TW526367B - Substrate assembling apparatus - Google Patents

Substrate assembling apparatus Download PDF

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Publication number
TW526367B
TW526367B TW089105073A TW89105073A TW526367B TW 526367 B TW526367 B TW 526367B TW 089105073 A TW089105073 A TW 089105073A TW 89105073 A TW89105073 A TW 89105073A TW 526367 B TW526367 B TW 526367B
Authority
TW
Taiwan
Prior art keywords
substrates
substrate
assembling apparatus
vacuum chamber
vacuum
Prior art date
Application number
TW089105073A
Other languages
Chinese (zh)
Inventor
Satoshi Hachiman
Kiyoshi Imaizumi
Masayuki Saito
Yukihiro Kawasumi
Haruo Sankai
Original Assignee
Hitachi Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP08961299A external-priority patent/JP3410983B2/en
Priority claimed from JP17290399A external-priority patent/JP3535044B2/en
Application filed by Hitachi Ind Co Ltd filed Critical Hitachi Ind Co Ltd
Application granted granted Critical
Publication of TW526367B publication Critical patent/TW526367B/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Liquid Crystal (AREA)

Abstract

The present invention relates to a substrate assembling apparatus in which substrates to be bonded together in a vacuum chamber are held opposite to each other and bonded together by narrowing the gap between the substrates in a vacuum. In the substrate assembling apparatus in accordance with the present invention, a pressing plate comprises a means for holding an upper substrate out of the substrates opposite to each other by making an electrostatic attractive force act on the upper substrate in the vacuum chamber, and the upper and the lower substrates are bonded to each other in a vacuum chamber by narrowing the gap between the substrates in a vacuum while the upper substrate is being held using the holding means.

Description

526367 A8 B8 C8 D8 六、申請專利範圍 ，並吸收該貼合手段受到的變形之變形吸收手段。 7 ·如申請專利範圍第1項所述之基板之安裝裝置， 至少在利用兩真空室單元之合體所形成的真空室之外側， 設有可使解除合體之任一真空室單元水平移動之移動手段 、和在位於該真空室外側的該工作台上之另一側的基板， 以閉鎖的圖形來繪製接著劑之繪製手段以及在利用該工作 台上之另一側的基板之接著劑所繪製的閉鎖圖形之內側， 滴下液晶之滴下手段。 8 .如申請專利範圍第1項所述之基板之安裝裝置， 在該工作台設有利用靜電吸著力來保持另一側的基板之靜 電吸著板。 —- .1^1 ^^1 n —l·. k n n (讀先閱·#背面之注意事項再填寫本頁) 訂 線 經濟部智慧財產局員工消費合作社印製 I紙張尺度適用中國國家糅準(CNS ) A4此格（21GX297公釐） -3 一526367 A8 B8 C8 D8 6. Scope of patent application and deformation absorption means to absorb the deformation of the laminating means. 7 · The mounting device for the substrate as described in item 1 of the scope of the patent application, at least on the outside of the vacuum chamber formed by the combination of the two vacuum chamber units, is provided with a movement that can move any of the vacuum chamber units horizontally Means, and a drawing method for drawing an adhesive with a latched pattern on a substrate on the other side of the table on the outside of the vacuum chamber, and drawing on an adhesive using a substrate on the other side of the table On the inside of the latch pattern, the dripping means for dripping the liquid crystal. 8. The mounting device for a substrate as described in item 1 of the scope of the patent application, the table is provided with an electrostatic absorbing plate that holds the substrate on the other side by electrostatic attraction. —- .1 ^ 1 ^^ 1 n —l ·. Knn (Read the first read · Notes on the back of the page before filling out this page) Threading printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, printed by the consumer co-operative society I Paper standards are applicable to Chinese national standards (CNS) A4 this grid (21GX297 mm) -3 1

TW089105073A 1999-03-30 2000-03-20 Substrate assembling apparatus TW526367B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP08961299A JP3410983B2 (en) 1999-03-30 1999-03-30 Substrate assembly method and apparatus
JP17290399A JP3535044B2 (en) 1999-06-18 1999-06-18 Substrate assembling apparatus and method, and liquid crystal panel manufacturing method

Publications (1)

Publication Number Publication Date
TW526367B true TW526367B (en) 2003-04-01

Family

ID=26431027

Family Applications (1)

Application Number Title Priority Date Filing Date
TW089105073A TW526367B (en) 1999-03-30 2000-03-20 Substrate assembling apparatus

Country Status (3)

Country Link
KR (1) KR100360833B1 (en)
SG (1) SG87888A1 (en)
TW (1) TW526367B (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7190431B2 (en) 2004-07-09 2007-03-13 Innolux Display Corp. Method for curing sealant used when sealing an LCD panel
US7372691B2 (en) 2004-06-11 2008-05-13 Innolux Display Corp. Apparatus and method for joining two substrates
CN102636913A (en) * 2011-02-15 2012-08-15 常阳工学株式会社 Sealing method and apparatus thereof
CN103959453A (en) * 2011-11-25 2014-07-30 信越工程株式会社 Wafer transport apparatus and wafer assembly line
CN104898310A (en) * 2014-03-06 2015-09-09 Nlt科技股份有限公司 Substrate laminating apparatus, substrate laminating method, and stereoscopic display device

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6739929B2 (en) * 2000-03-31 2004-05-25 Minolta Co., Ltd. Method and apparatus for producing a display panel, method for adhering an adhesive sheet and method for adhering plates
KR100783705B1 (en) * 2001-06-26 2007-12-07 삼성전자주식회사 Devices for combining panels for a display and methods for manufacturing the display using the same
JP3693972B2 (en) * 2002-03-19 2005-09-14 富士通株式会社 Bonded substrate manufacturing apparatus and substrate bonding method
KR100847816B1 (en) * 2002-03-25 2008-07-23 엘지디스플레이 주식회사 Vacuum bonding device for liquid crystal display
KR101245181B1 (en) * 2006-03-13 2013-03-19 엘아이지에이디피 주식회사 Substrate bonding apparatus
KR101292803B1 (en) * 2006-12-06 2013-08-02 엘아이지에이디피 주식회사 Apparatus for assembling substrates having a gap control unit

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2925427B2 (en) * 1993-05-14 1999-07-28 信越化学工業株式会社 Electrostatic chuck
JPH1026763A (en) * 1996-07-11 1998-01-27 Seiko Epson Corp Production of liquid crystal panel and device therefor

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7372691B2 (en) 2004-06-11 2008-05-13 Innolux Display Corp. Apparatus and method for joining two substrates
US7190431B2 (en) 2004-07-09 2007-03-13 Innolux Display Corp. Method for curing sealant used when sealing an LCD panel
CN102636913A (en) * 2011-02-15 2012-08-15 常阳工学株式会社 Sealing method and apparatus thereof
CN103959453A (en) * 2011-11-25 2014-07-30 信越工程株式会社 Wafer transport apparatus and wafer assembly line
CN103959453B (en) * 2011-11-25 2017-03-08 信越工程株式会社 Base board delivery device and substrate assembly line
CN104898310A (en) * 2014-03-06 2015-09-09 Nlt科技股份有限公司 Substrate laminating apparatus, substrate laminating method, and stereoscopic display device
CN104898310B (en) * 2014-03-06 2019-05-10 Nlt科技股份有限公司 Substrate stacked laminator, substrate laminating method and 3 d display device
US10718953B2 (en) 2014-03-06 2020-07-21 Tianma Microelectronics Co., Ltd. Substrate laminating apparatus, substrate laminating method, and stereoscopic display device

Also Published As

Publication number Publication date
KR20010020690A (en) 2001-03-15
KR100360833B1 (en) 2002-11-13
SG87888A1 (en) 2002-04-16

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GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees