TW526367B - Substrate assembling apparatus - Google Patents

Substrate assembling apparatus Download PDF

Info

Publication number
TW526367B
TW526367B TW089105073A TW89105073A TW526367B TW 526367 B TW526367 B TW 526367B TW 089105073 A TW089105073 A TW 089105073A TW 89105073 A TW89105073 A TW 89105073A TW 526367 B TW526367 B TW 526367B
Authority
TW
Taiwan
Prior art keywords
substrates
substrate
assembling apparatus
vacuum chamber
vacuum
Prior art date
Application number
TW089105073A
Other languages
English (en)
Chinese (zh)
Inventor
Satoshi Hachiman
Kiyoshi Imaizumi
Masayuki Saito
Yukihiro Kawasumi
Haruo Sankai
Original Assignee
Hitachi Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP08961299A external-priority patent/JP3410983B2/ja
Priority claimed from JP17290399A external-priority patent/JP3535044B2/ja
Application filed by Hitachi Ind Co Ltd filed Critical Hitachi Ind Co Ltd
Application granted granted Critical
Publication of TW526367B publication Critical patent/TW526367B/zh

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Liquid Crystal (AREA)
TW089105073A 1999-03-30 2000-03-20 Substrate assembling apparatus TW526367B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP08961299A JP3410983B2 (ja) 1999-03-30 1999-03-30 基板の組立方法およびその装置
JP17290399A JP3535044B2 (ja) 1999-06-18 1999-06-18 基板の組立て装置とその方法、及び液晶パネルの製造方法

Publications (1)

Publication Number Publication Date
TW526367B true TW526367B (en) 2003-04-01

Family

ID=26431027

Family Applications (1)

Application Number Title Priority Date Filing Date
TW089105073A TW526367B (en) 1999-03-30 2000-03-20 Substrate assembling apparatus

Country Status (3)

Country Link
KR (1) KR100360833B1 (ko)
SG (1) SG87888A1 (ko)
TW (1) TW526367B (ko)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7190431B2 (en) 2004-07-09 2007-03-13 Innolux Display Corp. Method for curing sealant used when sealing an LCD panel
US7372691B2 (en) 2004-06-11 2008-05-13 Innolux Display Corp. Apparatus and method for joining two substrates
CN102636913A (zh) * 2011-02-15 2012-08-15 常阳工学株式会社 密封方法及其装置
CN103959453A (zh) * 2011-11-25 2014-07-30 信越工程株式会社 基板输送装置及基板装配线
CN104898310A (zh) * 2014-03-06 2015-09-09 Nlt科技股份有限公司 基板层叠装置、基板层叠方法及立体显示装置

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6739929B2 (en) * 2000-03-31 2004-05-25 Minolta Co., Ltd. Method and apparatus for producing a display panel, method for adhering an adhesive sheet and method for adhering plates
KR100783705B1 (ko) * 2001-06-26 2007-12-07 삼성전자주식회사 표시 장치용 기판의 결합 장치 및 이를 이용한 표시장치의 제조 방법
JP3693972B2 (ja) * 2002-03-19 2005-09-14 富士通株式会社 貼合せ基板製造装置及び基板貼合せ方法
KR100847816B1 (ko) * 2002-03-25 2008-07-23 엘지디스플레이 주식회사 액정표시소자의 진공 합착 장치
KR101245181B1 (ko) * 2006-03-13 2013-03-19 엘아이지에이디피 주식회사 기판 합착 장치
KR101292803B1 (ko) * 2006-12-06 2013-08-02 엘아이지에이디피 주식회사 기판 합착장치의 간격유지유닛

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2925427B2 (ja) * 1993-05-14 1999-07-28 信越化学工業株式会社 静電チャック
JPH1026763A (ja) * 1996-07-11 1998-01-27 Seiko Epson Corp 液晶パネルの製造方法及びその装置

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7372691B2 (en) 2004-06-11 2008-05-13 Innolux Display Corp. Apparatus and method for joining two substrates
US7190431B2 (en) 2004-07-09 2007-03-13 Innolux Display Corp. Method for curing sealant used when sealing an LCD panel
CN102636913A (zh) * 2011-02-15 2012-08-15 常阳工学株式会社 密封方法及其装置
CN103959453A (zh) * 2011-11-25 2014-07-30 信越工程株式会社 基板输送装置及基板装配线
CN103959453B (zh) * 2011-11-25 2017-03-08 信越工程株式会社 基板输送装置及基板装配线
CN104898310A (zh) * 2014-03-06 2015-09-09 Nlt科技股份有限公司 基板层叠装置、基板层叠方法及立体显示装置
CN104898310B (zh) * 2014-03-06 2019-05-10 Nlt科技股份有限公司 基板层叠装置、基板层叠方法及立体显示装置
US10718953B2 (en) 2014-03-06 2020-07-21 Tianma Microelectronics Co., Ltd. Substrate laminating apparatus, substrate laminating method, and stereoscopic display device

Also Published As

Publication number Publication date
KR100360833B1 (ko) 2002-11-13
KR20010020690A (ko) 2001-03-15
SG87888A1 (en) 2002-04-16

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Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees