TW559979B - Substrate support and method of fabricating the same - Google Patents

Substrate support and method of fabricating the same Download PDF

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Publication number
TW559979B
TW559979B TW091117388A TW91117388A TW559979B TW 559979 B TW559979 B TW 559979B TW 091117388 A TW091117388 A TW 091117388A TW 91117388 A TW91117388 A TW 91117388A TW 559979 B TW559979 B TW 559979B
Authority
TW
Taiwan
Prior art keywords
subassembly
substrate support
reinforcing member
scope
mold
Prior art date
Application number
TW091117388A
Other languages
English (en)
Inventor
Naomi Matsumura
Masahiko Kowaka
William A Bagley
Akira Terashi
Hideaki Kondo
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Application granted granted Critical
Publication of TW559979B publication Critical patent/TW559979B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D19/00—Casting in, on, or around objects which form part of the product
    • B22D19/02—Casting in, on, or around objects which form part of the product for making reinforced articles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component

Description

559979 六、申請專利範圍 10. 如申請專利範圍第1項所述之方法，其中該加工步驟 更包含： 用一鋁插塞來填入該鋁中因該柱栓之被移除的部 分所留下的空隙。 11. 如申請專利範圍第1項所述之方法，其中該第一補強 件是由金屬或陶瓷所製成。 12. 如申請專利範圍第1項所述之方法，其中該第一補強 件是由選自於氧化鋁板，氧化鋁纖維及氧化鋁顆粒結 合氧化矽纖維，氧化矽顆粒，碳化矽纖維或碳化矽顆 粒所構成的組成中之陶瓷材料所製成的。 13. —種製造一基材支樓器的方法，該方法至少包含： 組裝一次组件，其包括一被設置成穿過一加熱件之 柱栓，該加熱件被夾在一第一補強件與一第二補強件 之間； 將該次組件支撐在一模子的底部的上方； 用熔融的鋁包覆該被置入模子内的次組件用以形 成一鑄件； 藉由移除該柱栓的至少一部分來在該鑄件上形成 一孔；及 將一插塞置於該孔的至少一部分中。 第 221" 559979 六、申請專利範圍 14. 如申請專利範圍第13項所述之方法，其中該組裝次 組件的步驟更包含將一背板以至少相距40公釐的間 隔開來的方式编合至該次組件。 15. —種製造一基材支撐器的方法，該方法至少包含： 組裝一次組件，其包含一加熱件其被多個柱栓保持 在一第一補強件與一第二補強件之間； 將一背板以至少相距40公釐的間隔開來的方式耦 合至該次組件； 在一單次傾注中用熔融鋁來鑄造被支撐於一模子 中的該次組件； 施加壓力至該熔融鋁；及 將圍該被鑄造的次組件周圍的柱栓的至少一部分 去除掉。 16.如申請專利範圍第is項所述之方法，其更包含： 施加一至少40MPa的壓力至該熔融鋁的一區域其 至少位在該次组件的正上方s 17. 如申請專利範圍第15項所述之方法’其更包含將該 模子加熱至介於35〇t至40(Tc的温度。 18. 如申請專利範圍第15項所逑之方法，其更包含用— 銘插塞來填入該紹中因該权栓之被移除的部分所留 第23育 559979 t、申請專利範圍 下的空隙。 1 9.如申請專利範圍第1 5項所述之方法，其中該施加壓 力的步驟更包含用IS來灌注（impregnating)該第一補強件 及該第二補強件。 20. 如申請專利範圍第1 5項所述之方法，其更包含將該 基材支撐器陽極化。 21. —種基材支撐器，其至少包含： 一鑄造的IS本體，其具有一外表面； 一加熱件，其被埋設在該本體内； 一第一補強件，其被埋設在該本體内； 至少一孔其被形成在該外表面與該加熱件或該第 一補強件之間； 一插塞，其被設置在該孔中介於該外表面與該加熱 件或該第一補強件之間。 2 2.如申請專利範圍第21項所述之基材支撐器，其中該 鑄造的鋁本體是在鋁的一單一傾注操作中形成的。 23.如申請專利範圍第22項所述之基材支撐器，其中在 鑄造期間一柱栓將該加熱件及該補強件保持在一間 隔開來的關係且在該插塞插入之前可從該孔中被至 559979 t、申請專利範圍 少部分地去除掉。 24. 如申請專利範圍第21項所述之基材支撐器，其中該 插塞被焊接至該鋁本體。 25. 如申請專利範圍第21項所述之基材支撐器，其更包 含一第二補強件，其被埋設在該本體中且被夾在該加 熱件與該第一補強件之間。 26. —種由一處理所製造的基材支撐器，該處理至少包 含： 將一第一補強件及一加熱件放在一柱栓上用以形 成一次組件； 在一模子中用熔融鋁將該次組件包覆起來用以形 成一鑄件；及 藉由移除至少一部分的柱栓來加工（finishing)該鑄 件。 第25頁
TW091117388A 2001-08-01 2002-08-01 Substrate support and method of fabricating the same TW559979B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/921,104 US6510888B1 (en) 2001-08-01 2001-08-01 Substrate support and method of fabricating the same

Publications (1)

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TW559979B true TW559979B (en) 2003-11-01

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Application Number Title Priority Date Filing Date
TW091117388A TW559979B (en) 2001-08-01 2002-08-01 Substrate support and method of fabricating the same

Country Status (7)

Country Link
US (2) US6510888B1 (zh)
EP (1) EP1412968A2 (zh)
JP (1) JP2005524968A (zh)
KR (1) KR100589281B1 (zh)
CN (1) CN100470715C (zh)
TW (1) TW559979B (zh)
WO (1) WO2003012835A2 (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7122979B2 (en) * 2000-12-27 2006-10-17 Transportation Techniques, Llc Method and apparatus for selective operation of a hybrid electric vehicle in various driving modes
US20040221959A1 (en) * 2003-05-09 2004-11-11 Applied Materials, Inc. Anodized substrate support
US8372205B2 (en) * 2003-05-09 2013-02-12 Applied Materials, Inc. Reducing electrostatic charge by roughening the susceptor
TWI412621B (zh) * 2004-07-16 2013-10-21 Applied Materials Inc 具有遮蔽板的陰影框
US20060054090A1 (en) * 2004-09-15 2006-03-16 Applied Materials, Inc. PECVD susceptor support construction
US8173228B2 (en) * 2006-01-27 2012-05-08 Applied Materials, Inc. Particle reduction on surfaces of chemical vapor deposition processing apparatus
US20080131622A1 (en) * 2006-12-01 2008-06-05 White John M Plasma reactor substrate mounting surface texturing
JP2010114280A (ja) * 2008-11-07 2010-05-20 Sukegawa Electric Co Ltd 基板加熱プレートヒータ
KR101147998B1 (ko) * 2011-11-14 2012-05-24 주식회사 포톤 고효율 서셉터 및 이의 제조 방법
JP5857081B2 (ja) * 2014-02-17 2016-02-10 助川電気工業株式会社 基板加熱プレートヒータの製造方法
CN104570419B (zh) * 2014-12-26 2018-01-30 深圳市华星光电技术有限公司 吸附式载台及其吸附方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3885128A (en) * 1974-07-01 1975-05-20 Gen Electric Glass-ceramic plate heating unit cast-in heat spreader
JPS5996236A (ja) 1982-11-26 1984-06-02 Toyota Motor Corp 複合材料の製造方法
US5293923A (en) 1992-07-13 1994-03-15 Alabi Muftau M Process for metallurgically bonding aluminum-base inserts within an aluminum casting
JPH0711446A (ja) 1993-05-27 1995-01-13 Applied Materials Inc 気相成長用サセプタ装置
US5509459A (en) 1994-09-28 1996-04-23 The United States Of America As Represented By The Secretary Of The Navy Pressure cast alumina tile reinforced aluminum alloy armor and process for producing the same
US6086680A (en) 1995-08-22 2000-07-11 Asm America, Inc. Low-mass susceptor
US5584936A (en) 1995-12-14 1996-12-17 Cvd, Incorporated Susceptor for semiconductor wafer processing
JPH09213781A (ja) 1996-02-01 1997-08-15 Tokyo Electron Ltd 載置台構造及びそれを用いた処理装置
DE19711702C1 (de) 1997-03-20 1998-06-25 Siemens Ag Anordnung zur Bearbeitung einer Substratscheibe und Verfahren zu deren Betrieb
US6190113B1 (en) 1997-04-30 2001-02-20 Applied Materials, Inc. Quartz pin lift for single wafer chemical vapor deposition/etch process chamber
JPH11343571A (ja) * 1998-05-29 1999-12-14 Ngk Insulators Ltd サセプター

Also Published As

Publication number Publication date
US6510888B1 (en) 2003-01-28
EP1412968A2 (en) 2004-04-28
WO2003012835A3 (en) 2003-08-28
CN100470715C (zh) 2009-03-18
KR20040030917A (ko) 2004-04-09
JP2005524968A (ja) 2005-08-18
US20030079853A1 (en) 2003-05-01
US20030024680A1 (en) 2003-02-06
WO2003012835A2 (en) 2003-02-13
CN1555569A (zh) 2004-12-15
KR100589281B1 (ko) 2006-06-14

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