TW548353B - Process and device for the production of a single - Google Patents

Process and device for the production of a single Download PDF

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Publication number
TW548353B
TW548353B TW087120906A TW87120906A TW548353B TW 548353 B TW548353 B TW 548353B TW 087120906 A TW087120906 A TW 087120906A TW 87120906 A TW87120906 A TW 87120906A TW 548353 B TW548353 B TW 548353B
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Taiwan
Prior art keywords
ring
single crystal
patent application
heating device
melt
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TW087120906A
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English (en)
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Ammon Wilfried Dr Von
Erich Dr Tomzig
Janis Dr Virbulis
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Wacker Siltronic Ges Fur Halbe
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    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B15/00Single-crystal growth by pulling from a melt, e.g. Czochralski method
    • C30B15/14Heating of the melt or the crystallised materials
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S117/00Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
    • Y10S117/90Apparatus characterized by composition or treatment thereof, e.g. surface finish, surface coating
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T117/00Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
    • Y10T117/10Apparatus
    • Y10T117/1024Apparatus for crystallization from liquid or supercritical state
    • Y10T117/1032Seed pulling
    • Y10T117/1068Seed pulling including heating or cooling details [e.g., shield configuration]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T117/00Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
    • Y10T117/10Apparatus
    • Y10T117/1024Apparatus for crystallization from liquid or supercritical state
    • Y10T117/1032Seed pulling
    • Y10T117/1072Seed pulling including details of means providing product movement [e.g., shaft guides, servo means]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T117/00Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
    • Y10T117/10Apparatus
    • Y10T117/1024Apparatus for crystallization from liquid or supercritical state
    • Y10T117/1076Apparatus for crystallization from liquid or supercritical state having means for producing a moving solid-liquid-solid zone
    • Y10T117/1088Apparatus for crystallization from liquid or supercritical state having means for producing a moving solid-liquid-solid zone including heating or cooling details

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)

Description

經濟部中央標準局員工消費合作社印製 548353 A7 B7 五、發明説明(1 ) 本發明相闞於藉由融體抽拉單晶體以製造半導體材料 單晶體之一種方法及一種裝置,其中該融體係容納在一坩 堝内且係藉坩堝周圍之旁側加熱器加熱。 此種製造單晶體之方法係稱為左科拉斯基法且係 經常研究之目摞。業已習知的是,成長中單晶體内若干特 殊缺點之影響視抽拉速率V及單晶體與融體間相界處之軸 向溫度梯度G而定。若抽拉單晶體期間之情況能滿足V/ G〈 Ccrit (C crit 係一常數)之條件,將形成許多稱作大 凹痕之填隙缺點(杜恩伯格,安孟合著,電化學學會學報, 第143卷,第5期(1996))。該類缺點(M下稱作L-缺點)將 大幅損及進一步加工單晶體Μ製造功能性電子分件之產率 。由上述條件可清楚地顯示,為避免L-缺點之發生,應試 圖儘可能提高抽拉速率。 但抽拉單晶體時,經發琨:若單晶體成長之方式變化 不大,抽拉速率僅能增加至某一程度。特別是,成長速率 過高時,單晶體開始喪失預期之圓柱形成長且以不完全呈 圓形成長,亦即形成對應其晶體取向之平面晶體面,Μ取 代圓柱形側表面。再者,若成長並非完全圓形,在經抽拉 之材料内產生晶體結晶格子缺點之風險則增加,因而導致 該材料不能再使用。 本發明顯示一種方法用Μ拖延由圓柱型成長過渡至不 完全11Μ成長直至成長速率達到高於現行者為止。 本發明相鬮於一種藉由融體抽拉單晶體Μ製造半導體 材料單晶體之方法,該融體係容納在一坩堝内且係藉坩渦 - 3 - 本紙張尺度適用中國國家檩準(CNS ) Α4規格(210X297公釐) (讀先閱鍊背面之注意事項再填寫本頁) •1^^· 訂 548353 Α7 Β7 五、發明説明(2 ) 周圍之旁側加熱器加熱,其中於圍繞單晶體之環型區域内 ,藉圍繞單晶體且位於融體上方之環型加熱裝置,該融體 得Μ進一步加熱。 該方法更便於製造實際上無L-缺點之圓柱形單晶體。 用其製造大直徑(例如:直徑200公厘、300公厘或400公厘) 矽單晶體特別有利。 為實施該方法,特建議一種裝置,其中圍繞單晶體之 環型加熱裝置係配置在融體上方,其所釋出之輻射能係用 Μ加熱圍鐃單晶體之環型區域之融體。 有利的是,該環型加熱裝置係適當地配置在單晶體上 方,俾單晶體與加熱裝置間之距離小於加熱裝置與坩堝壁 間之距雛。若加熱裝置與單晶體間之距離儘可能小至僅3 公分,將特別合意。若加熱裝置係固定在一絕熱型防熱護 罩(該護罩可防止單晶體接受旁側加熱器之熱輻射能)之下 緣上則更為合意。應謹慎從事的是,加熱裝置僅係用以加 熱融體,並非單晶體。所Μ,假若適當,單晶體與加熱裝 置間應設置絕熱型防熱護罩。環型加熱裝置與融體表面間 之距離Μ10至20公厘為佳。 經濟部中央標準局員工消費合作社印製 (請先閲氟背面之注意事項再填寫本頁) 環型加熱裝置係於單晶體周圍之近-表面區域内加熱融 體。所以在單晶體與坩堝間之融體中產生一陡峭軸向溫度 梯度,Μ促使單晶體之圓柱型成長。 該環型加熱裝置更可用Μ提供製造融體所需之部分能 源並縮短熔化半導體材料所需之時間。若旁側加熱器及( 假若適當)及底部加熱器(配置在坩堝下方)之熱源減少, 一 4 - 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ297公釐) 548353 A7 B7 五、發明説明(3 ) Μ環型加熱器進一步加熱融體亦屬合意。如此可防止坩渦 材料(通常係石英玻璃且易遭熱融體侵襲)提前腐蝕。坩堝 腐蝕速率之減緩有助於提昇單#型半導體材料之產率。 再者,由於其熱慣性低,該環型加熱裝置亦可合意地 用Μ實施迅速能源控制,進而影響徑向成長及抽拉速率。 因此直徑及抽拉速率之變動可大幅減低。 在另一具體實施例中,藉改變熱源,該環型加熱裝置 係用Μ控制融體及晶體中之氧含量。增加環型裝置之熱源 可促使SiO自融體表面蒸發,而旁側加熱器及(隨意地)底 加熱器之熱源則減少,因而降低石英玻璃之腐蝕作用。所 以,融體内之氧濃度減低且混入晶體之氧減少。 藉助於附圖,玆將本發明作更詳细說明如下,其中 圖1係概略顯示本發明之第一個具體實施例。 圖2係概略顯示本發明之第二個且較為合意之具體實 施例。 經濟部中央標準局員工消費合作社印製 (請先閲讒背面之注意事項再填寫本頁) 依照圖1所示本發明之具體實施例,位於融體2上方 之環型加熱裝置(反射器)1係固定在一絕熱器3之下方且 將熱輻射能反射至融體。該反射器係配置在單晶體周圍且 距單晶體4甚近。藉助於所反射之熱輻射能,該融體得以 在單晶體周圍之環型區域内加熱。 如圖2所示,該環型加熱裝置亦可設計成為一有效加 熱器5。該有效加熱器可能係一電阻加熱器(例如:由石墨 或钼製成)或一由射頻交流電操作之感應加熱器。後者最 好是由高溫下安定且導電性高之材料(例如:钼、_或钽) -5 一 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 548353 A7 B7 五、發明説明(4 ) 所組成,或經設計成一水冷式銅管或銀管。 圖式簡單說明: 圖1 :本發明「製造單晶體裝萱」之第一個具體實施例 圖2 :本發明「製造單晶體裝置」之第二個且較為合意之 具體實施例 各元件編號: 1 環型加熱裝置(反射器) 2 融體 3 絕熱器 4 單晶體 5 有效加熱器 (請先閱讒背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 6 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐)

Claims (1)

  1. 548353 A8 B8 C8 D8 六、申請專利範圍 6.如申請專利範圍第5項之裝置,其中該環型加熱裝置 係一朝向融體反射熱輻射能之反射器。 7·如申請專利範圍第5項之裝置,其中該環型加熱裝置 係一朝向融體放射熱輻射能之電阻加熱器。 8.如申請專利範圍第5項之裝置,其中該環型加熱裝置 係一感應加熱器,並以電磁感應方式加熱圍繞單晶體之環 型區域内之融體。 9·如申請專利範圍第5、6、7或8項之裝置,其中該環 型護罩係固定在一防熱護罩之下緣以防止單晶體受熱。 10·如申請專利範圍第5項之裝置,其中單晶體與環型加 熱裝置間具有絕熱效果。 11·如申請專利範圍第1項之方法,其中係藉調整環型加 熱裝置之熱源連同旁侧加熱器及底部加熱器之熱源以改變 成長中晶體内之氧含量。 (請先閱讀背面之注意事項再填寫本頁) 訂i:-------線一 經濟部智慧財產局員工消費合作社印製 8_ 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐)
TW087120906A 1997-12-18 1998-12-16 Process and device for the production of a single TW548353B (en)

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DE19756613A DE19756613A1 (de) 1997-12-18 1997-12-18 Verfahren und Vorrichtung zur Herstellung eines Einkristalls

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US (2) US6132507A (zh)
EP (1) EP0926270B1 (zh)
JP (1) JP3066742B2 (zh)
KR (1) KR100297575B1 (zh)
DE (2) DE19756613A1 (zh)
TW (1) TW548353B (zh)

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DE102009056638B4 (de) 2009-12-02 2013-08-01 Siltronic Ag Verfahren zum Ziehen eines Einkristalls aus Silizium mit einem Abschnitt mit gleich bleibendem Durchmesser
DE102011079284B3 (de) 2011-07-15 2012-11-29 Siltronic Ag Ringförmiger Widerstandsheizer zum Zuführen von Wärme zu einem wachsenden Einkristall
DE102016209008B4 (de) 2016-05-24 2019-10-02 Siltronic Ag Verfahren zur Herstellung einer Halbleiterscheibe aus einkristallinem Silizium, Vorrichtung zur Herstellung einer Halbleiterscheibe aus einkristallinem Silizium und Halbleiterscheibe aus einkristallinem Silizium
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KR19990063097A (ko) 1999-07-26
EP0926270A1 (de) 1999-06-30
JP3066742B2 (ja) 2000-07-17
KR100297575B1 (ko) 2001-10-26
US6238477B1 (en) 2001-05-29
DE59803424D1 (de) 2002-04-25
EP0926270B1 (de) 2002-03-20
JPH11228285A (ja) 1999-08-24
US6132507A (en) 2000-10-17
DE19756613A1 (de) 1999-07-01

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