TW513348B - Laser processing method, method for manufacturing ink jet recording head using such method of manufacture, and ink jet recording head manufactured by such method of manufacture - Google Patents

Laser processing method, method for manufacturing ink jet recording head using such method of manufacture, and ink jet recording head manufactured by such method of manufacture Download PDF

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Publication number
TW513348B
TW513348B TW089112898A TW89112898A TW513348B TW 513348 B TW513348 B TW 513348B TW 089112898 A TW089112898 A TW 089112898A TW 89112898 A TW89112898 A TW 89112898A TW 513348 B TW513348 B TW 513348B
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Taiwan
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ink
recording head
laser
jet recording
ink jet
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TW089112898A
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English (en)
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Jun Koide
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Canon Kk
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1632—Manufacturing processes machining
    • B41J2/1634—Manufacturing processes machining laser machining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/145—Arrangement thereof
    • B41J2/15—Arrangement thereof for serial printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1607—Production of print heads with piezoelectric elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/162—Manufacturing of the nozzle plates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14379—Edge shooter
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14387—Front shooter

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)

Description

513348 A8 B8 C8 D8 六、申請專利範圍 1 1 .如申請專利範圍第1項之雷射處理方法，雷射 光述的波長落於3 5 _0至1 0 0 0 n m的範圍。 1 2 ·如申請專利範圍第1項之雷射處理方法，雷射 光述的脈波照射時間設成500femto秒或更小。 1 3 ·如申請專利範圍第1項之雷射處理方法，雷射 震盪器具有傳播光述的空間遞縮裝置。 1 4 ·如申請專利範圍第1 3項之雷射處理方法，傳 播光束的空間壓縮裝置包括脈波產生機構，及利用光束波 長散佈性的縱向模式同步機構。 1 5 .如申請專利範圍第1 3項之雷射處理方法，傳 播光束的空間壓縮裝置由脈波產生機構以及利用光束波長 散佈，性的縱向模式同步法所構成。 1 6 · —種噴墨記錄頭的製造方法，利用雷射處理來 形成墨水通道的至少部份構件，具有用以將墨滴排出至記 錄媒體的排放埠；維持供應至排放埠之墨水的液體室；連 通排放埠與液體室的墨流’通道；及墨流通道內时能M產··生 元件，用以產生排.墨的能量；及用以將墨水自外側供應至 液體室內的供墨埠，製造方法包括步驟：利用多脈波雷射 光束，形成作爲墨水通道部件的凹槽部位或通孔，此雷射 光束由雷射震盪器所放出，並具有極大的空間及瞬間能量 密度，且派波的放射時間小於.1微微秒。 1 7 .如申請專利範圍第1 6項之噴墨記錄頭製造方 法’使雷射光束通過預疋間隔上具有多個開口的光罩而照 射，以同時形成多個作爲墨水通道一部份的凹槽部位及通 本紙張又度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閲讀背面之注意事項再填寫本頁) 、IT. Μ丨. 經濟部智慧財產局員工消費合作社印製 513348 A8 B8 C8 D8 六、申請專利範圍 孔。 1 8 ·如申請專利範圍第1 6項之噴墨記錄頭製造方 法’形成墨水通道一部份的構件是由樹脂所構成。 1 9 .如申請專利範圍第1 6項之噴墨記錄頭製造方 法’形成墨水通道一部份的構件是由s i或s i複合材料 所構成。 .一 2 0 ·如申請專利範圍第1 7至第1 9項任一項之噴 墨記錄頭製造方法，凹槽部位是形成墨水流道的溝槽。 2 1 ·如申請專利範圍第1 7至第1 9項任一項之噴 囊記錄頭製造方法，通孔成爲排放埠。 ， 2 2 · 一種噴墨記錄頭的製造方法，利用雷射處理來 形成.墨水通道的至少部份構件，且構件是由兩種或多種不 同材料所構成’包括用以將墨滴排出至記錄媒體的排放埠 ’維持供應至排放埠之墨水的液體室；連通排放埠與液體 ^的墨流通道，及墨流通道內的能量產生元件，用以產生 排墨的酡呈；，及用以將墨水自外側供應至液體室馬的供墨 場’製造方法包括步驟：利用多脈波雷射光束，在幾乎單 〜步驟中，同時對兩種或多種不同的構件材料進行昇華處 理’此雷射光束由雷射震盪器所放出，並具有極大的空間 及瞬間能量密度，且派波的放射時間小於1微微秒。 2 3 ·如申請專利範圍第2 2項之噴墨記錄頭製造方 法’以兩種或多種材料所形成的構件，以接合狀態構成至 少部分之噴墨頭的噴墨通道，且幾乎是在單一歩驟中同時 進行昇華處理而不產生任何扭曲。 本纸張尺度適用中國國家標準（CNS ) A4規格（210χ297公釐） ----------〉裝-- (請先閎讀背面之注意事項再填寫本頁) 訂 經濟部智慧財產局員工消費合作社印製 513348 A8 B8 C8 D8 六、申請專利範圍 經濟部智慧財產局員工消費合作社印製 2 4 . 製造方法， 屬材料，無 不且合而形成 2 5 . 使此噴墨記 成於一透明 出至記錄媒 室；連通排 量產生元件 供應至液體 波雷射光束 » 束波長呈透 射震盪器所 派波的放射 遠埋。 2 6 . 有一構件以 構件由低雷 之材料（B 件包括用以 排放埠之墨 » 及墨流通 及用以將墨 如申請專利範 兩種或多種不 機複合材料， 〇 一種噴墨記錄 錄頭具有形成 墨流通道成形 體的排放埠； 放埠與液體室 ，用以產生排 室內的供墨埠 ，將高於預定 明之墨流道成 放出，並具有 時間小於1微 一種噴墨記錄 形成至少部分 射吸收率之透 )所製成，且 將墨滴排出至 水的液體室； 道內的能量產 水自外側洪應 圍第2 2或2 3項之噴墨記錄頭 同的材料是由有機樹脂材料，金 玻璃材料或礦物質材料等隨意地 頭的製 部k分墨 構件中 維持供 的墨流 墨的能 ，製造 能量密 形構件 極大的 微秒； 造方法， 水通道的 ，構件包 應至排放 通道；及 量；及用 方法包.括 度的光束 的內部， 空間及瞬 以及對墨 利用雷 構件， 括用以 埠之墨 墨流通 以將墨 步驟： 收聚在 此雷射 間能量 流通道 射處理， 且構件形 將墨滴排 水的液體 道內的能 水自外側 利用多脈 相對於光 光束由雷 密度，且 進行昇華 頭的製造方法，此噴墨記錄頭具 的墨流通道，位，於工件內側的此 明材料（A )及較高雷射吸收率 利用雷射處理方法加以處理，構 記錄媒體的排放埠；維持供應至 連通排放埠與液體室的墨流通道 生元件，用以產生排墨的能量； 至液體室內的供墨埠，製造方法 本纸張尺度適用中國國家樣準（CNS ) A4規格（21〇 X 297公釐） -5- (請先閱讀背面之注意事項再填寫本頁) 513348 經濟砵智慧財產局員工消費合作社印製 A8 B8 C8 D8 六、申請專利範圍 包括步驟：利用具有多個脈波的雷射光束’此雷射光束由 雷射震盪器所放出，.並具有極大的空間及瞬間能量密度， 且派波的放射時間小於1微微秒，以其波長可穿透幾乎透 明’並具低吸收率的材料（A )，且將雷射照射至工件內 部的材料（B ) ’其在雷射波長下具有高於材料（a )的 吸收率；及利用昇華法處理对料（B )。 2 7 ·如申請專利範圍第2 5或第2 6項之噴墨記錄 頭製造方法，當處理墨流通道及其他部件時，先形成排放 埠以將昇華及蒸發所產生的副產物排至外側，接著再處理 墨流通道。 •， 2 8 ·如申請專利範圍第2 7項之噴墨記錄頭製造方 法，，當處理墨流通道及其他部件時，墨流通道及其他部件 在近於排放埠的位置進'行處理。 2 9 ·如申請專利範圍第1 6 ，1 7，2 2 ，2 3 ， 2 5及2 6項之任一項噴墨記錄頭製造方法，當時施處理 時，·藉由在其R邰混入染料，以吸收對應至雷射光束的.震 盪波長。 . 3 0 ·如申請專利範圍第1 6 ，1 7，2 2 ，2 3 ， 2 5及2 6項之任一項噴墨記錄頭製造方法，雷射光束的 波長落於3 5 0至1 0 0 0 n m的範圍。 . 3 1 ·如申請專利範圍第1 6 ，1 7，2 2 .，2 3 ， 2 5及2 6項之任一項噴墨記錄頭製造方法，雷射光束的 脈波照射時間設成500femto秒或更小。 · 3 2 ·如申請專利範圍第1 6 ，1 7，2 2 ，2 3 ， 本紙張尺度適用中國國家揉準（CNS ) A4規格（2丨0X297公釐） (請先閱讀背面之注意事項再填寫本頁)
513348 A8 B8 C8 D8 經濟部智慧財產局員工消費合作社印製 六、申請專利範圍 2 5及2 6項之任一項噴墨記錄頭製造方法，雷射震盪器 具有傳播光述的空間壓縮裝置。 3 3 ·如申請專利範圍第3 2項之噴墨記錄頭製造方 法’傳播光束的空間壓縮裝置包括脈波產生機構，及利用 光束波長散佈性的縱向模式同步機構。 . 3 4 ·如申請專利範ip第3 2項之噴墨記錄頭製造方 法’傳播光束的空間壓縮裝置由脈波產生機構以及利用光 束波長散佈性的縱向模式同步法所構成。 3 5 · —種噴墨記錄頭，具有利用雷射處理來形成墨 水通道的至少部份構件，此構件具有用以將墨滴排出至記 錄媒體的排放埠；維持供應至排放埠之墨水的液體室；連 通排t放埠與液體室的墨流通道；墨流通道內的能量產生元 件’用以產生排墨的能量；及用以將墨水自外側供應至液 體室內的供墨埠，噴墨頭包括作爲墨水通道部件的凹槽部 位或通孔，其由雷射震盪器所放出之雷射所形成，並具有 極大的空間及瞬間能量密度，且派波的放射時間小於1微 微秒。 . 3 6 .如申請專利範圍第3 5項之噴墨記錄頭，使雷 射光束通過預定間隔上具有多個開口的光罩而照射，以同 時形成多個作爲墨水通道一部份的凹槽部位及.通孔。 3 7 .如申請專利範圍第3 5項之噴墨記錄頭’形成 墨水通道一部份的構件是由樹脂所構成。 3 8 .如申請專利範圍第3 5項之噴墨記錄頭’形成 墨水通道一部份的構件是由S . 1或S 1複合材料所構成。 0------、玎------鐵r (請先閱讀背面之注意事項再填寫本頁) 表紙張尺度適用中國國家樣準（CNS ) A4規格（210X297公釐） -7- 513348 A8 B8 C8 D8 六、申請專利範圍 3 9 .如申請專利範圍第3 6項之噴墨記錄頭，凹槽 部位是形成墨水流道的溝槽。 1-·* n n m in m I m n n n (請先閲讀背面之柱意事項再填寫本頁) 4 ◦.如申請專利範圍第3 6項之_墨記錄頭，通孔 成爲排放埠。 4 1 . 一種噴墨記錄頭，利用雷射處理來形成墨水通 道的至少部份構件，且構怜是由兩種或多種不同材料所構 成：包括用以將墨滴排出至記錄媒體的排放埠；維持供應 至排放埠之墨水的液體室；連通排放埠與液體室的墨流通 道；及墨流通道內的能量產生元件，.用以產生排墨的能量 :及用以將墨水自外側供應至液體室內的供墨璋，包括： , 兩種或多種不同的構件材料是利用多脈波雷射光束， 在幾乎單一步驟中同時進行昇華處理而形成，此雷射光束 » 由雷射震盪器所放出，並具有極大的空間及瞬間能量密度 ，且派波的放射時間小於1微微秒。 經濟部智慧財產局員工消費合作社印製 4 2 ·如申師專利車e圍弟4 1項之噴墨記錄頭，由兩 種或多種材料所形成的構件，以接合狀態構成至少部分之 噴墨頭的噴墨通道，且幾乎是在單一步驟中同時進行昇華 處理而不產生任何扭曲。 4 3 ·如申請專利範圍第4 1或第4 2項之噴墨記錄 頭’兩種或多種不同的材料是由有機樹脂材料，金屬材料 ，無機複合.材料，玻璃材料或礦物質材料等隨意地組合而 形成。 4 4 · ~種噴墨記錄頭，利用雷射處理，健此噴墨記 錄頭具有形成部分墨水通道的構件，且構件形成於一透明 表紙張尺度適用中國國家標準（CNS ) Μ規格（2丨〇><297公瘦） -8 513348 經濟部智慧財產局員工消費今作社印製 B8 C8 D8 六、申請專利範圍 墨流通道成形構件中，構件包括用以將墨滴排出至記錄媒 體的排s(埠；維持供應至排放埠之墨水的液體室；連通排 放埠與液體室的墨流通道；及墨流通道內的能量產生元件 ’用以產生排墨的能量；及用以將墨水自外側供應至液體 室內的供墨埠，包括： < 該構件是利用多脈波雷~射光束，將高於預定能量密度 的光束收聚在相對於光束波長呈透明之墨流道成形構件的 內部而形成，雷射光束由雷射震盪器所放出，並具有極大 的空間及瞬間能量密度，且派波的放射時間小 '於1微微秒 〇 ， 4 5 . —種噴墨記錄頭，其具有一構件以形成至少部 分的墨流通道，位於工件內側的此構件由低雷射吸收率之 % 透明材料（A )及較高雷射吸收率之材料（B )所製成， 且利用雷射處理方法加以處理，構件包括用以將墨滴排出 至記錄媒體的排放埠；維持供應至排放埠之墨水的液體室 ;連通排放埠與液體室的墨流通道；及墨流通道內的能量 產生元件，用以產生排墨的能量；及用以將墨水自外側供 應至液體室內的供墨埠，包括： 該構件是利用具有多個脈波的雷射光束來形成，此雷 射光束由雷射震盪器所放出，並具有極大的空間及瞬間能 量密度，且脈波的放射時間小於1微微秒，以此雷射的波 長可穿透幾乎透明，並具低吸收率的材料（A )，並將雷 射照射至工件內部的材料（B )，其在雷射波長下具有高 於材料（A )的吸收率。 本紙張尺度適用中國國家標準（CNS ) A4規格（210 X 297公釐） ---------^------1T------, (請先閲讀背面之注意事項再填寫本頁) -9- 經濟部智慧財產局員工消費合作社印製 513348 A8 B8 C8 D8 Γ、申請專利範圍 4 6 ·如申請專利範,圍第4 4或第4 5項之噴墨記錄 頭，當處理墨流通道及其他部件時，先形成排放埠以將昇 華及蒸發所產生的副產物排至外側，接著再處理墨流通道 〇 4 7 ·如申請專利範圍第4 6項之噴墨記錄頭，，當處 理墨流通道及其他部件時·’-墨流通道及其他部件在近於排 放埠的位置進行處理。 、 4 8 ·如申請專利範圍第3 5 ，3 6 ，4 1 ，4 2 ，. 4 4或4 5項之噴墨記錄頭，進一步包括其內部混有染料 的構件，以吸收對應至雷射光束的震盪波長。， 本紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ297公釐） Μ1Τ0,.------------··------ (請先閎讀背面之注意事項再填寫本頁) -10-
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Publication number Priority date Publication date Assignee Title
JP2002355977A (ja) 2001-02-08 2002-12-10 Canon Inc 撥液部材、該撥液部材を用いたインクジェットヘッド、それらの製造方法及びインクの供給方法
US20030217995A1 (en) * 2002-05-23 2003-11-27 Yosuke Toyofuku Laser processing method using ultra-short pulse laser beam
BRPI0608050A2 (pt) * 2005-02-23 2009-11-03 Picodeon Ltd Oy método de deposição por laser pulsado
US7977602B2 (en) * 2007-03-21 2011-07-12 Photon Dynamics, Inc. Laser ablation using multiple wavelengths
JP5208092B2 (ja) * 2009-11-18 2013-06-12 キヤノン株式会社 液体供給部材の製造方法及び液体吐出ヘッドの製造方法
EP3010723B1 (en) * 2013-06-18 2021-09-22 Apple Inc. Laser engraved reflective surface structures and method therefor
KR20160005802A (ko) 2014-07-03 2016-01-18 마이크로 인스펙션 주식회사 레이저 가공장치
US20160184926A1 (en) * 2014-12-30 2016-06-30 Suss Microtec Photonic Systems Inc. Laser ablation system including variable energy beam to minimize etch-stop material damage
US10569365B2 (en) * 2015-11-23 2020-02-25 The Boeing Company Method for preparing a fluid flow surface
US20170176856A1 (en) * 2015-12-21 2017-06-22 Az Electronic Materials (Luxembourg) S.A.R.L. Negative-working photoresist compositions for laser ablation and use thereof
DE102017112086A1 (de) 2017-06-01 2018-12-06 Carl Zeiss Meditec Ag Künstliche Augenlinse mit diffraktiver Gitterstruktur sowie Verfahren zum Herstellen einer künstlichen Augenlinse
DE102017112085A1 (de) 2017-06-01 2018-12-06 Carl Zeiss Meditec Ag Künstliche Augenlinse mit darin ausgebildetem Medikamentendepot und Verfahren zum Herstellen einer künstlichen Augenlinse
DE102017112087A1 (de) 2017-06-01 2018-12-06 Carl Zeiss Meditec Ag Künstliche Augenlinse mit lasererzeugter doppelbrechender Struktur sowie Verfahren zum Herstellen einer künstlichen Augenlinse
US11201077B2 (en) * 2017-06-12 2021-12-14 Kulicke & Soffa Netherlands B.V. Parallel assembly of discrete components onto a substrate
EP3639297A4 (en) 2017-06-12 2021-01-20 Uniqarta, Inc. PARALLEL MOUNTING OF DISCREET COMPONENTS ON A SUBSTRATE
JP2019107789A (ja) * 2017-12-15 2019-07-04 株式会社小糸製作所 樹脂成形品および車両用部品
CN113399829B (zh) * 2021-07-09 2022-11-11 东莞市中麒光电技术有限公司 焊接装置及使用该焊接装置的焊接方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57102016A (en) * 1980-12-17 1982-06-24 Hitachi Ltd Pattern generator
GB8722085D0 (en) 1987-09-19 1987-10-28 Cambridge Consultants Ink jet nozzle manufacture
JPH02121842A (ja) 1988-10-31 1990-05-09 Canon Inc インクジェット記録ヘッドおよびインクジェット記録ヘッドの製造方法
US5208604A (en) 1988-10-31 1993-05-04 Canon Kabushiki Kaisha Ink jet head and manufacturing method thereof, and ink jet apparatus with ink jet head
JP2771557B2 (ja) 1988-10-31 1998-07-02 キヤノン株式会社 インクジェット記録ヘッドの製造方法
US5312396A (en) 1990-09-06 1994-05-17 Massachusetts Institute Of Technology Pulsed laser system for the surgical removal of tissue
ATE144197T1 (de) * 1991-02-20 1996-11-15 Canon Kk Tintenstrahlaufzeichnungskopf, tintenstrahlaufzeichnungsvorrichtung diesen verwendend und verfahren zu seiner herstellung
EP0536431B1 (de) 1991-10-07 1994-11-30 Siemens Aktiengesellschaft Laserbearbeitungsverfahren für einen Dünnschichtaufbau
EP0542656A1 (en) * 1991-10-31 1993-05-19 International Business Machines Corporation Pattern propagation by blanket illumination of patterned thermal conductors and patterned thermal insulator on a thermal conductor
DE69306600T2 (de) * 1992-01-17 1997-04-17 Fujitsu Ltd Verfahren zur Herstellung eines mehrschichtigen Leitersubstrats
US5656186A (en) * 1994-04-08 1997-08-12 The Regents Of The University Of Michigan Method for controlling configuration of laser induced breakdown and ablation
US5786560A (en) * 1995-03-31 1998-07-28 Panasonic Technologies, Inc. 3-dimensional micromachining with femtosecond laser pulses
US5720894A (en) 1996-01-11 1998-02-24 The Regents Of The University Of California Ultrashort pulse high repetition rate laser system for biological tissue processing
JP3501598B2 (ja) * 1996-10-16 2004-03-02 キヤノン株式会社 レーザー加工方法、インクジェット記録ヘッド及びインクジェット記録ヘッド製造装置
US6156030A (en) * 1997-06-04 2000-12-05 Y-Beam Technologies, Inc. Method and apparatus for high precision variable rate material removal and modification
DE19736110C2 (de) * 1997-08-21 2001-03-01 Hannover Laser Zentrum Verfahren und Vorrichtung zur grat- und schmelzfreien Mikrobearbeitung von Werkstücken

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AU4373500A (en) 2001-01-04
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CN1287899A (zh) 2001-03-21
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CA2313204A1 (en) 2000-12-30
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