TW502476B - Socket for test processing - Google Patents

Socket for test processing Download PDF

Info

Publication number
TW502476B
TW502476B TW088115140A TW88115140A TW502476B TW 502476 B TW502476 B TW 502476B TW 088115140 A TW088115140 A TW 088115140A TW 88115140 A TW88115140 A TW 88115140A TW 502476 B TW502476 B TW 502476B
Authority
TW
Taiwan
Prior art keywords
socket
contact
contact pin
socket body
aforementioned
Prior art date
Application number
TW088115140A
Other languages
English (en)
Chinese (zh)
Inventor
Kazuhisa Ozawa
Original Assignee
Enplas Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enplas Corp filed Critical Enplas Corp
Application granted granted Critical
Publication of TW502476B publication Critical patent/TW502476B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1015—Plug-in assemblages of components, e.g. IC sockets having exterior leads
    • H05K7/1023—Plug-in assemblages of components, e.g. IC sockets having exterior leads co-operating by abutting, e.g. flat pack
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
    • H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
    • H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
    • H01R12/7011—Locking or fixing a connector to a PCB

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Connecting Device With Holders (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW088115140A 1998-09-02 1999-09-02 Socket for test processing TW502476B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26405698A JP3670491B2 (ja) 1998-09-02 1998-09-02 ハンドラー用ソケット

Publications (1)

Publication Number Publication Date
TW502476B true TW502476B (en) 2002-09-11

Family

ID=17397936

Family Applications (1)

Application Number Title Priority Date Filing Date
TW088115140A TW502476B (en) 1998-09-02 1999-09-02 Socket for test processing

Country Status (5)

Country Link
JP (1) JP3670491B2 (ko)
KR (1) KR100400686B1 (ko)
MY (1) MY131349A (ko)
TW (1) TW502476B (ko)
WO (1) WO2000014833A1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4279039B2 (ja) * 2003-04-22 2009-06-17 株式会社エンプラス 電気部品用ソケット
JP4745006B2 (ja) * 2005-09-28 2011-08-10 セイコーエプソン株式会社 接続装置
JP5081989B2 (ja) * 2011-01-17 2012-11-28 セイコーエプソン株式会社 接続装置及び被検査装置の検査方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS593485U (ja) * 1982-06-30 1984-01-10 本多通信工業株式会社 集積回路用ソケツト
JPS59192980A (ja) * 1983-04-15 1984-11-01 Mitsutoyo Mfg Co Ltd 電子部品検査用導通部材
JPS6372880U (ko) * 1986-10-29 1988-05-16
JPH01130292U (ko) * 1988-02-29 1989-09-05
KR970003838Y1 (ko) * 1994-01-29 1997-04-24 금성일렉트론 주식회사 반도체 소자용 소켓
KR970002249Y1 (ko) * 1994-02-05 1997-03-20 금성일렉트론 주식회사 아이씨 소켓
JPH08233899A (ja) * 1995-02-28 1996-09-13 Ando Electric Co Ltd Ｉｃのコンタクト機構
JP2940858B2 (ja) * 1995-10-18 1999-08-25 株式会社アドバンテスト Ｉｃ試験装置
KR0134814Y1 (ko) * 1996-09-30 1999-01-15 문정환 반도체 패키지 테스트용 소켓
KR200141129Y1 (ko) * 1996-09-30 1999-05-15 문정환 반도체 패키지 테스트용 소켓

Also Published As

Publication number Publication date
JP2000082554A (ja) 2000-03-21
JP3670491B2 (ja) 2005-07-13
KR100400686B1 (ko) 2003-10-08
WO2000014833A1 (fr) 2000-03-16
MY131349A (en) 2007-08-30
KR20010006521A (ko) 2001-01-26

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Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees