TW502476B - Socket for test processing - Google Patents
Socket for test processing Download PDFInfo
- Publication number
- TW502476B TW502476B TW088115140A TW88115140A TW502476B TW 502476 B TW502476 B TW 502476B TW 088115140 A TW088115140 A TW 088115140A TW 88115140 A TW88115140 A TW 88115140A TW 502476 B TW502476 B TW 502476B
- Authority
- TW
- Taiwan
- Prior art keywords
- socket
- contact
- contact pin
- socket body
- aforementioned
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1015—Plug-in assemblages of components, e.g. IC sockets having exterior leads
- H05K7/1023—Plug-in assemblages of components, e.g. IC sockets having exterior leads co-operating by abutting, e.g. flat pack
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
- H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
- H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
- H01R12/7011—Locking or fixing a connector to a PCB
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Connecting Device With Holders (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26405698A JP3670491B2 (ja) | 1998-09-02 | 1998-09-02 | ハンドラー用ソケット |
Publications (1)
Publication Number | Publication Date |
---|---|
TW502476B true TW502476B (en) | 2002-09-11 |
Family
ID=17397936
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW088115140A TW502476B (en) | 1998-09-02 | 1999-09-02 | Socket for test processing |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP3670491B2 (ko) |
KR (1) | KR100400686B1 (ko) |
MY (1) | MY131349A (ko) |
TW (1) | TW502476B (ko) |
WO (1) | WO2000014833A1 (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4279039B2 (ja) * | 2003-04-22 | 2009-06-17 | 株式会社エンプラス | 電気部品用ソケット |
JP4745006B2 (ja) * | 2005-09-28 | 2011-08-10 | セイコーエプソン株式会社 | 接続装置 |
JP5081989B2 (ja) * | 2011-01-17 | 2012-11-28 | セイコーエプソン株式会社 | 接続装置及び被検査装置の検査方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS593485U (ja) * | 1982-06-30 | 1984-01-10 | 本多通信工業株式会社 | 集積回路用ソケツト |
JPS59192980A (ja) * | 1983-04-15 | 1984-11-01 | Mitsutoyo Mfg Co Ltd | 電子部品検査用導通部材 |
JPS6372880U (ko) * | 1986-10-29 | 1988-05-16 | ||
JPH01130292U (ko) * | 1988-02-29 | 1989-09-05 | ||
KR970003838Y1 (ko) * | 1994-01-29 | 1997-04-24 | 금성일렉트론 주식회사 | 반도체 소자용 소켓 |
KR970002249Y1 (ko) * | 1994-02-05 | 1997-03-20 | 금성일렉트론 주식회사 | 아이씨 소켓 |
JPH08233899A (ja) * | 1995-02-28 | 1996-09-13 | Ando Electric Co Ltd | Icのコンタクト機構 |
JP2940858B2 (ja) * | 1995-10-18 | 1999-08-25 | 株式会社アドバンテスト | Ic試験装置 |
KR0134814Y1 (ko) * | 1996-09-30 | 1999-01-15 | 문정환 | 반도체 패키지 테스트용 소켓 |
KR200141129Y1 (ko) * | 1996-09-30 | 1999-05-15 | 문정환 | 반도체 패키지 테스트용 소켓 |
-
1998
- 1998-09-02 JP JP26405698A patent/JP3670491B2/ja not_active Expired - Fee Related
-
1999
- 1999-09-01 KR KR10-1999-7009611A patent/KR100400686B1/ko not_active IP Right Cessation
- 1999-09-01 WO PCT/JP1999/004745 patent/WO2000014833A1/ja not_active Application Discontinuation
- 1999-09-02 MY MYPI99003804A patent/MY131349A/en unknown
- 1999-09-02 TW TW088115140A patent/TW502476B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP2000082554A (ja) | 2000-03-21 |
JP3670491B2 (ja) | 2005-07-13 |
KR100400686B1 (ko) | 2003-10-08 |
WO2000014833A1 (fr) | 2000-03-16 |
MY131349A (en) | 2007-08-30 |
KR20010006521A (ko) | 2001-01-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4A | Issue of patent certificate for granted invention patent | ||
MM4A | Annulment or lapse of patent due to non-payment of fees |