TW527101U - Interface card heat sink - Google Patents

Interface card heat sink

Info

Publication number
TW527101U
TW527101U TW091211178U TW91211178U TW527101U TW 527101 U TW527101 U TW 527101U TW 091211178 U TW091211178 U TW 091211178U TW 91211178 U TW91211178 U TW 91211178U TW 527101 U TW527101 U TW 527101U
Authority
TW
Taiwan
Prior art keywords
heat sink
interface card
card heat
interface
sink
Prior art date
Application number
TW091211178U
Other languages
English (en)
Inventor
Jeng-Cheng Chen
Jing-Hung Chen
Jr-Ching Luo
Original Assignee
Abit Comp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Abit Comp Corp filed Critical Abit Comp Corp
Priority to TW091211178U priority Critical patent/TW527101U/zh
Priority to RU2002131182A priority patent/RU2239226C2/ru
Priority to US10/301,792 priority patent/US6717811B2/en
Priority to FR0301097A priority patent/FR2842987A1/fr
Publication of TW527101U publication Critical patent/TW527101U/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW091211178U 2002-07-23 2002-07-23 Interface card heat sink TW527101U (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
TW091211178U TW527101U (en) 2002-07-23 2002-07-23 Interface card heat sink
RU2002131182A RU2239226C2 (ru) 2002-07-23 2002-11-20 Рассеивающее тепло устройство для интерфейсных плат
US10/301,792 US6717811B2 (en) 2002-07-23 2002-11-22 Heat dissipating apparatus for interface cards
FR0301097A FR2842987A1 (fr) 2002-07-23 2003-01-31 Dispositif de dissipation de chaleur pour cartes d'interface

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW091211178U TW527101U (en) 2002-07-23 2002-07-23 Interface card heat sink

Publications (1)

Publication Number Publication Date
TW527101U true TW527101U (en) 2003-04-01

Family

ID=28451994

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091211178U TW527101U (en) 2002-07-23 2002-07-23 Interface card heat sink

Country Status (4)

Country Link
US (1) US6717811B2 (zh)
FR (1) FR2842987A1 (zh)
RU (1) RU2239226C2 (zh)
TW (1) TW527101U (zh)

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TW572246U (en) * 2001-07-26 2004-01-11 Jiun-Fu Liou Heat dissipating module with a self rapid heat conduction
WO2003060916A1 (fr) * 2001-12-27 2003-07-24 Fujitsu Limited Dispositif a memoire et refroidisseur
AU2003214698A1 (en) * 2002-04-06 2003-10-27 Zalman Tech Co., Ltd Chipset cooling device of video graphic adapter card
TW577585U (en) * 2002-12-24 2004-02-21 Delta Electronics Inc Multi-level heat-dissipating device
US20050068727A1 (en) * 2003-09-29 2005-03-31 Chien-Chun Yu Heat dissipating structure of accelerated graphic port card
US7359197B2 (en) * 2004-04-12 2008-04-15 Nvidia Corporation System for efficiently cooling a processor
US6978828B1 (en) 2004-06-18 2005-12-27 Schlumberger Technology Corporation Heat pipe cooling system
US7265974B2 (en) * 2004-09-16 2007-09-04 Industrial Design Laboratories Inc. Multi-heatsink integrated cooling device
US12010987B2 (en) 2004-10-07 2024-06-18 Transmedics, Inc. Systems and methods for ex-vivo organ care and for using lactate as an indication of donor organ status
US8304181B2 (en) 2004-10-07 2012-11-06 Transmedics, Inc. Method for ex-vivo organ care and for using lactate as an indication of donor organ status
IL273422B (en) 2004-10-07 2022-07-01 Transmedics Inc Methods and systems for extracorporeal organ treatment
US7283364B2 (en) * 2004-11-29 2007-10-16 Ati Technologies Inc. Thermal management apparatus
US7382616B2 (en) * 2005-01-21 2008-06-03 Nvidia Corporation Cooling system for computer hardware
US7304846B2 (en) * 2005-02-11 2007-12-04 Inventec Corporation Heatsink device of video graphics array and chipset
US20060187638A1 (en) * 2005-02-24 2006-08-24 Vinson Wade D System and method for liquid cooling of an electronic device
US7272000B2 (en) * 2005-03-31 2007-09-18 Inventec Corporation Heat dissipating structure of interface card
US9078428B2 (en) 2005-06-28 2015-07-14 Transmedics, Inc. Systems, methods, compositions and solutions for perfusing an organ
US7262965B2 (en) * 2005-10-28 2007-08-28 Shuttle Inc. Thermal structure for electric devices
US20070097646A1 (en) * 2005-11-02 2007-05-03 Xue-Wen Peng Heat dissipating apparatus for computer add-on cards
CN100464279C (zh) 2005-11-17 2009-02-25 富准精密工业(深圳)有限公司 散热装置
US7365989B2 (en) * 2006-03-08 2008-04-29 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipating device for computer add-on cards
US7369412B2 (en) * 2006-05-02 2008-05-06 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
TWM304893U (en) * 2006-06-09 2007-01-11 Cooler Master Co Ltd Cooling structure of interface card
TWM304894U (en) * 2006-06-09 2007-01-11 Cooler Master Co Ltd Cooling device of interface card
US7724537B1 (en) * 2006-07-17 2010-05-25 The Grantham Family, L.P. Lock down device
TWM307949U (en) * 2006-09-22 2007-03-11 Forcecon Technology Co Ltd Heat-dissipating module structure with heat-conductive panel
US7443672B2 (en) * 2006-10-03 2008-10-28 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Video graphics array (VGA) card assembly
US7382618B2 (en) * 2006-10-13 2008-06-03 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipating apparatus for computer add-on cards
JP5231732B2 (ja) * 2006-10-26 2013-07-10 株式会社東芝 冷却装置、およびこれを備えた電子機器
US7447023B2 (en) * 2006-12-08 2008-11-04 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device for computer add-on cards
US9457179B2 (en) 2007-03-20 2016-10-04 Transmedics, Inc. Systems for monitoring and applying electrical currents in an organ perfusion system
JP4783326B2 (ja) * 2007-04-11 2011-09-28 株式会社東芝 電子機器
US7495923B2 (en) * 2007-07-23 2009-02-24 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device having fixing bracket
CN101365325B (zh) * 2007-08-10 2010-12-08 华硕电脑股份有限公司 散热模块及运用此散热模块的可拆卸式扩展卡
US20090059524A1 (en) * 2007-08-27 2009-03-05 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20090059525A1 (en) * 2007-09-05 2009-03-05 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device for computer add-on cards
US8654530B1 (en) * 2007-10-16 2014-02-18 Nvidia Corporation Heat transfer apparatus and method for transferring heat between integrated circuits
US9247728B2 (en) 2008-01-31 2016-02-02 Transmedics, Inc. Systems and methods for ex vivo lung care
US8248806B1 (en) * 2008-12-01 2012-08-21 Nvidia Corporation System and method for directly coupling a chassis and a heat sink associated with a circuit board or processor
CN102200807A (zh) * 2010-03-25 2011-09-28 鸿富锦精密工业（深圳）有限公司 扩充卡隔热罩
CN102402263A (zh) * 2010-09-10 2012-04-04 鸿富锦精密工业（深圳）有限公司 散热装置
US8885336B2 (en) * 2010-12-29 2014-11-11 OCZ Storage Solutions Inc. Mounting structure and method for dissipating heat from a computer expansion card
DK2704560T3 (da) 2011-04-14 2022-05-23 Transmedics Inc Organbehandlingsopløsning til maskinperfusion ex-vivo af donorlunger
TWI476575B (zh) * 2012-05-04 2015-03-11 Inventec Corp 電子裝置及其散熱結構
US9013874B2 (en) * 2012-09-12 2015-04-21 Sk Hynix Memory Solutions Inc. Heat dissipation device
DK3151663T3 (da) 2014-06-02 2020-11-30 Transmedics Inc Ex vivo-organplejesystem
CA2970117A1 (en) 2014-12-12 2016-06-16 Darren FREED Apparatus and method for organ perfusion
WO2016171654A1 (en) * 2015-04-20 2016-10-27 Hewlett Packard Enterprise Development Lp Supplemental air cooling
CN107949419B (zh) 2015-09-09 2021-03-05 特兰斯迈迪茨公司 离体器官护理系统用的主动脉插管
US10032356B1 (en) * 2017-07-05 2018-07-24 Evga Corporation Display card protection circuit monitoring structure
WO2019032079A1 (ru) * 2017-08-11 2019-02-14 Сергей Сергеевич ТОВАРНИЦКИЙ Корпус для вычислительного устройства
WO2019032080A1 (ru) * 2017-08-11 2019-02-14 Сергей Сергеевич ТОВАРНИЦКИЙ Устройство для охлаждения
TWI784820B (zh) * 2021-11-30 2022-11-21 宏碁股份有限公司 顯示卡組件
CN114253359B (zh) * 2022-03-01 2022-07-22 荣耀终端有限公司 导热器件及电子设备

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US6058012A (en) * 1996-08-26 2000-05-02 Compaq Computer Corporation Apparatus, method and system for thermal management of an electronic system having semiconductor devices
US6424528B1 (en) * 1997-06-20 2002-07-23 Sun Microsystems, Inc. Heatsink with embedded heat pipe for thermal management of CPU
JP3488060B2 (ja) * 1997-11-12 2004-01-19 株式会社Ｐｆｕ 薄型電子装置の放熱装置
US6408934B1 (en) * 1998-05-28 2002-06-25 Diamond Electric Mfg. Co., Ltd. Cooling module
JP4493117B2 (ja) * 1999-03-25 2010-06-30 レノボ シンガポール プライヴェート リミテッド ノートブック型パーソナルコンピューターの冷却方法及び冷却装置
JP4156132B2 (ja) * 1999-06-15 2008-09-24 株式会社Ｐｆｕ 半導体モジュール装置
TW448711B (en) * 1999-07-22 2001-08-01 Foxconn Prec Components Co Ltd Heat dissipation device
US6512673B1 (en) * 2000-07-05 2003-01-28 Network Engines, Inc. Low profile equipment housing with angular fan
US6373700B1 (en) * 2001-06-18 2002-04-16 Inventec Corporation Heat sink modular structure inside an electronic product

Also Published As

Publication number Publication date
US6717811B2 (en) 2004-04-06
RU2239226C2 (ru) 2004-10-27
FR2842987A1 (fr) 2004-01-30
US20040017658A1 (en) 2004-01-29

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MK4K Expiration of patent term of a granted utility model