TW577981B - Method and apparatus for inspecting flaw - Google Patents

Method and apparatus for inspecting flaw Download PDF

Info

Publication number
TW577981B
TW577981B TW090102533A TW90102533A TW577981B TW 577981 B TW577981 B TW 577981B TW 090102533 A TW090102533 A TW 090102533A TW 90102533 A TW90102533 A TW 90102533A TW 577981 B TW577981 B TW 577981B
Authority
TW
Taiwan
Prior art keywords
plate member
light
inspection
inspection object
transmitting plate
Prior art date
Application number
TW090102533A
Other languages
English (en)
Chinese (zh)
Inventor
Mitsuhiro Kitagawa
Shigeru Yuki
Original Assignee
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Application granted granted Critical
Publication of TW577981B publication Critical patent/TW577981B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G01B11/303—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces using photoelectric detection means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/16—Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G01B11/306—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces for measuring evenness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/30—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring roughness or irregularity of surfaces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
    • G01M11/08—Testing mechanical properties
    • G01M11/081—Testing mechanical properties by using a contact-less detection method, i.e. with a camera

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
TW090102533A 2000-02-14 2001-02-06 Method and apparatus for inspecting flaw TW577981B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000034810A JP2001228091A (ja) 2000-02-14 2000-02-14 欠陥検査方法及びその装置

Publications (1)

Publication Number Publication Date
TW577981B true TW577981B (en) 2004-03-01

Family

ID=18559096

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090102533A TW577981B (en) 2000-02-14 2001-02-06 Method and apparatus for inspecting flaw

Country Status (3)

Country Link
JP (1) JP2001228091A (ko)
KR (1) KR100417764B1 (ko)
TW (1) TW577981B (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2839147B1 (fr) * 2002-04-30 2004-07-09 Soitec Silicon On Insulator Dispositif et procede de controle automatique de l'etat de surface de plaque par mesure de vitesse de collage
JP5190433B2 (ja) * 2009-10-27 2013-04-24 日東電工株式会社 配線回路基板の検査方法、配線回路基板の製造方法および配線回路基板の検査装置
CN107345789B (zh) * 2017-07-06 2023-06-30 深圳市强华科技发展有限公司 一种pcb板孔位检测装置及方法
CN107472866B (zh) * 2017-08-11 2023-07-14 上海凯思尔电子有限公司 一种用于pcb板aoi工序的双层流转系统

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0154559B1 (ko) * 1993-06-30 1998-12-01 가나이 쯔또무 결함 레티클 검사장치 및 방법

Also Published As

Publication number Publication date
JP2001228091A (ja) 2001-08-24
KR100417764B1 (ko) 2004-02-05
KR20010082128A (ko) 2001-08-29

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees