TW530337B - Substrate processing apparatus and substrate processing method - Google Patents

Abstract

In a substrate processing apparatus, processing liquid can be supplied to the upper surface of the processed substrate at high speed. A slit shape discharge opening 24 extending perpendicularly to the moving direction of the substrate and a liquid supply nozzle 7 having a connection surface 30 and a liquid supply surface 31 subsequent to the discharge opening 24 are prepared in a substrate processing apparatus for supplying processing liquid to the upper surface of the substrate. The processing liquid expelled from the discharge opening 24 is spread over the connection surface 30 and retained in the liquid supply surface 31 by surface tension. The processing liquid retained in the liquid supply surface 31 is contacted with the substrate flatly and supplied to the surface of the substrate.

Description

530337 Technical Field Related Substrates Pei Chi Development, Money Management Method. Technology] After the device is exposed, for example, the substrate development film has made the problem of leaking the liquid into the substrate. The high-efficiency, non-defective developer solution can be used in the method. However, the problem of the substrate surface is on the substrate. Means] V. Description of the invention (1) [The invention belongs to the liquid crystal display circle, etc., and the device and the substrate. [Known technique After the substrate is processed, the pattern is developed on the drawing. Bucket. The photo-resistance conveyor belt is used to transfer the liquid, and the solution is large on the substrate, and there is a funnel-lock ejection liquid at the rear end. However, in this case, there is a shadow spot. The liquid of the present invention is disposed below the processing bucket [solving the problem processing device and substrate, electro-paste display engraving, photoresist peeling, such as substrate development, mounting the processed substrate table, and then exposing the developing solution to the processing device. However, the end is sequentially filled with liquid], although it is required to increase the flow rate of the liquid filling method of §§3 speed filling method, so that the display of the filled liquid will be partially developed ^ processing method, especially the substrate for the feeder In the substrate processing apparatus for semiconductor and semiconductor crystal processing, the surface on which the photoresist film is formed is filled with a developing solution and washed away. There is a rolling conveyor belt and a liquid-filled leakage substrate on the substrate to be processed, which is convenient for rolling. After rolling, spit out the other end from the filling funnel. If the moving speed of the processing substrate is increased, the front of the substrate and. Although it can be considered that the filling liquid can also be lost from the substrate surface at the front and rear ends. The time difference will produce a significant difference. In the substrate processing equipment, the processing liquid can be filled at high speed.

530337 V. Description of the invention (2) The substrate processing device of the first patent application scope is a substrate processing device for filling a processing liquid on a substrate, and is provided with a substrate holding mechanism, a filling nozzle, and a moving mechanism. The substrate holding mechanism is a mechanism that holds a substrate to be processed. The liquid-filling nozzle has a slit-shaped discharge port along the first direction, and fills the processing liquid on the substrate surface held on the substrate holding mechanism. The mechanism is to place the substrate in the first direction with respect to the liquid-filling nozzle ', and the two liquids intersect! The nozzle is on the substrate held on the substrate holding mechanism: ice remains, and a liquid-filled surface of a planar filling liquid is formed on the substrate. Ye give it :: Please patent No.! In the substrate processing apparatus of this item, the substrate held on the stage is moved toward the type that crosses the filling V nozzle by a moving mechanism. At this time, the treatment liquid will be discharged from the filling nozzle, and the shape of the filling liquid will be in contact with the substrate to be treated when the treatment liquid is in the surface: If it is a processing device, it will stay on the filling surface. If the substrate touches the filling liquid of the processed plate, the filling liquid can be surely filled on the front of the substrate due to the Λ 2 planar connection. The fast-moving case declares the substrate processing device of the second item of the patent scope, which surrounds the first item of the substrate. In the processing device, the end of the substrate in the downstream direction of the substrate moving direction of the Teflon liquid filling surface of the liquid filling nozzle. Formed in the substrate processing device of the patent application scope No. 3 and the substrate processing equipment No. 1 or 2, the liquid filling nozzle and the right angle of the patent range "'the inclined i-path leading to the discharge port will benefit from the outside. The substrate processing device of the fourth item is in the patent application. Page 5 9H〇3129.ptd 530337 V. Description of the invention (3) In the substrate processing device of any one of the items 1 to 3, the liquid filling nozzle Between the discharge port and the filling surface, there is a contact surface for guiding the processing liquid discharged from the discharge port to the filling surface. The substrate processing apparatus according to the scope of patent application No. 5 belongs to the scope of patent application. In the substrate processing apparatus of any one of items 1 to 4, the filling surface of the liquid filling nozzle is formed parallel to the surface of the substrate held on the substrate holding mechanism. The substrate processing apparatus of claim 6 is within the scope of patent application In the substrate processing apparatus according to any one of items 1 to 5, the width in the second direction of the filling surface of the filling nozzle is 10 mm or more and 40 mm or less. When the length in the second direction of the filling surface is within this range, from The processing fluid discharged from the discharge port will be borrowed The surface tension easily stays on the liquid filling surface. The substrate processing device of the patent application No. 7 is in the substrate processing device of the patent application No. 3, and the inclined path of the liquid filling nozzle is 1 relative to the liquid filling surface. An angle of 0 ° to 50 °. When the angle of the inclined path with respect to the filling surface is within this range, the processing liquid discharged from the discharge port will easily stay on the filling surface by surface tension. The substrate processing device with the scope of patent application No. 8 is the substrate processing device with the scope of patent application No. 4. The contact length of the contact surface of the filling nozzle is 0.1 mm or more and 3 mm or less. When contacting the contact surface When the length is within this range, the processing liquid discharged from the discharge port will easily stay on the liquid filling surface by surface tension. The substrate processing device with the scope of patent application No. 9 belongs to the scope of patent application No. 1 In the substrate processing apparatus of any one of 8 items, the length in the first direction of the discharge opening of the filling nozzle is longer than the length of the substrate to be processed in the same direction.

91103129.ptd Page 6 530337 V. Explanation of the invention (4)-Covering the pu, because in the first month, all the substrates will be spit out in the first direction; therefore, the processing liquid can be reliably filled in the liquid. On the substrate. Wai Di Factory ”:? The substrate processing device 4 'surrounding the tenth item is a substrate processing device with a patent application and a mobile item, and further has a control unit, a force, and a control mechanism. The control mechanism is set to "moving the plate" near the front of the substrate, and the speed of the substrate is set at the center of the substrate. In terms of speed, the movement of the substrate is reduced at the rear end of the substrate. If the movement of the substrate is controlled in this way, the liquid can be reliably filled even at the head and the rear end of the substrate. The substrate processing device of the eleventh item is included in the substrate processing device of a cup applied for a patent application, and is further equipped with a regeneration mechanism that supplies the liquid to be regenerated. = Degree spit out from the filling nozzle. In this case, the pre-supply is fully performed because the process = 2 ::: ’is used because the used process ⑯ can be reused, and the process fluid in 2’ is used. / I ί The substrate processing device i of the item 12 of the profit range is a substrate processing device for filling the processing liquid with a substrate holding: structure y, tap, bird first liquid filling nozzle, and moving mechanism . Substrate holding mechanism A mechanism for holding a substrate to be processed. The first filling nozzle is provided along the ΓΓΐ outlet ′ and fills the processing liquid on the surface of the substrate holding plate. The second filling nozzle has a slit-like discharge σ extending in the first direction. The second liquid-filling nozzle is juxtaposed with the first liquid-filling nozzle in a first direction crossing the first direction, and the first liquid-filling nozzle is used. C: \ 2D-C0DE \ 91-05 \ 91103129.ptd Page 7 530337

On the surface of the substrate filled with the processing liquid, the processing liquid is filled. The substrate is moved relative to the first and second filling nozzles in the second direction relative to the moving mechanism system. The substrate processing apparatus in the first and second patent application scopes is applied by the liquid nozzle from the front of the substrate toward the front. The rear end portion is sequentially filled with the processing liquid, and a second liquid filling nozzle is used to refill a certain surface filled with liquid through the first liquid filling nozzle. According to the substrate processing item No. 2 in the scope of the patent application, two tongues are used, because the two nozzles of the first and second liquid filling nozzles are repeated and wide. Therefore, even when the substrate is moved at high speed, it can be sure. The filling liquid for the front and rear parts of the j plate. 'The substrate processing device of the 13th patent application scope of the patent application is based on the second filling liquid in the substrate processing device of the  Nozzle: the interval between the ejection and the substrate surface held on the substrate holding mechanism, the interval between the ejection outlet of the liquid-filled nozzle and the substrate surface is wider, and the first-filled nozzle and the second-filled nozzle are placed According to the patent application, the substrate processing device of the 13th item of J. West has been applied. Because the second liquid filling nozzle is configured to be older than the f liquid filling nozzle, it can prevent the liquid filling liquid that is filled by the first liquid filling nozzle from being discharged by the second liquid filling nozzle. The phenomenon that the liquid filling nozzle suppresses the flow. The substrate processing device No. 14 of the scope of application for patents is located in the substrate processing device of No. 12 or 13 of Shen Yuwei. Filling nozzle according to any one of the above items. According to # 利 范围 第In the case of the substrate processing device of item 4, because Taifeng Kou Di filled the liquid and pouted, so that the substrate was in contact with the processing liquid and filled the surface. Because of the + + one and two buckles, when moving a certain board, Even the front and back of the substrate can be reliably filled.

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The substrate of the 15th scope of the patent application covers the substrate of any one of the items 2 to 2 (the J application has a processing solution for guiding the external processing liquid from the outside to the middle of the road), and the processing liquid supply path is weeping. # 的 treatment fluid supply surface. In this case, the substrate surface on the m substrate holding mechanism is in a phantom, since the second filling liquid: liquid straight soil comes out of the substrate, so the The processing liquid is the first liquid flow generated by He Ming. The processing liquid flows in the direction of the substrate processing method of item 216, and the processing liquid is filled on the substrate surface. In the above method, a liquid filling nozzle having a long slit-shaped discharge port in the first direction and a liquid filling surface continuous with the liquid discharge surface of the discharge port are disposed above the surface of the substrate; and the discharge process is performed from the discharge port of the liquid filling nozzle. Liquid, and the process liquid stays in the liquid-filled surface; while the liquid-filling nozzle moves relative to the substrate, the processing liquid stays in the liquid-filled surface in contact with the surface of the substrate, and the processing The liquid is filled on the surface of the substrate. According to the patent application The substrate processing method of the 16th item can achieve the same function and effect as the case of the substrate processing device of the patent application item 1. The substrate processing method of the patent application item 17 is in the patent application range. In the 16 substrate processing method, the filling liquid of the substrate surface by the processing liquid is to accelerate the substrate movement near the front of the substrate, and set the substrate movement to a certain speed in the center of the substrate. At the rear end, the movement of the substrate is decelerated. If the substrate processing method according to item 17 of the scope of patent application is used, it can reach the base of the scope of item 10 of the patent application.

C: \ 2D-C0DE \ 91-05 \ 9U03129.ptd Page 9 530337 V. Description of the invention (7) The patent for the plate processing device applies to the liquid nozzle on the second upper surface of the upper surface of the substrate. ; Fill one by one while making the first fill according to the application of the same application to the second side with a long top on the substrate mouth, and spit out a filling slit in the direction of the filling liquid on the spray surface of the outlet filling liquid The second liquid-filled nozzle of the first nozzle has the patent effect. On the surface of the patent, a liquid-filled slit-like direction according to the liquid-filled spit is ejected with the substrate mouth; in the case of one side, the method around item 18, the nozzle is provided with a discharge port, and the above-mentioned discharge port is filled with liquid with the substrate. The ejection nozzle of the ejection outlet has the same function as the substrate to be filled in the liquid filling range No. 1 to No. 1 to No. 13. The substrate processing is to place the first filling liquid on the substrate surface, and the second filling liquid to spray the first filling liquid between the substrate surfaces. The substrate and the substrate enter and exit the processing liquid, and the substrate performs a substrate processing effect at the substrate where the item of the processing liquid is phased on. The method is to move the mouth upwards and upwards in the direction of the mouth. The rows of the mouths are spaced apart from each other in a wider row and filled with liquid. The system of the mobile substrate processing method device will be thin and slender; On the side of the substrate 5, if the liquid is filled, in the case, the physical liquid filling liquid is discharged in a slit-like first direction, the first direction is on the substrate, and the first filling arrangement is arranged on the side from the second surface; on the used processing liquid. It can be reached that the same substrate processing method around item 19 is a method of filling the processing liquid with a long slit-shaped discharge nozzle in the first direction, which is set above the surface of the substrate; The second liquid-filling nozzle that is ejected in the first direction intersects the first liquid-filling nozzle in a cross direction with the first liquid-filling nozzle, and is located at a gap between the opening of the substrate surface and the surface of the substrate, which is longer than the surface of the first liquid-filling nozzle. It is arranged in a wider interval; the processing liquid is discharged from the first outlet, and the processing liquid stays in a surface shape so that the first filling liquid nozzle and the substrate are relatively moved.

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The surface of the plate is in contact with the surface and stays on the filling surface. The surface filling treatment liquid is used; while the second filling liquid is used, the treatment liquid is filled with the first filling nozzle. According to the processing liquid in the patent application, the substrate nozzle and the substrate are subjected to the substrate filling of the processing liquid on the filling liquid. The substrate processing item No. 14 of the substrate processing item No. 14 is for filling the processing liquid with the substrate. The holding mechanism and the filling system hold the slit-shaped discharge opening of the substrate to be processed, and place the substrate on the surface of the substrate. The processing liquid based on the liquid-filled surface, which is moved to the second substrate holding mechanism in the first direction and based on the liquid-filled surface and which is no. 20 out of the patent application range, will be held in parallel to contact the substrate. Base plate of the base range

Fan 2 ^ ° tongue, you can achieve the same effect as the patent application ^ Xiongri Temple, phase @. The substrate processing device for the substrate processing device of the patent application No. 20 has a liquid nozzle and a moving mechanism. Substrate holding mechanism Mechanism. The liquid-filling nozzle is provided with a processing liquid filled in a first direction and held on a substrate holding mechanism. The mechanism moves the substrate in an intersecting direction with respect to the liquid-filling nozzle. The liquid-filling nozzle is held on the plate ′ slightly in parallel and has a liquid-filling surface facing downward, and a discharge port is provided on the surface connected to the upper position. In the substrate processing apparatus of the item, the processing liquid is discharged from the discharge port into the filling surface, and the retained processing liquid is omitted and the processing liquid is filled on the substrate. According to the application of the board processing device, the substrate processing device with the same function and effect as in the case of applying for a special processing device can be applied to the substrate processing device of the 21st patent application scope, which belongs to the substrate processing device of the 20th patent application scope. The filling liquid is formed by the treatment liquid discharged from the slit-shaped discharge port so as to surround the filling surface by surface tension. ^

530337 V. Description of the invention (9) The substrate processing device of the scope item (1) is the substrate processing device of the patent applicant. The substrate holding mechanism is a horizontal attitude holder substrate, and the liquid filling surface is slightly downward. . [Embodiment of the Invention] [First Embodiment] [Overall Structure] The substrate processing apparatus of the invention shown in the second embodiment of Taina-the substrate display of the embodiment ... In this embodiment, the substrate developing device includes a main liquid storage tank 1, a substrate processing section 2, and a control machine. &Quot; ~ The shadow liquid is stored in the f% calibration mechanism 3 and the reproduction system 4. The device of the display liquid of the display screen is stored in the toilet (hydrogen and oxygen etching film. The substrate processing unit 2 is a device for developing the photoresist film e-board. It is processed A handle injury * = ρ, night And the to-be-processed base tank 1, the A board, the second controller, and the control mechanism 3 are the devices that control the developer storage brain and the storage system, and the regeneration system 4 are equipped with microelectronics " (Photoresist f) The device in the toilet liquid storage tank 1. ^.. Then return to the developing developer storage tank 1 through the pipe 6 and connect to the pipe 6 with a pump 5 and a filter 1 midway. . When driving ^:? 2 is equipped with the filter 10, the developer storage tank "moving the pump 5%" will pass through the piping 6 2 2. In addition, • shadow liquid storage tank! Shell: through, ...: To the substrate processing section 2. In the substrate processing section 2, the officer 9 is connected to the substrate processing pipe 9 and returned to the developer storage tank.

Bu, in the developer storage tank J 9H03l29.ptd page 12 530337 V. Description of the invention (10), the discharge pipe 12 is connected to the regeneration system 4. A drain valve 11 is provided at the discharge pipe. The drain valve n is widely used for adjusting the flow rate of the developer solution. In addition, the developer solution is stored in steps 2; ', and then the liquid level adjustment pipe 5 is used. This liquid level adjustment piping discharge valve 11 is connected to the discharge pipe 12 at the downstream end. 1 Transmission The substrate processing unit 2 is provided with a substrate holding belt U, a liquid filling nozzle 8, and a liquid supply: tube wide. = ,, Belt system = The substrate to be processed is growing from the left side to the right side of the paper. The liquid supply pipe 7 is a mechanism for filling the liquid nozzle 8 #. The substrate to be processed is sequentially filled with the developing solution supplied by the nozzle 8 and the developing solution supplied by the nozzle 8 = "private movement", and the liquid is sequentially filled from the filling nozzle to the rear end. The disturbance 2 mechanism 3 is connected to the pump 5 and the drain valve 丨〗 and Li 13 (Yuki memory. This memory is stored in the _ described), and has a microcomputer disk for the pump 13 and other = = not available: 5 and The draining system η is controlled by the regeneration sequence 4 from the used developer solution, and the second liquid storage tank 1 is adjusted and then introduced through the piping 1 4 Concentration), storage tank ". By controlling the display of the control mechanism: the liquid returns to the regeneration system 4 and flows into the developer storage; the pump adjusts the developer from [the structure of the filling nozzle] into the h1. Figure 2 is from this Implementation of the shape bear + ^ wwenhezui 8 viewed from the second direction 91103129.ptd page 13 ΨΚ 530337

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V. Description of the invention (12) The configuration of the liquid-filled nozzle 8 in the use state is shown in FIG. 4. In other words, the inclined flow path 28 is inclined downward and the discharge port 24 faces the end of the substrate in the forward direction, and the 'contact surface 30 is located lower and lower than the discharge port 24, and the filling liquid = 31 is directed downward and slightly from the substrate surface. Take a parallel horizontal attitude. [Operation] When the liquid is filled on the substrate, the following pre-feeding is performed first. By the instruction from the control mechanism 3, the pump 5 and the pump 13 are driven, and the drain valve u is opened. Thereby, the developer is supplied from the developer storage tank 1 to the substrate processing section 2 through the piping 6 and the filter 10, and the developer is supplied from the liquid supply pipe 7 to the filling nozzle 8 and is ejected out of the substrate through the ejection outlet 24. Inside the processing unit 2. The discharged developer is returned to the developer storage tank 丨 through the pipe 9. In addition, the developer in the developer storage tank 1 is supplied to the regeneration system 4 through the drain valve 丨 丨 and the discharge pipe 丨 2. After the alkalinity and fatigue (photoresist concentration) are adjusted by the regeneration system 4, the pump is pumped. 13 and piping 14 return to the developer storage tank 1+. In this way, the air that has penetrated into the pipes 6, 9, 4 and the liquid supply pipe 7 and the filling nozzle 1 ^ 8 can be eliminated. When the pre-feeding is completed, the flow rate discharged from the filling nozzle 8 will be reduced 'using a rolling conveyor 16 to move the substrate in the second direction. The developing solution discharged from the discharge port 24 is transmitted to the contact surface 30 by the surface tension, and is further transmitted to the filling surface 31 by the contact surface 30, and is retained therein. When the substrate is transported and reaches below the filling nozzle 8, the developer remaining on the filling surface 3 丨 will contact the substrate in a plane shape, and will be liquid from the front head of the substrate to the rear end. Among them, the angle 0 formed by the filling surface 31 and the joining surfaces 25 and 26 is shown in FIG. 2

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As shown, the best is 10. From the outlet 2 4 while falling on the substrate developer solution will not be transmitted to the 'contact surface 30'. If the second side of the liquid surface 31 has a greater gravity on the contact surface 30 than the table If it is dropped on the substrate at 30, although the developer solution is on the surface 31, and if it falls within this range, it will be displayed on the substrate; on the contrary, if the liquid is evenly extended in addition, when the substrate is moved on the board, If the substrate is moved in front of the substrate with 'in the center of the substrate and the rear end of the plate, if the substrate is moved at a harder speed, it can be filled with more than 50. the following. If the angle $ is larger than this range, the discharged developer will not be transferred to the contact surface 30. On the other hand, if the angle 0 is smaller than this range, it will be transferred to the filling surface 31 and dropped on the substrate. The network length b is preferably from 0.1 mm to 3 mm. The white length a is preferably 10 mm or more and 40 mm or less. If the length b is greater than this range, the developer is applied to the developer surface tension, so that the developer has not yet been transmitted to the contact panel, otherwise 'if the contact length b is less than this range and transmitted to the contact surface 30, but does not stay on the filling substrate on. In addition, if the length a of the liquid-filling surface 31 is small, the film will not stay on the liquid-filling surface 31 and will fall. If the length a of the liquid-filling surface 31 is larger than this range, the entire liquid-filling surface 31 will be developed. The moving speed, as shown in Fig. 5, begins to fill with liquid. The head will be slower first, and then gradually accelerated. ’The substrate is moved at a certain speed, and the movement at & is decelerated. In this way, the vicinity of the front part and the rear part of the substrate that controls the liquid of the substrate can be used. Even if the front part and the rear part of the substrate are liquid, according to the substrate developing device of this embodiment, because The substrate comes into contact with the developer and is filled with liquid on the substrate. Therefore, even when the substrate is moved at a high speed, the liquid can be reliably filled in the front and rear portions of the substrate. Front

530337 V. Description of the invention (14) —---- If the result is high, the substrate can be filled with liquid at high speed. Since the used developer is adjusted again by the regeneration system 4, the pre-feeding can be performed at a large flow rate. Thereby, the invasion bubbles can be sufficiently excluded from the piping, and development spots on the substrate can be prevented. [Second Embodiment] + Fig. 6 is a layout diagram of a liquid-filled spray S 8 of a substrate developing device according to a second embodiment of the present invention. The structure of the substrate developing device of the second embodiment is approximately the same as that of the substrate developing device of the first embodiment shown in FIG. 1 to FIG. 3, and description of the same structure is omitted. In the first embodiment, although the substrate processing unit 2 is provided with one liquid filling nozzle 8, in the second embodiment, the substrate processing unit 2 is provided with three liquid filling nozzles including liquid filling nozzles 8, 41, 42 and the like. The distance X between the liquid filling nozzle 8 at the most upstream end of the substrate in the forward direction of the substrate and the substrate is the smallest, and the distances y, z between the liquid filling nozzles 41, 42 at the downstream end and the substrate are sequentially larger. In addition, the liquid-filling nozzles 41 and 42 are arranged so that the liquid-filling surface 31 is slightly parallel to the substrate, and the liquid-filling nozzle 42 at the most downstream end is arranged so that the discharge port 24 is perpendicular to the substrate. 0 The substrate developing device in the second embodiment In the transfer substrate, the processing liquid is firstly applied to the planar filling liquid using the filling nozzle 8 and

In some cases, the processing liquid is applied to the surface filling liquid from the filling nozzle 41, and the liquid filling nozzle 42 is used to fill the liquid. …, Strong: Dan spear J According to the substrate developing device of the second embodiment, since the nozzles 8, 41, and 42 are repeatedly filled with liquid on the substrate, even if the two liquid fillings on the substrate are fast, the substrate can be reliably filled. Forehead toiletry * degree is better than filling treatment. In this way, the filling position of the substrate can be executed at a high speed and the heart king can be executed. In addition,

530337 V. Description of the invention 05) ^ ----— __ The last filling nozzle 42 is used to make the filling nozzle 8 and 41 vertically through the filling nozzle 8 and 41 on the substrate, so that it can be suppressed (in other words, filling The development of the liquid nozzles 8, 41, and 1 shadow liquid, the developing solution outflow direction of the nozzles 8, 4 1 in the front direction of the substrate) the direction of the second shadow liquid flow path, that is, the third embodiment from the filling liquid spraying example Generate flow. The present invention is not limited to this. Even in the case of the liquid filling / filling nozzle, the present invention achieves the same effects as described above. When the filling liquid is sprayed above $ ::, it can also be caused by using more filling nozzles, and when j or more than four are placed, the filling liquid is processed on the substrate, and the filling liquid is placed on the substrate. Therefore, it can be made higher [Third Embodiment] The above situation. The distance from the liquid surface 31 to the substrate is based on the fact that the base is directly filled with liquid and the liquid is sprayed to move the fast liquid in the convenient state, and it is described in the second embodiment. However, as shown, a true liquid nozzle of Example V is used. For three or more industries, the spleen A, the love month with a filling nozzle 8, 41 /, the soil plate month 丨 J, the most upstream filling nozzle 8 in the direction of travel, the distance X between them becomes smaller, π # 山 和 心 形状 1% 8 away from y is enlarged. In addition, a state where the liquid nozzle 41 and the substrate are slightly parallel to the substrate is filled. For liquid matter, 41 is arranged in the substrate developing device filled with the embodiment. The liquid nozzle 8 is pressed on the planar filling liquid, and the surface is filled with V. Then, the liquid filling nozzle 41 is filled with V and filled with liquid. After the solution was over, drink the treatment solution. In the plate developing device of this embodiment, although the liquid filling nozzle 42 is vertical like the second embodiment, in this embodiment, since two nozzles 8, 41 are repeatedly filled with liquid on the substrate, Accelerating the degree of the substrate can also reliably fill the front and rear ends of the substrate with a liquid filling process that can execute the substrate at a high speed.

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[Fourth embodiment] Among the two liquid filling nozzles of the third embodiment described above, the posture of the liquid filling nozzle 41 at the downstream end is changed as shown in Fig. 8 to form the fourth embodiment. T, the filling nozzle 41 is vertically downward according to the liquid discharge port 24 of the filling nozzle 41, and the inclined flow path 28 is perpendicular to the substrate in a horizontal posture, and the lower surface 32 connected to the discharge port 24 is parallel to the substrate surface. Configure it. The distance X between the liquid-filling nozzle 8 at the most upstream end of the substrate in the forward direction of the substrate and the substrate is reduced, and the distance y between the liquid-filling nozzle 41 at the downstream end and the substrate is greater than X. The filling surface 31 of the filling nozzle 8 is slightly parallel to the substrate. According to the fourth embodiment, as in the third embodiment, the substrate can be filled with liquid at a high speed. Furthermore, in this embodiment, the flow path 28 of the liquid-filling nozzle 41 at the downstream end is set vertically downward, and the liquid is vertically supplied to the substrate, compared with the case where the flow path 28 is inclined obliquely to the substrate advance direction; The following advantages can be obtained. First, it suppresses the flow of the developer solution filled on the substrate, and suppresses the phenomenon of processing spots and dots caused by the flow of the developer solution. In addition, since the liquid-filling nozzle 41 at the downstream end does not need to allow liquid to flow into the surface 3 1 X, the length c of the contact surface 30x need not be limited to the range described in the first embodiment. Lmm。 Spit uniformly downward, so compared to the upstream end of the filling nozzle 8 b, c length takes a shorter shape, for example, c can be less than about 1mm, preferably less than 0. lmm. Second, the ejection outlet 24 is sandwiched and connected to the lower surface 32 of the contact surface 30x. When it contacts the supplied developer solution filled on the substrate, the liquid surface can be reduced to reduce the generation of processing spots. Effect.

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Thirdly, if the flow path 28 is oriented in the oblique direction of the substrate advance direction in the liquid-filling nozzle 4i at the downstream end, the liquid supplied to the rear end portion of the substrate will generate a flow force in the substrate advance direction, and Liquid flows in this direction, resulting in a state where no liquid exists at the rear end portion of the substrate. The rear end portion of the substrate is not developed and processing spots may occur. However, by using the flow path 28 vertically downward, it does not occur. This kind of liquid can suppress the generation of processing spots. [Material of filling nozzle]

The liquid-filling nozzle 8 of each of the above-mentioned embodiments is configured such that the communication surface 30 and the liquid-filling surface 31 of the liquid-filling nozzle 41 of the second and third embodiments are preferably mixed with the joint surface 30 and the liquid-filling surface 31. —Lift up and down around the filling surface 31. Therefore, in the above-mentioned embodiments, the nozzle bodies 2 and 22 are preferably made of a material which can obtain a sufficiently high hydrophilicity for the contact surface 30 and the liquid filling surface 31, such as a metal material, specifically a stainless steel material. It is structured such that the substrate and the liquid filling surface 31 are exposed on the metal surface. Thereby, by encircling the contact surface 30 and the liquid filling surface 31 of the developing surface, it is possible to ensure more stable, and to perform the liquid filling treatment of the substrate at a higher speed and stability. It is not limited to the above-mentioned structure ', and at least the contact surface and the filling body: the nozzle t body 22 may be formed using a metal material such as stainless steel. In addition, the nozzle body 21, 22 is formed by using the moon and the sun, and only the contact surface ㈣, ^ surface 31 is subjected to surface protection 'to obtain a sufficiently high hydrophilic structure Λ. For example, metal plating, or metal can be considered. The liquid filling nozzle 42 of the second embodiment is attached to the liquid filling nozzle 42 of the second embodiment and the fourth embodiment, and the liquid filling nozzle 42 is in contact with the liquid filled on the substrate.

530337 V. Description of the invention (18) The effects of spraying of filling fluids such as those mentioned above will be the same as the above, and the flow discharged from the 24 will be combined. [Other implementations are described in the above description, but the present invention can also be applied to a substrate, a semiconductor, that is, a substrate, a semiconductor, or the like. [Effects of the invention According to this liquid, the plate is moved at high speed to perform filling. In addition, according to the front head of the substrate and the post-regeneration processing nozzle, Γ =: 'the properties of these materials and the surface state'-= $ 角 卜 方 In the state where there is no substrate, the fourth fourth & The liquid-filling nozzle 41 in the form is formed to be hydrophobic with the surface 30χ and the lower surface 32, and then is ejected from the liquid: the liquid flows downward downwards μ ± the soil outlet.] It will not be easy to produce a disordered shape on the mobile] In the example, although the substrate developing device is used in a substrate for a liquid crystal display device, a plasma sintered body; a circle, etc., depends on an engraving device, a photoresist peeling = a wet etching for a plate, and a photoresist peeling device; The filling liquid of an etching liquid and a peeling liquid is performed. It is also applicable to substrates for liquid crystal display devices, water washing devices such as wafers, or basecoats 1 for cleaning ^ If the results are clear, the liquid remaining in the liquid filling nozzles will contact the substrate to be processed and fill. ， Matter, "", can also be sure of the front and back of the substrate; iiim, the front of the substrate and the back of the substrate, because the end can also be reliably filled with liquid ... Spit out of the liquid nozzle because it has been used a single time

C: \ 2D.00DE \ 9l.05 \ 91103129.ptd Page 21 530337 V. Description of the invention (19) The treatment liquid can not be discarded and can be reused, which can reduce the amount of liquid discharged. In addition, the used processing liquid is reused, so that a large amount of processing liquid can be used for sufficient pre-feeding. In addition, according to other examples of the present invention, the liquid filling is repeated, so that the liquid can be more reliable, and the processing discharged from the liquid filling nozzle of the substrate head can be moved at a higher speed. This can prevent the use of the processing liquid in the liquid filling nozzle at the rear end of the substrate. Flow direction [Explanation of element number], because a plurality of filling nozzles are used to fill the front and rear portions of the substrate. In addition, since the liquid from the front of the substrate is vertically ejected toward the substrate, the processing liquid filled with the liquid nozzle generates a liquid flow on the filling. Developer storage tank substrate processing unit control mechanism regeneration system 5 pumps b, 9 piping 1 liquid supply piping 8, 4 1, 4 2 filling nozzle I 〇 filter II discharge valve 1 2 discharge piping 13 pump 14 piping 1 5 Liquid level adjustment piping

530337 V. Description of the invention (20) 16 Roller feeding 21 ~ 22 Nozzle body 23 Shelf 24 Spit out D 25 ^ 26 Joint surface 27 Recess 28 Inclined inclined flow path 29 Open π 30 Interlocking surface 31 Filling surface 32 Lower surface

C: \ 2D-mDE \ 91-05 \ 91103129.ptd Page 23 530337 Brief Description of Drawings Figure 1 is a substrate developing device according to the first embodiment. Fig. 2 is an enlarged view of a filling nozzle. FIG. 3 is an exploded view of the filling nozzle. FIG. 4 is an explanatory diagram for explaining the filling of a filling nozzle. Figure 5 shows the substrate moving speed. Fig. 6 is a liquid filling nozzle according to a second embodiment. Fig. 7 is a liquid filling nozzle according to a third embodiment. Fig. 8 is a liquid filling nozzle according to a fourth embodiment.

C: \ 2D-roDE \ 91-05 \ 91103129.ptd Page 24

Claims (1)

530337 6. Scope of patent application1. A substrate processing device is a plate processing device for filling a processing liquid on a substrate, and includes: & a substrate holding mechanism for holding a substrate; A liquid-filling nozzle for filling the processing liquid on the substrate surface held on the substrate holding mechanism by a slit-shaped discharge port; otherwise, the substrate is opposed to the liquid-filling nozzle toward the first direction of the first direction. Movement mechanism moving in the direction; Table = 2 = The mouth is attached to the substrate held on the substrate holding mechanism 'and has a treatment / night to be discharged from the above-mentioned discharge port, and is held in the above-mentioned person ^ η, ^ ^ ^ ^ A liquid filling surface is formed on the substrate. 2. The discharge outlet of the filling liquid nozzle as described in the item 丨 of the patent application, which is located at the end of the downstream end mentioned above. The direction of movement of the substrate formed on the liquid-filled surface 'wherein, the above-mentioned guide is guided by the above-mentioned spit 3. The liquid-filled nozzle of the United States, such as the second item in the scope of the patent application, has a device φ η from the outside Externally supplied process liquid, inclined channel in the outlet. & 夂 状 4 · If the patent application fan said the liquid filling nozzle is on the substrate processing device of the above-mentioned discharge item, in which, between the processing liquid port and the filling surface discharged from the discharge port, there is a supply and discharge liquid from the above 5 · If the scope of patent application is ^ 'Guide to the contact surface on the above filling surface. The substrate processing apparatus of the liquid-filling nozzle of the liquid-filling surface is a form item, wherein the surface of the substrate. ， 成 Parallel to the substrate holding mechanism 6 · If the substrate processing device under the scope of the patent application, the above C: \ 2D-roDE \ 91-05 \ 91103l29.ptd page 25, patent application filling liquid Mouth taxi. The width of the true / night plane in the second direction is more than 10 mm and less than 40 mm. 7) For example, the substrate processing device of the third item of the dumping range of the liquid filling nozzle is applied, wherein the above-mentioned angle. The channel is at 10 relative to the filling level. Above and 50. The following is a liquid filling nozzle with two wins !! The substrate processing device of the fourth item in the range, wherein the contact length of the above 9 · Russian: ,,, and ° f is 0.1 or more and 3 mm or less. Among them, the substrate processing device of any one of items 1 to 8 in the above range, and the above-mentioned first direction length of the ejection outlet of the nozzle 2 of the processing object 2 is more than the same. The length in the direction is longer. Wherein, the substrate processing device of any of the items 1 to 8 of the patent scope is further provided with a control mechanism that controls the moving mechanism; the plate moving mechanism is near the front of the substrate, Accelerate the above-mentioned basis to be constant, i = set the movement of the substrate at the center of the substrate to reduce the degree of arrest, and set the movement of the substrate to U at the rear end of the substrate. The substrate processing equipment according to any one of items 1 to 4 is further equipped with a regeneration mechanism for applying liquid supplied to the substrate; Danson will use the processing liquid regenerated by the regeneration mechanism to remove the liquid from the nozzle again. Spit out. / 2 1 — A substrate processing apparatus is a substrate processing apparatus for filling a processing liquid on a substrate, and includes: a substrate holding mechanism for holding a substrate; 530337 6. The scope of the patent application has a slit-shaped discharge port along the first direction, and the processing substrate is replaced by the wrong% π n I> the first filling liquid on the substrate surface held by the upper plate holding stack structure Slightly. In the second direction crossing the first direction, the first-埴 '+ 1 row' has a slit-shaped discharge port extending in the-direction above: == the above-mentioned filling nozzle A second liquid-filling nozzle for filling the liquid-treating liquid on the substrate surface of the liquid-filling processing liquid; and a moving mechanism for moving the substrate in the same direction relative to the first and second liquid-filling nozzles. No. ^ 13. If the substrate processing device of the scope of application for patent No. 12 is repeated, the first and the second: liquid filling nozzles are based on the surface of the substrate held on the substrate holding mechanism according to the discharge of the liquid filling nozzles. The interval is arranged in a dagger manner between the 7y th liquid-filling nozzle and the substrate surface. See the detailed description 1 4. If the substrate processing device of the patent application No. 丨 2, the first liquid filling nozzle is any one of the items i to 8 of the patent application scope, and the liquid filling nozzle is above. 15. In the case of the substrate processing device described in item 12 or 13 of the scope of patent application, the above-mentioned second liquid filling nozzle in the basin has a processing liquid supply path for processing processing from the outside and in the discharge port; The processing liquid is perpendicular to the surface of the substrate held on the substrate holding mechanism. / 、 Response system 16 A substrate processing method is a method for filling the processing liquid with liquid, characterized in that the soil surface will be provided with a long and narrow slit-shaped discharge port in the first direction, I Filling nozzle for filling surface of ^ pi outlet, placed above the substrate surface. C: \ 2D-C0DE \ 91-05 \ 91103129.ptd page 27 530337 VI. The patent application scope = = the mouth of the mouth discharges the treatment liquid, and leaves the treatment liquid surface w in the above-mentioned filling surface; Stagnation: The liquid nozzle is relatively moved to the substrate, while the processing liquid of the planar treatment is brought into contact with the surface of the substrate, and the processing liquid is filled on the surface of the substrate. The liquid 1 treatment method for the substrate according to item 16 of the above claim Λ range, in which the stage of surface filling is near and near the front plate of the substrate, and the filling nozzle is accelerated to move. At a base speed of 乂 τ tf, the movement of the substrate to the liquid filling nozzle near the rear end of the liquid filling nozzle is decelerated. Λ8 ·: A kind of Λ plate processing method, which is a method of filling the processing liquid on the surface of the substrate, which is characterized in that: a long slit-shaped discharge opening in the first direction is placed above the surface of the substrate; %% will be described in the first party: the second filling liquid with a long slit-shaped discharge opening, '+ in the second direction of the father in the first direction, and the first filling =: ί ϊ ί is located above the substrate surface, and is arranged according to a wider distance between the ejection outlet and the surface of the substrate; between the ejection outlet and the surface of the substrate, τ ΐ causes the first liquid-filling nozzle and the substrate to move relative to each other, -side from The second outlet of the second liquid-filling nozzle discharges the treatment ⑨ and fills the liquid on the substrate surface; while the second liquid-filling nozzle and the substrate are relatively moved, the 530337 VI. Scope of patent application The above-mentioned first filling liquid has been used. 1. I prepared the substrate on the processing liquid on the filling liquid, filled it with 1 method, 9 methods, and a kind of liquid-filling nozzle with a long slit-shaped discharge port on its base. The second liquid-filled spray nozzles with a long slit-shaped discharge port are side by side and located above the surface of the substrate, and according to the interval between the discharge and the mouth-to-mouth surface, the interval is wider than that of the first liquid-filled nozzle. The method is arranged; a processing liquid is discharged from the discharge port of the first liquid filling nozzle between the surfaces of the soil plate, and the liquid remains on the liquid filling surface; and the processing liquid is made to make the first liquid filling nozzle and the substrate perform Relative displacement, the substrate surface is in contact with the surface remaining in the liquid-filled surface while the substrate surface is filled with the liquid treatment liquid; and the second liquid-filled nozzle and the substrate are relatively moved on the two sides. The first liquid filling nozzle is provided with the processing liquid while being filled with the processing liquid. From the substrate, fill 20. A substrate processing apparatus for filling the processing liquid with the substrate processing apparatus, which is characterized by having: a substrate holding mechanism for holding the substrate to be processed on the reverse side; A slit-shaped discharge port, and holding a liquid holding nozzle on the surface of the substrate held on the substrate holding mechanism; and C: \ 2D-00DE \ 9l-05 \ 9H03129.ptd Page 29 530337 6. Scope of patent application-Moving mechanism for moving the above-mentioned substrate with respect to the liquid-filling nozzle in the second direction crossing the first direction ; Where the above-mentioned liquid-filling nozzle is a substrate held on the substrate holding mechanism slightly parallel and has a liquid-filling surface facing downward, on a surface connected to the liquid-filling surface and at a position higher than the liquid-filling surface, The above-mentioned outlet is provided. 2 1 · The substrate processing apparatus according to the scope of application for patent No. 20, wherein the liquid filling nozzle is configured to surround the liquid filling surface with surface tension according to the processing liquid discharged from the thin and slit-shaped discharge port. . 22. The substrate processing apparatus according to claim 20 or 21, wherein the substrate holding mechanism holds the substrate in a slightly horizontal posture; the liquid filling surface is a slightly horizontal surface facing downward. Page 30