TW530994U - Air conduction device of heat sink - Google Patents

Air conduction device of heat sink

Info

Publication number
TW530994U
TW530994U TW091200995U TW91200995U TW530994U TW 530994 U TW530994 U TW 530994U TW 091200995 U TW091200995 U TW 091200995U TW 91200995 U TW91200995 U TW 91200995U TW 530994 U TW530994 U TW 530994U
Authority
TW
Taiwan
Prior art keywords
heat sink
air conduction
conduction device
air
sink
Prior art date
Application number
TW091200995U
Other languages
English (en)
Inventor
Jen-Tian Lai
Tzung-Lung Li
Shuai Jiang
Original Assignee
Foxconn Prec Components Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Prec Components Co Ltd filed Critical Foxconn Prec Components Co Ltd
Priority to TW091200995U priority Critical patent/TW530994U/zh
Priority to US10/116,308 priority patent/US6736196B2/en
Publication of TW530994U publication Critical patent/TW530994U/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20172—Fan mounting or fan specifications

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW091200995U 2002-01-30 2002-01-30 Air conduction device of heat sink TW530994U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW091200995U TW530994U (en) 2002-01-30 2002-01-30 Air conduction device of heat sink
US10/116,308 US6736196B2 (en) 2002-01-30 2002-04-03 Fan duct assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW091200995U TW530994U (en) 2002-01-30 2002-01-30 Air conduction device of heat sink

Publications (1)

Publication Number Publication Date
TW530994U true TW530994U (en) 2003-05-01

Family

ID=28788803

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091200995U TW530994U (en) 2002-01-30 2002-01-30 Air conduction device of heat sink

Country Status (2)

Country Link
US (1) US6736196B2 (zh)
TW (1) TW530994U (zh)

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US6930882B2 (en) * 2003-04-07 2005-08-16 Dell Products L.P. Processor shroud adaptor for multiple CPU locations
US20040264127A1 (en) * 2003-06-27 2004-12-30 Rick Chiu Ceiling ventilation arrangement for personal computer case
DE20317856U1 (de) * 2003-11-07 2004-05-06 Asia Vital Component Co., Ltd Luftleitverkleidung
JP2005158045A (ja) * 2003-11-20 2005-06-16 First Internatl Computer Inc 導風カバーの構造及びその製造法
CN1323339C (zh) * 2003-11-21 2007-06-27 大众电脑股份有限公司 导风罩的结构及制法
US7256993B2 (en) * 2004-04-05 2007-08-14 Dell Products L.P. Adjustable heat sink shroud
TWI252972B (en) * 2004-06-01 2006-04-11 Avance Technologies Inc Cooling air hood
TWM259219U (en) * 2004-06-04 2005-03-11 Enlight Corp Heat dissipation structure of computer host interior
CN2706794Y (zh) * 2004-06-11 2005-06-29 鸿富锦精密工业（深圳）有限公司 导风装置
CN2763888Y (zh) * 2004-12-24 2006-03-08 富准精密工业(深圳)有限公司 导风装置
TWM275458U (en) * 2005-04-01 2005-09-11 Foxconn Tech Co Ltd Heat dissipation device
TW200701871A (en) * 2005-06-24 2007-01-01 Micro Star Int Co Ltd Heat dissipation device
US20080047689A1 (en) * 2005-07-12 2008-02-28 Denso Corporation Heat exchanger
US20070058341A1 (en) * 2005-09-12 2007-03-15 Tsung-Te Hsiao Fan duct
US20070089862A1 (en) * 2005-10-20 2007-04-26 Cui-Jun Lu Heat dissipation device including dust mask
CN1955879A (zh) * 2005-10-24 2007-05-02 鸿富锦精密工业（深圳）有限公司 分流式导风罩
US20070243817A1 (en) * 2006-03-31 2007-10-18 Inventec Corporation Air ducting cover
US7753107B2 (en) * 2006-08-18 2010-07-13 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
CN100499983C (zh) * 2006-09-08 2009-06-10 富准精密工业(深圳)有限公司 散热装置
US20080060334A1 (en) * 2006-09-08 2008-03-13 Kido Duane R Systems and method for improving airflow in an onion topping device
US7492590B2 (en) * 2006-12-15 2009-02-17 Hong Fu Jin Pecision Industry (Shenzhen) Co., Ltd. Computer enclosure
US20080299889A1 (en) * 2007-06-03 2008-12-04 Miao-Chin Liu Detachable guide air hood
CN101743445B (zh) * 2007-06-20 2012-11-28 澳大利亚奇胜有限公司 风扇组件
US7595982B2 (en) * 2007-12-04 2009-09-29 Sun Microsystems, Inc. Low airflow impedance PCBA handling device
US8047271B2 (en) * 2007-12-20 2011-11-01 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device having a fan holder
US8069908B2 (en) * 2007-12-27 2011-12-06 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device having a fan holder
JP5361878B2 (ja) * 2008-05-15 2013-12-04 パナソニック株式会社 ファン及びそれを備えた電子機器
CN201298197Y (zh) * 2008-10-22 2009-08-26 鸿富锦精密工业（深圳）有限公司 电脑壳体
CN102045990A (zh) * 2009-10-26 2011-05-04 富准精密工业(深圳)有限公司 散热装置
CN102056454A (zh) * 2009-10-29 2011-05-11 鸿富锦精密工业（深圳）有限公司 具防呆结构的散热装置及采用该散热装置的电子装置
CN102076204A (zh) * 2009-11-19 2011-05-25 鸿富锦精密工业（深圳）有限公司 散热装置及使用该散热装置的电子装置
CN201628900U (zh) * 2009-12-23 2010-11-10 鸿富锦精密工业（深圳）有限公司 电子装置壳体
CN201654653U (zh) * 2009-12-25 2010-11-24 鸿富锦精密工业（深圳）有限公司 风扇固定装置
CN102122201B (zh) * 2010-01-08 2013-03-20 鸿富锦精密工业（深圳）有限公司 导风装置
CN102147646B (zh) * 2010-02-04 2013-11-06 鸿富锦精密工业（深圳）有限公司 导风罩
CN102196708A (zh) * 2010-03-11 2011-09-21 鸿富锦精密工业（深圳）有限公司 导风罩
CN102202487A (zh) * 2010-03-26 2011-09-28 鸿富锦精密工业（深圳）有限公司 散热装置
CN102300421A (zh) * 2010-06-23 2011-12-28 鸿富锦精密工业（深圳）有限公司 电子装置壳体
CN102467194A (zh) * 2010-11-10 2012-05-23 鸿富锦精密工业（深圳）有限公司 导风罩
CN102480895A (zh) * 2010-11-22 2012-05-30 鸿富锦精密工业（深圳）有限公司 电子装置及其导风罩
CN102573383B (zh) * 2010-12-09 2016-05-25 赛恩倍吉科技顾问（深圳）有限公司 导风罩及使用该导风罩的散热装置
CN102647883A (zh) * 2011-02-17 2012-08-22 鸿富锦精密工业（深圳）有限公司 导风罩
CN102759962A (zh) * 2011-04-28 2012-10-31 鸿富锦精密工业（深圳）有限公司 具有导风罩的电脑壳体
US8937482B1 (en) 2011-06-28 2015-01-20 Sensata Technologies, Inc. Apparatus and method for ramping and controlling the temperature of a component using a vortex tube
CN102905501A (zh) * 2011-07-26 2013-01-30 鸿富锦精密工业（深圳）有限公司 导风罩
CN102958322A (zh) * 2011-08-25 2013-03-06 鸿富锦精密工业（深圳）有限公司 导风罩
CN103079380A (zh) * 2011-10-26 2013-05-01 鸿富锦精密工业（深圳）有限公司 风扇模组及具有该风扇模组的机柜
US9456706B2 (en) 2012-02-17 2016-10-04 Hussmann Corporation Merchandiser with airflow divider
US9220354B2 (en) 2012-02-17 2015-12-29 Hussmann Corporation Merchandiser with airflow divider
CN103903340B (zh) * 2012-12-27 2016-10-12 鸿富锦精密工业(武汉)有限公司 自动售货机
US10165696B1 (en) * 2017-08-10 2018-12-25 Adtran, Inc. Removable module with spring latch

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US5630469A (en) * 1995-07-11 1997-05-20 International Business Machines Corporation Cooling apparatus for electronic chips
US5563768A (en) * 1995-08-31 1996-10-08 At&T Global Information Solutions Company Heat source cooling apparatus and method utilizing mechanism for dividing a flow of cooling fluid
US5917698A (en) * 1998-02-10 1999-06-29 Hewlett-Packard Company Computer unit having duct-mounted fan
US6094346A (en) * 1998-12-29 2000-07-25 Intel Corporation Processor assembly cooling cell
US6515862B1 (en) * 2000-03-31 2003-02-04 Intel Corporation Heat sink assembly for an integrated circuit
US6587335B1 (en) * 2000-06-30 2003-07-01 Intel Corporation Converging cooling duct for a computer cooling system
US6343011B1 (en) * 2000-08-03 2002-01-29 Lite-On Enclosure Inc. Screwless wind conduit positioning device
US6496368B2 (en) * 2001-05-14 2002-12-17 Delta Electronics, Inc. Heat-dissipating assembly having heat sink and dual hot-swapped fans
US6464578B1 (en) * 2001-10-24 2002-10-15 Enlight Corporation Fan and hood arrangement

Also Published As

Publication number Publication date
US20030188847A1 (en) 2003-10-09
US6736196B2 (en) 2004-05-18

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees