TW570966B - A curable adhesive composition for use in microelectronic devices - Google Patents
A curable adhesive composition for use in microelectronic devices Download PDFInfo
- Publication number
- TW570966B TW570966B TW090108606A TW90108606A TW570966B TW 570966 B TW570966 B TW 570966B TW 090108606 A TW090108606 A TW 090108606A TW 90108606 A TW90108606 A TW 90108606A TW 570966 B TW570966 B TW 570966B
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- carbon atoms
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- alkyl group
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Description
經濟部智慧財產局員工消費合作社印製 570966 A7 一 B7 五、發明說明(i) 本案爲1999年六月18日提出之第09/336,245號案之部 份繼續申請案〇 本發明領域 本發明有關適合用作微電子元件或半導體封裝黏著劑 之組合物〇 本發明背景 黏著劑組合物,尤其導電性黏著劑,係在半導體封裝 及微電子元件之製作及組裝中用於各種目的〇較突顯之用 法爲將積體電路晶片黏合於引線框或其他基質,及將電路 封裝或總成黏合於印刷線路板〇 對電子包裝作業中導電性黏著劑之要求爲其等須具有 良好之機械强度、不影響組件或載體之固化性質、及與目 前工業中所用現有塗施設備相容之觸變性質〇 黏著劑黏合或交連技藝之另一重要情況爲黏接頭再加 工之能力〇對於涉及大體積物品之單一晶片包裝作業而言 ,可將故障之晶片丟棄而無顯著損失◦然而,丟棄僅有一 故障晶片之複晶片封裝則屬昂貴;準此,故障晶片再加工 之能力將爲製作上之優點0現今,半導體工業之一主要推 力爲開發各種符合所有黏著劑强度及撓性要求,但亦可再 加工之黏著劑,亦即將能予移除而不破壞基質。 本發明綜述 本發明有關一種用於電子裝置之黏著劑組合物,包含 一或更多單或多官能順丁烯二醯亞胺化合物或者一或更多 順丁烯二醯亞胺化合物以外之單或多官能乙烯基化合物或 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297 (請先閱讀背面之注意事項再填寫本頁) ,-裝------r-ltr---------一 570966 A7 137 五、發明說明(2) 者順丁烯二醯亞胺與乙烯基化合物之組合、一固化起發劑 、及隨意之一或更多填料之可固化組合物〇該組合物係設 計成可再加工〇 在另一具體形式中,本發明爲該由上述可固化黏著劑 組合物產生之固化黏著劑0 在另一具體形式中,本發明爲一種微電子總成,包含 一用一固化黏著劑組合物黏合於基質之電子組件,該組合 物係由一包含一或更多單或多官能順丁烯二醯亞胺化合物 或者一或更多單或多官能乙烯基化合物或者順丁烯二醯亞 胺與乙烯基化合物之組合、一固化起發劑、及隨意之一或 更多填料之組合物所製備〇 本發明詳诚 用於本發明黏著劑組合物中之順丁烯二醯亞胺及乙烯 基化合物乃可固化之化合物,意指其等能進行聚合反應, 不論有無交聯。如說明書中所用,固化意指進行聚合,不 論有無交聯〇如業界所了解,交聯作用爲二聚合物鏈藉一 元素、分子基團、或化合物之橋接而附著,且一般而言在 加熱時發生。當交聯密度增加時,物質性質可由熱塑性改 變至熱固性〇 藉由單或多官能化合物之正確選擇及用量有可能製備 寬廣交聯密度範圍之聚合物Q多官能化合物之反應部份愈 大,交聯密度愈大。若需要熱塑化性質,該等黏著劑組合 物可由單官能化合物製備以限制交聯密度〇可添加小量之 多官能化合物以對該組合物提供一些交聯作用及强度,唯 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297 (請先閱讀背面之注意事項再填寫本頁) 裝 訂: 經濟部智慧財產局員工消費合作社印製 570966 A7 __B7 ____ 五、發明說明(3) 多官能化合物之量限制於不使所需熱塑化性質消失之量0 在此等參數內,個別黏著劑之强度及彈性可裁修以適應特 定之最終用途0 在必需將該總成再加工及使用熱塑性物質之情況下, 電子組件可予撬離基質,並可將任何殘餘黏著劑加熱直到 其軟化而易移除爲止〇 交聯密度亦可加以控制,以給予該已固化黏著劑一寬 廣範圍之玻璃轉變溫度,以承當後續之處理及操作溫度〇 在本發明黏著劑組合物中,順丁烯二醯亞胺及乙烯基 化合物可單獨或組合使用。該順丁烯二醯亞胺或乙烯基化 合物或二者在可固化封裝黏著劑組合物內之存在量,以存 在之有機成份(不含任何填料)爲準爲2至98重量% 〇 該黏著劑組合物進一步包含至少一自由基起發劑,其 定義爲一種分解成具有一或更多未配對電子、高度反應且 通常壽命短之分子片段之化學物種,能藉由鏈機制起發化 學反應〇該自由基起發劑存在量爲該等有機化合物(不含 任何填料)重量之〇·1至10%,較佳爲ϋ·1至3.0 % 〇該 經濟部智慧財產局員工消費合作社印製 -------------裳·-- (請先閱讀背面之注意事項再填寫本頁) .% 自由基固化機制提供迅速之固化,並對該組合物提供固化 前之長架儲壽命〇較佳之自由基起發劑包括過氧化物譬如 過辛酸丁酯及過氧化雙異丙苯以及偶氮化合物譬如2,2,-偶氮雙(2 -甲基丙腈)及2,2’-偶氮雙(2_甲基丁腈)〇 另法,各黏著劑組合物可含有光起發劑以取代自由基 起發劑’然後可藉紫外線照射起發固化程序〇光起發劑之 存在量爲該等有機化合物(不含任何填料)之重量之0.1 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公_ ) ""' 570966 A7 137 經濟部智慧財產局員工消費合作社印製 五、發明說明(4) 至1 0 %,較佳爲〇 · 1至3 · 0 % 0有些情況下,光起發及熱 起發二者可能均皆合宜。舉例言之,固化程序可藉紫外線 照射起始,而在稍後之處理步驟中,可藉加熱完成自由基 固化而完成固化作用0 一般而言,此等組合物將在80-2 0 0 °C之溫度範圍內固 化,而固化作用將在少於1至60分鐘之時間長度內完成。 如一般所了解,每一黏著劑組合物之時間及溫度態樣均有 變化,故可設計不同之組合物以提供適合特定工業製作程 序之固化態樣〇 合宜之黏著劑用導電性填料爲銀、銅、金、鈀、鉑。 於某些情況成,可能需要非導電性填料以例如調節流變性 ,譬如明礬、矽石、及鐵佛龍〇 如說明書通篇所用,符號C ( 0 )係指羰基團〇 順丁烯二醯亞胺化合物 適用於本發明黏著劑組合物之順丁烯二醯亞胺化合物 具有一由通式[M-Xm]n-Q或通式[M-Zm]n-K所代表之結構 〇對於此等特定通式,當小寫爲整數1時,該化合物 將爲一單官能化合物;而當小寫"η ”爲整數2至6時,該 化合物將爲一多官能化合物〇 在通式[M-Xm]n-Q代表之化合物中: Μ爲具有下列結構式之順丁烯二醯亞胺部份:
本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公 (請先閱讀背面之注意事項再填寫本頁) 裝 ---1 I 訂*--------- % 570966 A7 B7 五、發明說明(5) 式中R1爲Η或L至C5烷基; 每一 X獨立爲一由具有下列結構式(ί )至(IV )之芳香 族基團中選出之芳香族基團: 0) (II) (III)
(IV) ——C—ΝΗ— Q爲線性或有支鏈烷基、烷基氧基、烯烴、烯氧基、 芳基、芳基氧基、院胺、院硫化物、稀肢、嫌硫化物、或 芳基硫化物等物種,可含有自該鏈懸垂或作爲該鏈部份主 幹之飽和或不飽和環狀或雜環狀取代基,且其中存在之任 何雜原子可能或可能不直接附接於X ; 或者Q爲具有下列結構之胺基甲酸乙酯: ;. 〇 0 0 0 —R2 一X一C—NH一(〇,#一0—S一NH“R3-NH廉? 式中R2獨立爲一具有1至18個碳原子之烷基、芳基、或芳 基烷基;R3爲一在鏈內有高至100個原子之烷基或烷基氧 基鏈,該鏈可含有芳基取代基;X爲〇、S、N或P ;而7 爲〇至50 ; 或者Q爲具有下列結構式之酯: 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297 (請先閱讀背面之注意事項再填寫本頁) 裝---------- 訂------ 經濟部智慧財產局員工消費合作社印製 570966 Α7 ______ Β7 五、發明說明(6) 〇 0 一C一 〇—R3一〇— 中一 式中R3爲一在鏈內有高至100個原子之烷基或烷基氧基鏈 ,該鏈可含有芳基取代基; 或者Q爲具有下列結構式之矽氧烷·· -(CR^je-tSiR^Olr-SiRS-CCR^ig-式中每一位置之R1取代基獨立爲Η或一具有1至5個碳原 子之烷基團,且每一位置之R4取代基獨立爲Η 、一具有1 至5個碳原子之烷基團、或一芳基團,而e及g獨立爲1 至1〇且f爲1至50 ;而 m爲〇或1 ,且η爲1至6〇 較佳之組合物爲脂肪族雙順丁烯二醯亞胺化合物類, 其中順丁烯二醯亞胺部份係經由胺基甲酸乙酯或尿素鍵合 連接於該主幹,譬如在下列較佳化合物中者: (請先閱讀背面之注意事項再填寫本頁) 裝 訂·
本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公 570966 A7 _ B7 五、發明說明(7) 在通式[M-Zm]n-K代表之化合物中: Μ爲一具有下列結構式之順丁烯二醯亞胺部份: RV/ N— 0 式中R1爲Η或1至05烷基; Ζ爲線性或有支鏈烷基、烷基氧基、烷胺、烷硫化物 、烯烴、烯氧基、烯胺、烯硫化物、芳基、芳基氧基或芳 基硫化物等物種,可含有自該鏈懸垂或作爲該鏈部份主幹 之飽和或不飽和環狀或雜環狀取代基,且其中存在之任何 雜原子可能或可能不直接附接於Κ ; 或者Ζ爲具有下列結構之胺基甲酸乙酯: 0 〇〇 〇 一一X一C一NH^R^-N Η-Ό一(〇—(^一0—C~ N H—R3- N H-C-)~ X—一 式中R2獨立爲一具有1至18個碳原子之烷基、芳基、或芳 基烷基;R3爲一在鏈內有高至100個原子之烷基或烷基氧 基鏈,該鏈可含有芳基取代基;X爲0、S、N或P ;而乂 爲〇至50 ; 或者Z爲具有下列結構式之矽氧烷·· -(CRS )e-[SiR42-〇]f-SiR42-(CR12 )g-式中每一位置之R1取代基獨立爲Η或一具有1至5個碳原 子之院基團,且每一位置之R4取代基獨立爲Η 、一具有1 至5個碳原子之烷基團、或一芳基團,而e及g獨立爲1 至10且f爲1至50 ; κ爲一由具有下列結構式(v)至(X II)之芳香族基團 本紙張尺度適用中國國家標準(CNS)A4規格(210 x 297公 (請先閱讀背面之注意事項再填寫本頁) 裝---- 訂-丨 經濟部智慧財產局員工消費合作社印製 137570966 經濟部智慧財產局員工消費合作社印製 五、發明說明(8) 中選出之芳香族基團(雖然僅有一鍵可予顯示以代表與芳 香族基團K之連接,但此將被視爲代表任何如以n所述及 定義之額外鍵數): (V) (V!)
式中p爲1至100 ; (VII)
(請先閱讀背面之注意事項再填寫本頁) -I * i n iM— n i ii ϋ 一-ejΓ ϋ n n n n n i I » 式中R5、R6及R7爲線性或有支鏈烷基、烷基·氧基、烷胺、 烷硫化物、烯烴、烯氧基、烯胺、烯硫化物、芳基、芳基 氧基、或芳基硫化物等物種,可含有自該鏈懸垂或作爲該 鏈部份主幹之飽和或不飽和環狀或雜環狀取代基,且其中 存在之任何雜原子可能或可能不直接附接於該芳香族環; 或者R5、R6及R7爲具有下列結構式之矽氧烷: -(CR^ )e.[SiR42-〇]f-SiRS-(CH3 )g- 式中R1取代基爲Η或一具有1至5個碳原子之烷基團,且 每一位置之R4取代基獨立爲一具有1至5個碳原子之烷基 團或一芳基團,而e爲1至10且f爲i至5〇; 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公&) ---- 570966
經濟部智慧財產局員工消費合作社印製 Λ7 Β7 五、發明說明(9)
(XII)
而m爲0或1 ,且11爲1至6 〇 較佳之順丁烯二醯亞胺化合物尤其用作可再加工性組 合物者爲N-丁基苯基順丁烯二醯亞胺及恥乙基苯基順丁烯 二醯亞胺0 乙烯基化合物 適用於本發明黏著劑組合物之乙烯基化合物(非本文 中之順丁烯二醯亞胺類)具有下列結構式:
對於此等特定結構,當小寫"η ”爲整數1時,該化合 物將爲一單官能化合物;而當小寫"η "爲整數2至6時, 該化合物將爲一多官能化合物。 在此等結構中,Κ1及Κ2爲Η或一有1至5個碳原子之 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297坌 (請先閱讀背面之注意事項再填寫本頁)
570966 Λ7 B7 五、發明說明(10) 烷基;或與形成乙烯基團之碳形成一 5至9個成員之環狀 (請先閱讀背面之注意事項再填寫本頁) 物;B 爲 C、S、N、0、C(0)、O-C(O)、◦(0)-〇、C(0)NH、 或C(0)N(R8 ),其中R8爲Cl至C5烷基;m爲〇或1 ; η爲 1-6 ;而X、Q、Z及Κ均如上述。 B 較佳爲 0、C(0)、C(0)-0、C(0)NHSC(0)N(R8); B 更佳爲 0、C(0)、0-C(0)、C(0)-0、或 C(0)N(RM ◦ 作爲黏著劑之較佳乙烯基化合物爲乙烯基醚或稀硫化 物〇合宜乙烯基化合物之實例如下: 〇 0 ⑶私叫\s / a(ch 如 ch3 及 \/。-(CH2)36-。. 其他組合物成份 經濟部智慧財產局員工消費合作社印製 視該封裝包覆劑所將黏結之基質之本質而定,包覆劑 亦可含有偶聯劑。本文中所用偶聯劑爲一含有供與順丁烯 二醯亞胺及其他乙烯基化合物反應之可聚合官能基團以及 一能與存在於基質表面上之金屬氫氧化物縮合之官能基團 之化學物種。此等偶聯劑及在特定基質組合物內之較佳用 量均已知於業界。合宜之偶聯劑爲矽烷、矽酸酯、金屬丙 烯酸酯或甲丙烯基酸酯、鈦酸酯、及含有鉗合配位體譬如 膦、硫醇、及乙醯乙酸鹽之化合物0當存在時,偶聯劑典 型用量高至順丁烯二醯亞胺及其他單官能乙烯基化合物之 1〇重量%,而較佳量爲〇·ΐ-3·〇重量% 〇 此外,各包覆劑組合物含有對所得已固化組合物賦予 額外撓性及韌性之化合物。此等化合物可爲任何Tg爲或小 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297兮&)_ 570966 A7 B7 五、發明說明(n) 於5 0 °C之熱硬性或熱塑性物質,且典型爲以圍繞化學鏈自 由旋轉、存在醚基團、及欠缺環狀物結構爲特徵之聚合物 質〇合宜之此等變性劑包括聚丙烯酸酯、聚(丁二烯)、 聚THF (聚合四氫呋喃)、CTBN (羧基端接丁腈)橡膠、 及聚丙二醇Q當存在時,韌化用化合物典型用量約高至順 丁烯二醯亞胺及其他單官能乙烯基化合物之15重量% 〇 若砂氧綜部份不爲順丁烯二醯亞胺或乙烯基化合物結 構之一部份,則矽氧烷可添加於各封裝包覆劑配方以賦予 彈性〇合宜之矽氧烷爲甲丙烯氧基丙基端接之聚二甲基矽 氧烷及胺基丙基端接之聚二甲基矽氧烷,可購自聯合化學 技藝公司及其他公司〇 亦可添加種類及用量均爲業界熟練人士已知之其他添 加物,譬如黏著促進劑〇 操作特性 此等組合物將在晶片黏附用黏著劑之商業可接受範圍 內操作〇對80 X 80平方密耳矽晶片之黏著劑商業可接受晶 片剪力値在室溫時之範圍爲大於或等於1千克,而於240 °0時爲大於或等於〇·5千克,而對50ϋχ500平方密耳晶片 之彎曲量在室溫時爲小於或等於70微米〇 熱膨脹係數(CTE)爲旣定物質每單位溫度變化之尺寸 之變化。不同物質將具有不同之膨脹率。若附接於一處之 各元素爲不同之CTE ,則熱循環會導致各附接之元素彎屈 、破裂、或層離〇在典型半導體總成中,晶片之CTE範圍 爲2或3ppm/t:;對於有機電路板基質,CTE大於30 ppm 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297 (請先閱讀背面之注意事項再填寫本頁) 裝·-------—訂'------- 經濟部智慧財產局員工消費合作社印製 570966 Λ7 Β7 五、發明說明(12) / t ;因此,黏著劑之CTE最佳爲介於基質與晶片者〇 當聚合物受到加熱時,將經由一介於堅硬玻璃狀態至 柔軟橡膠狀態之轉換區域移動◦此區域稱爲玻璃轉變區域 或Tg 〇若繪製聚合物之膨脹對溫度之圖形,玻璃轉變區域 爲較低溫度/玻璃狀區域熱膨脹係數與較高溫度/橡膠狀 區域熱膨脹係數間之交點〇高於此區域,膨脹率顯著增高 〇因此,該聚合物之玻璃轉變溫度較佳爲高於塗施期間所 經驗之正常操作溫度,而在需要可再加工性時,玻璃轉變 溫度較佳爲低於任何再加工溫度〇 本發明之另一具體形式包括各種具有本文中所述通式 [M-Xro]n-Q及[M-Zm]n-K之順丁烯二醯亞胺,式中Q及Z 可爲具有下列結構式之酯: 0 0 0 〇
1 II II II II 一卜-。一 ¢- r3- ci—〇—r3 ” δ—' R广 δ ~ 〇一 或下列結構之酯: :? 0 0 0 卜3_ C— R3冬。-。一尺3— 0- C一 R^4p~ 1 式中p爲1至100 ; 每一:R3可獨立爲一在鏈內有高至1 00個原子之烷基或烷基 氧基鏈,該鏈可含有芳基取代基;或者 具有下列結構式之矽氧烷: -(CR12)e-[SiR42-〇]f-SiRS-(CR12)g-式中每一位置之R1取代基獨立爲Η或一具有1至5個碳原 子之烷基團,每一位置之W取代基獨立爲一具有1至5個 本紙張尺度適用中國國家標準(CNS)A4規格(21〇 X 297 (請先閒讀背面之注意事項再填寫本頁) Γ
經濟部智慧財產局員工消費合作社印製 570966 Λ7 ___ 137______ 五、發明說明(13) 碳原子之烷基團或一芳基團,e及g獨立爲1至10,且f 爲1至50 〇 本發明之另一具體形式包括具有下列本文中所述結構 式之乙烯基化合物:
式中 B 爲 C、 S、 N、 0、 C(0)、 0-C(0)、 C(0)-0、 C(0)NH、 或C(0)N(R8),其中^爲^至^烷基ο 本發明之另一具體形式包括具有下列本文中所述結構 式之乙烯基化合物: (請先閱讀背面之注意事項再填寫本頁)
經濟部智慧財產局員工消費合作社印製 式中Q及Ζ可爲具有下列結構式之酯: 〇 〇 0 0 〜R,。- C - R3-C -。- R3 1R3-各-。- R34jj 或下列結構之酯: 〇 0 0 0 一|(V C— 0— R3-〇一。一 R34 C— 0—R3-〇-C-R34p·
I 式中p爲1至100 ; 每一R3可獨立爲一在鏈內有高至1〇〇個原子之烷基或烷基 氧基鏈,該鏈可含有芳基取代基;或者 具有下列結構式之矽氧烷: 本紙張尺度適用中國國家標準(CNSM4規格(210 X 297~i^ 570966
五、發明說明(14) -(CR1 2 )e-[SiR4 2 -0]f-SiRS -(CR12 )g- (請先閱讀背面之注意事項再填寫本頁) 式中每一位置之P取代基獨立爲H或一具有1至5個碳原 子之烷基團,每一位置之R4取代基獨立爲一具有1至5個 碳原子之烷基團或一芳基團,e及g獨立爲1至1〇,且£ 爲1至50 〇 本發明之另一具體形式包括如本文中所述含有陰離子 性或陽離子性固化起發劑之可固化黏著劑組合物0此等起 發劑之類型及有用量均詳知於業界〇 實例 將各種順丁烯二醯亞胺及乙烯基化合物製備及配製成 黏著劑組合物。該等組合物予調查未固化組成之黏滯度及 觸變指數,以及已固化組成之固化態樣、玻璃轉變溫度、 熱膨脹係數、熱機械分胡1、及一些情況下之可再加工性。 實例1 丁二烯一歴稀腈雙順丁烯二醯亞胺之製備 H2^rγ^^NHί ch3 ‘丄八/ 經濟部智慧財產局員工消費合作社印製
C三N
CH,
1·罐了瑪=酸断内_ I 2. Ac20, NaOAc, Et3N
本紙張尺度適用中國國家標準(CNS)A4規格(210 x 297坌 570966 經濟部智慧財產局員工消費合作社印製 Λ7 B7 五、發明說明(15) 胺基端接之丁二烯一丙烯腈(BF Goodrich公司所售 Hycar樹脂1 3 0 0 XU ATBN ,該結構內之m及11整數提供 3600之數平均分子量)(4 5 0克,50 0毫摩爾,以胺當量 AEW =450克爲準)溶解於配備以添加用漏斗、機械攪拌器 、內部溫度探針及氮氣入口 /出口之3升裝四頸燒瓶內之 CHC13 (1000毫升)中0將已攪拌之溶液置於氮氣下並於 冰浴上冷卻。將在C H C 13 ( 5 0毫升)中之順丁烯二酸酐( 9 8 · 1克,1摩爾)注入添加用漏斗內,並以3 〇分鐘時間將 此溶液加於反應內,而內部反應溫度維持低於1 〇 ec 〇此混 合物於冰上攪拌3 0分鐘,然後溫熱至室溫並額外攪拌4小 時0對所得獎液添加乙酸酐(Ac20) (65ΰ·4克,6摩爾) 、三乙胺(Et3N) (64·8克,0.64摩爾)及乙酸鈉(NaOAc) (62 · 3克,0 · 7 6摩爾)〇將反應加熱至溫和迴流溫度達5 小時,讓其冷卻至室溫,並續用水(1升)、飽和碳酸氫 鈉(1升)及水(2X1升)萃取〇於眞空移除溶劑以產生 順丁烯二醯亞胺端接之丁二烯丙烯腈〇 實例2 製·^由三(環氧基丙基)異m尿酸衍φ夕 丁烯二醢亞胺)
本紙張尺度適用中國國家標準(CNS)A4規格(210 x 297含 (請先閱讀背面之注意事項再填寫本頁)
570966 A7 B7 五、發明說明(16)
解於配備以機械攪拌器、內部溫度探針及氮氣入口 /出口 之2升裝三頸燒瓶內之THF ( 500毫升)中。對此溶液添 加羥基苯基順丁烯二醯亞胺(189 ·2克,1摩爾)及苯甲 基二甲基胺(1 .4克,0·ϋ5重量% ) 〇該溶液加熱至80 達7小時〇然後讓反應冷卻至室溫,過濾,並用5 %氯化 氫水液(5 0 0毫升)及蒸餾水(1升)沖洗濾液。所得三 氮哄三(順丁烯二_亞胺)固體於室溫予眞空乾燥〇 實例3 順丁烯二醯亞胺某棕櫚酸酯之製備 --------------裝--- (請先閱讀背面之注意事項再填寫本頁) -1丨訂: 經濟部智慧財產局員工消費合作社印製
0 1 H3C(H2C)14/SCI 0 H〇"\/N,
ο ο
棕櫚醯氯(274 ·9克,1摩爾)溶解於配備以機械攪 拌器、內部溫度探針、添加用漏斗及氮氣入口 /出口之2 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297 570966 A7 _ B7 五、發明說明(17) 升裝三頸燒瓶內之二乙醚(5 0 〇毫升)中。添加在蒸餾水 (5 0 0毫升)中之碳酸氫鈉(8 4 · 0克,1摩爾),劇烈攪 拌,並於氮氣下之冰浴上將溶液冷卻〇將在二乙_( 1 〇 〇 毫升)中之羥基乙基順丁烯二醯亞胺(Ml克,1摩爾) 注入添加用漏斗內,並以3 Q分鐘時間將此溶液添加於反應 內,內部溫度於添加期間維持< 1 0 °C 〇在冰上另外攪拌該 反應30分鐘,然後讓其溫熱至室溫並攪拌4小時。將反應 移至分離漏斗,並用蒸餾水(500毫升)、5 %氯化氫水 液(50G毫升)及蒸餾水(2χ 5〇〇毫升)沖洗已分離之有 機層。有機物予分離,於無水硫酸鎂上乾燥,過濾並於眞 空移除溶劑,以產生脂肪族順丁烯二醯亞胺〇 實例4 製備一由5 -異氣酸鹽基(異氰酸鹽基甲某)_ 1 順丁嫌二觸亞胺 (請先閱讀背面之注意事項再填寫本頁) * ---- n n —Γ ·1 一口 r ^ n I— mmmam 1» ϋ ·
570966 A7
五、發明說明(18) 5-異m酸鹽基(異氰酸鹽基甲基卜i,3,3 -三甲基環 己烷(111 · 1 5克,0 · 5摩爾)於配備以機械攪拌器、添加 用漏斗及氮氣入口 /出口之1升裝三頸燒瓶內之THF (500 毫升)中媒合〇將反應置於氮氣下,並添加二丁錫二月桂 酸酯(觸媒S η 1 1 ) ( 6 · 3 1克,1 〇毫摩爾)及羥基乙基順丁 烯二醯亞胺(1 4 1克,1摩爾)同時攪袢,且於7 (TC將所 得混合物加熱4小時。將溶於THF (1〇ϋ毫升)中之徑基 乙基順丁烯二醯亞胺(141克,1摩爾)注入添加用漏斗 內0以30分鐘時間將此溶液添加於異氰酸鹽溶液,所得混 合物於7 0 °C額外加熱4小時。讓反應冷卻至室溫並於眞空 移除溶劑〇將殘留之油溶於CH2 C 12 ( 1升)中,並用1 0 % 氯化氫水液(1升)及蒸餾水(2 X 1升)沖洗〇已分離之 有機物於硫酸鎂上乾燥,過濾並於眞空移除溶劑,以產生 順丁烯二醯亞胺〇 實例5 製備由P r i ρ ο 1 2 0 3 3衍生之二聚乙烯B沫
雙(1,10-啡啉)Pd(0Ac)2 ( 0·21 克,0·54毫摩爾)在 氮氣下溶解於配備以機械攪拌器之2升裝三頸燒瓶內之丁 基乙烯基醚(8.18克,81.7毫摩爾)、庚烷(1〇〇毫升) 與'"二聚二醇"(由Unichema公司以Pnpol 2 0 3 3銷售, 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公# --------------裝--- (請先閱讀背面之注意事項再填寫本頁) 訂.· 經濟部智慧財產局員工消費合作社印製 570966 A7 B7 五、發明說明(19) 15.4克,27. 2毫摩爾)所成混合物中。該溶液加熱至輕緩 迴流達6小時〇讓溶液冷卻至室溫,並續倒於活性碳(2 0 克)上且攪拌1小時〇過濾所得漿液,並於眞空移除超量 之丁基乙烯基醚及庚烷以產生爲黃色油之乙烯醚0生成物 顯現可接受之4 NMR、FT-IR及13C NMU光譜特性。黏滯 度典型爲〜1 〇 〇厘泊。 實例6 製備由二聚二醇(Pripol 2033)衍生 t二聚二丙烯酯 ,
二聚二醇(Unichema公司之Pripol 2033 , 284.4 克 ,500毫升)在氮氣下溶解於配備以機械攪拌器、添加用 漏斗、及內部溫度探針之1升裝三頸燒瓶內之無水丙酮( 500毫升)中。對此溶液添加三乙胺(1〇1 ·2克,1摩爾 ),並在冰浴上將溶液冷卻至4 °C 〇將媒合於無水丙酮( 100毫升)中之丙烯醯氯(90.5克,1摩爾)注入添加用 漏斗內,並以60分鐘時間添加於已攪拌之反應溶液,內部 溫度維持< 1 〇 °C 〇在冰上額外攪拌此溶液2小時,然後讓 其溫熱至室溫並攪拌4小時〇經由旋轉蒸發器移除全部溶 劑,並於CH2 Cl2 ( 1升)中將殘留物媒合〇該溶液用5 % 氯化氫水液(8 0 0毫升)及水(2 X 8 0 0毫升)沖洗〇已分 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297兮 (請先閱讀背面之注意事項再填寫本頁) -I · ϋ n n n I L· .1^-r^Jit n t ί ϋ n ϋ n I · 經濟部智慧財產局員工消費合作社印製 570966 Λ7 B7 五、發明說明(20) 離之有機物於無水硫酸鎂上 ,以產生二丙烯酯油0 實例7 N-乙某苯某順丁烯二醯亞胺 將4-乙基苯胺(12.12 並緩慢添加於9 · 8 1克順丁烯 冷卻無水乙醚中之攪拌溶液 攪拌30分鐘。將淡黃色結晶 毫升)溶解順丁烯醯胺酸及 160 °C油浴中加熱。迴流3 置於1升裝燒杯內之冰水中 物並於己院中再結晶0收集 乾燥過夜〇 FTIR及NMR分析 特性◦ 實例8 雙(烯硫化物)之製備HCr\ 乾燥,過濾並於眞空移除溶劑 之製備 克)溶於 二酸酐在 〇添加完 過濾及乾 2〇克之乙 小時後, 並劇烈攪 之晶體物 顯示出乙 50毫升之無 10U毫升於 畢後,反應 燥。用乙酸 酸鈉0反應 將溶液冷卻 拌1小時〇 質於5 0°C眞 基順丁烯二 水乙醚中 冰浴中所 混合物予 酐(2 0 0 混合物於 至室溫, 吸濾生成 空烘箱內 _亞胺之 (請先閱讀背面之注意事項再填寫本頁)
D 0JI X 〇 cw 0H 經濟部智慧財產局員工消費合作社印製 觸媒η 52 ο οΑΑ0. ^,(CH2)1〇CH3 3C(H2C)i0^S^ 本紙張尺度適用中國國家標準(CNS)A4規格(2〗0 x 297 570966 Λ7 B7 五、發明說明(21) (請先閱讀背面之注意事項再填寫本頁) 二聚酸(以Unichema公司Empol商標銷售)( 5 7 4·6 克,1摩爾)及炔丙醇(1 12 · 1克,2摩爾)於配備以機 械攪拌及Dean-Stark蒸餾裝置之3升裝三頸燒瓶內之甲苯 (1升)中媒合◦添加濃硫酸(’ 5毫升)並迴流該溶液6 小時,直到共沸蒸餾出36毫升之水爲止。讓溶液冷卻至室 溫,用水(2 X 1升)沖洗,於無水硫酸鎂上乾燥,並於眞 空移除溶劑以產生爲油之炔丙酯中間產物〇
此酯中間產物(6 5 0 . 7克,1摩爾)在氮氣下於配備 以迴流冷凝器、機械攪拌器、及內部溫度探針之1升裝三 頸燒瓶內之THF ( 2ϋϋ毫升)中媒合。添加月桂基硫醇( 404.8克,2摩爾)及2, 2’-偶氮雙(2,4-二甲基戊睛) (以DuPont公司Vazo 52商標銷售,11克),並於油浴上 將所得混合物攪拌加熱至7 Q°C達7小時◦讓反應冷卻至室 溫並於眞空移除溶劑,以產生烯硫化物油〇 實例A 6-順丁烯二醯亞胺基己酸之製備 6-順丁烯二醯亞胺基己酸
0 經濟部智慧財產局員工消費合作社印製 用已知之方法合成酸功能性順丁烯二醯亞胺,即6 -順 丁烯二醯亞胺基己酸〇胺基己酸(100克,7.6X10-1摩 爾)溶解於配備以機械攪拌、內部溫度探針及添加用漏斗 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公g) 570966 A7 B7 五、發明說明(22) (請先閱讀背面之注意事項再填寫本頁) 之500毫升裝四頸燒瓶內之冰醋酸(50毫升)中。將順丁 烯二酸酐(74.8克,7·6χ1〇-ι摩爾)溶解於乙腈(75毫 升)中之溶液注入添加用漏斗內〇於室溫以1小時時間將 此溶液添加於胺基己酸,內部反應溫度維持小於3 5 °C 〇添 加完畢後將反應攪拌3小時〇將反應發液過濾,於7 0°C眞 空烘箱(P〜25 T)內將分離之濾液乾燥過夜,以產生166 及灰白色固體(95%) 〇生成物醯胺酸顯現與文獻資料一 致之FT-IR及1H NMR光譜特性〇 經濟部智慧財產局員工消費合作社印製 上述醯胺酸(I66克,VJXlO-1摩爾)於氮氣下在 配備以機械攪拌及Dean-Stark蒸餾裝置之1升裝三頸燒瓶 內之甲苯(2〇〇毫升)、苯(2〇〇毫升)與三乙胺(211 毫升,1 · 5 1摩爾)之溶液中媒合。將此溶液加熱至迴流溫 度達4小時,並將所生成之水收集於Dean-Stark阱內〇添 加蒸餾水(4 0 0毫升)於反應燒瓶以溶解生成物之三乙銨 鹽,後者在反應期間自總溶液大量分離Q將此水液層分離 ,用50%氯化氫予酸化至pH〜1 ,並用乙酸乙酯(600毫 升)萃取〇此有機層用蒸餾水(4 0 0毫升)沖洗〇已分離 之有機層於硫酸鎂上乾燥,繼於眞空移除溶劑以產生灰白 色固體(76· 2克,50% ) 〇生成物6-順丁烯二醯亞胺基己 酸在FT-IR及1H NMR攝譜術上與文獻物質相同〇 實例Β a二聚二酯雙順丁烯二醯亞胺〃之製備 a二聚二酯雙順丁烯二醯亞胺〃(及環狀異構物) 缮)- 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297 570966 A7
五、發明說明(23)
Γ%先閱讀背面之、注意事項再填寫本頁}
Pripol 2033 (11111(:1^1]^公司、、二聚二醇",92.4克 經濟部智慧財產局員工消費合作社印製
,1·69χΐ0_ι摩爾)、6-順丁烯二醯亞胺基己酸(75·〇克 ,3 · 5 5 X 1 0 - 1摩爾)及硫酸(〇 · 5 0毫升,〜8 · 5 X 1 0 - 3摩 爾)於氮氣下在配備以機械攪拌器、Dean-Stark阱及內部 溫度探針之1升裝四頸燒瓶內之甲苯(:300毫升)中製漿 0將反應加熱至輕緩迴流逹二小時,並將所生之水收集於 Dean-S tai*k阱內〇該阱予洩流並將〜50毫升之甲苯溶劑餾 離反應,以移除微量水分並將酯化平衡驅至完成。讓反應 冷卻至室溫,添加額外之甲苯(1 0 0毫升)(實驗室規模 上,於此處較佳爲添加二乙醚替代甲苯),並用飽和碳酸 氫鈉水液( 3 0 0毫升)及蒸餾水( 300毫升)沖洗溶液。 將有機層分離及於無水硫酸鎂上乾燥,並於眞空移除溶劑 以產生橘色油(107.2克,68%) 〇通過一*短柱之砂石或 礬土流洗樹脂之甲苯溶液可將該物質進一步純化〇此雙順 丁烯二醯亞胺樹脂液體顯現可接受之FT-U 、1 NMR、及 1 3 C NMR資料〇 r丨典型爲〜2 5 00厘泊〇 實例C _vv癸嫁二醇二酯雙暖J烯二醯亞胺〃之製遍 a癸烷二醇二酯雙順丁烯二醯亞胺" ^紙張尺度適用中國國家標準(CNS)A4規格(21〇 X 297公1) "— 一
570966 Α7 _ Β7 五、發明說明(24) 0 ; t 人。 6 〇
應用實例B中所述之一般步驟,用癸烷二醇(2 9 · 5克 ,1.69Xl〇-1摩爾)取代Pripol 2033 〇此程序產生中度 可溶性之雙順丁烯二醯亞胺固體(54 · 9克,58 % )〇生成 物顯現令人滿意2FT-IR及1H NMR資料〇 實例D ♦甘油三酯三(順:Γ烯二醯亞胺)〃之製備 0 0=^ 0 (請先閱讀背面之注意事項再填寫本頁) 〇 經濟部智慧財產局員工消費合作社印製 〇 人》^N ,、 il 0 利用實例B所列約定,用甘油(1 o . 4克,1 · 1 3 x 1 0- 1 摩爾)取代p r i ρ ο 1 2 ϋ 3 3 0生成物爲黏稠液體,顯現可接 受之FT-IR及1 Η ΝΜΚ資料。 實例Ε 製備a IPDI之雙(m-硝基苯甲基胺基甲酸i旨)〃
N 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297兮&)_ 〇Λ. Ο 異 摩爾) 及二丁 氣下於 2升裝 溶液加 異氰酸 )沖洗 體,後 實例F Μ vv 570966 A7 B7 五、發明說明(25) A IPDI之雙(m-硝基苯甲基胺基甲酸酯)〃 佛爾酮二異氰酸酯("IPDI ",10U · 0克,4 · 5 X ΙΟ-ν m-硝基苯 甲基醇 (137.8 克, 9.0X10-1 摩爾) 基錫二月桂酸酯(2·8克,4·5Χ10-3摩爾)在氮 配備以機械攪拌器、迴流冷凝器及內部溫度探針之 三頸燒瓶內之無水甲苯(1500毫升)中媒合。所得 熱至90°C達4小時。試樣固體部份之IR中未觀察到 酯波帶。讓溶液冷卻至室溫並用蒸餾水(10 〇毫升 〇將有機層分離並於眞空移除溶劑,以產生黃色液 者顯現可接受之FT-IR及1 Η NMK特性〇 IPDI之雙(m-胺基苯甲基胺基甲酸酯)〃 (請先閱讀背面之注意事項再填寫本頁) NH2
經濟部智慧財產局員工消費合作社印製 ♦ IPDI之雙(m-胺基苯甲基胺基甲酸酯)〃 實例£之二硝基化合物(8.28克,1.57\10-2摩爾) 在氮氣下溶解於配備以磁攪拌之5 0 0毫升裝三頸圓底燒瓶 內之乙醇(1〇〇毫升)中。添加環己烯(28 · 6毫升,2 · 82 X 10-1摩爾),繼以5 % Pd/C (鈀/碳)(4.14克)〇所 得漿液輕緩迴流6 · 5小時。此溶液一過濾等分量之FT- I R 於1 529厘米及1 3 5 2厘米·:不顯現硝基伸展波帶〇讓總溶 液冷卻至室溫並過濾〇於眞空移除溶劑以產生黃色半固體 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公 570966 A7 B7 五、發明說明(26) {請先閱讀背面之注意事項再填寫本頁}
(6.6克,90% ),後者顯現可接受之FT-IR及1Η NMK光 譜特性〇 實例G 製備a IPDI之雙(dM噴丁烯二醯亞胺菽采甲基
a IPDI之雙(m-順丁烯二醯亞胺基苯甲基胺基甲酸酯)〃 實例F之二胺(6·6克,1·41χ1〇ι摩爾)在氮氣下 於配備以機械攪拌器及添加用漏斗之2 5 0毫升裝四頸燒瓶 內之丙酿(60毫升)中媒合,並冷卻至4 eC 〇以30分鐘時 間將溶解於丙_ (20毫升)中之順丁烯二酸酐(2. 76克, 經濟部智慧財產局員工消費合作社印製 2 . 82 X 10- 2摩爾)〇所得溶液於4 °C攪拌1小時,並績讓 其溫熱至室溫並攪拌過夜〇 FT- I β分析指示無剩餘之順丁 烯二酸酐,如由〜1 8 1 0厘米-1處缺少酐伸展波帶所判定〇 對上醯胺酸溶液添加乙酸酐(8·5毫升,9 ,ϋ X 10- 2 摩爾)、三乙胺(I·26毫升,9·〇Χΐ〇·3摩爾)及乙酸鈉 (0·88克,1.1Χ10-2摩爾)〇所得溶液於氮氣下輕緩迴 流4小時。讓反應冷卻至室溫並於眞空移除全部溶劑〇所 得黏稠液體於二氯甲烷(2 〇 〇毫升)中再媒合,並用蒸餾 水( 3 X 200毫升)萃取〇於是有機物及於無水硫酸鎂上乾 燥,過濾並於眞空移除溶劑以產生淺褐色固體(6.75克, 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公爸)_ 570966
經濟部智慧財產局員工消費合作社印製 A7 ____B7_____ 五、發明說明(27) 76 % ) 〇此物質顯現可接受之FT-IR及1 Η NMK光譜特徵。 實例Η 製備、、D D I 1 4 1 0之雙(m _硝某苯甲基胺基甲酸酯)〃
▲ DD1 1410之雙(m-硝基苯甲基胺基甲酸酯)〃 (及環狀異構物)
DDI 1410 (Henkel 公司 a 二聚二異氰酸酯",99,77 克,1 · 65 X 10 - 1摩爾,以13 · 96 % NC0爲準)、m-硝基苯 甲基醇(50·8克,3.32Xl〇d摩爾)及二丁基錫二月桂酯 (0.3毫升,8·3 X 1G-4摩爾)在氮氣下於配備以機械攪 拌器、迴流冷凝器及內部溫度探針之1升裝四頸燒瓶內之 甲苯(1 5 0毫升)中媒合。將反應加熱至8 5 °C達2 . 5小時 〇該反應一等分量之FT-IU分析指示異氰酸酯官能基團完 全消耗,如由2 2 7 2厘米-1處缺少波帶所判定〇於眞空將溶 劑移離該反應,以產生黃色油,後者靜置於溫度時固化( 152 ·4克,1〇2 % (微量甲苯))〇此固體顯現令人滿意 之FT-IR及1H NMR光譜特徵〇 實例I 製備a DDI 141〇之雙(m-胺某_苯甲基胺某甲酸酯)" 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公 (請先閱讀背面之注意事項再填寫本頁)
570966 A7 B7 五、發明說明(28) 0 Η 、0八、丨 m〇
--------------裝--- (請先閱讀背面之注意事項再填寫本頁) a DDI H10之雙(m-胺基苯甲基胺基甲酸酯)〃 (及環狀異構物)
實例Η之二胺生成物(39.6克,4.32X10-2摩爾)及 二水合氯化亞錫在氮氣下於配備以機械攪拌器及迴流冷凝 器之1升裝三頸燒瓶內之乙酸乙酯(3 ϋ ϋ毫升)中製漿。 將反應加熱至輕緩迴流並劇烈攪拌3小時〇讓溶液冷卻至 室溫並用飽和碳酸氫鈉之溶液帶至pH 7-8 〇將混合物推過 2 5微米過濾器,以產生一分離成混濁水液層及中度清澈有 機層之混合物。將水液層分離並用乙酸乙酯(1 0 0毫升) 沖洗0將有機層結合,用蒸餾水(3 0 0毫升)萃取,並於 無水硫酸鎂上乾燥。過濾漿液並於眞空將溶劑移離濾液, 以產生黃色黏性固體(Μ . 8克,92 % ) 〇 實例J 經濟部智慧財產局員工消費合作社印製 製備^ DDI 1410之雙(m-順丁烯二醢亞胺基苯甲基 胺某甲酸酯)
本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公 經濟部智慧財產局員工消費合作社印製 570966 A7 B7 五、發明說明(Μ) ^ D D 1 1 4 1 ϋ之雙(m -順丁烯二醯亞胺基苯甲基 胺基甲酸酯)〃(及環狀異構物) 順丁烯二酸酐(1 5 · 4克,1 · 5 7 X 1 0 - 2摩爾)溶解於配 備以機械攪拌器、內部溫度探針及添加用漏斗之2升裝四 頸燒瓶內之丙酮(3 00毫升)中。此溶液在冰洛上冷卻至 〜4 °C 〇將實例I所製備二胺(63· 4克,7·48 X 10-2摩爾 )在丙_ (70毫升)中之溶液注入添加用漏斗內,並以30 分鐘時間添加於順丁烯二酸酐溶液,而內部溫度維持< 10 °C 〇將所得溶液攪拌1小時,並續讓其溫熱至室溫並攪拌 2小時〇 對此醯胺酸溶液添加乙酸酐(24 · 7毫升,2 . 61 X 10 - 1 摩爾)、三乙胺(6·25毫升,4.48X10-2摩爾)及四水合 乙酸鎂(0.37克,1.50Χ 10-3摩爾)〇此溶液予輕緩迴流 6 · 5小時,然後讓其冷卻至室溫〇於眞空移除全部溶劑, 並將所得暗色液體溶解於二乙醚( 500毫升)中〇此溶液 用蒸餾水(5 0 0毫升)沖洗〇然後用飽和碳酸氫鈉水液( 5〇〇毫升)並再用蒸餾水( 5 00毫升)沖洗已分離之有機 層〇有機物予分離,於無水硫酸鎂上乾燥,並於眞空移除 溶劑以產生黏稠之橘色油◦此物質顯現與預期之雙順丁烯 二醯亞胺生成物一致之FT-IR、1 Η ΝΜΚ及"c NMR光譜特 徵。 實例ΑΑ 低應力晶..片__Μ.附用黏著劑配方及在各種引線框 上之晶片抗剪强麻 本紙張尺度適用中國國家標準(CNS)A4規格⑵G X 297公g) (請先閱讀背面之注意事項再填寫本頁)
570966 A7 B7 五、發明說明(30) (請先閱讀背面之注意事項再填寫本頁) 於室溫用機械混合器將以下結合生成黏滯度爲19 011厘 泊(5 rpm ,圓錐及平板)及觸變指數爲5.36之填銀晶片 黏附用黏著劑配方: 實例B之液體雙順丁烯二醯亞胺 2 · 644克 實例5之二聚乙烯醚 2 · 644克
Ricon 131MA20 (Kicon 樹脂公司) ϋ.6ΰ1 克
Silquest A-174 (Witco 公司) 0·ϋ40 克 USP-90MD(Witco 公司) 0.099 XD002 6 ( NSCC公司简業機密) 0.119 SF-96 銀片 23.794 所得糊劑如下詳述予分配於不同金屬引線框上,並將 1 2 0 X 1 2 0密耳矽晶片置於黏著劑珠上以生成約i密耳之黏 結線。各試樣於200 °C a急速固化〃 60分鐘,並於室溫及 24 0 °C測量晶片抗剪强度。然後,此等試樣受到高溫及濕 度(85 °C / 85% RH)達48小時〇然後於室溫及240 °C再次 測量晶片抗剪强度◦各項結果表列於表I 〇 表1 :順丁烯二醯亞胺/乙烯醚晶片黏附用 經濟部智慧財產局員工消費合作社印製 黏著劑之晶片抗剪强度(DSSj__ 不暴露於水 暴露於水後 (48小時 /85 eC /85 RH) 固化態樣 _6 0 秒 / 2 ϋ 0。。_ _ 6 0 / 2 0 0 °C_ 测試溫度 2 5〇C 2 4 0 °C ‘2 5°C 2 4 0 °C 銅引線框 4,88+/- 1 .46 + /- 6.54+/- 1.84+/- DSS(千克) 0.25 0.35 ϋ ,82 0.76 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公g) 570966 銀銅引線框 5.29+/- 2 · 17 + /- 9,50+/- 1 · 56 + /- DSS(千克) 0.34 0 .43 1.88 0 .72 鈀銅 5.52 + /- 1.99+/- 11.9+/- 3.53+/- DSS(千克) 0 .39 0 .44 1,3 0.66 A7 ____B7 五、發明說明(31) 此等元件在8 5 °C / 8 5 % Μ飽和後之典型水分攝取量爲0 . 1 8 重量% 〇固化期間重量損失爲〇 . 16 + /-ϋ . 05重量% 〇 實例ΒΒ 順丁烯二醯亞胺/乙烯_晶片黏附用黏荖劑之hast測試 利用實例AA之黏著劑組合物,以類似實例AA之方式將 1 20 X 1 20密耳晶片黏附於各種不同組成之引線框〇然後用 v'急速固化〃(60秒/ 2 0 0 °C)及a快速烘箱固化〃(15 分鐘/ 1 7 5 eC )之條件將已黏結晶片固化〇所得已固化元 件接受模擬之HAST测試條件(130 °C,《5 % M)達13〇小 時〇如表2所示,各元件於室溫及高溫顯現良好之以晶片 抗剪强度(DSS)所量度之黏著力〇 表2 在模擬HAST測試條件後之晶片杭前 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 固化態樣 6 ϋ 秒 / 2 0 (TC 1 5 分鐘 / 1 7 s 測試溫度 2 5°〇 24 0 °C 2 5〇C 銅引線框 15.3+/- 1.12+/- 17.2+/- 丄· 2 5 + DSS(千克) 1 . 8 0.35 (K 8 0.39 銀銅引線框 16.3+/- 2.81+/- 14.8+/- 2.6 + DSS(千克) 1 .9 0.55 1.8 1 . 6 鈀銅 15.7+/- 3.04+/- 14.4+/- 2.96 + DSS(千克) 1 .7 0.46 U . 7 0.90 本紙張尺度適用中國國家標準(CNS)A4規格mo X 297 570966 A7 _____ B7_ 五、發明說明(3 2)
實例CC (請先閱讀背面之注意事項再填寫本頁) 用順丁烯二醯亞胺/乙烯醒晶片黏附用 -_黏著劑所黏結大晶片之彎曲 使用實例A A中所述晶片黏附用組合物將5 0 0 X 5 0 〇密耳 晶片黏結於鈀一銅引線框0於若干溫度及時間將已組裝之 物件vv急速固化",並測量晶片彎曲量°典型結果列示於 表3 〇此黏著劑所顯現之性能使其符合v低應力〃物質〇 表3 :順丁稀二醯亞胺/乙稀魅晶片黏附用 _黏荖劑在50 0 X 50 0密耳晶片上之蠻曲 熱史 1分鐘/ 2 0 0 °C +1分鐘/24〇1 +4小時/175°〇 彎曲(微米)1〇, 4+/-1.3 11.9 + /-1.4 14 . 1 W-1 . 6
實例DD 順丁烯二酿亞胺/乙烯醚晶片黏附用黏著劑之熱分析 使用實例AA之組合物以一向下拉引棒生成〜1密耳之 膜。各膜在熱板上、、急速固化〃(60秒,2 00 °C)或予烘 箱固化(4小時/ 1 7 5 °C ),並藉動態機械分析(A )予 以定性。各項結果摘列於表4 〇 經濟部智慧財產局員工消費合作社印製 表.4_AJlr烯二醯亞胺/乙烯_晶片黏附膜之熱分析 固化態樣—___(30秒/ 200 〇C 4小時/ 1 7 5。。
Tg ( eC ) -1 35 〜65°C 模數(E,)(psi) 4 2 1,3 0 0 5 1 3,9 0 0 1 〇 〇 °C 模數(E,)( p s i ) 5,8 64 2 3,9 8 0 各物質顯現之模數低於低應力黏著劑之典型Tg 〇高於 Tg之溫度時各物質之模數足以承受典型之線黏結條件,而 本紙張尺度適用中國國家標準(CNs)A4規格(210 X 297坌&)_ 570966 A7 B7 五、發明說明(33)
不故障〇 實例EE (請先閱讀背面之注意事項再填寫本頁) 矽氧烷雙順丁烯二醯亞胺之製備 甲醇末端矽氧烷(DMS-C15 ,Gelest公司;2 7.2 6克 ,27.2毫摩爾)及Ν,Ν-二甲基胺基枇啶(DMAP; 0.07克, 經濟部智慧財產局員工消費合作社印製 〇 · 55毫摩爾)在氮氣下於配備以機械攪拌器、添加用漏斗 及內部溫度探針之500毫升裝四頸燒瓶內之CH2C:U (2〇〇 毫升)中媒合0此溶液在冰浴上冷卻至〜5 °C 〇將二環己 基碳二醯胺(DCC ; 14.6克,68.1毫摩爾)在CH2C12 (50 毫升)中之溶液注入添加用漏斗內。此UCC溶液於45分鐘 時間內添加於該矽氧烷/ UMAP溶液,同時將內部溫度維持 < 1 0 °C 〇此溶液於冰浴上攪拌2小時,此時,該溶液一等 分量之FT-IR分析指示有酯(174〇厘米及殘餘DCC ( 2120厘米〃)存在〇讓該溶液溫熱至室溫並額外攪拌三小 時。將乙酸(20毫升)添加於該反應並額外攪拌一小時, 此時,FT- I Κ指示無殘餘DCC 〇將該溶液過濾移除沉澱之 二環己基尿素(DC ϋ ),並於眞空將溶劑移離濾液。剩餘之 油於己烷(2 ϋ 0毫升)中再媒合,並冷卻至〜5 達一週 。所得溶液自沉澱之帶紅色固體過濾以產生一淺褐色溶液 〇此溶液於室溫與矽膠(1 ϋ克)製漿達-小時,過濾並於 眞空移除溶劑,以產生一淺褐色溶液,後者顯現可接受之 1 H NMR、2 9 Si NMR及 FT-IK 光譜特徵 〇
0 〇 本紙張尺度適用中國國家標準(CNS)A4規格(210x 297兮夢)_ 本 口 申請曰期 90 04.10 案 號 90108606 類 別 \公/处 (以上各欄由本局填註) A4 C4 570966 !專利説明書 中 文 發明 新型 名稱 英 文 姓名 國 籍 用於微電子元件之可固化黏著劑組合物
A CURABLE ADHESIVE COMPOSITION FOR USE IN MICROELECTRONIC DEVICES 唐諾赫爾 裝 發明 創作 人 住、居所 稱 名 美國 美國賓州多樂城柏拉路125號 司 公 股 控 資 投 學 化 及 粉 澱 民 國 商 美 嘬 訂 線 Γ .VI tJL >»ν>1 乂广? !'>— 1 Π.;·/ i .Ti印梵 申請人 國 籍 住 、居所 (事務所) 代 表人 姓 名 美國 美國德拉瓦州威明頓銀翼路3411號諧和廣場 本紙張尺度適用中國國家標準(CNS ) Λ4况格(2 10X 297公犛)
Claims (1)
- 570966(92·03·31·修正)1· 一種可固化黏著劑組合物,用於將電子組件黏合於 基質,包含一順丁烯二醯亞胺化合物及一爲0.1至10重量 %之由自由基起發劑、光起發劑、及其等之組合形式所組 成集團中選出之固化起發劑,該順丁烯二醯亞胺化合物具 有通式[M-Xm]n-Q ,式中η爲1至6 ,m爲1或2 ,而 (a ) Μ爲一具有下列結構式之順丁烯二醯亞胺部份:式中R1爲Η或具有1至5個碳原子之烷基; (b) X爲一由具有下列結構式之芳香族基團中選出之芳香 族基團:l (iv)(c ) Q爲具有下列結構式之酯: 〇 〇 Ο II II —R8·—C一〇—R3—Q-C— R8— 式中R3爲具有下列結構式之矽氧烷: -(CR1i)Q - (〇)1>0 -(CR^HSi-R^-Or-Si-^CR^WO),^ ~(CR12)g ~570966 申請專利範圍續頁 式中每一位置之R1取代基獨立爲Η或一具有1至5個碳原 子之烷基團,R8爲一具有1至20個碳原子之直線或有支鏈 烷基或烯氧基,每一位置之R4取代基獨立爲一具有1至5 個碳原子之烷基團或一芳基團,e及g獨立爲1至10,而 f爲1至50 〇 2·—種可固化黏著劑組合物,用於將電子組件黏合於 基質,包含一順丁烯二醯亞胺化合物及一爲0.1至10重量 %之由自由基起發劑、光起發劑、及其等之組合形式所組 成集團中選出之固化起發劑,該順丁烯二醯亞胺化合物具 有通式Mn-Q,式中η爲1至6 ,而 (a ) Μ爲一具有下列結構式之順丁烯二醯亞胺部份: ,\ N—— / 〇 式中R1爲Η或具有1至5個碳原子之烷基; (b ) Q爲具有下列結構式之酯: 〇 〇 —R8一c一〇—R3—0-C— R8— 式中R3爲具有下列結構式之矽氧烷: -(cr12)q ~ (〇)1ι0 ^CR12)e^Si-R%^)r^HR42-~(CR12)g-{〇)1;0 ~(CR12)〇 - 式中每一位置之R1取代基獨立爲H或一具有l至5個碳原 子之烷基團,R8爲一具有1至20個碳原子之直線或有支鏈 570966 申請專利範圍續頁 烷基或烯氧基,每一位置之R4取代基獨立爲一具有1至5 個碳原子之烷基團或一芳基團,e及g獨立爲1至10,而 f爲1至50 〇 3 .如申請專利範圍第2項之可固化黏著劑組合物,其 中該順丁烯二醯亞胺化合物具有下列通式:
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-
2000
- 2000-04-14 US US09/549,639 patent/US6355750B1/en not_active Expired - Lifetime
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2001
- 2001-04-04 EP EP01107776A patent/EP1146065A1/en not_active Withdrawn
- 2001-04-10 CA CA002343632A patent/CA2343632A1/en not_active Abandoned
- 2001-04-10 TW TW090108606A patent/TW570966B/zh not_active IP Right Cessation
- 2001-04-10 KR KR1020010019038A patent/KR100795423B1/ko not_active IP Right Cessation
- 2001-04-10 JP JP2001111164A patent/JP2002020721A/ja active Pending
- 2001-04-10 CN CNB011192836A patent/CN1252144C/zh not_active Expired - Fee Related
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TWI415917B (zh) * | 2007-09-13 | 2013-11-21 | 3M Innovative Properties Co | 低溫結合電子黏接劑 |
Also Published As
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JP2002020721A (ja) | 2002-01-23 |
EP1146065A1 (en) | 2001-10-17 |
CA2343632A1 (en) | 2001-10-14 |
US6355750B1 (en) | 2002-03-12 |
CN1252144C (zh) | 2006-04-19 |
KR20010100882A (ko) | 2001-11-14 |
HK1041712B (zh) | 2006-12-08 |
KR100795423B1 (ko) | 2008-01-17 |
HK1041712A1 (en) | 2002-07-19 |
CN1321715A (zh) | 2001-11-14 |
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