co Ltd 散熱器固定裝置
WO2013089677A1 (en) * 2011-12-13 2013-06-20 Intel Corporation Heat dissipation device loading mechanisms
US9169856B2 (en) * 2012-02-02 2015-10-27 Asia Vital Components Co., Ltd. Fastening structure for thermal module
US20130340987A1 (en) * 2012-06-21 2013-12-26 Asia Vital Components Co., Ltd. Heat-dissipating base
CN103517613A (zh) * 2012-06-25 2014-01-15 富瑞精密组件（昆山）有限公司 散热装置
US20140036451A1 (en) * 2012-07-31 2014-02-06 Glenn C. Simon Heat sink assembly
DE102013100701B4 (de) 2013-01-24 2022-07-21 Infineon Technologies Ag Halbleitermodulanordnung und verfahren zur herstellung einer halbleitermodulanordnung
DE102016220555B4 (de) * 2016-10-20 2019-07-11 Harman Becker Automotive Systems Gmbh Kühlkörperbefestigungssystem und -verfahren
CN110137720B (zh) * 2018-02-09 2022-07-26 富士康(昆山)电脑接插件有限公司 一种用来固定散热器的固定装置及其抵压装置
CN112497154B (zh) * 2020-12-07 2022-08-30 苏州易德龙科技股份有限公司 一种mos管散热器安装夹具

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5870285A (en) * 1996-10-25 1999-02-09 International Business Machines Corporation Assembly mounting techniques for heat sinks in electronic packaging
US6055159A (en) * 1999-08-20 2000-04-25 Compal Electronics, Inc. Heat dissipating module for a heat generating electronic component
US6459582B1 (en) * 2000-07-19 2002-10-01 Fujitsu Limited Heatsink apparatus for de-coupling clamping forces on an integrated circuit package

Also Published As

Publication number Publication date
US6646881B1 (en) 2003-11-11

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Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees