TW556459B - Substrate processing equipment - Google Patents

Substrate processing equipment Download PDF

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Publication number
TW556459B
TW556459B TW92101122A TW92101122A TW556459B TW 556459 B TW556459 B TW 556459B TW 92101122 A TW92101122 A TW 92101122A TW 92101122 A TW92101122 A TW 92101122A TW 556459 B TW556459 B TW 556459B
Authority
TW
Taiwan
Prior art keywords
liquid
printed circuit
circuit board
substrate processing
substrate
Prior art date
Application number
TW92101122A
Other languages
English (en)
Chinese (zh)
Other versions
TW200408328A (en
Inventor
Kisaburo Niiyama
Chikara Hara
Original Assignee
Tokyo Kakoki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Kakoki Co Ltd filed Critical Tokyo Kakoki Co Ltd
Application granted granted Critical
Publication of TW556459B publication Critical patent/TW556459B/zh
Publication of TW200408328A publication Critical patent/TW200408328A/zh

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  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW92101122A 2002-11-08 2003-01-20 Substrate processing equipment TW556459B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002325078A JP2004158765A (ja) 2002-11-08 2002-11-08 基板処理装置

Publications (2)

Publication Number Publication Date
TW556459B true TW556459B (en) 2003-10-01
TW200408328A TW200408328A (en) 2004-05-16

Family

ID=32211940

Family Applications (1)

Application Number Title Priority Date Filing Date
TW92101122A TW556459B (en) 2002-11-08 2003-01-20 Substrate processing equipment

Country Status (2)

Country Link
JP (1) JP2004158765A (ja)
TW (1) TW556459B (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI433306B (zh) 2006-09-29 2014-04-01 Semiconductor Energy Lab 半導體裝置的製造方法
US8137417B2 (en) 2006-09-29 2012-03-20 Semiconductor Energy Laboratory Co., Ltd. Peeling apparatus and manufacturing apparatus of semiconductor device
JP2011023378A (ja) * 2009-07-13 2011-02-03 Tokyo Kakoki Kk 基板材の表面処理装置
CN101871121B (zh) * 2010-06-29 2012-07-04 常州市正成标牌设备有限公司 金属板材电解蚀刻方法及其蚀刻机
JP6189279B2 (ja) * 2014-11-14 2017-08-30 新光電気工業株式会社 エッチング装置
TWI575641B (zh) * 2016-06-02 2017-03-21 盟立自動化股份有限公司 溼式製程設備
KR102505266B1 (ko) * 2016-12-30 2023-02-28 어플라이드 머티어리얼스, 인코포레이티드 기판 상의 균일한 액체 유동 분배를 위한 스프레이 바 설계
JP7007060B2 (ja) * 2018-05-21 2022-01-24 東京化工機株式会社 基板材のエッチング装置

Also Published As

Publication number Publication date
JP2004158765A (ja) 2004-06-03
TW200408328A (en) 2004-05-16

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