TW555621B - Polishing end point detecting device for wafer polishing apparatus - Google Patents
Polishing end point detecting device for wafer polishing apparatus Download PDFInfo
- Publication number
- TW555621B TW555621B TW091122200A TW91122200A TW555621B TW 555621 B TW555621 B TW 555621B TW 091122200 A TW091122200 A TW 091122200A TW 91122200 A TW91122200 A TW 91122200A TW 555621 B TW555621 B TW 555621B
- Authority
- TW
- Taiwan
- Prior art keywords
- light
- brightness
- polishing
- light source
- termination point
- Prior art date
Links
Landscapes
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001369503A JP3804064B2 (ja) | 2001-12-04 | 2001-12-04 | ウェーハ研磨装置の研磨終点検出方法及び装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW555621B true TW555621B (en) | 2003-10-01 |
Family
ID=19178882
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW091122200A TW555621B (en) | 2001-12-04 | 2002-09-26 | Polishing end point detecting device for wafer polishing apparatus |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP3804064B2 (ja) |
TW (1) | TW555621B (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7764377B2 (en) | 2005-08-22 | 2010-07-27 | Applied Materials, Inc. | Spectrum based endpointing for chemical mechanical polishing |
KR101398570B1 (ko) * | 2005-08-22 | 2014-05-22 | 어플라이드 머티어리얼스, 인코포레이티드 | 화학적 기계적 폴리싱의 스펙트럼 기반 모니터링을 위한 장치 및 방법 |
TWI387508B (zh) * | 2008-05-15 | 2013-03-01 | 3M Innovative Properties Co | 具有終點窗孔之拋光墊及使用其之系統及方法 |
WO2009158665A1 (en) | 2008-06-26 | 2009-12-30 | 3M Innovative Properties Company | Polishing pad with porous elements and method of making and using the same |
US9162340B2 (en) | 2009-12-30 | 2015-10-20 | 3M Innovative Properties Company | Polishing pads including phase-separated polymer blend and method of making and using the same |
JP2012019114A (ja) * | 2010-07-08 | 2012-01-26 | Tokyo Seimitsu Co Ltd | 研磨終点検出装置、及び研磨終点検出方法 |
US8547538B2 (en) * | 2011-04-21 | 2013-10-01 | Applied Materials, Inc. | Construction of reference spectra with variations in environmental effects |
JP6473050B2 (ja) * | 2015-06-05 | 2019-02-20 | 株式会社荏原製作所 | 研磨装置 |
-
2001
- 2001-12-04 JP JP2001369503A patent/JP3804064B2/ja not_active Expired - Fee Related
-
2002
- 2002-09-26 TW TW091122200A patent/TW555621B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP3804064B2 (ja) | 2006-08-02 |
JP2003168667A (ja) | 2003-06-13 |
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Legal Events
Date | Code | Title | Description |
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GD4A | Issue of patent certificate for granted invention patent | ||
MM4A | Annulment or lapse of patent due to non-payment of fees |