TWI475608B - - Google Patents

Info

Publication number
TWI475608B
TWI475608B TW101119948A TW101119948A TWI475608B TW I475608 B TWI475608 B TW I475608B TW 101119948 A TW101119948 A TW 101119948A TW 101119948 A TW101119948 A TW 101119948A TW I475608 B TWI475608 B TW I475608B
Authority
TW
Taiwan
Application number
TW101119948A
Other languages
Chinese (zh)
Other versions
TW201351492A (zh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW101119948A priority Critical patent/TW201351492A/zh
Publication of TW201351492A publication Critical patent/TW201351492A/zh
Application granted granted Critical
Publication of TWI475608B publication Critical patent/TWI475608B/zh

Links

TW101119948A 2012-06-04 2012-06-04 利用加熱刀具切割晶圓貼合膜的裝置及方法 TW201351492A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW101119948A TW201351492A (zh) 2012-06-04 2012-06-04 利用加熱刀具切割晶圓貼合膜的裝置及方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW101119948A TW201351492A (zh) 2012-06-04 2012-06-04 利用加熱刀具切割晶圓貼合膜的裝置及方法

Publications (2)

Publication Number Publication Date
TW201351492A TW201351492A (zh) 2013-12-16
TWI475608B true TWI475608B (enrdf_load_stackoverflow) 2015-03-01

Family

ID=50158112

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101119948A TW201351492A (zh) 2012-06-04 2012-06-04 利用加熱刀具切割晶圓貼合膜的裝置及方法

Country Status (1)

Country Link
TW (1) TW201351492A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104526891B (zh) * 2014-12-18 2017-01-11 浙江中纳晶微电子科技有限公司 采用机械刀具切割晶圆的方法
CN114843179A (zh) * 2022-06-10 2022-08-02 上海积塔半导体有限公司 晶圆的减薄方法
CN115194861A (zh) * 2022-06-30 2022-10-18 河南通用智能装备有限公司 一种热切刀

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW579540B (en) * 2001-06-18 2004-03-11 Disco Corp Method of processing a semiconductor wafer and substrate for semiconductor wafers used in the same
TW201125018A (en) * 2009-09-29 2011-07-16 Nitto Denko Corp Method and apparatus for separating protective tape

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW579540B (en) * 2001-06-18 2004-03-11 Disco Corp Method of processing a semiconductor wafer and substrate for semiconductor wafers used in the same
TW201125018A (en) * 2009-09-29 2011-07-16 Nitto Denko Corp Method and apparatus for separating protective tape

Also Published As

Publication number Publication date
TW201351492A (zh) 2013-12-16

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