TW569169B - Sub chip on board for optical mouse - Google Patents

Sub chip on board for optical mouse Download PDF

Info

Publication number
TW569169B
TW569169B TW090126625A TW90126625A TW569169B TW 569169 B TW569169 B TW 569169B TW 090126625 A TW090126625 A TW 090126625A TW 90126625 A TW90126625 A TW 90126625A TW 569169 B TW569169 B TW 569169B
Authority
TW
Taiwan
Prior art keywords
pcb
sub
chip
board
pin holes
Prior art date
Application number
TW090126625A
Other languages
English (en)
Inventor
Dong-Hoon Kang
Joon-Ki Paik
Original Assignee
Samsung Electro Mech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mech filed Critical Samsung Electro Mech
Application granted granted Critical
Publication of TW569169B publication Critical patent/TW569169B/zh

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/033—Pointing devices displaced or positioned by the user, e.g. mice, trackballs, pens or joysticks; Accessories therefor
    • G06F3/0354—Pointing devices displaced or positioned by the user, e.g. mice, trackballs, pens or joysticks; Accessories therefor with detection of 2D relative movements between the device, or an operating part thereof, and a plane or surface, e.g. 2D mice, trackballs, pens or pucks
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/0304—Detection arrangements using opto-electronic means
    • G06F3/0317—Detection arrangements using opto-electronic means in co-operation with a patterned surface, e.g. absolute position or relative movement detection for an optical mouse or pen positioned with respect to a coded surface
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10871—Leads having an integral insert stop
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Position Input By Displaying (AREA)

Description

569169 A7 -----------_B7_ 五、發明説明（1) ' —'"" 發明之背景 ’ 本發明大體上係有關用於光學滑鼠板上的晶片子模 尤/、疋藉由直接連接一 ic晶片於一子印刷電路板（以 係稱為PCB)並以銷架設次pCB於一母PCB上而形成的一晶 片子模組。 習知技藝之說明 一般而言’一光學滑鼠藉由反射一接觸物品（譬如一 滑鼠墊）的光學滑鼠之本體放射的光線而操作，於是可使 在墊上的滑鼠之移動被偵測出，並使在一電腦螢幕上的游 標移動。光學滑鼠為由使用者點選的一指點裝置（或一顯 不游標控制裝置），以及獨立於鍵盤之外的一輸入裝置。 尤其疋’光學滑鼠有數種優點，如其精確地谓測出使用者 手的移動以及與習知球形滑鼠比較其可平順的移動，因而 其使用不斷地增加。此一光學滑鼠以光學辨識在其接觸物 品上的移動，轉換辨識出的值成為一電力信號，轉換電力 信號至電腦，以辨識出在螢幕上游標的位置。 第1圖為一習知光學滑鼠的側視圖。參看第1圖，光學 滑鼠10包括一光線放射單元12，一鏡片13，具有一光學感 應器16的一 1C晶片15以及在一殼體11上的一 PCB14。此 外，在滑鼠10之頂上配置由使用者按下的按鈕18。光線放 射單元12有一習知的LED(光線放射二及真空管）以發散光 線’且鏡片13集中自滑鼠墊20反射的光線^IC晶片15之光 學感應器16感應集、中之光線^ PCB14經由一引線框19連接 至1C晶片15。 本紙張尺度適用中國國家標準（CNS) A4規格（210X297公釐）
【裝丨 (請先閲讀背面之注意事項再填寫本頁) •訂· ;-線_ -4 - 569169 A7 ----------B7 五、發明説明（2 ) " ' '— -— (請先閲讀背面之注意事項再填寫本頁) 纟光干π鼠1G中，若光線放射單元⑽散光線，光線 放射至滑鼠塾20。放射之光線自滑鼠塾2〇反射。此時，自 滑鼠墊20反射的光線以鏡片13集中。若由鏡片㈣中之光 線放射至光學感應器16，鏡片13感應出放射的光線，因而 _辨識出在墊20上的滑鼠1〇之移動。如上述，光學滑鼠1〇感 •應出光、線因而滑氣1〇S移動方向及距離被辨識出，辨識 _ 結果轉換成-電力信號，而電力信號傳送至一電腦。因此， 使用者移動在滑鼠墊20上的光學滑鼠1〇以顯示出在榮幕上 的游標。 此外，光學滑鼠需要一構造，使其可辨識出接收之光 線並傳遞它至PCB。用以配置PCB&IC晶片於一光學滑鼠 上的構造已揭露於美國專利第4,52丨，772以及4,751，505號 案中。參看揭露於美國專利第4,521，772號案中的光學滑 鼠構造，具有一感應器列的一1C晶片與一POB分開，並連 φ 接至垂直地配置在PCB上的一支持元件。此外，參看揭露 於美國專利第4,751，505號案中的光學滑鼠構造，具有數 個銷的一封裝1C電路裝置架設在一 PCB上。 第2及3圖顯示架設在一基本的光學滑鼠上的板上之一 • 習知晶片之構造。參看第2及3圖，具有一光學感應器16〇 、 的一1C晶片Ϊ50製造成一封裝，且封裝ic晶片150架設在一 PCB100上。具有光學感應器16〇之1(：晶片15〇以電線接合 至一引線框170。此外，透明樹脂190塗敷在1C晶片150之 底表面上。此外，、具有用以通過接收之光線之一孔181的 一蓋180蓋在透明樹脂190上。如上述，在板製造商上的一 本紙張尺度適用中國國家標準（CNS) Α4規格（210X297公釐） 569169 A7 B7 五、發明説明（3 ) (請先閲讀背面之注意事項再填寫本頁) 晶片購買具有上述構造之完全封裝1C晶片，並架設它們於 PCB100上。參看第2及3圖，在板上的習知晶片知構造中， 1C晶片100通過引線框170架設在PCB100上，並以引線框 170支持，因而配置在PCB100上。此外，用以引導接收之 光線的一路徑101配置在PCB100上。 另一方面，在美國專利第4,751，505號案中揭露用以 架設在PCB上具有銷而無引線框的一封裝1C晶片之構造 體。然而，揭露於該專利中的構造體之問題在於其製造商 必須由晶片製造商手中購買封裝1C晶片並以與架設第2及3 圖之晶片於板相同之方法架設它們於PCB上。 如上述，用於光學滑鼠之板上的習知晶片之缺點在於 板上晶片製造商必須自晶片製造商‘買完全封裝感應器1C 晶片，包括用以接合1C晶片至PCB的引線框。此外，習知 板上晶片之問題在於它需要用以保護封裝1C晶片的一殼 體，因而增加造價及製造效率。 發明之摘要 因此，本發明之目的係針對上述問題備置用於光學滑 鼠的一板上晶片子模組，其直接連接具有一光學感應器的 一感應器晶粒至一次PCB的底表面，直接以電線接合光學 感應器至次PCB，並以銷架設次PCB於一母PCB，因而減 少造價並改善製造效率。 本發明的另一目的是備置用於光學滑^的一板上晶片 子模組，其具有一、次PCB，而該次PCB具有直接連接在次 PCB之底表面上的一感應器晶粒。 本紙張尺度適用中國國家標準（CNS) A4規格（210X297公釐） 6 569169 . A7 B7 五、發明説明（4 ) 依據本發明的一特徵，上述及其他目的可藉由備置用 於光學滑鼠的板上晶片子模組而達成，其包括具有數個輸 入/輸出墊以及數個銷孔的一次PCB ;具有以電線接合至 該輸入/輸出墊以感應接收光線並連接次PCB之底表面的 一感應器晶粒；覆蓋在次PCB之底表面上的感應器晶粒之 , 一透明樹脂；連接於次PCB之底表面使得蓋覆蓋透明樹脂 > 且具有引導接收光線至該光學感應器的一孔之一蓋；具有 引導接收光線至光學感應器之一孔以及數個對應於次PCB 之銷孔的銷孔的一母PCB ;以及數個共同地插入母PCB及 次PCB之銷孔中，以使次PCB固定在母PCB上的銷。 圖式之簡要說明 本發明之上述及其他目的，特i將在下文中配合圖式 之說明而更加清楚，其中： 第1圖為顯示習知光學滑鼠之構造的側視圖； 第2圖為顯示用於光學滑鼠之一習知板上晶片的侧視 i 圖； 第3圖為顯示第2圖之板上晶片的一平面圖； 第4圖為顯示依據本發明之另一實施例的用於光學滑 鼠之板上晶片子模組的側視圖； 第5圖為顯示用於本發明之光學滑鼠之板上晶片子模 組的平面圖。 較佳實施例之詳細說明 胃
本發明之板上^晶片子模組藉由備置一次PCB，直接連 接一感應器晶粒至次PCB，並以銷架設次PCB於一母PCB 本紙張尺度適用中國國家標準（CNS) A4規格（210X297公釐） (請先閲讀背面之注意事項再填寫本頁) •、tr· :線丨 7 569169 A7 _B7___ 五、發明説明（5 ) 上而形成，而習知板上晶片係藉由架設一 1C晶片封裝而形 成，其中一感應器以電線接合至一 PCB上的引線框。 (請先閲讀背面之注意事項再填寫本頁) 第4圖為顯示依據本發明之另一實施例的用於光學滑 鼠之板上的一子晶片的側視圖。第5圖為顯示板上晶片子 模組的平面圖。 參看第4圖，在本發明的板上子晶片中，具有一光學 感應器360的一感應器晶粒370直接連接至一次PCB300之 底表面。在次PCB300的底表面上，一透明樹脂390塗敷於 其上以蓋住感應器晶粒370。此外，一蓋380至於透明樹脂 390上。如第5圖所示，次PCB300直接以電線接合次PCB300 至光學感應器360而連接至光學感應器360。 覆蓋感應器晶粒370之透明樹脂390用以使光線通過， 以允許感應器360感應自一滑鼠墊（未顯示）反射之光線。 此外，透明樹脂390保護光學感應器360及接合電線隔絕外 界振動或雜質，並穩固地固定感應器晶粒370於次PCB300 上。 在透明樹脂390之外，蓋380置於其上以保護光學感應 器360及透明樹脂390。此外，一孔381形成在蓋380上，以 引導自滑鼠墊反射的光線至感應器360。 參看第4及5圖，次PCB300以數個銷400固定於母PCB200 上。在次PCB300及母PCB200上形成數個用以插入銷400的 銷孔。此外，另一孔201形成在母PCB200上i引導接收之 光線至光學感應器、360。 如上述，本發明之板上晶片備置一次PCB，並直接連 本紙張尺度適用中國國家標準（CNS) A4規格（210X297公釐） 569169 A7 _B7___五、發明説明（6 ) 接一感應器晶粒至次PCB的底表面，並固定次PCB於母PCB 上，而在習知板上晶片中，一封裝1C晶片以一引線框架架 設至PCB上。 因此，本發明的優點在於它不須任何習知1C晶片包 封，並備置用以直接定位一感應器晶粒的一次PCB，以及 以銷固定次PCB於一母PCB上，以改良製造效率並備置一 丨簡單且穩固的板上晶片構造體。 如上所述，本發明備置用於光學滑鼠的一板上晶片子 模組，其不須任何包括在習知1C晶片包封中的任何引線框 或任何殼體，因而減少造價。此外，本發明備置用於光學 滑鼠的一板上晶片子模組，其備置一次PCB，並直接連接 一感應器晶粒於次PCB上，並以銷固定次PCB於一母PCB 上，因而簡化其構造，並改良製造效率。 雖然本發明已揭露如上，但熟習此技藝人士可在不脫 離本發明之精神及範圍下可作不同的改良及取代。 (請先閲讀背面之注意事項再填窝本頁) :線丨 本紙張尺度適用中國國家標準（CNS) A4規格（210X297公釐） 9 569169 A7 B7 五、發明説明（7 ) 元件標號對照 10 光學滑鼠 170 引線框0 11 殼體 180 蓋 12 光線放射單元 181 13 鏡片 190 透明樹脂 14 PCB 200 PCB 15 1C晶片 201 16 光學感應器 300 PCB 18 按鈕 360 光學感應器 19 引線框 370 感應裔晶粒 20 滑鼠墊 380 蓋 100 PCB 381 101 路徑 390 透明樹脂 150 1C晶片 400 銷 160 光學感應器 (請先閲讀背面之注意事項再填寫本頁) •訂— ,¾. 本紙張尺度適用中國國家標準（CNS) A4規格（210X297公釐） 10

Claims (1)

  1. 569169 A8 B8 C8 D8 六、申請專利範圍 1. 一種用於光學滑鼠之板上晶片子模組，其包括： (請先閲讀背面之注意事項再填窝本頁) 一次PCB，其具有數個輸入/輸出墊及數個銷孔； 一感應器組，其具有以電線接合該輸入/輸出墊以 感應接收光線並連接於次PCB之一底表面； 一透明樹脂，其覆蓋住在次PCB之底表面上的感應 器晶粒的一蓋，其連接於次PCB之底表面使得蓋蓋住透 明樹脂，且具有一孔，以引導接收光線至該光學感應器； 一母PCB，其具有引導接收之光線至光學感應器之 一孔以及數個對應於次PCB之銷孔的銷孔； 數個銷，其共同插入母PCB及次PCB之銷孔中使得次 PCB固定於母PCB上。 2. —種光學滑鼠，其包括依據第1申請專利範圍形成的板 上之子晶片。 本紙張尺度適用中國國家標準（CNS) A4規格（210X297公釐） 11
TW090126625A 2001-08-14 2001-10-26 Sub chip on board for optical mouse TW569169B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR10-2001-0049056A KR100427356B1 (ko) 2001-08-14 2001-08-14 광마우스용 서브 칩 온 보드

Publications (1)

Publication Number Publication Date
TW569169B true TW569169B (en) 2004-01-01

Family

ID=19713201

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090126625A TW569169B (en) 2001-08-14 2001-10-26 Sub chip on board for optical mouse

Country Status (6)

Country Link
US (1) US6541762B2 (zh)
KR (1) KR100427356B1 (zh)
CN (1) CN1173257C (zh)
DE (1) DE10153717A1 (zh)
FR (1) FR2828749B1 (zh)
TW (1) TW569169B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI798602B (zh) * 2019-12-17 2023-04-11 日商蘇薩有限公司 電子設備

Families Citing this family (68)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6762751B2 (en) * 2001-12-17 2004-07-13 Behavior Tech Computer Corporation Optical pointing device
TW545648U (en) * 2002-03-21 2003-08-01 Paten Wireless Technology Inc Wireless input device capable of receiving receiver
US6967321B2 (en) * 2002-11-01 2005-11-22 Agilent Technologies, Inc. Optical navigation sensor with integrated lens
US6934065B2 (en) * 2003-09-18 2005-08-23 Micron Technology, Inc. Microelectronic devices and methods for packaging microelectronic devices
US7444005B2 (en) * 2003-11-04 2008-10-28 Becton, Dickinson And Company Apparatus and method for using optical mouse engine to determine speed, direction, position of scanned device and to obtain quantitative or qualitative data from same
US7583862B2 (en) * 2003-11-26 2009-09-01 Aptina Imaging Corporation Packaged microelectronic imagers and methods of packaging microelectronic imagers
US7253397B2 (en) * 2004-02-23 2007-08-07 Micron Technology, Inc. Packaged microelectronic imagers and methods of packaging microelectronic imagers
KR100780496B1 (ko) * 2004-03-24 2007-11-29 야마하 가부시키가이샤 반도체 장치, 자기 센서 및 자기 센서 유닛
US8092734B2 (en) * 2004-05-13 2012-01-10 Aptina Imaging Corporation Covers for microelectronic imagers and methods for wafer-level packaging of microelectronics imagers
US7253957B2 (en) * 2004-05-13 2007-08-07 Micron Technology, Inc. Integrated optics units and methods of manufacturing integrated optics units for use with microelectronic imagers
US20050275750A1 (en) 2004-06-09 2005-12-15 Salman Akram Wafer-level packaged microelectronic imagers and processes for wafer-level packaging
US7498647B2 (en) 2004-06-10 2009-03-03 Micron Technology, Inc. Packaged microelectronic imagers and methods of packaging microelectronic imagers
US7199439B2 (en) * 2004-06-14 2007-04-03 Micron Technology, Inc. Microelectronic imagers and methods of packaging microelectronic imagers
US7262405B2 (en) * 2004-06-14 2007-08-28 Micron Technology, Inc. Prefabricated housings for microelectronic imagers
US7232754B2 (en) * 2004-06-29 2007-06-19 Micron Technology, Inc. Microelectronic devices and methods for forming interconnects in microelectronic devices
US7294897B2 (en) * 2004-06-29 2007-11-13 Micron Technology, Inc. Packaged microelectronic imagers and methods of packaging microelectronic imagers
US7688309B2 (en) * 2004-07-06 2010-03-30 Logitech Europe S.A. Optical displacement module and method to reduce the size of an optical pointing device thereof
US7416913B2 (en) * 2004-07-16 2008-08-26 Micron Technology, Inc. Methods of manufacturing microelectronic imaging units with discrete standoffs
US7189954B2 (en) * 2004-07-19 2007-03-13 Micron Technology, Inc. Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers
US7402453B2 (en) * 2004-07-28 2008-07-22 Micron Technology, Inc. Microelectronic imaging units and methods of manufacturing microelectronic imaging units
US20060023107A1 (en) * 2004-08-02 2006-02-02 Bolken Todd O Microelectronic imagers with optics supports having threadless interfaces and methods for manufacturing such microelectronic imagers
US7364934B2 (en) * 2004-08-10 2008-04-29 Micron Technology, Inc. Microelectronic imaging units and methods of manufacturing microelectronic imaging units
US7521719B2 (en) * 2004-08-13 2009-04-21 Paul Steven Schranz Light emitting and image sensing device and apparatus
US7223626B2 (en) * 2004-08-19 2007-05-29 Micron Technology, Inc. Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers
US7397066B2 (en) * 2004-08-19 2008-07-08 Micron Technology, Inc. Microelectronic imagers with curved image sensors and methods for manufacturing microelectronic imagers
US7115961B2 (en) * 2004-08-24 2006-10-03 Micron Technology, Inc. Packaged microelectronic imaging devices and methods of packaging microelectronic imaging devices
US7205532B2 (en) * 2004-08-24 2007-04-17 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Integrated ball grid array optical mouse sensor packaging
US7429494B2 (en) 2004-08-24 2008-09-30 Micron Technology, Inc. Microelectronic imagers with optical devices having integral reference features and methods for manufacturing such microelectronic imagers
US7276393B2 (en) 2004-08-26 2007-10-02 Micron Technology, Inc. Microelectronic imaging units and methods of manufacturing microelectronic imaging units
US20070148807A1 (en) * 2005-08-22 2007-06-28 Salman Akram Microelectronic imagers with integrated optical devices and methods for manufacturing such microelectronic imagers
US7511262B2 (en) * 2004-08-30 2009-03-31 Micron Technology, Inc. Optical device and assembly for use with imaging dies, and wafer-label imager assembly
US7646075B2 (en) * 2004-08-31 2010-01-12 Micron Technology, Inc. Microelectronic imagers having front side contacts
US7300857B2 (en) * 2004-09-02 2007-11-27 Micron Technology, Inc. Through-wafer interconnects for photoimager and memory wafers
US20100001956A1 (en) * 2004-11-30 2010-01-07 Atlab Inc. Handheld terminal
US7271482B2 (en) * 2004-12-30 2007-09-18 Micron Technology, Inc. Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods
US7214919B2 (en) * 2005-02-08 2007-05-08 Micron Technology, Inc. Microelectronic imaging units and methods of manufacturing microelectronic imaging units
US20060177999A1 (en) * 2005-02-10 2006-08-10 Micron Technology, Inc. Microelectronic workpieces and methods for forming interconnects in microelectronic workpieces
US7303931B2 (en) * 2005-02-10 2007-12-04 Micron Technology, Inc. Microfeature workpieces having microlenses and methods of forming microlenses on microfeature workpieces
US7190039B2 (en) * 2005-02-18 2007-03-13 Micron Technology, Inc. Microelectronic imagers with shaped image sensors and methods for manufacturing microelectronic imagers
US20060202955A1 (en) * 2005-03-08 2006-09-14 Yuan-Jung Chang Wireless mouse for receiving a receiver thereunder
TWI275987B (en) * 2005-05-31 2007-03-11 Pixart Imaging Inc Optical input device with a light source die mounted on a detecting die and manufacture method thereof
US20060290001A1 (en) * 2005-06-28 2006-12-28 Micron Technology, Inc. Interconnect vias and associated methods of formation
US7795134B2 (en) * 2005-06-28 2010-09-14 Micron Technology, Inc. Conductive interconnect structures and formation methods using supercritical fluids
US7262134B2 (en) * 2005-09-01 2007-08-28 Micron Technology, Inc. Microfeature workpieces and methods for forming interconnects in microfeature workpieces
US7288757B2 (en) * 2005-09-01 2007-10-30 Micron Technology, Inc. Microelectronic imaging devices and associated methods for attaching transmissive elements
CN100426207C (zh) * 2005-09-23 2008-10-15 光宝科技股份有限公司 光源模块及感光模块设于支架上的光学模块
WO2007114587A1 (en) * 2006-03-30 2007-10-11 Mobisol Inc. Integrated micro-optic device
KR100883410B1 (ko) * 2006-07-20 2009-02-17 주식회사 애트랩 광 포인팅장치용 광센서모듈 및 그 제조방법
TWM311892U (en) * 2006-11-22 2007-05-11 Lite On Semiconductor Corp Movable inspection detecting module
CN101226433B (zh) * 2007-01-16 2010-07-14 义隆电子股份有限公司 光学滑鼠及其集成晶片
TWI426418B (zh) * 2007-12-25 2014-02-11 Myson Century Inc 光學導航感測器及其光學導航裝置
TWI346277B (en) * 2008-11-13 2011-08-01 Asustek Comp Inc Electronic apparatus and input device thereof
TWI498774B (zh) * 2008-12-04 2015-09-01 Elan Microelectronics Corp Optical mouse COB module and the optical mouse
US20100194465A1 (en) * 2009-02-02 2010-08-05 Ali Salih Temperature compensated current source and method therefor
SE533551C2 (sv) * 2009-02-12 2010-10-26 Senseair Ab En ljusdetektor anpassad att som diskret enhet fästas på en bärare
CN101807589B (zh) * 2009-02-17 2013-03-06 原相科技股份有限公司 感光模组及使用其的光学滑鼠
US8324602B2 (en) * 2009-04-14 2012-12-04 Intersil Americas Inc. Optical sensors that reduce specular reflections
US20100259766A1 (en) * 2009-04-14 2010-10-14 Intersil Americas Inc. Optical sensors and methods for providing optical sensors
JP2011033876A (ja) * 2009-08-03 2011-02-17 Nitto Denko Corp 光センサモジュールの製造方法およびそれによって得られた光センサモジュール
JP2011102955A (ja) * 2009-10-14 2011-05-26 Nitto Denko Corp 光センサモジュールの製造方法およびそれによって得られた光センサモジュール
DE102010000091B4 (de) * 2010-01-15 2012-06-14 Loewe Opta Gmbh Leiterplattenanordnung
JP5308408B2 (ja) 2010-07-27 2013-10-09 日東電工株式会社 光センサモジュール
JP5325184B2 (ja) 2010-08-31 2013-10-23 日東電工株式会社 光センサモジュール
US8538606B2 (en) 2010-11-03 2013-09-17 The Aerospace Corporation Systems, methods, and apparatus for sensing flight direction of a spacecraft
JP5693986B2 (ja) 2011-02-03 2015-04-01 日東電工株式会社 光センサモジュール
KR101237872B1 (ko) * 2011-02-24 2013-02-27 이병수 핑거 내비게이션 패키지 및 그 패키징 방법
DE102015109775B3 (de) * 2015-06-18 2016-09-22 RobArt GmbH Optischer Triangulationssensor zur Entfernungsmessung
DE102015119501A1 (de) 2015-11-11 2017-05-11 RobArt GmbH Unterteilung von Karten für die Roboternavigation

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4521772A (en) * 1981-08-28 1985-06-04 Xerox Corporation Cursor control device
JPS59103459U (ja) * 1982-12-28 1984-07-12 アルプス電気株式会社 フオトセンサ素子の位置決め構造
US4751505A (en) * 1986-06-23 1988-06-14 Xerox Corporation Optical mouse
US5463229A (en) * 1993-04-07 1995-10-31 Mitsui Toatsu Chemicals, Incorporated Circuit board for optical devices
JPH09181287A (ja) * 1995-10-24 1997-07-11 Sony Corp 受光装置とその製造方法
US6256016B1 (en) * 1997-06-05 2001-07-03 Logitech, Inc. Optical detection system, device, and method utilizing optical matching
JP3586379B2 (ja) * 1998-08-07 2004-11-10 ペンタックス株式会社 受光素子ユニット
US6198473B1 (en) * 1998-10-06 2001-03-06 Brad A. Armstrong Computer mouse with enhance control button (s)
US6531692B1 (en) * 1999-03-22 2003-03-11 Microsoft Corporation Optical coupling assembly for image sensing operator input device
JP4125848B2 (ja) * 1999-12-17 2008-07-30 ローム株式会社 ケース付チップ型発光装置
KR100384539B1 (ko) * 2000-09-29 2003-05-22 주식회사 애트랩 광마우스용 센서
TW504638B (en) * 2000-10-16 2002-10-01 Primax Electronics Ltd Optical mouse with a simplified design
KR20030014480A (ko) * 2001-08-11 2003-02-19 삼성전기주식회사 광마우스용 칩 온 보드

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI798602B (zh) * 2019-12-17 2023-04-11 日商蘇薩有限公司 電子設備
US11669175B2 (en) 2019-12-17 2023-06-06 Susa Inc. Electronic equipment

Also Published As

Publication number Publication date
KR100427356B1 (ko) 2004-04-13
US20030034441A1 (en) 2003-02-20
CN1402186A (zh) 2003-03-12
FR2828749A1 (fr) 2003-02-21
FR2828749B1 (fr) 2004-10-29
US6541762B2 (en) 2003-04-01
CN1173257C (zh) 2004-10-27
KR20030015016A (ko) 2003-02-20
DE10153717A1 (de) 2003-03-06

Similar Documents

Publication Publication Date Title
TW569169B (en) Sub chip on board for optical mouse
US7688309B2 (en) Optical displacement module and method to reduce the size of an optical pointing device thereof
US6501460B1 (en) Light-receiving unit for optical mouse and optical mouse having the same
US7701567B2 (en) Optoelectronic distance sensor
US7050043B2 (en) Optical apparatus
JP4602965B2 (ja) 光電入力装置、このような装置の製造方法、及びこのような装置の助けを借りて物体の動きを測定する方法
US20070194339A1 (en) Optical data communication module
CN113035795B (zh) 芯片封装结构和电子设备
CN111371975A (zh) 摄像模块封装结构
JPWO2008117800A1 (ja) 反射型光センサ
TWM302746U (en) Optical module and computer input device with improved capability of optical identification
KR20030014480A (ko) 광마우스용 칩 온 보드
EP2290505A1 (en) Optical device
KR101914541B1 (ko) 광학센서 패키지
JP2000077686A (ja) 半導体装置の実装構造
JP3976419B2 (ja) 光半導体装置
CN213336508U (zh) 反光热释电传感器
JP3976420B2 (ja) 光半導体装置
JP4159147B2 (ja) 半導体装置
TWI514201B (zh) 光學手指導覽器件
CN211606607U (zh) 摄像模块封装结构
KR20190105249A (ko) 광학센서 패키지 및 그 제조 방법
US20230309245A1 (en) Optical sensor package assembly
JP2000124479A (ja) 光半導体装置
JP2000133834A (ja) 光半導体装置

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees