TW579540B - Method of processing a semiconductor wafer and substrate for semiconductor wafers used in the same - Google Patents
Method of processing a semiconductor wafer and substrate for semiconductor wafers used in the same Download PDFInfo
- Publication number
- TW579540B TW579540B TW91122042A TW91122042A TW579540B TW 579540 B TW579540 B TW 579540B TW 91122042 A TW91122042 A TW 91122042A TW 91122042 A TW91122042 A TW 91122042A TW 579540 B TW579540 B TW 579540B
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor wafer
- substrate
- scope
- processing
- patent application
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 217
- 239000000758 substrate Substances 0.000 title claims abstract description 100
- 235000012431 wafers Nutrition 0.000 title claims description 208
- 238000012545 processing Methods 0.000 title claims description 27
- 238000000034 method Methods 0.000 title claims description 23
- 238000012546 transfer Methods 0.000 claims abstract description 12
- 238000005498 polishing Methods 0.000 claims description 35
- 238000005520 cutting process Methods 0.000 claims description 14
- 230000002079 cooperative effect Effects 0.000 claims description 8
- -1 polyethylene terephthalate Polymers 0.000 claims description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 5
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 229920000098 polyolefin Polymers 0.000 claims description 4
- 238000007517 polishing process Methods 0.000 claims 1
- 238000003672 processing method Methods 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 230000001681 protective effect Effects 0.000 description 5
- 238000003860 storage Methods 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 238000001723 curing Methods 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 239000004838 Heat curing adhesive Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000875 corresponding effect Effects 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001182766 | 2001-06-18 | ||
| JP2001368158A JP4074758B2 (ja) | 2001-06-18 | 2001-12-03 | 半導体ウエーハの加工方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW579540B true TW579540B (en) | 2004-03-11 |
Family
ID=26617074
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW91122042A TW579540B (en) | 2001-06-18 | 2002-09-25 | Method of processing a semiconductor wafer and substrate for semiconductor wafers used in the same |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4074758B2 (enrdf_load_stackoverflow) |
| TW (1) | TW579540B (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI475608B (enrdf_load_stackoverflow) * | 2012-06-04 | 2015-03-01 | ||
| TWI787535B (zh) * | 2018-07-26 | 2022-12-21 | 日商迪思科股份有限公司 | 晶圓加工方法 |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005039114A (ja) * | 2003-07-17 | 2005-02-10 | Disco Abrasive Syst Ltd | 半導体ウェーハ移し替え装置 |
| JP2005086074A (ja) * | 2003-09-10 | 2005-03-31 | Disco Abrasive Syst Ltd | 半導体ウェーハの移し替え方法 |
| JP5595790B2 (ja) * | 2010-05-27 | 2014-09-24 | 株式会社ディスコ | ウエーハの加工方法 |
| JP6746211B2 (ja) * | 2016-09-21 | 2020-08-26 | 株式会社ディスコ | ウェーハの加工方法 |
| JP7075268B2 (ja) * | 2018-04-12 | 2022-05-25 | 株式会社ディスコ | 研削装置 |
| JP7201342B2 (ja) * | 2018-06-06 | 2023-01-10 | 株式会社ディスコ | ウエーハの加工方法 |
| JP7376322B2 (ja) | 2019-11-06 | 2023-11-08 | 株式会社ディスコ | 樹脂シート固定装置 |
-
2001
- 2001-12-03 JP JP2001368158A patent/JP4074758B2/ja not_active Expired - Lifetime
-
2002
- 2002-09-25 TW TW91122042A patent/TW579540B/zh not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI475608B (enrdf_load_stackoverflow) * | 2012-06-04 | 2015-03-01 | ||
| TWI787535B (zh) * | 2018-07-26 | 2022-12-21 | 日商迪思科股份有限公司 | 晶圓加工方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2003077869A (ja) | 2003-03-14 |
| JP4074758B2 (ja) | 2008-04-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK4A | Expiration of patent term of an invention patent |