SG87888A1 - Substrater assembling apparatus - Google Patents
Substrater assembling apparatusInfo
- Publication number
- SG87888A1 SG87888A1 SG200001561A SG200001561A SG87888A1 SG 87888 A1 SG87888 A1 SG 87888A1 SG 200001561 A SG200001561 A SG 200001561A SG 200001561 A SG200001561 A SG 200001561A SG 87888 A1 SG87888 A1 SG 87888A1
- Authority
- SG
- Singapore
- Prior art keywords
- substrater
- assembling apparatus
- assembling
- substrater assembling
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Liquid Crystal (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP08961299A JP3410983B2 (en) | 1999-03-30 | 1999-03-30 | Substrate assembly method and apparatus |
JP17290399A JP3535044B2 (en) | 1999-06-18 | 1999-06-18 | Substrate assembling apparatus and method, and liquid crystal panel manufacturing method |
Publications (1)
Publication Number | Publication Date |
---|---|
SG87888A1 true SG87888A1 (en) | 2002-04-16 |
Family
ID=26431027
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200001561A SG87888A1 (en) | 1999-03-30 | 2000-03-20 | Substrater assembling apparatus |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR100360833B1 (en) |
SG (1) | SG87888A1 (en) |
TW (1) | TW526367B (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6739929B2 (en) * | 2000-03-31 | 2004-05-25 | Minolta Co., Ltd. | Method and apparatus for producing a display panel, method for adhering an adhesive sheet and method for adhering plates |
KR100783705B1 (en) * | 2001-06-26 | 2007-12-07 | 삼성전자주식회사 | Devices for combining panels for a display and methods for manufacturing the display using the same |
JP3693972B2 (en) * | 2002-03-19 | 2005-09-14 | 富士通株式会社 | Bonded substrate manufacturing apparatus and substrate bonding method |
KR100847816B1 (en) * | 2002-03-25 | 2008-07-23 | 엘지디스플레이 주식회사 | Vacuum bonding device for liquid crystal display |
CN100376945C (en) | 2004-06-11 | 2008-03-26 | 鸿富锦精密工业(深圳)有限公司 | Substrate plying-up apparatus and substrate plying-up process |
TWI313384B (en) | 2004-07-09 | 2009-08-11 | Innolux Display Corp | Method for curing sealant |
KR101245181B1 (en) * | 2006-03-13 | 2013-03-19 | 엘아이지에이디피 주식회사 | Substrate bonding apparatus |
KR101292803B1 (en) * | 2006-12-06 | 2013-08-02 | 엘아이지에이디피 주식회사 | Apparatus for assembling substrates having a gap control unit |
JP5706180B2 (en) * | 2011-02-15 | 2015-04-22 | 常陽工学株式会社 | Sealing method and apparatus |
JP5139604B1 (en) * | 2011-11-25 | 2013-02-06 | 信越エンジニアリング株式会社 | Substrate transfer device and substrate assembly line |
JP6311967B2 (en) | 2014-03-06 | 2018-04-18 | Tianma Japan株式会社 | Substrate bonding apparatus and substrate bonding method |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06326179A (en) * | 1993-05-14 | 1994-11-25 | Shin Etsu Chem Co Ltd | Electrostatic chuck |
JPH1026763A (en) * | 1996-07-11 | 1998-01-27 | Seiko Epson Corp | Production of liquid crystal panel and device therefor |
-
2000
- 2000-03-20 TW TW089105073A patent/TW526367B/en not_active IP Right Cessation
- 2000-03-20 SG SG200001561A patent/SG87888A1/en unknown
- 2000-03-29 KR KR1020000015984A patent/KR100360833B1/en not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06326179A (en) * | 1993-05-14 | 1994-11-25 | Shin Etsu Chem Co Ltd | Electrostatic chuck |
JPH1026763A (en) * | 1996-07-11 | 1998-01-27 | Seiko Epson Corp | Production of liquid crystal panel and device therefor |
Also Published As
Publication number | Publication date |
---|---|
KR100360833B1 (en) | 2002-11-13 |
TW526367B (en) | 2003-04-01 |
KR20010020690A (en) | 2001-03-15 |
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