TW563263B - Surface mounting method for high power light emitting diode - Google Patents

Surface mounting method for high power light emitting diode Download PDF

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Publication number
TW563263B
TW563263B TW091122418A TW91122418A TW563263B TW 563263 B TW563263 B TW 563263B TW 091122418 A TW091122418 A TW 091122418A TW 91122418 A TW91122418 A TW 91122418A TW 563263 B TW563263 B TW 563263B
Authority
TW
Taiwan
Prior art keywords
base
emitting diode
light
metal contact
patent application
Prior art date
Application number
TW091122418A
Other languages
English (en)
Chinese (zh)
Inventor
Tzer-Perng Chen
Original Assignee
United Epitaxy Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United Epitaxy Co Ltd filed Critical United Epitaxy Co Ltd
Priority to TW091122418A priority Critical patent/TW563263B/zh
Priority to DE10305021A priority patent/DE10305021B4/de
Priority to JP2003333088A priority patent/JP3994346B2/ja
Application granted granted Critical
Publication of TW563263B publication Critical patent/TW563263B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
TW091122418A 2002-09-27 2002-09-27 Surface mounting method for high power light emitting diode TW563263B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW091122418A TW563263B (en) 2002-09-27 2002-09-27 Surface mounting method for high power light emitting diode
DE10305021A DE10305021B4 (de) 2002-09-27 2003-02-07 Verfahren zur Herstellung oberflächenmontierbarer Hochleistungs-Leuchtdioden
JP2003333088A JP3994346B2 (ja) 2002-09-27 2003-09-25 発光ダイオードの表面実装方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW091122418A TW563263B (en) 2002-09-27 2002-09-27 Surface mounting method for high power light emitting diode

Publications (1)

Publication Number Publication Date
TW563263B true TW563263B (en) 2003-11-21

Family

ID=31989796

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091122418A TW563263B (en) 2002-09-27 2002-09-27 Surface mounting method for high power light emitting diode

Country Status (3)

Country Link
JP (1) JP3994346B2 (ja)
DE (1) DE10305021B4 (ja)
TW (1) TW563263B (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101577270B (zh) * 2008-05-06 2012-11-21 鸿富锦精密工业（深圳）有限公司 半导体发光组件
CN103875084A (zh) * 2011-10-05 2014-06-18 普因特工程有限公司 制造外壳封装型光学设备的方法和利用该方法制造的光学设备
CN106663731A (zh) * 2014-08-05 2017-05-10 西铁城电子株式会社 半导体装置及其制造方法

Families Citing this family (24)

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JP4557613B2 (ja) * 2004-06-28 2010-10-06 京セラ株式会社 発光素子収納用パッケージ、発光装置および照明装置
EP1810351B1 (en) 2004-10-22 2013-08-07 Seoul Opto Device Co., Ltd. Gan compound semiconductor light emitting element
JP4757477B2 (ja) * 2004-11-04 2011-08-24 株式会社 日立ディスプレイズ 光源ユニット、それを用いた照明装置及びそれを用いた表示装置
KR100696063B1 (ko) 2005-01-05 2007-03-15 엘지이노텍 주식회사 어레이 발광장치
KR100600372B1 (ko) 2005-06-08 2006-07-18 엘지전자 주식회사 발광소자 패키지 및 그 제조방법
KR100638868B1 (ko) 2005-06-20 2006-10-27 삼성전기주식회사 금속 반사 층을 형성한 엘이디 패키지 및 그 제조 방법
KR100629496B1 (ko) 2005-08-08 2006-09-28 삼성전자주식회사 Ｌｅｄ 패키지 및 그 제조방법
KR100616695B1 (ko) * 2005-10-04 2006-08-28 삼성전기주식회사 고출력 발광 다이오드 패키지
KR100699161B1 (ko) 2005-10-06 2007-03-22 엘지전자 주식회사 발광 소자 패키지 및 그의 제조 방법
KR100650263B1 (ko) 2005-11-24 2006-11-27 엘지전자 주식회사 발광 소자 패키지 및 그의 제조 방법
JP4828248B2 (ja) * 2006-02-16 2011-11-30 新光電気工業株式会社 発光装置及びその製造方法
TWI351115B (en) 2007-05-18 2011-10-21 Everlight Electronics Co Ltd Light-emitting diode module and the manufacturing method thereof
KR100926931B1 (ko) 2008-04-10 2009-11-19 주식회사 디에스엘시디 패키지 베이스용 리드프레임, 이를 이용한 전기전자소자패키지 및 그 제조방법
CN101581404B (zh) * 2008-05-13 2015-05-20 晶元光电股份有限公司 发光元件模块
TW201117428A (en) 2009-11-12 2011-05-16 Ind Tech Res Inst Method of manufacturing light emitting diode packaging
WO2011129615A2 (ko) * 2010-04-13 2011-10-20 Park Jae-Soon 발광 모듈 및 발광 모듈의 제조 방법
KR101897308B1 (ko) * 2011-01-17 2018-09-10 루미리즈 홀딩 비.브이. 발광 디바이스를 제조하기 위한 방법 및 그것을 포함하는 구조체
KR101262916B1 (ko) 2011-10-05 2013-05-09 (주)포인트엔지니어링 캔 패지키 타입의 광 디바이스 제조 방법 및 이에 의해 제조된 광 디바이스
WO2013061228A1 (en) * 2011-10-28 2013-05-02 Koninklijke Philips Electronics N.V. Light emitting device with integral shaped reflector
KR102005235B1 (ko) * 2013-03-06 2019-07-30 삼성전자주식회사 플립칩 본딩 구조를 갖는 발광 다이오드 패키지
KR20150031849A (ko) * 2013-09-17 2015-03-25 (주)포인트엔지니어링 칩 실장용 기판 및 칩 패키지
CN104576883B (zh) 2013-10-29 2018-11-16 普因特工程有限公司 芯片安装用阵列基板及其制造方法
US20180040780A1 (en) * 2015-02-13 2018-02-08 Citizen Electronics Co., Ltd. Light-emitting device and method for producing the same
US9666558B2 (en) 2015-06-29 2017-05-30 Point Engineering Co., Ltd. Substrate for mounting a chip and chip package using the substrate

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Publication number Priority date Publication date Assignee Title
JP3146452B2 (ja) * 1995-08-11 2001-03-19 スタンレー電気株式会社 面実装型ｌｅｄ素子及びその製造方法
DE19901918A1 (de) * 1998-01-28 1999-07-29 Rohm Co Ltd Halbleitende lichtemittierende Vorrichtung
JP4065051B2 (ja) * 1998-04-17 2008-03-19 スタンレー電気株式会社 表面実装ｌｅｄとその製造方法
EP1119058A4 (en) * 1999-07-29 2006-08-23 Citizen Electronics LIGHT-EMITTING DIODE
US6345903B1 (en) * 2000-09-01 2002-02-12 Citizen Electronics Co., Ltd. Surface-mount type emitting diode and method of manufacturing same
US20030057421A1 (en) * 2001-09-27 2003-03-27 Tzer-Perng Chen High flux light emitting diode having flip-chip type light emitting diode chip with a transparent substrate

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101577270B (zh) * 2008-05-06 2012-11-21 鸿富锦精密工业（深圳）有限公司 半导体发光组件
CN103875084A (zh) * 2011-10-05 2014-06-18 普因特工程有限公司 制造外壳封装型光学设备的方法和利用该方法制造的光学设备
US10062812B2 (en) 2011-10-05 2018-08-28 Point Engineering Co., Ltd. Substrate for can package-type optical device and optical device using same
CN103875084B (zh) * 2011-10-05 2018-11-13 普因特工程有限公司 制造外壳封装型光学设备的方法和利用该方法制造的光学设备
CN106663731A (zh) * 2014-08-05 2017-05-10 西铁城电子株式会社 半导体装置及其制造方法
CN106663731B (zh) * 2014-08-05 2019-08-06 西铁城电子株式会社 半导体装置及其制造方法

Also Published As

Publication number Publication date
DE10305021B4 (de) 2005-10-06
DE10305021A1 (de) 2004-04-08
JP2004119981A (ja) 2004-04-15
JP3994346B2 (ja) 2007-10-17

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