TW504792B - Method to form metal fuse - Google Patents

Method to form metal fuse Download PDF

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Publication number
TW504792B
TW504792B TW090108258A TW90108258A TW504792B TW 504792 B TW504792 B TW 504792B TW 090108258 A TW090108258 A TW 090108258A TW 90108258 A TW90108258 A TW 90108258A TW 504792 B TW504792 B TW 504792B
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Taiwan
Prior art keywords
forming
metal fuse
layer
metal
angstroms
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TW090108258A
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English (en)
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Sung-Shiung Wang
Yi-Min Huang
Tung-Sheng Shiung
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United Microelectronics Corp
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Priority to TW090108258A priority Critical patent/TW504792B/zh
Priority to US09/835,014 priority patent/US6617234B2/en
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Publication of TW504792B publication Critical patent/TW504792B/zh

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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
    • H01L23/5256—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/0401—Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
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    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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Description

504792 6603twf.doc/006 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（ί ) 本發明是有關於一種半導體的製造方法，且特別是有 關於一種形成金屬熔絲(Metal Fuse)的方法。 在半導體致程中，假如製造出的半導體記憶體元件存 在有數個有缺陷的記憶胞，或既使僅有一個有缺陷的記憶 胞，那麼則會形成具有缺陷的產品。通常，高積集度的元 件比低積集度的元件容易產生缺陷記憶胞，因此，當半導 體記憶體兀件的積集度增加時，其相對應的產率便會隨之 降低。 爲了提升半導體製程之良率，習知方法係以一種稱爲 多餘(redundancy)電路的方法來提昇半導體記憶體元件的產 率。除了用來儲存二進位數據之主要的記憶胞陣列外，此 技術並提供一多餘的記憶胞陣列，用來取代行列中有缺陷 的記憶胞。其中多餘記憶胞分別與字元線與位元線連接， 假如經測試主要記憶胞陣列後，發現有數千個缺陷記憶 胞，則將之以多餘之記憶胞來取代，藉此，可以生產出一 無缺陷產品的記憶體晶片。 採用了此種使用多餘電路之記憶元件，除了正常記憶 胞陣列之外，更包括一個備份的記憶胞陣列（或多餘記憶 胞陣列），用以替代出現在正常記憶胞陣列之中的缺陷記 憶胞之多個備份記憶胞，使元件正常運作。通常，主要言己 憶胞陣列與多餘記憶胞陣列，大致上係以熔絲來相連接， 當需要對缺陷記憶胞進行修復時，則將熔絲切斷。隨著$ 件的積極度增加，爲了降低製造成本與製程的複雜性，_ 熔絲的的製程中，越來越傾向將金屬熔絲形成在半導體％ 請 先 閱 讀 背 f 裝 I I I I 訂 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 504792 6603twf.doc/006 ΚΙ
五、發明說明（1) 經濟部智慧財產局員工消費合作社印製 件之最上層，亦即，使金屬熔絲與銲墊(bonding pad)形成 在同一層上，用以降低成本及減少製程的複雜性。 習知形成金屬熔絲與銲墊於同一層的方法包括：形成 一金屬層，之後將金屬層圖案化，同時形成金屬熔絲與銲 墊。然而，由於銲墊的厚度越厚越好，而熔絲之厚度卻是 越薄越好，因此，使用同一層之金屬層形成金屬熔絲與銲 墊，便很難兼顧金屬熔絲與銲墊之厚度考量。舉例而言： 在製程中，爲了形成較薄的金屬熔絲，所形成的金屬層厚 度則不能太厚，銲墊的厚度因此受限，而不夠厚的銲塾胃 使得後續打線(wire bonding)製程發生問題，因此如何兼雇頁 金屬熔絲與銲墊之厚度考量，便是一個重要之硏究目標。 因此，本發明的目的是提供一種形成金屬熔絲的方法， 以同時兼顧金屬熔絲與銲墊之考量。 本發明爲一種形成金屬熔絲的方法，其步驟包括：形 成一導電層於一基底上，並形成一介電層於基底中，其中 介電層中形成有一開口，此開口暴露出導電層。接著，形 成一金屬層於介電層上，並圖案化此金屬層，用以同時形 成一金屬熔絲與一銲墊，其中，銲墊透過開口與導電層電 性相連，且金屬熔絲與銲墊皆具有凹陷側壁，並在金屬熔 絲與銲墊之凹陷側壁上形成間隙壁，然後，形成一護層於 基底上暴露出金屬熔絲與銲墊。 利用本發明形成金屬熔絲與銲墊於同一層上，可降低 成本及減少製程的複雜性。另外，本發明可形成較厚之銲 墊，增進之後的在打線製程中之接線能力，並利用形成具 4 f請先閱讀背面之注意事項^填寫本頁> Μ # L_ 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 504792 6603twf.doc/006 A7 B7 五、發明說明（$ ) 有凹陷側壁的熔絲，使金屬熔絲之寬度變窄，而更容易燒 斷。此外，由於凹陷側壁上較厚的間係壁，因此，在金屬 熔絲燒斷時更能防止金屬熔絲之金屬橫向濺射，進而防止 金屬熔絲間的斷路。 爲讓本發明之上述和其他目的、特徵、和優點能更明 顯易懂，下文特舉一較佳實施例，並配合所附圖式，作詳 細說明如下： 圖式之簡單說明： 第1圖至第4圖係繪示本發明較佳實施例之一種形成 金屬熔絲的製造流程剖面圖。 圖示標記說明： 100 :基底 102 :導電層 104、106 :介電層 108 :開口 110、110a :阻障層 112 :金屬層 112a :銲墊 112b ·金屬溶絲 114 :凹陷側壁 116 :間係壁 118 :護層 實施例 第1圖至第4圖係繪示本發明較佳實施例之一種形成 5 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項巧填寫本頁)
---I----訂--------I 經濟部智慧財產局員工消費合作社印製 504792 6 6 0 3 twf . doc/ 0 0 6 A7 __ B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（+) 金屬熔絲的製造流程剖面圖。 請參照第1圖，首先，提供一基底100，在此基底100 中已形成有半導體元件，接著，在基底1〇〇中，形成導電 層102，導電層102之材質例如爲銅。之後，形成介電層 103於基底100上，其中，爲了防止導電層102之金屬擴 散，形成介電層之較佳方式包括：依序形成氮化矽層104 與氧化矽層106於基底100上。其中，氮化矽層104之厚 度約介於300埃至100埃之間，而氧化矽層106之厚度約 介於8000埃至10000埃之間。接著，將介電層103定義形 成一開口 108暴露出導電層102。 請參照第2圖，在基底100上形成一阻障層11〇，其 中，阻障層110之材質例如爲厚度約介於100埃至300埃 之氮化鉅(TaN)與厚度約介於1〇〇埃至300埃一钽金屬層 (Ta)，或者是厚度約介於100埃至300埃之氮化鈦層(TiN)。 之後，形成金屬層112於阻障層11〇上，此金屬層in之 材質較佳爲鋁。 請參照第3圖，利用等向性蝕刻步驟定義金屬層n2， 同時形成銲墊112a與金屬熔絲112b，並同時在銲墊112a 與金屬熔絲112b之側壁形成凹陷側壁(unciercut) 114。其 中，形成凹陷側壁114的方法可包括：調整等向性蝕刻步 驟中’餓刻氣體的流速比率(fl〇w rate rati〇)，或者是調整 蝕刻氣體的成分，控制鈾刻步驟中形成在銲墊U2a與金 屬熔絲112b側壁所形成的高分子，藉以形成凹陷側壁114。 請參照第4圖，形成一層絕緣層(未顯示)於基底1〇〇 6 (請先閱讀背面之注意事項_填寫本頁) 裝 寫士 訂--------- #· 本紙張尺度適用中國國家標準（CNS)A4規袼（210 X 297公愛） 504792 6603twf.doc/006 A7 ......_____ B7 五、發明說明（ο 上’利用非等項性蝕刻蝕刻絕緣層，於銲墊112a與金屬 熔絲112b的凹陷側壁114上各別形成側壁116，由於本發 明利用等向性蝕刻步驟使得銲墊112a與金屬熔絲112b具 有凹陷側壁114，因此可使金屬熔絲n2b之寬度變窄，而 更容易燒斷。另外，本發明更可形成較厚之金屬層112， 增加銲墊112a之厚度，增進之後的在打線製程中之接線 能力（bondability)。此外，由於凹陷側壁Π4使得間係壁116 厚度比形成在垂直側壁上的間隙壁較爲厚，因此，在金屬 熔絲112b燒斷時更能防止金屬熔絲U2b之金屬橫向濺射， 進而防止金屬熔絲112b間的斷路。 之後，形成護層118於基底100上，暴露出銲墊112a 與金屬熔絲112b，此護層118的形成方法可以是先形成一 厚度約介於4000埃至7000埃之間的氧化層，之後再形成 一厚度約介於4000埃至7000埃之間的氮化層於氧化層上， 然後，將此氧化層與氮化層圖案化，暴露出銲墊112a與 金屬熔絲112b。 利用本發明形成金屬熔絲與銲墊於同一層上，可降低 成本及減少製程的複雜性。另外，本發明可形成較厚之銲 墊，增進之後的在打線製程中之接線能力，並利用形成具 有凹陷側壁的熔絲，使金屬熔絲之寬度變窄，而更容易燒 斷。此外，由於凹陷側壁上較厚的間係壁，因此，在金屬 熔絲燒斷時更能防止金屬熔絲之金屬橫向濺射，進而防止 金屬熔絲間的斷路。 雖然本發明已以一較佳實施例之蝕刻熔絲接觸窗爲例 7 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注音？事項^填寫本頁) rl裝 #- 經濟部智慧財產局員工消費合作社印製 504792 6603twf.doc/006 A7 _B7 _ 五、發明說明（έ ) 揭露如上，然其並非用以限定本發明，任何熟習此技藝者， 在不脫離本發明之精神和範圍內，當可作多種之更動與潤 飾，因此本發明之保護範圍當視後附之申請專利範圍所界 定者爲準。 (請先閱讀背面之注咅？事項巧填寫本頁) rl^^ —------訂--------- # 經濟部智慧財產局員工消費合作社印製 8 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐）

Claims (1)

  1. 504792 A8 R8 6603twf.doc/006 Qg DB 六、申請專利範圍 1. 一種形成金屬熔絲的方法，包括： 形成一導電層於一基底中； 形成一介電層於該基底上，其中該介電層中形成有一 開口，該開口暴露出該導電層； 形成一金屬層於該介電層上； 圖案化該金屬層用以同時形成一金屬熔絲與一銲墊， 其中，該銲墊透過該開口與該導電層電性相連，且形成複 數個凹陷側壁於該金屬熔絲與該銲墊上； 在該金屬熔絲與該婷墊之該些複數個凹陰側壁上形成 複數個間隙壁；以及 形成一護層於該基底上，並暴露出該金屬熔絲與該銲 墊0 2. 如申請專利範圍第1項所述之形成金屬熔絲的方 法，其中該導電層包括一銅金屬層。 3. 如申請專利範圍第1項所述之形成金屬熔絲的方 法，其中該介電層包括一氮化矽層與一氧化矽層。 4. 如申請專利範圍第3項所述之形成金屬熔絲的方 法，其中該氮化矽層之厚度於300埃至1000埃之間。 5. 如申請專利範圍第3項所述之形成金屬熔絲的方 法，其中該氧化矽層之厚度於8000埃至10000埃之間。 6. 如申請專利範圍第1項所述之形成金屬熔絲的方 法，其中該金屬層包括一鋁金屬層。 7. 如申請專利範圍第1項所述之形成金屬熔絲的方 法，其中圖案化該金屬層之步驟包括進行一等向性蝕刻。 9 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事β 1 · I I 4W寫本頁) -J . 經濟部智慧財產局員工消費合作社印製 504792 A8 B8 6603twf.doc/006 Qg D8 六、申請專利範圍 8·如申請專利範圍第1項所述之形成金屬熔絲的方 法，其中I亥護層包括一氧化政層與一氮化砂層。 9·如申請專利範圍第8項所述之形成金屬熔絲的方 法，其中該氧化矽層之厚度於4000埃至7000埃之間。 10.如申請專利範圍第8項所述之形成金屬熔絲的方 法，其中該氮化矽層之厚度於4000埃至7000埃之間。 11· 一種形成金屬熔絲的方法，包括： 形成一介電層於一基底上，其中該介電層中形成有一 開口； 同時形成一金屬熔絲與一銲墊，並形成複數個凹陷側 壁於該金屬熔絲與該銲墊上； 在該金屬熔絲與該銲墊皆之該些複數個凹陷側壁上形 成複數個間隙壁；以及 形成一護層於該基底上，並暴露出該金屬熔絲與該舞 墊。 12·如申請專利範圍第11項所述之形成金屬熔絲的方 法，其中該介電層包括一氮化矽層與一氧化矽層。 13·如申請專利範圍第12項所述之形成金屬熔絲的方 法’其中該氮化矽層之厚度於300埃至1000埃之間。 14.如申請專利範圍第12項所述之形成金屬熔絲的方 法’其中該氧化矽層之厚度於8000埃至10000埃之間。 15·如申請專利範圍第π項所述之形成金屬熔絲的方 法’其中該金屬熔絲之材質包括鋁金屬。 16.如申請專利範圍第11項所述之形成金屬熔絲的方 10 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事寫本頁) · n 1-·— I n 1 n 1 e n 1 ϋ 1 n ϋ - 經濟部智慧財產局員H消費合作社印製 504792 六、申請專利範圍 法，其中該銲墊之材質包括鋁金屬。 17. 如申請專利範圍第11項所述之形成金屬熔絲的方 法，其中同時形成該金屬熔絲與該銲墊之步驟包括進行一 等向性蝕刻。 18. 如申請專利範圍第11項所述之形成金屬熔絲的方 法，其中該護層包括一氧化矽層與一氮化矽層。 19. 如申請專利範圍第18項所述之形成金屬熔絲的方 法，其中該氧化矽層之厚度於4000埃至7000埃之間。 20. 如申請專利範圍第18項所述之形成金屬熔絲的方 法，其中該氮化矽層之厚度於4000埃至7000埃之間。 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐）
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Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100429881B1 (ko) * 2001-11-02 2004-05-03 삼성전자주식회사 셀 영역 위에 퓨즈 회로부가 있는 반도체 소자 및 그제조방법
TW200531253A (en) * 2003-09-19 2005-09-16 Koninkl Philips Electronics Nv Fuse structure for maintaining passivation integrity
KR100534102B1 (ko) * 2004-04-21 2005-12-06 삼성전자주식회사 반도체 기억소자의 퓨즈 영역들 및 그 제조방법들
TWI333808B (en) * 2005-05-05 2010-11-21 Himax Tech Inc A method of manufacturing a film printed circuit board
KR100752662B1 (ko) * 2006-06-12 2007-08-29 삼성전자주식회사 퓨즈를 포함하는 반도체소자 및 그 퓨즈의 절단 확인방법
KR100819001B1 (ko) * 2006-10-23 2008-04-02 삼성전자주식회사 반도체 소자 및 그 제조 방법
KR100893939B1 (ko) * 2007-02-16 2009-04-21 삼성전자주식회사 본딩 패드 구조체를 갖는 전자 장치 및 그 제조방법
US7964934B1 (en) 2007-05-22 2011-06-21 National Semiconductor Corporation Fuse target and method of forming the fuse target in a copper process flow
US8030733B1 (en) * 2007-05-22 2011-10-04 National Semiconductor Corporation Copper-compatible fuse target
US20090045484A1 (en) * 2007-08-16 2009-02-19 International Business Machines Corporation Methods and systems involving electrically reprogrammable fuses
KR100979242B1 (ko) * 2008-04-28 2010-08-31 주식회사 하이닉스반도체 반도체 소자 및 그의 제조방법
US8633707B2 (en) 2011-03-29 2014-01-21 International Business Machines Corporation Stacked via structure for metal fuse applications

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR970003903B1 (en) * 1987-04-24 1997-03-22 Hitachi Mfg Kk Semiconductor device and fabricating method thereof
JPH06326059A (ja) * 1993-05-17 1994-11-25 Fujitsu Ltd 銅薄膜のエッチング方法
JPH07201864A (ja) * 1993-12-28 1995-08-04 Fujitsu Ltd 突起電極形成方法
JPH09159988A (ja) * 1995-12-12 1997-06-20 Nikon Corp 投射型表示装置
US5858869A (en) * 1997-06-03 1999-01-12 Industrial Technology Research Institute Method for fabricating intermetal dielectric insulation using anisotropic plasma oxides and low dielectric constant polymers
US6358831B1 (en) * 1999-03-03 2002-03-19 Taiwan Semiconductor Manufacturing Company Method for forming a top interconnection level and bonding pads on an integrated circuit chip

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