558734 A7 B7 五、發明說明（f ) [發明之技術領域】558734 A7 B7 V. Description of Invention (f) [Technical Field of Invention]
本發明係有關基板處理裝置’尤其具備：對於玻璃基板 等製造液晶顯示裝置（LCD)用面板之LCD用電發CVD裝置’ 對於矽晶圓施加各種成膜之裝置等笨重物機構升降 用之基板處理裝置。 ''广JThe present invention relates to a substrate processing apparatus 'especially provided with: an electro-chemical CVD apparatus for LCDs that manufactures panels for liquid crystal display devices (LCDs), such as glass substrates'. Processing device. '' Guang J
[背景技術】 如第1圖所示，如上逑之基板處理裝置，例如，將真空蓮 送室1為中心成放射狀，氣密式地連設有載入鎖固（load lock)室2,基板加熱室3，第1處理室4，第2處理室5,第 3處理室6,第4處理室7,第5處理室8,第6處理室9’ 在載入鎖固定2中有大氣蓮送室11成為氣密連設之構 成。在真空蓮送室1内部設有基板蓮送機器人10，而在 大氣蓮送室11設有大氣蓮送機器人12。 玆參照第18圖說明習知之基板加熱室3如下。 基板加熱室3係備有氣密式連設於真空蓮送室1中之真 空室15,在真空室15内收容有加熱單元（heater unit)16 ，加熱單元16設於升降軸18之上端，升降軸18是在垂直方 向中貫通真空室15之底板17,升降軸18下端偽連結於升降 驅動部（未圖示）。在升降軸18貫通底板17之部分設有伸 縮義（bellows)19,而以氣密式密封。 加熱單元1 6偽在天花板設有反射板2 1，而以所需間隔 設有加熱板2 2，在加熱板2 2與加熱板2 2之間可支持玻璃 基板23。在圖示之加熱單元16可收容6H之玻璃基板23。 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) T裝 ----^----訂---- 蠢· 經濟部智慧財產局員工消費合作社印製 558734 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（> ) 在面對真空室15之真空運送室1之面設有基板運送孔 (未圖示），基板運送孔係由閘閥（未圖示）所開閉。又，基 板運送孔係與基板運送機器人1 〇之運送位準相符，加熱 單元1 6係由升降驅動部間歇性地升降使各段之玻璃基板 2 3可與基板運送孔之位準相符。 近年，LCD係更加變成大型化，所以，玻璃基板也從基板 尺寸370x 470mrri向650x 830inm更加變大。所以，玻璃基 板2 3之總重量之增加，加熱單元1 6之大型化，更且隨著 大型化之構件強度之強化等，加熱單元1 6之總重量爲明 顯地增加。 因此，基板加熱室3之升降機構，係在升降軸1 8之上端 將笨重物以懸樑狀態支撐著。構造上，使圖形中心與重心 相符係困難之事，升降軸1 8之支持位置與加熱單元1 6之 重心是成偏心的。此時，如第1 9圖所示，由於負荷之偏心， 對於加熱單元1 6所作用之迴轉扭矩，致使升降軸1 8撓變， 加熱單元1 6將傾斜或向水平方向位移。並且，由於水平 方向之位移致使重心G與升降軸1 8之軸心距離^更加增 大，在升降軸18中係因加熱單元16之位移而會作用更大 之迴轉力矩。 在加熱單元1 6因玻璃基板2 3被加熱至2 0 0 °C ~ 4 0 0。(3， 所以，升降軸1 8也受到某程度之加熱。材料被加熱時其 剛性就降低，加熱單元1 6之傾斜，位移會更變大。 雖然在加熱單元16與基板運送機器人1〇之間進行玻 璃基板23之授受，但是，若加熱單元16與基板運送機器 -4- 本紙張尺度適用中國國家標準（CNS)A4規格（210 x 297公爱） -----I,---r— --------訂--------- (請先閱讀背面之注意事項再填寫本頁) 558734 A7 '^^_______B7__ 五、發明說明（4 ) 人1 0之相關位置不正確時，則基板運送機器人1 〇將衝突 於玻璃基板23而導致玻璃基板23之損傷或基板運送機 器人1 0之損傷。因此，以往即使加熱單元1 6位移，設計 成具有不與基板運送機器人10發生千擾之尺寸餘裕，玻 璃基板2 3之大型化所伴隨之餘裕必須更加變大，具有加 熱單元1 6，真空室1 5大型化之問題。 [發明槪要] 本發明係鑑於這種實情，欲升降此收容有複數個基板之 加熱單元等之基板收容部時，提供一種可抑制此基板收容 部之位移所用之基板處理裝置。 依據本發明，係提供一種基板處理裝置，其係備有； 收容複數基板所用之基板收容部，與 升降上述基板收容部所用之升降驅動機構，其具有與上 述基板收容部連接之升降軸；其特徵爲： 上述基板收容部是由上述升降軸所吊掛。 較佳爲，上述基板收容部爲具有加熱器。 又，較佳爲上述升降軸軸心之延長線爲通過上述基板收 容部之重心。又，較佳爲上述升降軸爲具有鉤住構件，由 上述鉤住構件鉤住上述基板收容部而吊掛，或經由連結上 述鉤住構件與上述基板收容部所用之連結構件，由上述鉤 住構件鉤住且吊掛上述基板收容部。 又，依據本發明，提供一種基板處理裝置，其特徵爲具有： 基板加熱室，進行基板處理用之處理室，具備基板運送裝 置之運送室，設於上述基板加熱室且收容複數基板所用之 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) -裝--------訂--------- 經濟部智慧財產局員工消費合作社印製 558734 A7B7 五、發明說明（斗） 基板收容部，與吊掛升降該基板收容部用之升降驅動機 構。 [較佳實施例] 茲參照圖面說明本發明之實施例如下。 首先，參照第1圖就製造本發明之第1至第3圖之實施 例之液晶顯示裝置面板所用之LCD電漿CVD裝置略述之。 將真空運送室1爲中心成放射狀氣密地連設：載入鎖固 室2,基板加熱室3,第1處理室4,第2處理室5,第3處 理室6,第4處理室7,第5處理室8,第6處理室9,在真 空運送室1內部設有基板運送機器人10。又，在載入鎖 固室2氣密地連設有大氣運送室11，在大氣運送室11中 設有大氣運送機器人12。 從外部運入於大氣運送室1 1中之玻璃基板，係由大氣 運送機器人12在載入鎖固室2中搬入所需片數，使載入 鎖固室2密閉，被真空吸引後之載入鎖固室2之真空運送 室1側被開啓，由基板運送機器人1 0在基板加熱室3中 搬入所需片數之玻璃基板。在基板加熱室3中玻璃基板 係被預備加熱至基板可處理之所需溫度（200 °C〜400 °C )。 預備加熱已結束之玻璃基板係由基板運送機器人1 0搬 入處理室4 , 5，6 , 7，8 , 9之任一個中，而進行成膜，蝕刻之 電漿處理，或退火處理等之加熱處理等所需之處理。 上述基板處理雖然在既定之成膜溫度中進行，但是如上 述藉將基板進行預備加熱，搬入於處理室4，5，6，7，8，9之 任一而可立即進行基板處理，可省略處理室4，5，6，7，8，9 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) -裝 ---I---訂----— II--· 經濟部智慧財產局員工消費合作社印製 558734 • A7 ___ B7 五、發明說明（r) 內之升溫製程且可提升生產量。 基板處理已結束之玻璃基板，係由基板運送機器人1〇 搬入上述載入鎖固室2中，在載入鎖固室2中回復大氣之 後，由大氣運送機器人12搬出大氣運送室11。 載入鎖固室2 ,基板加熱室3係將玻璃基板或多段方式 收容所需片數，而且，在大氣運送機器人12,基板運送機 器人1 0之移載過程中使所收容之玻璃基板升降。 第1實施例 茲參照第1圖至第6圖說明本發明之第1實施例之基 板處理裝置如下。 本實施例之基板處理裝置之基板加熱室3，係如第2圖 所示，具有氣密式地連設於真空運送室丨中之真空室15, 而在真空室15內收容有加熱單元16。將氣密之真空室15 之天花板2 5中遊貫有吊軸（升降軸）2 6而經由吊軸2 6使 加熱單元1 6連結於升降驅動部2 7。 在面對真空室15之真空運送室1之面中設有基板搬運 孔（未圖示），基板搬運孔係由閘閥（沒有圖示）開閉。基板 運送孔係與基板運送機器人1 0之運送位準相符，而加熱 單元1 6由升降驅動部27所升降使各段之玻璃基板23與 基板運送孔之位準相符。 茲就加熱單元1 6說明如下。 加熱器箱28係構成爲箱狀，跨越加熱單元1 6之兩側壁 1 6 a，1 6 a間設有加熱板22。加熱板22係向上下以所需段 數（圖示係7段）成等間隔配設，在最上段之加熱板2 2上 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) .裝 ----訂------ 經濟部智慧財產局員工消費合作社印製 558734 A7 B7 五、發明說明（^ ) 側設有反射板2 1。與加熱板2 2，2 2之間有基板承接件2 9 固著於側壁1 6 a。基板承接件2 9是L字形狀，在內端載 置有玻璃基板2 3。而且，在加熱板2 2間成6段構成之開 縫（s 1 〇 t ) 2 4以收容玻璃基板2 3。 茲就升降驅動2 7說明如下。 在吊軸26下端固著有加熱器箱28之頂板28a。如第5,6 圖所示，此吊軸2 6下端係使用螺栓5 1而固定於加熱器箱 2 8之頂板2 8 a。在天花板2 5上面豎設有縱長直方形狀之 機架30,跨越機架30之上下設有4支之導軸31,在導軸 3 1滑動自如地設有升降台3 2，在升降台3 2固著有吊軸2 6 之上端。吊軸2 6之軸心較佳爲設定成能夠通過加熱單元 1 6之重心，若不通過重心時儘可能通過重心附近，來設定 吊軸26之安裝位置，使加熱單元16之重量均衝。 如第3圖所示，與導軸3 1平行地設有滾珠螺旋3 3 ,滾 珠螺旋3 3之上端部，下端部分別由軸承3 4，3 5迴轉自如 地支撐。在滾珠螺旋3 3下方設有減速器3 6 ,在減速器3 6 安裝有升降馬達3 7。從軸承3 5突出之滾珠螺旋3 3下端 是連結於減速器3 6 ,滾珠螺旋3 3係藉由減速器3 6而連 結於升降馬達3 7。 在滾珠螺旋3 3中螺合有升降塊3 8 ,升降塊3 8個固著 於升降台3 2。而且，藉驅動升降馬達3 7經由減速器3 6 而使滾珠螺旋3 3迴轉，而升降塊3 8就會升降。由於升降 塊3 8之升降，則經由升降台3 2而使吊軸2 6升降。 再參照第2圖時，在升降台3 2與天花板2 5之間氣密地 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) f[Background Art] As shown in FIG. 1, as in the above substrate processing apparatus, for example, the vacuum shower chamber 1 is radially centered, and a load lock chamber 2 is hermetically connected. The substrate heating chamber 3, the first processing chamber 4, the second processing chamber 5, the third processing chamber 6, the fourth processing chamber 7, the fifth processing chamber 8, and the sixth processing chamber 9 'have an atmosphere in the load lock 2 The lotus delivery chamber 11 has a structure that is provided in an airtight manner. A substrate-feeding robot 10 is provided inside the vacuum-feeding chamber 1, and an atmospheric-feeding robot 12 is provided in the atmospheric-feeding chamber 11. The conventional substrate heating chamber 3 will be described with reference to FIG. 18 as follows. The substrate heating chamber 3 is provided with a vacuum chamber 15 which is air-tightly connected to the vacuum delivery chamber 1. A heating unit 16 is housed in the vacuum chamber 15. The heating unit 16 is provided at the upper end of the lifting shaft 18. The lifting shaft 18 is a bottom plate 17 which penetrates the vacuum chamber 15 in the vertical direction, and the lower end of the lifting shaft 18 is pseudo-connected to a lifting drive unit (not shown). The lift shaft 18 penetrates the bottom plate 17 and is provided with bellows 19, and is hermetically sealed. The heating unit 16 is provided with a reflecting plate 21 on the ceiling, and heating plates 22 are provided at a desired interval. A glass substrate 23 can be supported between the heating plate 22 and the heating plate 22. The heating unit 16 shown in the figure can accommodate a glass substrate 23 of 6H. This paper size applies to China National Standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before filling this page) T Pack ---- ^ ---- Order ---- Stupid · Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 558734 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (&); A substrate transport hole is provided on the side of the vacuum transport chamber 1 facing the vacuum chamber 15 ( (Not shown), the substrate transfer hole is opened and closed by a gate valve (not shown). In addition, the substrate conveying holes correspond to the conveying level of the substrate conveying robot 10, and the heating unit 16 is intermittently raised and lowered by the elevating driving section so that the glass substrates 23 in each section can conform to the level of the substrate conveying holes. In recent years, LCD systems have become larger. Therefore, glass substrates have also grown from substrate sizes of 370x 470mrri to 650x 830inm. Therefore, as the total weight of the glass substrate 23 increases, the heating unit 16 increases in size, and as the strength of the enlarged components increases, the total weight of the heating unit 16 increases significantly. Therefore, the lifting mechanism of the substrate heating chamber 3 is supported on the upper end of the lifting shaft 18 in a cantilever state. Structurally, it is difficult to match the center of the figure with the center of gravity. The support position of the lifting shaft 18 and the center of gravity of the heating unit 16 are eccentric. At this time, as shown in Fig. 19, due to the eccentricity of the load, the lifting shaft 18 is deformed due to the turning torque acting on the heating unit 16, and the heating unit 16 will be inclined or displaced horizontally. In addition, due to the displacement in the horizontal direction, the center distance G of the center of gravity G and the lifting shaft 18 is further increased. In the lifting shaft 18, a larger turning moment is caused by the displacement of the heating unit 16. In the heating unit 16, the glass substrate 23 is heated to 200 ° C to 400 °. (3, therefore, the lifting shaft 18 is also heated to a certain degree. When the material is heated, its rigidity is reduced, and the heating unit 16 is tilted, and the displacement will be larger. Although the heating unit 16 and the substrate transport robot 10 The acceptance and acceptance of the glass substrate 23 is carried out, but if the heating unit 16 and the substrate conveying machine are used -4- this paper size applies the Chinese National Standard (CNS) A4 specification (210 x 297 public love) ----- I, --- r— -------- Order --------- (Please read the notes on the back before filling this page) 558734 A7 '^^ _______ B7__ 5. Description of the invention (4) People 1 0 of When the relevant position is incorrect, the substrate transport robot 10 will collide with the glass substrate 23 and cause damage to the glass substrate 23 or the substrate transport robot 10. Therefore, even if the heating unit 16 is displaced in the past, it is designed to have a substrate The size margin of the transport robot 10 is disturbed, and the margin accompanying the increase in the size of the glass substrate 23 must be further increased, and there is a problem that the heating unit 16 and the vacuum chamber 15 are enlarged. [Inventive Summary] The present invention is based on the This kind of fact, if you want to lift and lower, this board contains a plurality of substrates. In the case of a substrate accommodating portion of a thermal unit, a substrate processing device for suppressing displacement of the substrate accommodating portion is provided. According to the present invention, a substrate processing device is provided, and a substrate accommodating portion for accommodating a plurality of substrates is provided. A lifting drive mechanism for lifting and lowering the substrate storage portion has a lifting shaft connected to the substrate storage portion; and is characterized in that the substrate storage portion is suspended by the lifting shaft. Preferably, the substrate storage portion is It has a heater. It is preferable that the extension line of the axis of the lifting shaft passes through the center of gravity of the substrate accommodating portion. It is also preferable that the lifting shaft has a hooking member, and the substrate receiving is hooked by the hooking member. According to the present invention, there is provided a substrate processing apparatus, which is provided with a substrate processing device. It is characterized by having: a substrate heating chamber, a processing chamber for substrate processing, a transportation chamber provided with a substrate transportation device, The paper size used in the above substrate heating chamber to accommodate multiple substrates is in accordance with China National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling out this page) -Package ----- --- Order --------- Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs and Consumer Cooperatives, printed 558734 A7B7 V. Description of the invention (bucket) The substrate storage section, and the lifting drive mechanism for lifting and lowering the substrate storage section. [Preferred Embodiment] An embodiment of the present invention will be described below with reference to the drawings. First, referring to Fig. 1, an LCD plasma CVD apparatus for manufacturing a liquid crystal display device panel according to the embodiments of Figs. 1 to 3 of the present invention will be described. Briefly. The vacuum transfer chamber 1 is connected in a radial and airtight manner as the center: the loading lock chamber 2, the substrate heating chamber 3, the first processing chamber 4, the second processing chamber 5, the third processing chamber 6, and the fourth processing chamber. 7, the fifth processing chamber 8, the sixth processing chamber 9, and a substrate transfer robot 10 is provided inside the vacuum transfer chamber 1. The load lock chamber 2 is air-tightly connected with an atmospheric transfer chamber 11, and the atmospheric transfer chamber 11 is provided with an atmospheric transfer robot 12. The glass substrates carried into the atmospheric transfer chamber 11 from the outside are loaded by the atmospheric transfer robot 12 into the loading and locking chamber 2 so that the loading and locking chamber 2 is sealed and vacuum loaded. The vacuum transfer chamber 1 side of the lock chamber 2 is opened, and the substrate transfer robot 10 carries the required number of glass substrates in the substrate heating chamber 3. In the substrate heating chamber 3, the glass substrate is preliminarily heated to a temperature (200 ° C ~ 400 ° C) required for the substrate to be processed. The glass substrate whose pre-heating has been completed is carried into the processing chamber 4, 5, 6, 7, 8, 9 by the substrate transfer robot 10, and is heated by plasma forming, etching, or annealing. Required processing. Although the above substrate processing is performed at a predetermined film forming temperature, as described above, the substrate can be immediately processed by carrying out preliminary heating of the substrate and carried into any of the processing chambers 4, 5, 6, 7, 8, 9 and can be omitted Processing chambers 4, 5, 6, 7, 8, 9 This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling this page) -Packing --- I --- Order ----- II-- · Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 558734 • A7 ___ B7 V. Description of the invention The heating process in (r) can increase the production volume. The glass substrate whose substrate processing has been completed is carried into the loading lock chamber 2 by the substrate transfer robot 10, and after returning to the atmosphere in the load lock chamber 2, the atmospheric transfer robot 12 removes the atmospheric transfer chamber 11. The loading lock chamber 2 and the substrate heating chamber 3 contain glass wafers or a plurality of pieces in a multi-segment manner, and the glass substrates contained therein are moved up and down during the transfer process by the atmospheric transfer robot 12 and the substrate transfer robot 10. First Embodiment A substrate processing apparatus according to a first embodiment of the present invention will be described below with reference to Figs. 1 to 6. The substrate heating chamber 3 of the substrate processing apparatus of this embodiment has a vacuum chamber 15 air-tightly connected to the vacuum transfer chamber 丨 as shown in FIG. 2, and a heating unit 16 is housed in the vacuum chamber 15. . A hanging shaft (elevating shaft) 2 6 is passed through the ceiling 2 5 of the airtight vacuum chamber 15, and the heating unit 16 is connected to the elevating driving unit 27 through the hanging shaft 2 6. A substrate transfer hole (not shown) is provided in the surface of the vacuum transfer chamber 1 facing the vacuum chamber 15, and the substrate transfer hole is opened and closed by a gate valve (not shown). The substrate conveying hole is in accordance with the conveying level of the substrate conveying robot 10, and the heating unit 16 is raised and lowered by the elevating driving section 27 so that the glass substrate 23 in each section is in accordance with the level of the substrate conveying hole. The heating unit 16 is described below. The heater box 28 is formed in a box shape, and a heating plate 22 is provided across the two side walls 16 a and 16 a of the heating unit 16. The heating plate 22 is arranged at equal intervals up and down with the required number of sections (7 sections shown in the figure). On the upper section of the heating plate 22, the paper size applies to the Chinese National Standard (CNS) A4 (210 X 297) (Please read the notes on the back before filling out this page). Assembling-ordering ------ printed by the Intellectual Property Bureau of the Ministry of Economic Affairs's Consumer Cooperatives 558734 A7 B7 V. Description of the invention (^) Side settings There are reflection plates 2 1. A substrate receiving member 2 9 is fixed to the side wall 16 a between the heating plate 2 2 and 2 2. The substrate receiving member 29 is L-shaped, and a glass substrate 23 is mounted on the inner end. Furthermore, a six-slot slit (s 1 0 t) 24 is formed between the heating plates 22 to accommodate the glass substrate 23. The lift drive 27 is described below. A ceiling plate 28 a of the heater box 28 is fixed to the lower end of the hanging shaft 26. As shown in Figures 5 and 6, the lower end of this hanging shaft 26 is fixed to the top plate 2 8 a of the heater box 2 8 with bolts 5 1. On the ceiling 25, there is a vertical and rectangular frame 30, and four guide shafts 31 are provided above and below the frame 30. A lifting platform 3 2 is slidably arranged on the guiding shaft 31, and a lifting platform 3 2 is provided on the lifting platform. 3 2 has the upper end of the hanging shaft 2 6 fixed. The axis of the hanging shaft 26 is preferably set to be able to pass through the center of gravity of the heating unit 16. If the center of gravity is not passed, the installation position of the hanging shaft 26 is set as close to the center of gravity as possible so that the weight of the heating unit 16 is evenly distributed. As shown in Fig. 3, a ball screw 3 3 is provided in parallel with the guide shaft 31, and the upper end and the lower end of the ball screw 3 3 are rotatably supported by bearings 3 4, 3 5 respectively. A speed reducer 3 6 is provided below the ball screw 3 3, and a lifting motor 37 is installed on the speed reducer 3 6. The lower end of the ball screw 3 3 protruding from the bearing 35 is connected to the reducer 3 6, and the ball screw 3 3 is connected to the lifting motor 37 through the reducer 36. Lifting blocks 3 8 are screwed into the ball screw 3 3, and the lifting blocks 3 8 are fixed to the lifting table 32. In addition, the ball screw 3 3 is rotated by driving the lifting motor 37 through the speed reducer 3 6, and the lifting block 38 is raised and lowered. Due to the lifting of the lifting block 38, the lifting shaft 26 is lifted through the lifting platform 32. When referring to Figure 2, the paper size between the lifting platform 3 2 and the ceiling 2 5 is air-tight. This paper applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm). (Please read the precautions on the back before filling (This page) f
Γ ^1 ϋ 1§ βϋ 11 I ^ 1 t ϋ ί ϋ ϋ I I 經濟部智慧財產局員工消費合作社印製 經濟部智慧財產局員工消費合作社印製 558734 A7 B7 五、發明說明（7 ) 設有伸縮囊3 9 ,而將吊軸2 6之天花板2 5之貫通部氣密 地密封。在天花板2 5設有排氣凸緣4 0 ,在排氣凸緣4 〇 連接有排氣管41，排氣管41係經由排氣凸緣40連通於 真空室15內並且也連通於排氣裝置（未圖示）。 以下，說明動作。 真空室15內係經由排氣凸緣40,排氣管41而由排氣 裝置（未圖示）吸引成真空。真氣運送室1內與加熱室3 之真空室15內係成爲同壓之狀態下由基板運送機器人10 來進行玻璃基板2 3之運入。 例如，在第2圖之狀態下最下段之開縫2 4是與基板運 送機器人1 0之運入位準相符，在最下段之開縫24中運入 玻璃基板2 3。運入後，就驅動升降馬達3 7，經由減速器3 6 使滾珠螺旋3 3迴轉。由於滾珠螺旋3 3之迴轉，升降塊3 8 只下降開縫24之節距分量，與升降塊38 —體之升降台32， 吊軸26，加熱單元1 6只下降開縫24之節距分量，從下第 2段之開縫2 4是與基板運送機器人1 〇之運入位準相符。 由基板運送機器人10運入第2片玻璃基板23。 反覆上述動作，在所有6段之開縫2 4中運入玻璃基板 2 3。運入後，加熱板2 2就被供電，將玻璃基板2 3加熱到 所需溫度。 按，在基板加熱室3加熱玻璃基板2 3之時段中，於處理 室4,5,6,7,8,9並行進行所需之處理。 當玻璃基板2 3被加熱到所需溫度時，就由基板運送機 器人10從基板加熱室3逐片運出，由基板運送機器人10 -9- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) ---I I I I I · I I I---I . 558734 Α7 Β7 五、發明說明（#) 運入於任一處理室4，5，6，7，8，9中。 玻璃基板2 3之運出係與玻璃基板2 3之運入相反之動 作，而由升降馬達3 7之升降塊3 8之1開縫節距分量之間 歇上升動作與基板運送機器人10之運出動作之互動下進 行。 關於玻璃基板2 3之運出，運送，若下一製程之處理室成 爲空狀態時，就立即進行運送，倘若下一製程之處理室爲 處理途中時，玻璃基板2 3就在基板加熱室3內維持所需 溫度，而等待至下一製程之處理室之處理結束。 下一製程之處理室，亦即處理室4，5，6 , 7，8，9之任一， 例如運送至處理室4，被處理之玻璃基板2 3係因應成膜 等之處理種類而選擇處理室5，6，7，8之任一，被運送至基 板運送機器人10進行處理。並且，運送至第6處理室9, 結束最終處理之後，經由載入鎖固室2由大氣運送機器人 12運出大氣運送室11。 茲參照第4圖來說明升降驅動部27如下。 升降驅動部2 7係經由吊軸2 6而吊掛加熱單元1 6。又， 吊軸26之軸心設定成能夠通過加熱單元1 6之重心。因 此，不會發生由於加熱單元16之重力所造成之迴轉力矩， 所以，加熱單元1 6不會發生傾傾，水平位移。 又，吊軸2 6之軸心未通過加熱單元1 6之重心，而只偏 心α時，在吊軸26中有加熱單元16之重量Wx偏心量α 之迴轉力矩在第4圖中作用於反時針方向。若吊軸2 6沒 有剛性時，加熱單元1 6將位移至重心G與吊軸26之延長 -10- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) -1 --------訂---------^i 經濟部智慧財產局員工消費合作社印製 經濟部智慧財產局員工消費合作社印製 558734 A7 B7 五、發明說明（9 ) 軸心相符爲止。亦即，α減少之方向，亦即向迴轉力矩減 少之方向發生位移。 然而，於本發明係所發生之最大迴轉力矩是重量W X偏 心量α，吊軸2 6係只有具有能夠對應於此迴轉力矩之剛 性就可以。 按，如上述以往係加熱單元1 6之位移連同偏心量/3會 更加增大，而增大迴轉力矩。與此相對，於本發明係可使 用較以往剛性更小之吊軸2 6，又使用同樣之吊軸2 6時加 熱單元1 6之位移可抑制成很小。 因可將加熱單元1 6之位移抑制爲小，所以可實現正確 之基板運送，可防止玻璃基板23與基板運送機器人1 0之 干擾，可避免玻璃基板23之破損而·減少維修次數。 第2實施例 於第1實施例，吊軸26 (升降軸）下端係使用螺栓5 1固 定於加熱器箱28之頂板28a，但是，於本實施例，並非只 是以螺絲固定而已，在吊軸26(升降軸）下端設鉤住部，將 加熱單元1 6鉤住於鉤掛部之後才螺絲固定之點與第1實 施例相異但是其他點爲相同。 如第7圖所示，在吊軸2 6先端部設鉤住構件5 2。在鉤 住構件5 2設有4個螺絲孔5 3。 雖然吊軸2 6之先端鉤掛構件5 2可直接鉤住於加熱單 元1 6，但是，於本實施例，係經由如第8圖所示之連結板5 4 將吊軸26先端之鉤住構件5 2鉤住於加熱單元1 6。在連 結板5 4設有2支連結棒固定用溝5 7。在連結棒固定用 -11 - 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公爱） -----------裝---- (請先閱讀背面之注意事項再填寫本頁) -1^ ·1111111 558734 A7 ____ B7 五、發明說明（、° ) 溝5 7中設有螺絲孔5 8。在連結板5 4中央部設有貫通孔 5 5 ,在其周圍設有4個孔5 6。又，如第1 3圖所示，在加熱 單元1.6上部，設有2支連結棒5 9。在連結棒5 9分別各 設有2個孔6 0。 如第9圖所示，配置吊軸2 6，連結板5 4，加熱單元1 6之 運結棒5 9。如第1 0圖所示，下降此吊軸2 6，將吊軸2 6先 端之鉤住構件5 2穿通於連結板5 4之貫通孔5 5 ° 如第1 1圖，第1 2圖所示，將吊軸2 6先端之鉤住構件5 2 穿通於連結板5 4之貫通孔5 5之狀態下將連結板5 4迴轉 9 0度，使用螺栓6 1固定。 在此狀態下上升此吊軸26時，加熱單元1 6之連結棒5 9 就被定位於·連結板5 4之連結棒固定用溝5 7 °在此狀態 下，如第1 4圖所示，藉由螺栓6 2來固定此連結板5 4與連 結棒5 9，而吊軸2 6與加熱單元1 6就被連結，藉升降吊軸 2 6 ,加熱單元1 6就可升降。 加熱單元1 6係在成鉤形狀之吊軸26先端之鉤住構件 52經由連結板54而被鉤住之狀態。於此，固定此吊軸26 先端之鉤住構件5 2與連結板5 4用之螺栓6 1，固定此連 結板5 4與連結棒5 9用之螺栓6 2之功能是定位，並非加 熱單元1 6之重心直接鉤住於螺栓6 1 , 62而成之狀態。像這 樣，加熱單元1 6因並非由螺栓6 1，6 2之栓緊力，耐力所固 定，所以即使由於熱周期之反覆而發生螺栓6 1 , 62之鬆弛， 加熱單元1 6也不至於從吊軸2 6掉落。又，對於螺栓6 1，6 2， 並非直接施加此加熱單元1 6之重量，所以，進行維修時螺 -12- 表紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐) ' " (請先閱讀背面之注意事項再填寫本頁) .裝--------訂--------- 經濟部智慧財產局員工消費合作社印製 558734 A7 B7 五、發明說明（Η ) 栓61，62之裝卸是容易的。 第3實施例 於本實施例，係在基板加熱室3之真空室1 5內之下部 設滑動基座7 1，這點是與第1實施例不同，但是其他點爲 相同。 因本發明之基板加熱室爲將加熱單元1 6由吊軸2 6吊 掛之吊掛式，所以，可以在加熱單元1 6之下放入此種屬於 裝卸用軌道工模之滑動基座7 1，利用滑動基座7 1就可容 易取出加熱單元1 6。 如第1 5圖所示，將真空室1 5內之下部設置滑動基座 71。如第16圖所示，將滑動基座71設置於真空室15內， 由軸81，托架80使隆起於真空室15之內壁加以固定，固 定後，如第1 5圖所示，在滑動基座7 1上使加熱單元1 6下 降，放鬆吊軸2 6與加熱單元1 6連結部分之螺栓，將吊軸 2 6從加熱單元1 6脫離。加熱單元1 6係藉使用滑動基座 上之滾輪7 2就可簡單移動。又，作爲安全措施時使用固 鎖螺栓7 4，就可固定加熱單元1 6使其不會發生不必要之 移動。藉設置此滑動基座7 1可將位於室開口部7 9中之 高低差7 3就消除，滑動基板7 1之滾輪7 2，位於作業台7 7 之滾輪7 8就互相排列於同一線上，就可容易將加熱單元 1 6從室開口部7 9取進取出。 又，在作業台77中也作爲安全措施而具有固定加熱單 元1 6所需之固定金屬件7 6以及脫落防止銷7 5。爲此將 加熱單元1 6移動於作業台7 7之後將作業台7 7移動至另 -13- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) —· ϋ ϋ n meat n n ϋ 一讀0,讎.^1 n i·— n ϋ I # 經濟部智慧財產局員工消費合作社印製 558734 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（p) 外處所，也可維修。 像這樣，藉使用滑動基座7 1，作業台7 7，則室開口部7 9 之高低差就消失，不需要此種跨越高低差之用力作業， 可將滑動基座71，作業台77上之加熱單元16容易且安 全地從真空室1 5之室開口部7 9取進取出。 關於不使用這種滑動基座7 1之情形，參照第1 7圖說明 如下。在真空室1 5具有拉出加熱單元1 6所用之維修用 之門82,使用0環83進行與真空室15間之真空密封。 因此，在真空室1 5存在有高低差73取進取出笨重（3 00kg 以上之）加熱單元1 6時，因必須跨越此高低差7 3所以變 成維修之障礙。 如上述，若依據本發明之上述各實施例，因可將升降驅 動部之加熱單元之位移抑制爲小，所以，可實現正確之基 板運送，可防止玻璃基板與基板運送機器人之干擾，可避 免玻璃基板之破損，維修次數就減少，而可提升裝置之運 轉率。 又，即使不變更預備加熱室3之運送位準就可增加玻璃 基板之載置段數，所以可得到高生產量，又也可擴大開縫 間距離藉大型化玻璃基板，即使基板或運送臂之撓變量增 加也可對應。 按，本發明並非限於基板加熱室3之升降驅動部2 7也 可實施於載入鎖固室2之升降驅動部，又成爲升降對象者 並非限於加熱單元1 6 ,也可以爲收容複數片基板用之收 容部。並且，當然也可實施於升降其他笨重物用之升降驅 -14- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） --------·— ^--------訂--------- (請先閱讀背面之注意事項再填寫本頁) 558734 A7 ____B7_五、發明說明（〇 ) 動部。 又，本發明也可適用於矽晶圓之處理裝置。 若依據本發明，欲升降收容複數基板用之加熱單元等基 板收容部時，可抑止此基板收容部之位移，其結果，可提供 一種基板處理裝置，其不僅提升基板收容部與其他機構間 之相對位置精度，並且，可防止機器間之互相干擾所引起 之損傷。 圖式簡單說明 第1圖係說明本發明實施例之基板處理裝置所用之槪 略平面圖。 第2圖係說明本發明第1實施例之基板處理裝置所用 之縱剖面圖。 第3圖係說明本發明第1實施例之基板處理裝置所用 之縱剖面圖。 第4圖係說明本發明第1實施例之基板處理裝置所用 之圖。 經濟部智慧財產局員工消費合作社印製 之 5分 第部 之 發 本 明 說 係 圖 剖 縱 大 放 圖 第 用 所 置 裝 彐二 理 處 板 基 之 例 施 實 用 所 置 裝 彐二 理 處 板 基 之 例 施 實 第 明 發 本 明 說 係放 圖之 6分 第部 之 剖 縱 大 圖 用 所 置 裝 m: 理 處 板 基 之 例 施 實 2 第 明 發 本 明。 說圖 係視 圖斗 7略 第槪 之 用 所 置 裝 mil 理 處 板 基 之 例 施 實 2 第 明 發 本 明。 說圖 係視 圖 4 8略 第槪 之 (請先閱讀背面之注意事項再填寫本頁)Γ ^ 1 ϋ 1§ βϋ 11 I ^ 1 t ϋ ί ί ϋ II Printed by the Employees 'Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Printed by 558734 A7 B7 V. Description of the invention (7) There is telescopic The bladder 3 9 hermetically seals the penetrating portion of the ceiling 25 of the hanging shaft 26. An exhaust flange 40 is provided on the ceiling 25, and an exhaust pipe 41 is connected to the exhaust flange 40. The exhaust pipe 41 communicates with the vacuum chamber 15 through the exhaust flange 40 and also communicates with the exhaust gas. Device (not shown). The operation will be described below. The inside of the vacuum chamber 15 is sucked into a vacuum by an exhaust device (not shown) through an exhaust flange 40 and an exhaust pipe 41. The glass substrates 23 are carried in by the substrate transfer robot 10 under the same pressure in the vacuum chamber 15 of the true air transfer chamber 1 and the heating chamber 3. For example, in the state shown in Fig. 2, the lowermost slot 24 is in accordance with the carrying level of the substrate transport robot 10, and the glass substrate 23 is carried in the lowermost slot 24. After being carried in, the lifting motor 37 is driven, and the ball screw 3 3 is rotated through the reducer 3 6. Due to the rotation of the ball screw 3 3, the lifting block 3 8 only lowers the pitch component of the slot 24, and the lifting block 38-the lifting platform 32 of the body, the hanging shaft 26, and the heating unit 16 only lowers the pitch component of the slot 24. The slot 2 4 from the second paragraph below corresponds to the loading level of the substrate transfer robot 10. The second glass substrate 23 is carried by the substrate transfer robot 10. Repeat the above operation, and carry in the glass substrate 2 3 in the slits 2 4 of all 6 sections. After being carried in, the heating plate 22 is powered, and the glass substrate 2 3 is heated to the required temperature. During the period in which the substrate heating chamber 3 heats the glass substrate 23, the required processing is performed in parallel in the processing chambers 4, 5, 6, 7, 8, and 9. When the glass substrates 2 and 3 are heated to the required temperature, they are conveyed piece by piece by the substrate conveying robot 10 from the substrate heating chamber 3, and the substrate conveying robots 10 -9. 210 X 297 mm) (Please read the notes on the back before filling out this page) --- IIIII · II I --- I. 558734 Α7 Β7 V. Description of the invention (#) Shipped in any processing room 4, 5, 6, 7, 8, 9 The carrying out of the glass substrate 23 is opposite to the carrying in of the glass substrate 23, and the intermittent raising operation of the slit pitch component by the lifting block 3 8 of the lifting motor 3 7 and the carrying out of the substrate transport robot 10 Under the action of interaction. Regarding the delivery and transportation of the glass substrate 2 3, if the processing chamber of the next process becomes empty, the transportation will be performed immediately. If the processing chamber of the next process is in the process of processing, the glass substrate 2 3 will be in the substrate heating chamber 3 Maintain the required temperature within the process and wait until the processing in the processing chamber of the next process ends. The processing chamber of the next process, that is, any of the processing chambers 4, 5, 6, 7, 8, 9 is transported to the processing chamber 4, and the glass substrate 2 to be processed is selected according to the type of processing such as film formation. Any one of the processing chambers 5, 6, 7, and 8 is transferred to the substrate transfer robot 10 for processing. Then, it is transported to the sixth processing chamber 9 and after the final processing is completed, it is transported out of the atmospheric transport chamber 11 by the atmospheric transport robot 12 via the load lock chamber 2. The lift driving unit 27 will be described below with reference to FIG. 4. The elevating drive section 27 hangs the heating unit 16 via a hanging shaft 26. The axis of the hanging shaft 26 is set to pass through the center of gravity of the heating unit 16. Therefore, a turning moment due to the gravity of the heating unit 16 does not occur, so the heating unit 16 does not tilt and shift horizontally. In addition, when the axis of the hoisting shaft 26 does not pass through the center of gravity of the heating unit 16 and only the eccentricity α, the weight Wx of the heating unit 16 in the hoisting shaft 26 has a turning moment acting on the reaction in FIG. 4 Hour hand direction. If the hanging shaft 2 6 is not rigid, the heating unit 16 will move to the center of gravity G and the extension of the hanging shaft 26 -10- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) (Please read first Note on the back then fill out this page) -1 -------- Order --------- ^ i Printed by the Consumers' Cooperatives of the Intellectual Property Bureau of the Ministry of Economy System 558734 A7 B7 V. Description of the invention (9) Until the axis coincides. That is, the direction in which α decreases, that is, the displacement occurs in the direction in which the turning moment decreases. However, the maximum turning moment that occurs in the present invention is the weight eccentricity α, and the suspension shaft 26 can only have rigidity that can respond to this turning moment. Pressing, as mentioned above, the displacement of the conventional heating unit 16 together with the eccentricity / 3 will further increase, and the turning torque will increase. On the other hand, in the present invention, the hanging shaft 26 having a lower rigidity than in the past can be used. When the same hanging shaft 26 is used, the displacement of the heating unit 16 can be suppressed to be small. Since the displacement of the heating unit 16 can be suppressed to be small, accurate substrate transportation can be achieved, interference between the glass substrate 23 and the substrate transportation robot 10 can be prevented, damage to the glass substrate 23 can be avoided, and the number of maintenance can be reduced. In the second embodiment, in the first embodiment, the lower end of the hanging shaft 26 (elevating shaft) is fixed to the top plate 28a of the heater box 28 with bolts 51. However, in this embodiment, it is not only fixed by screws. A hooking portion is provided at the lower end of 26 (elevating shaft). The point where the heating unit 16 is hooked to the hooking portion and then screwed is different from the first embodiment, but the other points are the same. As shown in FIG. 7, a hook member 52 is provided at the tip of the hanging shaft 26. The hook member 5 2 is provided with four screw holes 53. Although the leading end hooking member 5 2 of the hanging shaft 26 can be directly hooked to the heating unit 16, in this embodiment, the leading end of the hanging shaft 26 is hooked through the connecting plate 5 4 as shown in FIG. 8. The member 5 2 is hooked to the heating unit 16. The connecting plate 5 4 is provided with two connecting rod fixing grooves 57. -11 for fixing the connecting rod-This paper size is applicable to China National Standard (CNS) A4 specification (210 X 297 public love) ----------- install ---- (Please read the note on the back first Please fill in this page for more information) -1 ^ · 1111111 558734 A7 ____ B7 V. Description of the invention (, °) The groove 5 7 is provided with screw holes 5 8. A through hole 5 5 is provided in the central portion of the connecting plate 5 4, and four holes 5 6 are provided around the through hole. As shown in Fig. 13, two connecting rods 59 are provided on the upper part of the heating unit 1.6. Each of the connecting rods 5 9 is provided with two holes 60. As shown in Fig. 9, a hanging shaft 26, a connecting plate 5 4 and a heating rod 59 of the heating unit 16 are arranged. As shown in Fig. 10, lower the hanging shaft 26 and pass the hook member 5 2 at the tip of the hanging shaft 2 6 through the through hole 5 5 of the connecting plate 5 4 as shown in Fig. 11 and Fig. 12 As shown, the hooking member 5 2 at the tip of the hanging shaft 2 6 is passed through the through hole 55 of the connecting plate 5 4, and the connecting plate 5 4 is rotated 90 degrees, and fixed with the bolt 61. When the hanging shaft 26 is raised in this state, the connecting rod 5 9 of the heating unit 16 is positioned at the connecting rod fixing groove 5 7 of the connecting plate 5 4. In this state, as shown in FIG. 14 The connecting plate 5 4 and the connecting rod 5 9 are fixed by bolts 6 2, and the hanging shaft 2 6 and the heating unit 16 are connected. By lifting the hanging shaft 2 6, the heating unit 16 can be raised and lowered. The heating unit 16 is in a state where the hooking member 52 at the tip of the hook-shaped hanging shaft 26 is hooked via the connecting plate 54. Here, the bolt 6 1 for fixing the hook member 5 2 and the connecting plate 5 4 at the tip of the hanging shaft 26 is fixed, and the function of the bolt 6 2 for fixing the connecting plate 5 4 and the connecting rod 5 9 is positioning, not the heating unit. The center of gravity of 16 is directly hooked to bolts 6 1 and 62. In this way, the heating unit 16 is not fixed by the tightening force and endurance of the bolts 6 1, 6 2, so even if the loosening of the bolts 6 1, 62 occurs due to the repetition of the thermal cycle, the heating unit 16 will not be removed from Hanging shaft 2 6 drops. In addition, for bolts 6 1, 62, the weight of this heating unit 16 is not directly applied. Therefore, when performing maintenance, the size of the screw-12-sheet paper is subject to China National Standard (CNS) A4 (210 X 297 mm). " (Please read the notes on the back before filling out this page). -------- Order --------- Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 558734 A7 B7 V. Description of the invention (i) The attachment and detachment of the bolts 61 and 62 are easy. Third Embodiment This embodiment is different from the first embodiment in that a sliding base 71 is provided in the lower part of the vacuum chamber 15 of the substrate heating chamber 3, but the other points are the same. Because the substrate heating chamber of the present invention is a hanging type that suspends the heating unit 16 by a hanging shaft 2 6, the sliding base 7 belonging to the rail mold for loading and unloading can be placed under the heating unit 16. 1. The heating unit 16 can be easily taken out by using the sliding base 71. As shown in FIG. 15, a slide base 71 is provided inside and below the vacuum chamber 15. As shown in FIG. 16, the slide base 71 is set in the vacuum chamber 15, and the bulge is fixed on the inner wall of the vacuum chamber 15 by the shaft 81 and the bracket 80. After fixing, as shown in FIG. 15, Slide the base 7 1 to lower the heating unit 16, loosen the bolts at the connecting part of the hanging shaft 2 6 and the heating unit 16, and detach the hanging shaft 26 from the heating unit 16. The heating unit 16 can be easily moved by using the roller 7 2 on the sliding base. In addition, by using the locking bolt 7 4 as a safety measure, the heating unit 16 can be fixed so that it does not move unnecessarily. By providing this sliding base 7 1, the height difference 7 3 located in the chamber opening portion 7 9 can be eliminated. The rollers 7 2 of the sliding substrate 7 1 and the rollers 7 8 of the working table 7 7 are aligned on the same line. The heating unit 16 can be easily taken in and out from the chamber opening 79. In addition, the work table 77 includes, as a safety measure, a fixed metal member 76 required for fixing the heating unit 16 and a drop prevention pin 75. To this end, move the heating unit 16 to the workbench 7 7 and then move the workbench 7 7 to another -13- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) (Please read the back Please fill in this page again for attention) — · ϋ meat n meat nn ϋ First reading 0, 雠. ^ 1 ni · — n ϋ I # Printed by the Employees ’Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 558734 System A7 B7 V. Description of the invention (p) External spaces can also be repaired. In this way, by using the sliding base 7 1 and the working table 7 7, the height difference of the chamber opening portion 7 9 disappears. This kind of hard work across the height difference is not required. The sliding base 71 and the working table 77 can be mounted on The heating unit 16 is easily taken in and out from the chamber openings 79 of the vacuum chamber 15. The case where such a slide base 71 is not used is described below with reference to Fig. 17. The vacuum chamber 15 has a maintenance door 82 for pulling out the heating unit 16 and a 0-ring 83 is used to perform vacuum sealing between the vacuum chamber 15 and the vacuum chamber 15. Therefore, when there is a height difference 73 in the vacuum chamber 15 for taking in and taking out a heavy (300 kg or more) heating unit 16, the height difference 7 3 has to be crossed, which becomes an obstacle to maintenance. As described above, according to the above embodiments of the present invention, since the displacement of the heating unit of the lifting driving section can be suppressed to be small, accurate substrate transportation can be realized, interference between the glass substrate and the substrate transportation robot can be prevented, and avoidance can be avoided. If the glass substrate is damaged, the number of repairs will be reduced, and the operation rate of the device can be improved. In addition, the number of glass substrate placement stages can be increased without changing the transport level of the pre-heating chamber 3. Therefore, a high throughput can be obtained, and the distance between the slits can be increased by using a large-scale glass substrate. Corresponding increase in torsional variable is also available. According to the invention, the present invention is not limited to the lifting driving part 27 of the substrate heating chamber 3, and may also be implemented in the lifting driving part of the loading lock chamber 2. The person who becomes the lifting target is not limited to the heating unit 16 and may also accommodate a plurality of substrates. Containment Department. And, of course, it can also be implemented in lifting drives for lifting other heavy objects. -14- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) -------- · ^- ------ Order --------- (Please read the precautions on the back before filling this page) 558734 A7 ____B7_ V. Description of the invention (〇) Moving part. The present invention is also applicable to a silicon wafer processing apparatus. According to the present invention, when a substrate storage portion such as a heating unit for a plurality of substrates is to be raised and lowered, the displacement of the substrate storage portion can be suppressed. As a result, a substrate processing device can be provided, which not only improves the substrate storage portion and other mechanisms Relative position accuracy, and can prevent damage caused by mutual interference between machines. Brief Description of the Drawings Fig. 1 is a schematic plan view illustrating a substrate processing apparatus according to an embodiment of the present invention. Fig. 2 is a longitudinal sectional view illustrating a substrate processing apparatus according to a first embodiment of the present invention. Fig. 3 is a longitudinal sectional view illustrating a substrate processing apparatus according to a first embodiment of the present invention. Fig. 4 is a diagram for explaining a substrate processing apparatus according to a first embodiment of the present invention. 5 points printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Example of the implementation of the first Mingfa Benming said that the 6th part of the plan is placed in the large vertical section of the installation m: Example of the board of the management of the implementation of the 2nd Mingfa Benming. Illustrating the diagram is an example of using the mil to manage the base of the base. Figure 2 shows the present invention. Talking Picture Department View Picture 4 8 Sketch No. 2 (Please read the notes on the back before filling this page)
本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 558734 A7 ------ 五、發明說明（W ) 第9圖係說明本發明第2實施例之基板處理裝置所用 之槪略縱剖面圖。 第1 0圖係說明本發明第2實施例之基板處理裝置所用 之槪略斜視圖。 第1 1圖係說明本發明第2實施例之基板處理裝置所用 之槪略斜視圖。 第12圖係第11圖之A箭頭符號圖。 第1 3圖係說明本發明第2實施例之基板處理裝置所用 之槪略斜視圖。 第1 4圖係第1 3圖之BB線部分放大縱剖面圖。 第1 5圖係說明本發明第3實施例之基板處理裝置所用 之槪略縱剖面圖。 第1 6圖係說明本發明第3實施例之基板處理裝置所用 之槪略縱剖面圖。 第1 7圖係比較說明基板處理裝置所用之槪略縱剖面 圖。 第1 8圖係說明習知處理裝置所用之槪略縱剖面圖。 第1 9圖係說明習知基板處理裝置所用之圖。 (請先閱讀背面之注意事項再填寫本頁) 零裝--------訂--------- 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 558734 五、發明說明（15) 【符號說明】 1 真空運送室 2 ( L1 ) 載入鎖固 3(H) 基板加熱室 4 ( R1 ) 第1處理室 5 ( R2 ) 第2處理室 6 ( R3 ) 第3處理室 7 ( R4 ) 第4處理室 8 ( R5 ) 第5處理室 9 ( R6 ) 第6處理室 10 基板運送機器人 11 大氣運送室 12 大氣運送機器人 15 真空室 16 加熱單元 17 底板 18 升降軸 19 伸縮囊 2 1 反射板 22 加熱板 23 玻璃基板 24 開縫 25 天花板 26 吊軸（升降軸） 27 升降驅動部 28 加熱器箱 28a 頂板 29 基板承接件 30 跨越機架 3 1 導軸 32 升降台 -16a - 558734 五、發明說明（16) 33 滾珠螺旋 34 軸承 3 5 軸承 36 減速器 37 升降馬達 38 升降塊 39 伸縮囊 40 排氣凸緣 4 1 排氣管 5 1 螺栓 52 鉤住構件 53 螺絲孔 54 連結板 55 貫通孔 56 孔 57 連結棒固定用溝 5 8 螺絲孔 59 連結棒 60 孔 61、62 螺栓 7 1 滑動基座 72 滾輪 73 高低差 74 固鎖螺栓 75 脫落防止銷 76 金屬件 77 作業台 -16b-This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 558734 A7 ------ 5. Description of the invention (W) Figure 9 is used to illustrate the substrate processing device of the second embodiment of the present invention Zhi a little longitudinal section. Fig. 10 is a schematic perspective view illustrating a substrate processing apparatus according to a second embodiment of the present invention. Fig. 11 is a schematic perspective view illustrating a substrate processing apparatus according to a second embodiment of the present invention. FIG. 12 is an arrow A diagram of FIG. 11. Fig. 13 is a schematic perspective view illustrating a substrate processing apparatus according to a second embodiment of the present invention. FIG. 14 is an enlarged vertical sectional view taken along a line BB in FIG. 13. Fig. 15 is a schematic longitudinal sectional view showing a substrate processing apparatus according to a third embodiment of the present invention. Fig. 16 is a schematic longitudinal sectional view illustrating a substrate processing apparatus according to a third embodiment of the present invention. Fig. 17 is a schematic longitudinal sectional view of a substrate processing apparatus for comparison and explanation. Fig. 18 is a schematic longitudinal sectional view illustrating a conventional processing device. Fig. 19 is a diagram for explaining a conventional substrate processing apparatus. (Please read the precautions on the back before filling out this page.) Zero Pack -------- Order --------- Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. (CNS) A4 specification (210 X 297 mm) 558734 V. Description of the invention (15) [Symbol description] 1 Vacuum transfer chamber 2 (L1) Loading lock 3 (H) Substrate heating chamber 4 (R1) First treatment Chamber 5 (R2) 2nd processing chamber 6 (R3) 3rd processing chamber 7 (R4) 4th processing chamber 8 (R5) 5th processing chamber 9 (R6) 6th processing chamber 10 substrate transfer robot 11 atmospheric transfer chamber 12 Air transport robot 15 Vacuum chamber 16 Heating unit 17 Bottom plate 18 Lifting shaft 19 Telescopic bag 2 1 Reflective plate 22 Heating plate 23 Glass substrate 24 Slot 25 Ceiling 26 Hanging shaft (lifting shaft) 27 Lifting drive unit 28 Heater box 28a Top plate 29 Substrate receiving member 30 Straddle the frame 3 1 Guide shaft 32 Lifting table -16a-558734 V. Description of invention (16) 33 Ball screw 34 Bearing 3 5 Bearing 36 Reducer 37 Lifting motor 38 Lifting block 39 Telescopic bag 40 Exhaust flange 4 1 exhaust pipe 5 1 screw 52 Hooking member 53 Screw hole 54 Connecting plate 55 Through hole 56 hole 57 Connecting rod fixing groove 5 8 Screw hole 59 Connecting rod 60 hole 61, 62 Bolt 7 1 Slide base 72 Roller 73 Height difference 74 Locking bolt 75 falling off Prevent pin 76 Metal piece 77 Workbench-16b-