KR100412110B1 - 와이어 본딩 장치 - Google Patents

와이어 본딩 장치 Download PDF

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Publication number
KR100412110B1
KR100412110B1 KR10-2001-0045946A KR20010045946A KR100412110B1 KR 100412110 B1 KR100412110 B1 KR 100412110B1 KR 20010045946 A KR20010045946 A KR 20010045946A KR 100412110 B1 KR100412110 B1 KR 100412110B1
Authority
KR
South Korea
Prior art keywords
nozzle
wire
air
tension
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR10-2001-0045946A
Other languages
English (en)
Korean (ko)
Other versions
KR20020019876A (ko
Inventor
우시키히로시
모치다도오루
Original Assignee
가부시키가이샤 신가와
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 신가와 filed Critical 가부시키가이샤 신가와
Publication of KR20020019876A publication Critical patent/KR20020019876A/ko
Application granted granted Critical
Publication of KR100412110B1 publication Critical patent/KR100412110B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Replacement Of Web Rolls (AREA)
KR10-2001-0045946A 2000-09-07 2001-07-30 와이어 본딩 장치 Expired - Fee Related KR100412110B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2000-00272099 2000-09-07
JP2000272099A JP2002083837A (ja) 2000-09-07 2000-09-07 ワイヤボンディング装置

Publications (2)

Publication Number Publication Date
KR20020019876A KR20020019876A (ko) 2002-03-13
KR100412110B1 true KR100412110B1 (ko) 2003-12-24

Family

ID=18758279

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2001-0045946A Expired - Fee Related KR100412110B1 (ko) 2000-09-07 2001-07-30 와이어 본딩 장치

Country Status (4)

Country Link
US (1) US6619530B2 (https=)
JP (1) JP2002083837A (https=)
KR (1) KR100412110B1 (https=)
TW (1) TW556292B (https=)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006036873A1 (en) * 2004-09-27 2006-04-06 Kulicke And Soffa Industries, Inc. Wire feed system for a wire bonding apparatus
US20060091181A1 (en) * 2004-10-28 2006-05-04 Kulicke And Soffa Industries, Inc. Wire tensioner for a wire bonder
AU2005304141B2 (en) * 2004-11-02 2010-08-26 Hid Global Gmbh Laying device, contacting device, advancing system, laying and contacting unit, production system, method for the production and a transponder unit
US7677432B2 (en) * 2005-05-03 2010-03-16 Texas Instruments Incorporated Spot heat wirebonding
US20080236593A1 (en) * 2006-06-22 2008-10-02 Nellcor Puritan Bennett Llc Endotracheal cuff and technique for using the same
US8434487B2 (en) 2006-06-22 2013-05-07 Covidien Lp Endotracheal cuff and technique for using the same
US7971339B2 (en) * 2006-09-26 2011-07-05 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
US8286332B2 (en) * 2006-09-26 2012-10-16 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
WO2008057091A1 (en) * 2006-11-09 2008-05-15 Kulicke And Soffa Industries, Inc. Wire feed system for a wire bonding machine and configured to apply a variable tension to the wire; method of operating the same
JP4700633B2 (ja) 2007-02-15 2011-06-15 株式会社新川 ワイヤ洗浄ガイド
US7954689B2 (en) * 2007-05-04 2011-06-07 Asm Technology Singapore Pte Ltd Vacuum wire tensioner for wire bonder
SG146606A1 (en) * 2007-05-04 2008-10-30 Asm Tech Singapore Pte Ltd Temperature control of a bonding stage
US7896218B2 (en) * 2007-06-28 2011-03-01 Western Digital Technologies, Inc. Apparatus and method for conductive metal ball bonding with electrostatic discharge detection
ES2355682T3 (es) * 2007-09-18 2011-03-30 Hid Global Ireland Teoranta Procedimiento para la unión de un conductor de cable dispuesto sobre un sustrato.
US8459530B2 (en) * 2009-10-29 2013-06-11 Asm Technology Singapore Pte Ltd Automatic wire feeding method for wire bonders
EP2518760A4 (en) * 2009-12-25 2014-09-17 Adamant Kogyo Co Air tension apparatus
US20120132695A1 (en) * 2010-11-30 2012-05-31 Yue Zhang Wire feeding apparatus for wire bonders
JP5296233B2 (ja) * 2012-02-07 2013-09-25 株式会社新川 ワイヤボンディング装置
CN102658344B (zh) * 2012-05-29 2015-04-22 深圳恒高自动技术有限公司 线材自动引导穿线装置及线材引导输送方法
TWI566875B (zh) 2014-02-24 2017-01-21 新川股份有限公司 線張力器
CN105304223B (zh) * 2015-12-03 2017-07-28 浙江正导光电股份有限公司 一种微细铜线穿模引导装置
DE102020117641A1 (de) * 2020-07-03 2022-01-05 Hesse Gmbh Drahtführungsmodul und Ultraschall-Drahtbonder hiermit
WO2023067776A1 (ja) * 2021-10-21 2023-04-27 株式会社新川 ワイヤ張力調整方法及びワイヤ張力調整装置
DE102022001054A1 (de) * 2022-03-25 2023-09-28 Hesse Gmbh Ultraschallbondvorrichtung und Drahtführungsmodul hierfür
CN220506046U (zh) * 2023-08-14 2024-02-20 上海凯虹科技电子有限公司 一种焊线机及其气管接头
CN117123984A (zh) * 2023-10-27 2023-11-28 宁波尚进自动化科技有限公司 双通道氮气保护装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4172544A (en) * 1977-05-17 1979-10-30 Sola Basic Industries, Inc. Wire tensioning and feeding device
JPS571238A (en) * 1980-06-03 1982-01-06 Fujitsu Ltd Bonding of wire
JPS58218131A (ja) 1982-06-14 1983-12-19 Mitsubishi Electric Corp ネイルヘツドワイヤボンダのワイヤ供給装置
JPH075668B2 (ja) 1987-02-04 1995-01-25 チッソ株式会社 高結晶性ポリプロピレン
DE58908123D1 (de) * 1988-02-23 1994-09-08 F&K Delvotec Bondtechnik Gmbh Vorrichtung und Verfahren zur gesteuerten Zuführung eines Bonddrahtes zum wedge oder zur Kapillare eines Bondkopfes.
JP2617541B2 (ja) * 1988-11-01 1997-06-04 九州日本電気株式会社 ワイヤーボンディング装置
US5114066A (en) * 1990-11-20 1992-05-19 Texas Instruments Incorporated Voice coil programmable wire tensioner
JP3016880B2 (ja) 1991-02-01 2000-03-06 三菱化学株式会社 フィルム成形用高結晶性ポリプロピレン
JP3260531B2 (ja) 1994-02-01 2002-02-25 宮崎沖電気株式会社 エアによる極細線の張力発生装置
US5402927A (en) * 1994-06-09 1995-04-04 Kulicke And Soffa Investments, Inc. Adjustable wire tensioning apparatus
JP3576214B2 (ja) * 1994-07-12 2004-10-13 宮崎沖電気株式会社 ワイヤボンダにおけるバキュームテンショナの制御方法とその構造
JPH0945721A (ja) * 1995-08-03 1997-02-14 Kaijo Corp ワイヤ案内装置及びワイヤ案内方法並びに該装置を具備したワイヤボンディング装置
US5750645A (en) 1996-05-10 1998-05-12 Inteplast Corporation Process for the production of calendered film of polypropylene resin
JP3984657B2 (ja) 1997-05-15 2007-10-03 チッソ株式会社 ポリプロピレン系未延伸成形体
US6376058B1 (en) 1999-12-21 2002-04-23 Avery Dennison Corporation Polypropylene based compositions and films and labels formed therefrom

Also Published As

Publication number Publication date
JP2002083837A (ja) 2002-03-22
US6619530B2 (en) 2003-09-16
KR20020019876A (ko) 2002-03-13
US20020027152A1 (en) 2002-03-07
TW556292B (en) 2003-10-01

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