TW555621B - Polishing end point detecting device for wafer polishing apparatus - Google Patents

Polishing end point detecting device for wafer polishing apparatus Download PDF

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Publication number
TW555621B
TW555621B TW091122200A TW91122200A TW555621B TW 555621 B TW555621 B TW 555621B TW 091122200 A TW091122200 A TW 091122200A TW 91122200 A TW91122200 A TW 91122200A TW 555621 B TW555621 B TW 555621B
Authority
TW
Taiwan
Prior art keywords
light
brightness
polishing
light source
termination point
Prior art date
Application number
TW091122200A
Other languages
English (en)
Chinese (zh)
Inventor
Akihiko Yamane
Osamu Matsushita
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Application granted granted Critical
Publication of TW555621B publication Critical patent/TW555621B/zh

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Landscapes

  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW091122200A 2001-12-04 2002-09-26 Polishing end point detecting device for wafer polishing apparatus TW555621B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001369503A JP3804064B2 (ja) 2001-12-04 2001-12-04 ウェーハ研磨装置の研磨終点検出方法及び装置

Publications (1)

Publication Number Publication Date
TW555621B true TW555621B (en) 2003-10-01

Family

ID=19178882

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091122200A TW555621B (en) 2001-12-04 2002-09-26 Polishing end point detecting device for wafer polishing apparatus

Country Status (2)

Country Link
JP (1) JP3804064B2 (ja)
TW (1) TW555621B (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7764377B2 (en) 2005-08-22 2010-07-27 Applied Materials, Inc. Spectrum based endpointing for chemical mechanical polishing
KR101398570B1 (ko) * 2005-08-22 2014-05-22 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 폴리싱의 스펙트럼 기반 모니터링을 위한 장치 및 방법
TWI387508B (zh) * 2008-05-15 2013-03-01 3M Innovative Properties Co 具有終點窗孔之拋光墊及使用其之系統及方法
WO2009158665A1 (en) 2008-06-26 2009-12-30 3M Innovative Properties Company Polishing pad with porous elements and method of making and using the same
US9162340B2 (en) 2009-12-30 2015-10-20 3M Innovative Properties Company Polishing pads including phase-separated polymer blend and method of making and using the same
JP2012019114A (ja) * 2010-07-08 2012-01-26 Tokyo Seimitsu Co Ltd 研磨終点検出装置、及び研磨終点検出方法
US8547538B2 (en) * 2011-04-21 2013-10-01 Applied Materials, Inc. Construction of reference spectra with variations in environmental effects
JP6473050B2 (ja) * 2015-06-05 2019-02-20 株式会社荏原製作所 研磨装置

Also Published As

Publication number Publication date
JP3804064B2 (ja) 2006-08-02
JP2003168667A (ja) 2003-06-13

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