TW556292B - Wire bonding apparatus - Google Patents

Wire bonding apparatus Download PDF

Info

Publication number
TW556292B
TW556292B TW090117782A TW90117782A TW556292B TW 556292 B TW556292 B TW 556292B TW 090117782 A TW090117782 A TW 090117782A TW 90117782 A TW90117782 A TW 90117782A TW 556292 B TW556292 B TW 556292B
Authority
TW
Taiwan
Prior art keywords
nozzle
air
tension
lead
air passage
Prior art date
Application number
TW090117782A
Other languages
English (en)
Chinese (zh)
Inventor
Hiroshi Ushiki
Tooru Mochida
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Application granted granted Critical
Publication of TW556292B publication Critical patent/TW556292B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Replacement Of Web Rolls (AREA)
TW090117782A 2000-09-07 2001-07-20 Wire bonding apparatus TW556292B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000272099A JP2002083837A (ja) 2000-09-07 2000-09-07 ワイヤボンディング装置

Publications (1)

Publication Number Publication Date
TW556292B true TW556292B (en) 2003-10-01

Family

ID=18758279

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090117782A TW556292B (en) 2000-09-07 2001-07-20 Wire bonding apparatus

Country Status (4)

Country Link
US (1) US6619530B2 (https=)
JP (1) JP2002083837A (https=)
KR (1) KR100412110B1 (https=)
TW (1) TW556292B (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102630338A (zh) * 2009-12-25 2012-08-08 Adamant工业株式会社 空气张力装置
CN102658344A (zh) * 2012-05-29 2012-09-12 深圳恒高自动技术有限公司 线材自动引导穿线装置及线材引导输送方法
CN103999204A (zh) * 2012-02-07 2014-08-20 株式会社新川 打线装置

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006036873A1 (en) * 2004-09-27 2006-04-06 Kulicke And Soffa Industries, Inc. Wire feed system for a wire bonding apparatus
US20060091181A1 (en) * 2004-10-28 2006-05-04 Kulicke And Soffa Industries, Inc. Wire tensioner for a wire bonder
AU2005304141B2 (en) * 2004-11-02 2010-08-26 Hid Global Gmbh Laying device, contacting device, advancing system, laying and contacting unit, production system, method for the production and a transponder unit
US7677432B2 (en) * 2005-05-03 2010-03-16 Texas Instruments Incorporated Spot heat wirebonding
US20080236593A1 (en) * 2006-06-22 2008-10-02 Nellcor Puritan Bennett Llc Endotracheal cuff and technique for using the same
US8434487B2 (en) 2006-06-22 2013-05-07 Covidien Lp Endotracheal cuff and technique for using the same
US7971339B2 (en) * 2006-09-26 2011-07-05 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
US8286332B2 (en) * 2006-09-26 2012-10-16 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
WO2008057091A1 (en) * 2006-11-09 2008-05-15 Kulicke And Soffa Industries, Inc. Wire feed system for a wire bonding machine and configured to apply a variable tension to the wire; method of operating the same
JP4700633B2 (ja) 2007-02-15 2011-06-15 株式会社新川 ワイヤ洗浄ガイド
US7954689B2 (en) * 2007-05-04 2011-06-07 Asm Technology Singapore Pte Ltd Vacuum wire tensioner for wire bonder
SG146606A1 (en) * 2007-05-04 2008-10-30 Asm Tech Singapore Pte Ltd Temperature control of a bonding stage
US7896218B2 (en) * 2007-06-28 2011-03-01 Western Digital Technologies, Inc. Apparatus and method for conductive metal ball bonding with electrostatic discharge detection
ES2355682T3 (es) * 2007-09-18 2011-03-30 Hid Global Ireland Teoranta Procedimiento para la unión de un conductor de cable dispuesto sobre un sustrato.
US8459530B2 (en) * 2009-10-29 2013-06-11 Asm Technology Singapore Pte Ltd Automatic wire feeding method for wire bonders
US20120132695A1 (en) * 2010-11-30 2012-05-31 Yue Zhang Wire feeding apparatus for wire bonders
TWI566875B (zh) 2014-02-24 2017-01-21 新川股份有限公司 線張力器
CN105304223B (zh) * 2015-12-03 2017-07-28 浙江正导光电股份有限公司 一种微细铜线穿模引导装置
DE102020117641A1 (de) * 2020-07-03 2022-01-05 Hesse Gmbh Drahtführungsmodul und Ultraschall-Drahtbonder hiermit
WO2023067776A1 (ja) * 2021-10-21 2023-04-27 株式会社新川 ワイヤ張力調整方法及びワイヤ張力調整装置
DE102022001054A1 (de) * 2022-03-25 2023-09-28 Hesse Gmbh Ultraschallbondvorrichtung und Drahtführungsmodul hierfür
CN220506046U (zh) * 2023-08-14 2024-02-20 上海凯虹科技电子有限公司 一种焊线机及其气管接头
CN117123984A (zh) * 2023-10-27 2023-11-28 宁波尚进自动化科技有限公司 双通道氮气保护装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4172544A (en) * 1977-05-17 1979-10-30 Sola Basic Industries, Inc. Wire tensioning and feeding device
JPS571238A (en) * 1980-06-03 1982-01-06 Fujitsu Ltd Bonding of wire
JPS58218131A (ja) 1982-06-14 1983-12-19 Mitsubishi Electric Corp ネイルヘツドワイヤボンダのワイヤ供給装置
JPH075668B2 (ja) 1987-02-04 1995-01-25 チッソ株式会社 高結晶性ポリプロピレン
DE58908123D1 (de) * 1988-02-23 1994-09-08 F&K Delvotec Bondtechnik Gmbh Vorrichtung und Verfahren zur gesteuerten Zuführung eines Bonddrahtes zum wedge oder zur Kapillare eines Bondkopfes.
JP2617541B2 (ja) * 1988-11-01 1997-06-04 九州日本電気株式会社 ワイヤーボンディング装置
US5114066A (en) * 1990-11-20 1992-05-19 Texas Instruments Incorporated Voice coil programmable wire tensioner
JP3016880B2 (ja) 1991-02-01 2000-03-06 三菱化学株式会社 フィルム成形用高結晶性ポリプロピレン
JP3260531B2 (ja) 1994-02-01 2002-02-25 宮崎沖電気株式会社 エアによる極細線の張力発生装置
US5402927A (en) * 1994-06-09 1995-04-04 Kulicke And Soffa Investments, Inc. Adjustable wire tensioning apparatus
JP3576214B2 (ja) * 1994-07-12 2004-10-13 宮崎沖電気株式会社 ワイヤボンダにおけるバキュームテンショナの制御方法とその構造
JPH0945721A (ja) * 1995-08-03 1997-02-14 Kaijo Corp ワイヤ案内装置及びワイヤ案内方法並びに該装置を具備したワイヤボンディング装置
US5750645A (en) 1996-05-10 1998-05-12 Inteplast Corporation Process for the production of calendered film of polypropylene resin
JP3984657B2 (ja) 1997-05-15 2007-10-03 チッソ株式会社 ポリプロピレン系未延伸成形体
US6376058B1 (en) 1999-12-21 2002-04-23 Avery Dennison Corporation Polypropylene based compositions and films and labels formed therefrom

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102630338A (zh) * 2009-12-25 2012-08-08 Adamant工业株式会社 空气张力装置
CN102630338B (zh) * 2009-12-25 2015-08-19 Adamant工业株式会社 空气张力装置
CN103999204A (zh) * 2012-02-07 2014-08-20 株式会社新川 打线装置
CN103999204B (zh) * 2012-02-07 2016-09-14 株式会社新川 打线装置
CN102658344A (zh) * 2012-05-29 2012-09-12 深圳恒高自动技术有限公司 线材自动引导穿线装置及线材引导输送方法
CN102658344B (zh) * 2012-05-29 2015-04-22 深圳恒高自动技术有限公司 线材自动引导穿线装置及线材引导输送方法

Also Published As

Publication number Publication date
KR100412110B1 (ko) 2003-12-24
JP2002083837A (ja) 2002-03-22
US6619530B2 (en) 2003-09-16
KR20020019876A (ko) 2002-03-13
US20020027152A1 (en) 2002-03-07

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