TW541593B - Method and system for improving focus accuracy in a lithography system - Google Patents

Method and system for improving focus accuracy in a lithography system Download PDF

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Publication number
TW541593B
TW541593B TW091108247A TW91108247A TW541593B TW 541593 B TW541593 B TW 541593B TW 091108247 A TW091108247 A TW 091108247A TW 91108247 A TW91108247 A TW 91108247A TW 541593 B TW541593 B TW 541593B
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TW
Taiwan
Prior art keywords
patent application
scope
item
sensor
area
Prior art date
Application number
TW091108247A
Other languages
English (en)
Chinese (zh)
Inventor
Michael L Nelson
Justin L Kreuzer
Peter L Filosi
Christopher J Mason
Original Assignee
Asml Us Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Us Inc filed Critical Asml Us Inc
Application granted granted Critical
Publication of TW541593B publication Critical patent/TW541593B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7019—Calibration
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H23/00—Processes or apparatus for adding material to the pulp or to the paper
    • D21H23/02—Processes or apparatus for adding material to the pulp or to the paper characterised by the manner in which substances are added
    • D21H23/22—Addition to the formed paper
    • D21H23/32—Addition to the formed paper by contacting paper with an excess of material, e.g. from a reservoir or in a manner necessitating removal of applied excess material from the paper
    • D21H23/34—Knife or blade type coaters
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7007—Alignment other than original with workpiece
    • G03F9/7011—Pre-exposure scan; original with original holder alignment; Prealignment, i.e. workpiece with workpiece holder
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/7026—Focusing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N21/00—Selective content distribution, e.g. interactive television or video on demand [VOD]
    • H04N21/40—Client devices specifically adapted for the reception of or interaction with content, e.g. set-top-box [STB]; Operations thereof
    • H04N21/41—Structure of client; Structure of client peripherals
    • H04N21/414—Specialised client platforms, e.g. receiver in car or embedded in a mobile appliance
    • H04N21/41415—Specialised client platforms, e.g. receiver in car or embedded in a mobile appliance involving a public display, viewable by several users in a public space outside their home, e.g. movie theatre, information kiosk

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
TW091108247A 2001-04-25 2002-04-22 Method and system for improving focus accuracy in a lithography system TW541593B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/841,187 US6859260B2 (en) 2001-04-25 2001-04-25 Method and system for improving focus accuracy in a lithography system

Publications (1)

Publication Number Publication Date
TW541593B true TW541593B (en) 2003-07-11

Family

ID=25284253

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091108247A TW541593B (en) 2001-04-25 2002-04-22 Method and system for improving focus accuracy in a lithography system

Country Status (5)

Country Link
US (3) US6859260B2 (https=)
EP (1) EP1253471A3 (https=)
JP (1) JP4213907B2 (https=)
KR (1) KR100719975B1 (https=)
TW (1) TW541593B (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6859260B2 (en) * 2001-04-25 2005-02-22 Asml Holding N.V. Method and system for improving focus accuracy in a lithography system
JP2003031474A (ja) * 2001-07-16 2003-01-31 Oki Electric Ind Co Ltd 露光装置および露光方法
US7289230B2 (en) 2002-02-06 2007-10-30 Cyberoptics Semiconductors, Inc. Wireless substrate-like sensor
WO2004034391A1 (ja) * 2002-10-10 2004-04-22 Sony Corporation 光ディスク用原盤の製造方法及び光ディスクの製造方法
US6781103B1 (en) * 2003-04-02 2004-08-24 Candela Instruments Method of automatically focusing an optical beam on transparent or reflective thin film wafers or disks
US7068349B2 (en) * 2003-04-24 2006-06-27 Asml Netherlands B.V. Method of and preventing focal plane anomalies in the focal plane of a projection system
US20050134816A1 (en) * 2003-12-22 2005-06-23 Asml Netherlands B.V. Lithographic apparatus, method of exposing a substrate, method of measurement, device manufacturing method, and device manufactured thereby
US7126668B2 (en) * 2004-04-28 2006-10-24 Litel Instruments Apparatus and process for determination of dynamic scan field curvature
US7265364B2 (en) * 2004-06-10 2007-09-04 Asml Netherlands B.V. Level sensor for lithographic apparatus
US7835017B2 (en) * 2004-12-22 2010-11-16 Asml Netherlands B.V. Lithographic apparatus, method of exposing a substrate, method of measurement, device manufacturing method, and device manufactured thereby
US7504833B1 (en) * 2005-04-01 2009-03-17 Cypress Semiconductor Corporation Automatically balanced sensing device and method for multiple capacitive sensors
US7369214B2 (en) * 2005-08-11 2008-05-06 Asml Holding N.V. Lithographic apparatus and device manufacturing method utilizing a metrology system with sensors
US7502096B2 (en) * 2006-02-07 2009-03-10 Asml Netherlands B.V. Lithographic apparatus, calibration method, device manufacturing method and computer program product
US7893697B2 (en) 2006-02-21 2011-02-22 Cyberoptics Semiconductor, Inc. Capacitive distance sensing in semiconductor processing tools
CN101410690B (zh) * 2006-02-21 2011-11-23 赛博光学半导体公司 半导体加工工具中的电容性距离感测
JP5092298B2 (ja) * 2006-07-21 2012-12-05 富士通セミコンダクター株式会社 フォトマスク、焦点計測装置及び方法
DE112007002309T5 (de) 2006-09-29 2009-07-30 Cyberoptics Semiconductor, Inc., Beaverton Substratähnlicher Teilchensensor
KR20100057758A (ko) * 2007-08-24 2010-06-01 가부시키가이샤 니콘 이동체 구동 방법 및 이동체 구동 시스템, 그리고 패턴 형성 방법 및 패턴 형성 장치
US8237919B2 (en) 2007-08-24 2012-08-07 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method for continuous position measurement of movable body before and after switching between sensor heads
US7940374B2 (en) * 2008-06-30 2011-05-10 Asml Holding N.V. Parallel process focus compensation
US20110261344A1 (en) * 2009-12-31 2011-10-27 Mapper Lithography Ip B.V. Exposure method
US10274838B2 (en) * 2013-03-14 2019-04-30 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for performing lithography process in semiconductor device fabrication
US10576603B2 (en) 2014-04-22 2020-03-03 Kla-Tencor Corporation Patterned wafer geometry measurements for semiconductor process controls
WO2015199801A1 (en) * 2014-06-24 2015-12-30 Kla-Tencor Corporation Patterned wafer geometry measurements for semiconductor process controls
JP2018138990A (ja) 2016-12-08 2018-09-06 ウルトラテック インク 再構成ウェハーのリソグラフィ処理のための焦点制御のための走査方法
JP7200234B2 (ja) 2017-10-04 2023-01-06 エーエスエムエル ネザーランズ ビー．ブイ． 干渉計ステージ位置決めデバイス
KR102693518B1 (ko) 2018-09-06 2024-08-08 삼성전자주식회사 Opc 방법, 및 그 opc 방법을 이용한 마스크 제조방법
TWI911212B (zh) * 2020-04-24 2026-01-11 美商科文特股份有限公司 用於在虛擬工廠環境中執行局部ｃｄｕ建模和控制的非暫時性的媒體、系統及方法
US12535314B2 (en) 2020-05-04 2026-01-27 Asml Netherlands B.V. System and method for generating level data for a surface of a substrate
KR102526522B1 (ko) * 2022-11-02 2023-04-27 (주)오로스테크놀로지 포커스를 제어하는 오버레이 계측 장치 및 방법과 이를 위한 프로그램

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61196532A (ja) * 1985-02-26 1986-08-30 Canon Inc 露光装置
US5883703A (en) 1996-02-08 1999-03-16 Megapanel Corporation Methods and apparatus for detecting and compensating for focus errors in a photolithography tool
EP1944654A3 (en) * 1996-11-28 2010-06-02 Nikon Corporation An exposure apparatus and an exposure method
US6208407B1 (en) * 1997-12-22 2001-03-27 Asm Lithography B.V. Method and apparatus for repetitively projecting a mask pattern on a substrate, using a time-saving height measurement
EP1037117A3 (en) * 1999-03-08 2003-11-12 ASML Netherlands B.V. Off-axis levelling in lithographic projection apparatus
JP2001160530A (ja) * 1999-12-01 2001-06-12 Nikon Corp ステージ装置及び露光装置
US6859260B2 (en) * 2001-04-25 2005-02-22 Asml Holding N.V. Method and system for improving focus accuracy in a lithography system

Also Published As

Publication number Publication date
KR20020092175A (ko) 2002-12-11
EP1253471A2 (en) 2002-10-30
JP4213907B2 (ja) 2009-01-28
US6859260B2 (en) 2005-02-22
US7053984B2 (en) 2006-05-30
US20060187436A1 (en) 2006-08-24
US7248336B2 (en) 2007-07-24
EP1253471A3 (en) 2005-11-02
KR100719975B1 (ko) 2007-05-21
US20050128456A1 (en) 2005-06-16
US20020158185A1 (en) 2002-10-31
JP2003031493A (ja) 2003-01-31

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