TW526334B - Test socket - Google Patents

Test socket Download PDF

Info

Publication number
TW526334B
TW526334B TW088118949A TW88118949A TW526334B TW 526334 B TW526334 B TW 526334B TW 088118949 A TW088118949 A TW 088118949A TW 88118949 A TW88118949 A TW 88118949A TW 526334 B TW526334 B TW 526334B
Authority
TW
Taiwan
Prior art keywords
test
socket
integrated circuit
circuit board
plunger
Prior art date
Application number
TW088118949A
Other languages
English (en)
Chinese (zh)
Inventor
Mark A Swart
Charles J Johnston
Gordon A Vinther
Steve B Sargeant
Original Assignee
Capital Formation Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Capital Formation Inc filed Critical Capital Formation Inc
Application granted granted Critical
Publication of TW526334B publication Critical patent/TW526334B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/11—End pieces or tapping pieces for wires, supported by the wire and for facilitating electrical connection to some other wire, terminal or conductive member
    • H01R11/18—End pieces terminating in a probe

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Connecting Device With Holders (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
TW088118949A 1998-11-02 1999-12-07 Test socket TW526334B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US18473298A 1998-11-02 1998-11-02

Publications (1)

Publication Number Publication Date
TW526334B true TW526334B (en) 2003-04-01

Family

ID=22678114

Family Applications (1)

Application Number Title Priority Date Filing Date
TW088118949A TW526334B (en) 1998-11-02 1999-12-07 Test socket

Country Status (4)

Country Link
JP (1) JP3087965B2 (ja)
KR (1) KR20000035134A (ja)
DE (1) DE19954041A1 (ja)
TW (1) TW526334B (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI550286B (zh) * 2015-06-18 2016-09-21 Test equipment for electronic components
TWI567395B (zh) * 2016-05-06 2017-01-21 致茂電子股份有限公司 電流探針

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4197659B2 (ja) 2003-05-30 2008-12-17 富士通マイクロエレクトロニクス株式会社 電子部品用コンタクタ及びこれを用いた試験方法
JP3791689B2 (ja) * 2004-01-09 2006-06-28 日本電子材料株式会社 プローブカード
KR100654492B1 (ko) 2005-02-01 2006-12-05 주식회사 대양기전 검사소켓이 슬라이드접촉에 적합한 시소 프로브유니트
DE102005030550B3 (de) * 2005-06-22 2006-10-26 JHS Technik Josef Schäfer Vorrichtung zum Prüfen von bestückten oder unbestückten Leiterplatten
DE102005030551B3 (de) * 2005-06-22 2007-01-04 JHS Technik Josef Schäfer Vorrichtung zum Übertragen von elektrischen Signalen zwischen einem Tester und einem Prüfadapter
KR100890975B1 (ko) 2008-01-08 2009-03-27 주식회사 휴먼라이트 칩 검사장치
DE102008008810B4 (de) * 2008-02-12 2012-03-29 Ep Ants Gmbh Sockel für ein elektronisches Bauelement, Verfahren zum Bestücken eines Sockels und Verfahren zum Kontaktieren eines elektronischen Bauelements
WO2017060946A1 (ja) * 2015-10-05 2017-04-13 ユニテクノ株式会社 検査用基板
JP7467110B2 (ja) * 2019-12-26 2024-04-15 株式会社エンプラス Ｉｃソケット
US11293976B1 (en) * 2020-09-25 2022-04-05 Essai, Inc. Integrated circuit device test tooling with dual angle cavities
JP7453891B2 (ja) * 2020-10-06 2024-03-21 日本航空電子工業株式会社 電気部品検査器具

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI550286B (zh) * 2015-06-18 2016-09-21 Test equipment for electronic components
TWI567395B (zh) * 2016-05-06 2017-01-21 致茂電子股份有限公司 電流探針

Also Published As

Publication number Publication date
KR20000035134A (ko) 2000-06-26
DE19954041A1 (de) 2000-05-11
JP3087965B2 (ja) 2000-09-18
JP2000162270A (ja) 2000-06-16

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