TW495842B - Substrate treating device and substrate treating method - Google Patents

Substrate treating device and substrate treating method Download PDF

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Publication number
TW495842B
TW495842B TW090110980A TW90110980A TW495842B TW 495842 B TW495842 B TW 495842B TW 090110980 A TW090110980 A TW 090110980A TW 90110980 A TW90110980 A TW 90110980A TW 495842 B TW495842 B TW 495842B
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Taiwan
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lamp
substrate
ultraviolet
monitoring
ultraviolet irradiation
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TW090110980A
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Chinese (zh)
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Yoshiharu Ota
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Tokyo Electron Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70358Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

An ultraviolet application unit (UV) is provided with the same number of photosensors (72(1)-72(n)) for individually monitoring the emission state of a plurality of (n) ultraviolet lamps (64(1)-64(n)) in a lamp chamber (66). A stage (76) that can be moved horizontally or vertically to place and support a substrate G is provided in a washing treatment chamber (68) that is adjacent and below the lamp chamber (66). When, for example, the lamp (64(1)) out of the plurality of ultraviolet lamps (64(1)-64(n)) causes emission failure, the use of the lighting of the failed lamp (64(1)) is stopped. Then, a scanning speed (stage traveling speed in a Y direction) in the ultraviolet application treatment is corrected to a slower speed by a specific ratio as compared with a reference speed when all lamps are normal so that the amount of irradiation with ultraviolet rays by the remaining ultraviolet lamps (64(2)-64(n)) in normal state does not become lower than a specific lower-limit value for assuring treatment quality to the substrate G on the stage (76).

Description

495842 A7 ____B7_ 五、發明説明(彳) 〔發明之目的〕 〔發明所屬的技術領域及其領域的習知技術〕 (請先閲讀背面之注意事項再填寫本頁) 本發明是有關將紫外線照射於被處理基板而來進行預 定的處理之基板處理裝置及基板處理方法。 在半導體裝置或液晶顯示裝置(L CD )的製造中, 是以被處理基板(例如半導體晶圓,L C D基板等)的表 面處於淸靜化狀態爲前提,進行各種的微細加工。因此, 在各加工處理前或各加工處理間會進行被處理基板表面的 洗淨,例如在光學微影成像的過程中,會在光阻劑塗怖前 先洗淨被處理基板的表面。 以往就供以去除被處理基板表面的有機物之洗淨法而 言,例如有根據紫外線照射的乾式洗淨技術。此紫外線照 射洗淨技術是利用預定波長(使用低壓水銀燈來作爲紫外 線光源時爲185nm, 254nm,使用介電質勢壘放 電燈來作爲紫外線光源時爲1 7 2 n m )的紫外線來使激 勵氧氣,而根據所產生的臭氧及發生期間的氧氣來使基板 表面上的有機物氧化•汽化,然後予以除去。 經濟部智慧財產局員工消費合作社印製 以往典型的紫外線照射洗淨裝置是在具有石英玻璃窗 的燈室內並列收容複數個形成上述紫外線光源的燈,並經 由該石英玻璃窗來將被處理基板配置於燈室所鄰接的洗淨 處理室內,且經由該石英玻璃窗來以一定時間將燈室內的 燈所產生的紫外線照射於被處理基板的表面。最近亦有藉 由掃描機構(和被處理基板的表面平行相對移動)來謀求 裝置的小型化者(燈數的削減及石英玻璃窗的小型化等) 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 一 -4- 495842 A7 ___B7_ 五、發明説明(2) 〇 (請先閱讀背面之注意事項再填寫本頁) 在上述這般的紫外線照射洗淨裝置中,爲了取得所期 望的洗淨效果,而必須分別確保預定値以上藉由紫外線燈 而照射於被處理基板上的紫外線的照度及光量,以能夠符 合這樣的紫外線照射條件來取決裝置各部份的式樣。但, 若紫外線燈因經時劣化或其他原因而異常變暗或不發光時 ,則對被處理基板的紫外線的照度及光量會不足,而恐有 造成洗淨不佳之虞。 就以往典型的紫外線照射洗淨裝置而言,即使燈室內 只有一盞紫外線燈產生上述不良的情況,還是會馬上停止 洗淨處理的運轉,然後發出必須更換燈的警報。但,這樣 的安全處置不僅不會測出洗淨不良品,而且在上述狀況發 生時會停止生產線,因此會造成裝置產能的低下。 〔發明所欲解決之課題〕 經濟部智慧財產局員工消費合作社印製 本發明有鑒於習知技術的問題點,而以提供一種即使 紫外線燈發生發光不良等的異常,還是可以繼續進行正常 的紫外線照射處理之基板處理裝置及基板處理方法爲其目 的。 本發明之另一目的在於提供一種不會因爲紫外線燈異 常而導致對被處理基板的紫外線照射量在不期望的時期產 生不足,進而得以進行計畫管理之基板處理裝置及基板處 理方法。 爲了達成上述目的,本發明之基板處理裝置是屬於一 本紙張尺度適用中國國家標準(CNS ) A4規格(210〆297公釐) -5- 495842 A7 ____ _B7 五、發明説明(3) 種供以將紫外線照射於被處理基板而來進行預定的處理之 基板處理裝置,其特徵是具有: (請先閲讀背面之注意事項再填寫本頁) 一支撐機構;該支撐機構是供以支撐上述被處理基板 •,及 一紫外線照射機構;該紫外線照射機構是具備複數個 接受電力的供給而來發射紫外線的燈,且將由上述燈所發 射出的紫外線照射於上述被處理基板;及 一燈監視機構;該燈監視機構是供以個別監視上述複 數個燈的各發光狀態;及 一控制機構;該控制機構是供以根據來自上述燈監視 機構的監視資訊來控制上述紫外線照射處理的預定參數。 就如此構成的基板處理裝置而言,是在經常性或預定 的情況下,例如在各次紫外線照射處理前,先藉由燈監視 機構的燈監視機能來判定所使用之複數個燈的發光狀態是 否全部正常,或一部份發光不正常。依此判定結果,規定 或左右紫外線照射處理的預定參數將可利用控制機構來予 以控制或調節,藉此即使紫外線照射機構的燈發光狀態經 經濟部智慧財產局員工消費合作社印製 常性地變化,還是能夠對被處理基板取得安定的處理結果 〇 在上述基板處理裝置中,可具有一驅動機構,該驅動 機構是供以使上述支撐機構及上述燈的其中一方或雙方移 動於預定方向,而使來自上述紫外線照射機構的紫外線能 夠掃描被支撐於上述支撐機構上的上述被處理基板的被處 理面。又,在此構成中,上述控制機構可具有掃描速度控 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) ~ -6 - 495842 A7 ____B7_ 五、發明説明(4) (請先閱讀背面之注意事項再填寫本頁) 制機能’該掃描速度控制機能是根據來自上述燈監視機構 的監視資訊來可變控制上述掃描的速度(參數)。此情況 ’上述控制機構是在其中之一上述燈的發光狀態異常的監 視資訊由上述燈監視機構所測出時,會以能夠中止該異常 燈之方式來控制上述紫外線照射機構,同時根據該上述掃 描速度控制機能來設定成:使上述掃描速度形成只比預定 的基準値慢預定比例的値。 如此一來,可藉停止實質上不能管理的異常燈使用, 然後在比基準値還要慢的掃描速度下使正常燈之管理可能 的紫外線進行掃描,而使得以對被處理基板確保必要且充 分的紫外線照射量,進而能夠取得正常的處理結果。 經濟部智慧財產局員工消費合作社印製 或者’上述控制機構亦可具有紫外線照射時間控制機 能’該紫外線照射時間控制機能是根據來自上述燈監視機 構的監視資訊來可變控制上述紫外線的照射時間。此情況 ’上述控制機構是在其中之一上述燈的發光狀態異常的監 視資訊由上述燈監視機構所測出時,會以能夠中止該異常 燈之方式來控制上述紫外線照射機構,同時根據該上述紫 外線照射時間控制機能來設定成:使該上述紫外線照射時 間形成只比預定的基準値長預定比例的値。利用此方式, 亦可取得與上述同樣正常的處理結果。 或者,上述控制機構亦可具有燈亮度控制機能,該亮 度控制機能是根據來自上述燈監視手段的監視資訊來個別 控制上述燈的亮度。此情況,上述控制機構是在其中之一 上述燈的發光狀態異常的監視資訊由上述燈監視機構所測 本紙張尺度適用中國國家標準(CNS ) A4規格(21〇X297公釐) ~ " 495842 A7 五、發明説明(5) &時,會以能夠中止該異常燈之方式來控制上述紫外線照 射機構,同時根據該上述燈亮度控制機能來設定成··使正 常狀態之上述燈的亮度形成只比預定的基準値高預定比例 的値。利用此方式,亦可取得與上述同樣正常的處理結果 此 外線照 持於非 異常的 會取代 控制上 中所被 變更。 另 線照射 ,其特 •,及 外,在上述 射機構的上 點燈使用狀 監視資訊由 該異常燈, 述紫外線照 使用的紫外 外,本發明 於被處理基 徵是具有: 本發明之基板處 述複數個燈中的 態,其他其中之一上述燈的發光狀態爲 上述監視機構所 而以能夠點燈使 理裝置中,可以上述紫 部份作爲預備燈來保 測出時,上述控制機構 用上述預備燈之方式來 射機構。如此一來,在紫外線照射機構 線燈組合可作爲上述參數來適宜地予以 之基板處理裝置是屬於一種供以將紫外 板而來進行預定的處理之基板處理裝置 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 支撐機構;該支撐機構是供以支撐上述被處理基板 一紫外線照射機構;該紫外線照射機構是具備接受電 力的供給而來發射紫外線的燈,且將由上述燈所發射出的 紫外線照射於上述被處理基板;及 一燈監視機構;該燈監視機構 的發光狀態;及 是供以個別監視上述燈 控制機構;該控制機構是供以根據來自上述燈監視 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -8 495842 A7 __ B7 五、發明説明(6) 機構的監視資訊來控制上述紫外線照射處理的預定參數。 (請先閱讀背面之注意事項再填寫本頁) 就如此的基板處理裝置而言,是在經常性或預定的情 況下,例如在各次紫外線照射處理前,先藉由燈監視機構 的燈監視機能來判定所使用之複數個燈的發光狀態是否全 部正常,或一部份發光不正常。依此判定結果,規定或左 右紫外線照射處理的預定參數將可利用控制機構來予以控 制或調節,藉此即使紫外線照射機構的燈發光狀態經常性 地變化,還是能夠對被處理基板取得安定的處理結果。具 體而言,例如藉由上述燈監視機構來監視上述燈的亮度, 當其亮度低下時,予以控制成延長燈的照射時間。 再者,本發明之基板處理方法是屬於一種供以由複數 個燈來將紫外線照射於被處理基板而來進行預定的處理之 基板處理方法,其特徵是具有: 個別監視上述複數個燈的發光狀態之過程;及 根據上述監視過程的監視資訊來控制紫外線照射處理 的預定參數之過程。 經濟部智慧財產局員工消費合作社印製 又,本發明之基板處理方法屬於一種供以由複數個燈 來將紫外線照射於被處理基板而來進行預定的處理之基板 處理方法,其特徵是具有: 個別監視上述複數個燈的發光狀態之過程;及 在上述監視的過程中,任何上述燈的發光狀態被確認 出爲異常時,控制紫外線照射處理的預定參數,使能夠停 止該異常燈的使用,而藉由殘餘的燈來進行正常照射之過 程。 本紙張尺度適用中國國家標準(CNS ) A4規格(210X29*7公羡1 ~~ -9- 495842 A7 _B7_ 五、發明説明(7) 〔發明之構成及作用〕 以下參照圖面來詳述本發明的實施形態。 第1圖是表示本發明之一實施形態搭載有基板處理裝 置的光阻劑塗怖顯像處理系統的模式平面圖。此塗怖顯示 裝置系統是被設置於無塵室內,例如以L C D基板作爲被 處理基板,在L CD製程中進行光學微影成像過程中的洗 淨,光阻劑塗怖,預烘烤,顯像及後烘烤的各處理。曝光 處理是在鄰接設置於此系統的外部之曝光裝置(圖未示) 中進行。 此曝光顯像處理系統大致是由卡匣站(C/S ) 1 〇 ,及程序站(P / S ) 1 2,介面部(I / F ) 1 4所構 成。 設置於系統的一端部之卡匣站(C / S ) 1 〇是具備 :可載置預定數(例如4個爲止)的卡匣C (供以收容複 數個的基板G )之卡匣承載台1 6,及針對該卡匣承載台 1 6上的卡匣C進行基板G的搬出入之搬送機構2 0。該 搬送機構2 0具有可保持基板G的機構,例如搬送臂,可 動作於X,Y,Z,0等4軸,而使能夠進行後述之程序 站(P/S) 12側的主搬送裝置38與基板G的傳遞。 程序站(P / S ) 1 2是經由(挾持)基板中繼部 2 3,藥液供給單元2 5及空間2 7來從卡匣站(C / S )1 0側開始依次橫一列設置洗淨程序部2 2,塗怖程序 部2 4,及顯像程序部2 6。 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) - ------f 丨 (請先閱讀背面之注意事項再填寫本頁) 訂 經濟部智慧財產局員工消費合作社印製 -10- 495842 A7 ----- B7__ 五、發明説明(8) (請先閱讀背面之注意事項再填寫本頁) 洗淨程序部2 2是含:兩個洗滌器洗淨單元(SRC )2 8,及上下兩段的紫外線照射/冷卻單元(UV/ C〇L) 30,及加熱單元(HP) 32,及冷卻單元( C 〇 L ) 3 4 。 塗怖程序部2 4是含:光阻劑塗怖單元(c T ) 4 0 ’及減壓乾燥單元(V D ) 4 2,及邊端去塗膜劑單元( ER) 44,及上下兩段型附著/冷卻單元(AD/ COL) 46 ’及上下兩段型加熱/冷卻單元(HP/ C〇L) 48,加熱單元(HP) 50。 顯像程序部2 6是含:三個顯像單元(DEV) 5 2 ’及兩個上下兩段型加熱/冷卻單元(HP/C〇L ) 55,及加熱單元(HP) 53。 在各程序部22,24,26的中央部長度方向上設 有搬送路徑36,52,58,主搬送裝置38,54, 經濟部智慧財產局員工消費合作社印製 6 0會沿著各搬送路徑而移動,對各程序部內的各單元進 行存取,而使能夠進行基板G的搬入/搬出或搬送。並且 ,就此系統而言,在各程序部22,24,26中,在搬 送路徑3 6,5 2,5 8的一方側配置有旋轉系的單元( SCR,CT,DEV等),另一方側配置有熱處理或照 射處理系的單元(:《?,〇〇1^,11¥等)。 設置於系統的他端側之介面部(I / F ) 1 4會在與 程序站(P / S ) 1 2鄰接的一側設置基板傳遞部5 7及 緩衝台5 6,以及與曝光裝置鄰接的一側設置搬送機構 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -11 - 495842 A7 _____B7 五、發明説明(9) (請先閱讀背面之注意事項再填寫本頁) 第2圖是表示此塗怖顯像處理系統的處理程序。首先 ’在卡匣站(C/S) 10中,搬送機構20會從承載台 1 6上預定的卡匣C中取出1個基板G,然後傳遞給程序 站(P/S) 12的洗淨程序部22的主搬送裝置38 ( 步驟S 1 )。 在洗淨程序部2 2中’基板G會首先被依次搬入紫外 線照射/冷卻單元(U V / C〇L ) 3 0,然後在上段的 紫外線照射單元(U V )施以紫外線照射的乾式洗淨,其 次在下段的冷卻單元(COL)冷卻至預定溫度爲止(步 驟S 2 )。在此紫外線照射洗淨下,基板表面的有機物會 被去除。藉此,基板G的可潤溼性會提升,可提高下個過 程之刮削洗淨的洗淨效果。 經濟部智慧財產局員工消費合作社印製 其次,基板G會接受洗滌器洗淨單元(SRC) 2 8 的其一刮削洗淨處理,由基板表面來去除粒子狀的汙垢( 步驟S 3 )。在刮削洗淨後,基板G會在加熱單元(Η P )3 2接受加熱的脫水處理(步驟S 4 )。其次,在冷卻 單元(COL) 34冷卻至一定的基板溫度爲止(步驟 S5)。藉此來完成洗淨程序部22的前處理,然後基板 G會經由主搬送裝置3 8的基板傳遞部2 3來搬送至塗怖 程序部2 4。 在塗怖程序部2 4中,基板G會首先依次搬入附著/ 冷卻單元(AD/COL) 46,在最初的附著單元( A D )中接受疏水化處理(Η M D S )(步驟S 6 ),在 其次的冷卻單元(COL)中冷卻至一定的基板溫度爲止 本紙張尺度適用中國國家標準(CNS ) A4規格(21〇X297公釐) -12- 495842 A7 _B7___ 五、發明説明(β (步驟S 7 )。 (請先閱讀背面之注意事項再填寫本頁) 然後,基板G會在光阻劑塗怖單元(C Τ ) 4 0中塗 怖光阻劑,其次在減壓乾燥單元(V D ) 4 2中接受減壓 的乾燥處理,接著在邊端去塗膜劑單元(ER) 44中去 除基板周緣部多餘(不要)的光阻劑(步驟S 8 )。 其次,基板G會依次被搬入加熱/冷卻單元(HP/ C〇L ) 4 8,在最初的加熱單元(Η P )進行塗怖後的 烘烤處理(預烘烤)(步驟S 9 ),接著在冷卻單元( COL)中冷卻至一定的基板溫度爲止(步驟S10)。 並且,在此塗怖後的烘烤處理中亦可使用加熱單元(Η Ρ )5 0 〇 經濟部智慧財產局員工消費合作社印製 在上述塗怖處理後,基板G會利用塗怖程序部2 4的 主搬送裝置54與顯像程序部26的主搬送裝置60來搬 送至介面部(I/F) 14,由此傳送至曝光裝置(步驟 S 1 1 )。曝光裝置會使基板G上的光阻劑曝光成預定的 電路圖案。然後,完成圖案曝光的基板G會從曝光裝置回 到介面部(I/F) 14。又,介面部(I/F) 14的 搬送機構5 9會經由基板傳遞部5 7來將自曝光裝置所接 受的基板G予以傳遞至程序站(P / S ) 1 2的顯像程序 部2 6 (步驟S 1 1 )。 在顯像程序部2 6中,基板G會在顯像單元(D Ε V )52的其中之一接受顯像處理(步驟S12),接著依 次搬入加熱/冷卻單元(HP /COL) 5 5的其中之一 ,在最初的加熱單元(Η P )進行後烘烤處理(步驟 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ297公釐) -13- 495842 A7 ___B7_ 五、發明説明(1) (請先閲讀背面之注意事項再填寫本頁) 5 1 3 ),然後在冷卻單元(COL)中冷卻至一定的基 板溫度爲止(步驟S 14)。在此後烘烤處理中亦可使用 加熱單元(HP) 53。 在顯像程序部2 6中完成一連串處理的基板G會藉由 程序站(P/S) 12內的搬送裝置60,54,38來 搬回至卡匣站(C/S) 10,在此利用搬送裝置20來 收容於其中之一的卡匣C內(步驟S1)。 其次,參照第3〜7圖來說明有關搭載於以上所述之 塗怖顯像處理系統的本發明之一實施形態的紫外線照射單 元(U V )。 如第3圖所示,本實施形態的紫外線照射單元(U V )是在下面安裝石英玻璃,在室內具有:使複數個(圖示 例爲3個)的圓筒狀紫外線燈6 4 (1),6 4 (2),、、、 6 4 (η)並列收容於燈的長度.方向與垂直的水平方向之燈室 6 6,及鄰接設置於該燈室6 6的下方之洗淨處理室6 8 〇 在燈室6 6內,各紫外線燈6 4 ( i ) ( i = 1,2,、 經濟部智慧財產局員工消費合作社印製 、、,η )例如可爲介電質勢壘放電燈,利用後述的燈電 源部(9 6 )來接受商用交流電力的供給而發光,放射合 適於有機污染的洗淨之波長1 7 2 n m的紫外線(紫外準 分子光)。並且,在各紫外線燈6 4 ( i )的背面或上面 配置橫剖面圓弧狀的凹面反射鏡7 0。藉由各紫外線燈 6 4 ( i )而放射於上方〜側方的紫外線會反射於正上方 的反射鏡凹面部,而使能夠朝向石英玻璃窗6 2側。 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 14- 495842 Α7 Β7 五、發明説明(β (請先閱讀背面之注意事項再填寫本頁) 在此實施例中,供以分別監視燈6 4 ( 1 )〜6 4 ( η )的發光狀態之可光電變換上述波長1 7 2 nm的紫外 線之複數(η)個的光感測器72 (1)〜72 (η)是 被設置於燈室6 6內的適當位置,例如各燈6 4 ( 1 )〜 6 4 ( η )的正上方。 在燈室6 6內亦可設置:例如以水冷方式來冷卻燈 64(1)〜64 (η)的冷卻水套(圖未示),及使供 以防止吸收紫外線(會使燈發光效率惡化)的氧氣進入室 內之惰性氣體(例如Ν 2 )導入且充滿的氣體流通機構(圖 中未示)等。 在燈室6 6的兩側設有應用單元7 4,該應用單元 7 4收容有供以在此紫外線照射單元(U V )內的各部供 給所要的用力或控制信號之用力供給部及控制部。又,藉 由輸入根據燈室6 6內的各種感測器(例如光感測器7 2 (1 )〜7 2 ( η ))而輸出的電氣信號來進行所要的信 號處理之各種測定或監視電路等亦可設置於應用單元7 4 內。 經濟部智慧財產局員工消費合作社印製 在洗淨處理室6 8內設有供以載置基板G且予以支撐 之可水平移動及昇降的承載台7 6。就本實施形態而言, 是在使用螺桿7 8之自走式的承載台驅動部8 0上使承載 台7 6能夠昇降搭載於垂直方向(圖的Ζ方向)’承載台 驅動部8 0會沿著螺桿7 8及與此平行延伸的引導構件 8 2而使能夠往返移動於預定的水平方向(圖的Υ方向) ,亦即以能夠橫切(和燈配列方向平行)於燈室6 6的正 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ297公釐) -15- 495842 Μ _________Β7_ 五、發明説明(d 下方之方式來往返移動。此刻的移動速度爲可變控制速度 〇 (請先閲讀背面之注意事項再填寫本頁) 在承載台7 6中垂直貫通有:在基板G的搬入/搬出 時供以以水平姿勢來支撐的複數根(例如6根)的昇降銷 8. 4。就本實施形態而言,各昇降銷8 4會被固定於基板 傳遞用的預定高度位置,藉由昇降機構(圖未示)來使這 些固定昇降銷8 4能夠昇降於承載台7 6不會阻礙基板G 的搬入/搬出之退避用的下限高度位置H b與承載台7 6 本身供以載置支撐基板G的上限高度位置H a (虛線所示 )之間。並且,在承載台7 6的上面設有:供以支撐基板 G的多數個支撐銷(圖未示),及供以吸引保持基板G的 真空夾頭吸引□(圖未示)等。 在鄰接於承載台7 6的Y方向原點位置的洗淨處理室 6 8的側壁安裝有:供以在接近固定昇降銷8 4的上端部 高度位置搬入/搬出基板G之可開閉的擋板(門)8 6。 此擋板8 6是面向洗淨程序部2 2的搬送路徑3 6 (第1 經濟部智慧財產局員工消費合作社印製 圖),主搬送裝置3 8可經由開狀態的擋板8 6來從搬送 路徑3 6上將基板G搬入洗淨處理室6 8內,以及從洗淨 處理室6 8搬出基板G。 其次,參照第4圖來說明有關此紫外線照射單元( UV)的控制系構成。控制部8 8可由微電腦所構成,在 其內藏的記憶·體中儲存有供以控制本單元內的各部及全體 的所要程式,經由適當的介面來連接於統籌本塗怖顯像處 理系統全體的處理程序之主控制器(圖未示)及本紫外線 本纸張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) _ ' -16- 495842 Α7 Β7 五、發明説明(14) 照射單元(U V )內之控制系的各部。 (請先閱讀背面之注意事項再填寫本頁) 在此實施形態中,與控制部8 8相關之本紫外線照射 單元(UV )內的主要部份爲:供以驅動擋板8 6的擋板 驅動部9 0,供以在Z方向昇降驅動承載台7 6之承載台 昇降驅動部9 2 ,供以在Y方向水平驅動或掃描驅動承載 台7 6之掃描驅動部9 4 ,供以個別點燈驅動燈室6 6內 的紫外線燈6 4 ( 1 )〜6 4 ( η )之燈電源部9 6,供 以個別監視這些紫外線燈6 4 ( 1 )〜6 4 ( η )的點燈 狀態之燈監視部9 8等。並且,承載台昇降驅動部9 2及 掃描驅動部9 4分別具有驅動源(例如伺服馬達),設置 於承載台驅動部8 0內。燈電源部9 6及燈監視部9 8是 與控制部8 8 —起設置於應用單元7 4內。 第5圖是表示燈電源部9 6及燈監視部9 8之一構成 例模式圖。燈電源部9 6具有:商用交流電源1 〇 〇 ,及 電氣性連接於此交流電源1 0 0的電源端子與燈室6 6內 的各紫外線燈6 4 ( 1 )〜6 4 ( η )的電極端子之間的 開閉器1 0 2 ( 1 )〜1 0 2 ( η )。並且,各開閉器 經濟部智慧財產局員工消費合作社印製 1 0 2 ( 1 )〜1 0 2 ( η )是根據來自控制部8 8的控 制信號G 1〜G η來個別進行〇Ν ·〇F F控制。如此一 來,將可經由燈電源部9 6來分別控制燈室6 6內全體紫 外線燈6 4 ( 1 )〜6 4 ( η )的點燈•熄燈。 燈監視部9 8具有:在燈室6 6內接受來自各紫外線 燈6 4 ( 1 )〜6 4 ( η )的紫外線光,然後變換成電氣 信號之光感測器7 2 ( 1 )〜7 2 ( η ),及根據光感測 本紙張尺度適用中國國家標準(CNS ) Α4規格(210X 297公釐) -17- 495842 A7 經濟部智慧財產局員工消費合作社印製 五、發明説明( 器72 (1)〜72 (η)的輸出信號L1〜Ln來 或推測各紫外線燈6 4 ( 1 )〜6 4 ( η )的亮度狀 而來判定發光狀態之測光電路1 〇 4。並且,在燈室 內在各光感測器7 2 ( i )的周圍設有適當的遮光部 10 6,該遮光部1 〇 6可使來自各光感測器7 2 ( 所對應之紫外線燈6 4 ( i )的紫外線比來自其他紫 燈的紫外線還要能夠選擇性或重點性地受光。 其次,參照第6圖來說明此紫外線照射單元(u 的主要動作程序。首先,接受來自上述主控制器的指 使單元內的各部(含控制部8 8 )初期化(步驟A 1 在此初期化中,承載台7 6是在Y方向上被定位於接 板8 6的預定原點位置,在z方向上下降至退避用的 位置(H b )。並且,控制部8 8可使承載台7 6移 Y方向的速度,亦即作爲掃描速度的初期値,以紫外 64 (1)〜64 (η)全體正常時所採用的掃描速 爲基準速度F s來設定於預定的暫存器內。 若主搬送裝置3 8 (第1圖)從卡匣站(c/S) 1 0來將處理前的基板G搬送至本紫外線照射單元(υ ν )則,則控制部8 8會各部來使能夠進行主搬送裝置3 8 與基板G間的傳遞(步驟a 2 )。 更詳而言之,控制部8 8會首先將使擋板8 6開啓的 控制信號輸出至擋板驅動部9 0 ,而令擋板8 6開啓。又 ,主搬送裝置3 8具有一對的搬送臂,使洗淨前的基板G 承載於一方的搬送臂,以及使另一方的搬送臂在空(無基 測定況, 外線 V ) 示, )° 近擋 高度 動於 線燈 度作 ^衣-- {請先閲讀背面之注意事項再填寫本頁) 訂 ·· 本紙張尺度適用中國國家標準(CNS ) A4規格(210x297公董) -18 - 495842 A7 __________ B7_ 五、發明説明(16> (請先閲讀背面之注意事項再填寫本頁) 板)狀態下朝向本紫外線照射單元(U V )移動。當本紫 外線照射單兀(UV)內無洗淨完成的基板g時,會經由 保持開啓狀態的擋板8 6來使支撐洗淨前的基板G的一方 搬送臂伸展於洗淨處理室6 8內,將該未洗淨基板G移載 於固定昇降銷8 4的上面。當本紫外線照射單元(UV) 內有洗淨完成的基板G時,最初會以空的搬送臂來搬出該 洗淨完成的基板G,然後與上述同樣的搬入未洗淨的基板 G。如此一來,一旦在本紫外線照射單元(UV)應接受 紫外線洗淨處理的基板G藉由主搬送裝置3 8而搬入載置 於固定昇降銷8 4上,則會關閉擋板8 6。 其次,控制部8 8會控制承載台昇降驅動部9 2來使 承載台7 6上昇至基板載置用的高度位置H a (步驟A 3 )。此刻,在承載台7 6的上昇期間,會使真空夾頭開始 吸引,當承載台7 6到達基板載置用的高度位置H a ,可 同時吸引保持基板G 〇 其次,控制部8 8會開啓燈電源部9 6的全體開閉器 1 0 2 ( 1 )〜1 0 2 ( η ),而使全體紫外線燈6 4 ( 經濟部智慧財產局員工消費合作社印製 1 )〜6 4 ( η )點起(步驟A 4 )。然後,根據來自燈 監視部9 8的測光電路1 〇 4的測光或監視資訊來個別地 檢查各紫外線燈6 4 ( 1 )〜6 4 ( η )的發光狀態,依 據該檢查結果來進行本紫外線照射單元(U V )之紫外線 洗淨處理用的預定參數(例如掃描速度,照射時間等)的 變更(步驟A 5 ) 〇 第7圖是表示本實施形態之參數變更處理(步驟A 5 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 一~ -19- 495842 A7 ___B7 五、發明説明(17) (請先閲讀背面之注意事項再填寫本頁) )的詳細程序。首先,測定燈室6 6內射入各光感測器 72 (1)〜72 (η)的紫外線照度(步驟B1)。由 於各光感測器7 2 ( 1 )〜7 2 ( η )是選擇性或重點性 地接受來自所對應之紫外線燈6 4 ( 1 )〜6 4 ( η )的 紫外線光,因此各光感測器7 2 ( 1 )〜7 2 ( η )所接 受的紫外線照度會與所對應之各紫外線燈6 4 ( 1 )〜 6 4 ( η )的亮度成比例。因此,可從各光感測器7 2 ( 1)〜72 (η)的輸出信號L1〜Ln來取出各紫外線 燈6 4 ( 1 )〜6 4 ( η )的亮度絕對値或相對値(步驟 Β 2 ),判定使用上是否低於下限値,亦即判定使用上合 適與否(步驟Β 3 )。 經濟部智慧財產局員工消費合作社印製 在上述燈監視檢查(步驟Β 1〜Β 3 )中發現有亮度 爲低於一定下限値(含不點燈的狀態)的紫外線燈6 4 ( i )時,會將此紫外線燈6 4 ( i )視爲發光不良的異常 燈,然後把燈電源部9 6內的該當開閉器1 0 2 ( i )切 換成〇F F狀態,藉由控制部8 8來控制中止該異常燈 6 4 ( i )的使用(步驟B 4 )。在此,即使不點燈使用 一部份的紫外線燈(.i ),還是可以在下個過程的紫外線 照射處理(步驟A 6 )中修正預定的參數(掃描速度等) ,而使能夠賦予基板G充分的紫外線照射量(光量)(步 驟 B 5 )。 例如,在具備3個紫外線燈6 4 ( 1 )〜(3 )的構 成中,出現一盞燈6 4 ( 1 )發光不良的監視檢查結果時 ,控制部8 8會關閉燈電源部9 6的開閉器1 0 2 ( 1 ) 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -20 - 經濟部智慧財產局員工消費合作社印製 495842 A7 B7 五、發明説明(18) ,而來中止對該燈6 4 ( 1 )供給電力。然後,對承載台 7 6上的基板G ,以處於正常狀態所剩餘的紫外線燈6 4 (2)〜64(η)的紫外線照射量不會低於能夠保證處 理品質之預定下限値以下的方式來將紫外線照射處理的掃 描速度修正成只比全體燈正常時的基準速度還要慢預定比 例的速度F k。大致說來,由於所點燈使用的燈會從全部 正常時的3個減少至2個,因此可以紫外線照射時間形成 3/2倍之方式來修正掃描速度F k成爲基準速度F s的 2 / 3倍。更精細是可控制正常燈6 4 ( 2 ) ,6 4 ( 3 )的亮度。例如,正常燈64 (2) ,64 (3)的亮度 比使用開始時的初期値還要低時,爲了補償該亮度低下的 部份,可降低速度來求取修正掃描速度F k。然後所求得 的修正掃描速度F k會被置換設定成在初期化(步驟A 1 )中所被設定的基準掃描速度F s。 在上述燈監視檢查(步驟B 1〜B 3 )中未發現有異 常燈時,會原封不動地採用(維持)在初期化(步驟A 1 )中所設定的基準掃描速度Fs (步驟B6)。 其次,在第6圖中,在完成上述參數變更處理(步驟 A 5 )後,會對基板G執行紫外線洗淨處理(步驟A 6 ) 。爲了進行此紫外線洗淨處理,控制部8 8會藉由承載台 驅動部8 0的掃描驅動部9 4來使承載台7 6在原點位置 與虛線7 6 ’所示的動向位置之間單向移動或往返移動於Y 方向。藉由該承載台7 6的Y方向移動,承載台上的基板 G會在燈室6 6的正下方以預定的高度位置Ha (亦即對 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) H 訂 (請先閲讀背面之注意事項再填寫本頁) -21- 495842 A7 __B7 五、發明説明(19) (請先閲讀背面之注意事項再填寫本頁;> 石英玻璃窗6 2取預定的間隔)橫切於Y方向,而使從燈 室6 6的石英玻璃窗6 2朝大致垂直下方放射的紫外線( 波長1 7 2 nm)能夠從基板G的一端掃描至另一端(γ 方向),照射全體的基板表面。 如此一來,可對基板G照射波長1 7 2 n m的紫外線 ’使存在於基板表面附近的氧氣能夠藉該紫外線來變成臭 氧〇3,並且臭氧〇3會藉該紫外線而勵起產生氧原子基 〇*。利用該氧基來使附著於基板G表面的有機物分解成二 氧化碳與水,而來從基板表面予以去除。 在如此掃描方式的紫外線洗淨處理中,對基板G的紫 外線照射量或光量會與承載台7 6的移動速度(掃描速度 )F成反比。亦即,掃描速度F越快,則對基板g的紫外 線照射時間越短’紫外線照射量少,相對的,掃描速度F 越慢’則對基板G的紫外線照射時間越長,紫外線照射量 多。 經濟部智慧財產局員工消費合作社印製 就本實施形態而言,當燈室6 6內之紫外線燈6 4 ( 1 )〜6 4 ( η )的發光狀態全部正常時,當然可確保所 預期的洗淨效果,但即使一部份的燈發光不正常,還是藉 由上述參數變更處理(步驟A 5 )來設定最合適的掃描速 度F (配合當前正常燈的發光狀態),因此可對基板g照 射所需且充分光量的紫外線,而來確保所預期的洗淨效果 。因此,在本紫外線照射單元(U V )中,可不必中止運 轉,而能夠繼續實施適當的紫外線洗淨處理。 在此’當發光不良的1盞異常燈6 4 ( i )被檢測出 本紙張尺度適用中國國家標準(CNS ) A4規格(21〇X297公羡) 22- 495842 A7 ____B7 五、發明説明(2〇) 時’控制部8 8亦可經由顯示器或蜂鳴器等(圖未示)來 發出警報資訊或信號(告知異常或故障事態)。 (請先閱讀背面之注意事項再填寫本頁} 若上述對基板G的紫外線洗淨處理終了時,控制部 88會關閉燈電源部96內的全體開閉器102 (1)〜 1〇2 (η),而使全體紫外線燈64 (1)〜64 (η )熄燈(步驟A 7 )。其次,在Y方向原點位置使真空夾 頭形成〇F F狀態後,藉由承載台昇降驅動部9 2來使承 載台76下降至退避用的高度位置Hb (步驟A8),使 基板G支撐於固定昇降銷8 4。藉此來完成1片基板G在 本紫外線照射單元(UV)內的全體過程,等待主搬送裝 置3 8 (第1圖)的來到。 如上述,由於本實施形態中即使燈室6 6內一部份的 紫外線燈6 4發光不良,還是能夠繼續實施適當的紫外線 洗淨處理動作,因此可以安定維持該紫外線照射單元( U V )所要求的生產能力,進而可以確保本塗怖顯像處理 系統的生產能力。又,因爲發光不良的燈只要在定期的維 修時更換成正常的燈即可,所以能夠進行計畫性的保管。 經濟部智慧財產局8(工消費合作社印製 就上述實施形態而言,雖爲燈電源部9 6供給一定的 交流電力給各紫外線燈6 4 ( 1 )〜6 4 ( η )之構成, 但亦可使用可變控制供應給各紫外線燈6 4 ( 1 )〜6 4 (η )的電力之燈電源裝置(圖未示),此情況,可藉上 述參數變更處理(步驟A 5 )來再行設定的參數亦可採用 燈投入電力或燈亮度。亦即,如上述,在步驟B 1〜B 3 的燈監視檢查中發現有發光不良的異常燈時,可利用控制 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -23- 495842 A7 _______B7_ 五、發明説明(21) (請先閲讀背面之注意事項再填寫本頁) 部8 8來中止該異常燈的使用,藉由燈投入電力或燈亮度 的修正’使能夠在紫外線照射處理中賦予基板G充分的紫 外線照射量(光量),藉此照樣可以取得同樣的效果。 又’就上述實施形態而言,在紫外線照射處理中可藉 上述參數變更處理(步驟A 5 )來再行設定的參數亦可採 用紫外線照射時間。亦即,如上述,在步驟B 1〜B 3的 燈監視檢查中發現有發光不良的異常燈時,可利用控制部 8 8來中止該異常燈的使用,藉由紫外線照射時間的修正 ’使能夠在紫外線照射處理中賦予基板G充分的紫外線照 射量(光量),藉此照樣可以取得同樣的效果。 又’就上述實施形態而言,雖是採用固定紫外線燈 6 4 ( 1 )〜6 4 ( η )側,而使基板G側平行移動於燈 配列方向的掃描方式,但亦可採用將基板G側固定於預定 位置’而使紫外線燈6 4 ( 1 )〜6 4 ( η )側與基板面 平行移動的掃描方式。又,掃描驅動機構並非只限於螺桿 機構,亦可爲皮帶式或滾筒式等。 經濟部智慧財產局員工消費合作社印製 又’並非只限於掃描方式,亦可爲固定紫外線燈6 4 (1)〜64(η)及基板G的雙方,呈對向配置的靜止 方式。此情況,可藉上述參數變更處理(步驟A 5 )來再 行設定的參數可採用上述紫外線照射時間或燈投入電力等 〇 又,亦可以設置於燈室6 6內的紫外線燈6 4 ( 1 ) 〜6 4 ( η )的一部份作爲預備燈,在正常狀態下放置不 使用,而至其他燈發光不良時,停止該發光不良燈的使用 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ297公釐)> -24- 495842 Α7 Β7 五、發明説明(22) ,由預備燈來取代之。此情況,可改變調整點燈用的紫外 線燈組合來作爲一種參數。 (請先閱讀背面之注意事項再填寫本頁) 又,可藉上述參數變更處理來再行設定的參數,雖是 單獨採用,但亦可採用組合2組以上的參數。例如,亦可 再設定掃描速度與紫外線照射時間雙方。 在上述實施形態中,是針對發光不良的燈來停止其點 燈使用。亦即,由於如此的異常燈是不能實質地予以控制 ,亦即無法依設定來管理來自燈室6 6的紫外線照射量, 因此最好是從所使用的燈群中予以排除,但若安全面上無 特別問題,亦可在變更上述參數下配合所需來持續使用該 異常燈。 又,即使尙未達到異常燈的程度,而只是被確認出燈 的亮度下降時,還是可以進行參數的修正。此類的控制並 非只限於設置複數個燈時,亦可適用於設置1個時,且即 使爲複數個燈,還是可以在個別監視發光狀態下進行。 經濟部智慧財產局員工消費合作社印製 又,在謀求本紫外線照射單元(U V )的最大限度運 轉持續性時,亦合適於在燈室6 6中可個別進行各紫外線 燈6 4 ( 1 )〜6 4 ( η )的安裝•拆卸之構成,例如模 組型的燈單元或殼(圖未示)。 又,在停止異常燈的使用時,即使以全部最大投入電 力來點亮剩餘的正常燈,對基板G的紫外線照度還是有可 能低於可確保所期望的洗淨效果之預定的下限値。因此當 修正參數也無效時,亦可發出所要的警報資訊來停止本紫 外線照射單元(U V )的運轉。 本紙張尺度適用中國國家標準(CNS ) Α4規格(210 X 297公釐) -25- 495842 A7 B7 五、發明説明(23) 上述實施型態的燈室6 6內或洗淨處理室6 8內的構 成’尤其是紫外線燈64(1)〜64(η),承載^ (請先閱讀背面之注意事項再填寫本頁) 7 6 ’承載台驅動部8 0等的構成爲一例,亦可針對各部 份進行種種的變更。 上述實施型態是有關紫外線照射洗淨裝置(υ ν )者 。但,本發明的基板處理裝置亦可適用於有機污染去除以 外的目的,將紫外線照射於被處理基板的處理。例如,在 上述塗怖顯像處理系統中,在後烘烤處理(步驟s丨3 ) 之後使光阻劑硬化的目的下將紫外線照射於基板G的過程 中可使用與上述實施型態相同的紫外線照射裝置。又,本 發明的被處理基板並非只限於L C D,亦可爲半導體晶圓 ,C D基板,玻璃基板,光罩,印刷基板等。 【發明之效果】 經濟部智慧財產局員工消費合作社印製 如以上所述,若利用本發明,則即使紫外線燈發生發 光不良等的異常,還是可以繼續進行正常的紫外線照射處 理,而使能夠規避生產能力的降低。並且,即使紫外線燈 的一部份發光不良,.還是可以不必馬上停止運轉,因此而 能夠進行計畫性的保管。 〔圖面之簡單說明〕 第1圖是表示本發明的基板處理裝置所適用可能的塗 怖顯像處理系統的構成的平面圖。 第2圖是表示實施形態的塗怖顯像處理系統的處理程 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -26- 495842 A7 B7 五、發明説明(24) 序流程圖。 第3圖是表示實施形態的紫外線照射單元的構成立體 圖。 第4圖是表示實施形態的紫外線照射單元的主要控制 系統的構成方塊圖。 第5圖是表示實施形態的紫外線照射單元的燈電源部 及燈監視部的一構成例圖。 第6圖是表示實施形態的紫外線照射單元的主要動作 程序的流程圖。 第7圖是表示實施形態的紫外線照射單元的參數更改 處理的詳細程序流程圖。 — 1^1-----LP! (請先閲讀背面之注意事項再填寫本頁) 訂 經濟部智慧財產局員工消費合作社印製 〔符號之說明〕 3 8 :主搬送裝置 U V :紫外線照射單元 6 2 :石英玻璃窗64(1),64(2),、、、64 6 6 :燈室 6 8 :洗淨處理室72(1),72(2),、、、72 7 6 :承載台 7 8 :螺桿 8 0 :承載台驅動部 8 2 :引導構件 :紫外線燈 :光感測器 Φ. 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -27 - 495842 A7 B7 五、發明説明(25) 8 4 :固定昇降銷 部 動 源 驅 電 降部 流 1 路 昇動部部交, 電 部台驅源視用} 光 板制載描電監商 1 測 擋控承掃燈燈:{ : • · ·· ·· · 0 .· ·· 013 2 //-*68246800 器 ο 88999911 閉 1 2ο495842 A7 ____B7_ V. Description of the invention (彳) [Purpose of the invention] [Technical field to which the invention belongs and the know-how in the field] (Please read the precautions on the back before filling out this page) The invention relates to irradiating ultraviolet rays to A substrate processing apparatus and a substrate processing method for performing a predetermined process on a substrate to be processed. In the manufacture of semiconductor devices or liquid crystal display devices (L CD), various microfabrications are performed on the premise that the surface of the substrate to be processed (for example, a semiconductor wafer, an LCD substrate, etc.) is in a quiet state. Therefore, the surface of the substrate to be processed is cleaned before or during each processing. For example, in the process of optical lithography, the surface of the substrate to be processed is cleaned before the photoresist is applied. Conventionally, as a cleaning method for removing organic substances on the surface of a substrate to be processed, there is, for example, a dry cleaning technique based on ultraviolet irradiation. This ultraviolet irradiation cleaning technology uses a predetermined wavelength (185nm, 254nm when a low-pressure mercury lamp is used as an ultraviolet light source, and 17 2 nm when a dielectric barrier discharge lamp is used as an ultraviolet light source) to excite oxygen, Organic substances on the surface of the substrate are oxidized and vaporized according to the generated ozone and oxygen during the generation, and then removed. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, a typical UV irradiation cleaning device used to house a plurality of lamps forming the above-mentioned ultraviolet light source in a lamp room with a quartz glass window, and arrange the substrate to be processed through the quartz glass window. The surface of the substrate to be processed is irradiated with ultraviolet rays generated by the lamp in the lamp chamber for a predetermined period of time in a cleaning processing chamber adjacent to the lamp chamber through the quartz glass window. Recently, there have been people who seek to miniaturize the device by using a scanning mechanism (relatively moving in parallel with the surface of the substrate to be processed) (reduction of the number of lamps and miniaturization of quartz glass windows, etc.). This paper standard applies Chinese National Standard (CNS) A4 Specifications (210X297mm) 1-4 495842 A7 ___B7_ V. Description of the invention (2) 〇 (Please read the precautions on the back before filling this page) In the above-mentioned ultraviolet irradiation cleaning device, in order to obtain the desired It is necessary to ensure the illuminance and light quantity of ultraviolet rays irradiated on the substrate to be processed by the ultraviolet lamp at a predetermined level or more, depending on the specifications of each part of the device in order to meet such ultraviolet irradiation conditions. However, if the ultraviolet lamp is abnormally darkened or does not emit light due to deterioration over time or other reasons, the ultraviolet illuminance and light amount of the substrate to be processed may be insufficient, which may cause poor cleaning. As for the typical ultraviolet irradiation cleaning device in the past, even if only one ultraviolet lamp in the lamp room causes the above-mentioned problems, the operation of the cleaning treatment will be stopped immediately, and then an alarm indicating that the lamp must be replaced is issued. However, such a safe disposal not only does not detect defective cleaning products, but also stops the production line when the above-mentioned situation occurs, which results in a reduction in device productivity. [Problems to be Solved by the Invention] The Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs has printed the present invention in view of the problems of the conventional technology, so as to provide a normal ultraviolet light that can continue to be used even if an abnormality occurs in the ultraviolet lamp. A substrate processing apparatus and a substrate processing method for irradiation processing are for this purpose. Another object of the present invention is to provide a substrate processing apparatus and a substrate processing method that do not cause insufficient ultraviolet irradiation amount to a substrate to be processed due to an abnormality of an ultraviolet lamp at an undesired period, thereby enabling planning management. In order to achieve the above object, the substrate processing apparatus of the present invention belongs to a paper standard applicable to the Chinese National Standard (CNS) A4 specification (210〆297 mm) -5- 495842 A7 ____ _B7 V. Description of the invention (3) A substrate processing apparatus for irradiating ultraviolet rays on a substrate to be processed for predetermined processing is characterized by: (Please read the precautions on the back before filling this page) a support mechanism; the support mechanism is used to support the above-mentioned processed A substrate, and an ultraviolet irradiation mechanism; the ultraviolet irradiation mechanism is provided with a plurality of lamps that emit ultraviolet rays by receiving a supply of electric power, and irradiates the ultraviolet rays emitted by the lamps to the substrate to be processed; and a lamp monitoring mechanism; The lamp monitoring mechanism is used to individually monitor each light emitting state of the plurality of lamps; and a control mechanism; the control mechanism is used to control predetermined parameters of the ultraviolet irradiation process based on monitoring information from the lamp monitoring mechanism. In the substrate processing apparatus configured in this way, in a regular or scheduled situation, for example, before each ultraviolet irradiation treatment, the light monitoring state of the plurality of lamps used is determined by the lamp monitoring function of the lamp monitoring mechanism. Whether all of them are normal, or some of them are abnormal. Based on this judgment result, the predetermined parameters that regulate or control the ultraviolet irradiation treatment can be controlled or adjusted by the control mechanism, so that even if the light emitting state of the lamp of the ultraviolet irradiation mechanism is printed by the employee's consumer cooperative of the Intellectual Property Bureau of the Ministry of Economy, it will change constantly. It is still possible to obtain stable processing results for the substrate to be processed. In the above-mentioned substrate processing apparatus, there may be a driving mechanism for moving one or both of the supporting mechanism and the lamp in a predetermined direction, and The ultraviolet rays from the ultraviolet irradiation mechanism are allowed to scan the processing surface of the processing target substrate supported on the support mechanism. Also, in this configuration, the above-mentioned control mechanism may have a scanning speed control, and the paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) ~ -6-495842 A7 ____B7_ V. Description of the invention (4) (Please read first Note on the back, please fill in this page again.) Control function: The scanning speed control function is to control the scanning speed (parameter) according to the monitoring information from the lamp monitoring mechanism. In this case, the above-mentioned control mechanism is to control the ultraviolet irradiation mechanism in such a manner that the abnormal lamp can be stopped when the monitoring information of one of the above-mentioned lamps is abnormally detected by the above-mentioned lamp monitoring mechanism. The scanning speed control function is set so that the scanning speed is set to a value which is slower than a predetermined reference value by a predetermined ratio. In this way, by stopping the use of abnormal lamps that are substantially unmanageable, and then scanning the ultraviolet rays that are possible for normal lamp management at a scanning speed that is slower than the reference threshold, it is possible to ensure necessary and sufficient for the substrate to be processed. The amount of ultraviolet radiation can further achieve normal processing results. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs or the above-mentioned control mechanism may also have an ultraviolet irradiation time control function. The ultraviolet irradiation time control function is to variably control the ultraviolet irradiation time based on monitoring information from the lamp monitoring mechanism. In this case, the above-mentioned control mechanism is to control the ultraviolet irradiation mechanism in such a manner that the abnormal lamp can be stopped when the monitoring information of one of the above-mentioned lamps is abnormally detected by the above-mentioned lamp monitoring mechanism. The ultraviolet irradiation time control function is set so that the above-mentioned ultraviolet irradiation time is set to a value that is longer than a predetermined reference value by a predetermined ratio. In this way, a normal processing result similar to the above can be obtained. Alternatively, the control mechanism may have a lamp brightness control function that individually controls the brightness of the lamp based on the monitoring information from the lamp monitoring means. In this case, the above-mentioned control mechanism is one of the monitoring information of the abnormal light emission state of the above-mentioned lamp. The paper size measured by the above-mentioned lamp monitoring mechanism is applicable to the Chinese National Standard (CNS) A4 specification (21 × 297 mm) ~ " 495842 A7 V. Description of the invention (5) & The ultraviolet irradiation mechanism will be controlled in such a way that the abnormal lamp can be stopped, and at the same time, the brightness of the lamp in the normal state is set according to the brightness control function of the lamp. Only a predetermined percentage of 値 is higher than a predetermined reference 値. In this way, the same normal processing results as above can be obtained. The outside line will be replaced by the control if it is not abnormal. Another line of irradiation, its special features, and the above, the above-mentioned shooting mechanism is used to monitor the use status monitoring information from the abnormal lamp, the ultraviolet light used in addition to the ultraviolet light, the present invention has the following features in the processed features: the substrate of the present invention The state of the plurality of lamps is described, and the other one of the above-mentioned lamps emits light due to the above-mentioned monitoring mechanism. In the device capable of lighting, the purple part can be used as a preliminary lamp to ensure the detection. The above-mentioned control mechanism Shoot the mechanism in the way of the above-mentioned preparation lamp. In this way, the substrate processing device that can be suitably used as the above parameters in the combination of the ultraviolet light irradiation line lamp belongs to a substrate processing device for performing predetermined processing by using an ultraviolet plate (please read the precautions on the back before (Fill in this page) The printed consumer support agency of the Intellectual Property Bureau of the Ministry of Economic Affairs's consumer cooperatives; this support mechanism is an ultraviolet irradiation mechanism for supporting the substrates to be processed; the ultraviolet irradiation mechanism is a lamp that emits ultraviolet rays by receiving power supply, And irradiating the ultraviolet light emitted by the lamp to the substrate to be processed; and a lamp monitoring mechanism; the light-emitting state of the lamp monitoring mechanism; and a lamp control mechanism for individually monitoring the lamp; Lamp monitoring This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -8 495842 A7 __ B7 V. Description of the invention (6) The monitoring information of the institution controls the above-mentioned predetermined parameters of the ultraviolet irradiation treatment. (Please read the precautions on the back before filling in this page.) For such a substrate processing device, it is under regular or scheduled conditions, such as by the lamp monitoring mechanism before each UV irradiation treatment. Function to determine whether the light-emitting states of the plurality of lamps used are all normal, or some of them are abnormal. Based on this determination result, predetermined parameters that define or control the left and right ultraviolet irradiation treatment can be controlled or adjusted by the control mechanism, thereby enabling stable processing of the substrate to be processed even if the light emission state of the lamp of the ultraviolet irradiation mechanism changes frequently. result. Specifically, for example, the brightness of the lamp is monitored by the lamp monitoring mechanism, and when the brightness is low, it is controlled to extend the irradiation time of the lamp. Furthermore, the substrate processing method of the present invention belongs to a substrate processing method for performing predetermined processing by irradiating ultraviolet rays on a substrate to be processed by a plurality of lamps, and is characterized in that: the light emission of the plurality of lamps is individually monitored; A state process; and a process of controlling predetermined parameters of the ultraviolet irradiation process based on the monitoring information of the above-mentioned monitoring process. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, the substrate processing method of the present invention belongs to a substrate processing method for performing predetermined processing by irradiating ultraviolet rays on a substrate to be processed by a plurality of lamps, which is characterized by: The process of individually monitoring the light-emitting states of the plurality of lamps; and during the above-mentioned monitoring, when any of the light-emitting states of the lamps is confirmed to be abnormal, controlling predetermined parameters of the ultraviolet irradiation treatment so that the use of the abnormal lamp can be stopped, And the process of normal irradiation is performed by the residual lamp. This paper size applies the Chinese National Standard (CNS) A4 specification (210X29 * 7 public envy 1 ~~ -9- 495842 A7 _B7_ V. Description of the invention (7) [Composition and function of the invention] The invention is described in detail below with reference to the drawings FIG. 1 is a schematic plan view showing a photoresist coating development processing system equipped with a substrate processing device according to an embodiment of the present invention. The coating display device system is installed in a clean room, for example The LCD substrate is used as the substrate to be processed in the process of optical lithography imaging, photoresist coating, pre-baking, development, and post-baking in the L CD process. The exposure process is set adjacent to This system is performed in an external exposure device (not shown). This exposure development processing system is roughly composed of a cassette station (C / S) 1 0, and a program station (P / S) 1 2 and an interface (I / F) 1 4. A cassette station (C / S) 1 installed at one end of the system is provided with: a predetermined number of cassettes C (for example, up to 4) can be loaded (for storing a plurality of cassettes C) Base plate G), and a cassette carrier 16 for the same The cassette C carries a transfer mechanism 20 for carrying in and out of the substrate G. The transfer mechanism 20 has a mechanism that can hold the substrate G, such as a transfer arm, which can move on 4 axes such as X, Y, Z, and 0, thereby enabling The main transfer device 38 on the side of the program station (P / S) 12 to be described later is transferred to the substrate G. The program station (P / S) 1 2 is via the (holding) substrate relay unit 2 3, and the chemical liquid supply unit 2 5 And space 2 7 from the cassette station (C / S) 1 0 side in a row in order to set the washing program section 2 2, the paint program section 2 4 and the development program section 26. This paper size applies to China Standard (CNS) A4 specification (210X297 mm)------- f 丨 (Please read the notes on the back before filling this page) Order printed by the Intellectual Property Bureau of the Ministry of Economic Affairs Consumer Cooperatives -10- 495842 A7- ---- B7__ 5. Description of the invention (8) (Please read the precautions on the back before filling out this page) The washing program section 2 2 contains: two scrubber washing units (SRC) 2 8 and two UV irradiation / cooling unit (UV / COL) 30, heating unit (HP) 32, and cooling unit (COL) 3 4 of the segment. : Photoresist coating unit (c T) 4 0 ′ and reduced-pressure drying unit (VD) 4 2, and edge strip coating unit (ER) 44, and upper and lower two-stage attachment / cooling unit (AD / COL) 46 'and upper and lower two-stage heating / cooling unit (HP / COL) 48, heating unit (HP) 50. The development program section 26 includes: three development units (DEV) 5 2' and Two upper and lower two-stage heating / cooling units (HP / COL) 55, and heating units (HP) 53. Conveyance paths 36, 52, 58 and main conveyance devices 38, 54 are provided along the length of the central portion of each of the program sections 22, 24, and 26. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 6 0 will follow each conveyance path While moving, each unit in each program section is accessed, and the board G can be carried in / out or carried. In this system, in each of the program sections 22, 24, and 26, a rotation unit (SCR, CT, DEV, etc.) is disposed on one side of the conveying path 3, 6, 2, 5, 8 and the other side Units equipped with a heat treatment or irradiation treatment system ("?, 〇〇 ^, 11 ¥, etc.). The intervening surface (I / F) 1 4 provided on the other side of the system is provided with a substrate transfer unit 5 7 and a buffer stage 5 6 on the side adjacent to the program station (P / S) 1 2 and adjacent to the exposure device. The transport mechanism is set on one side of the paper. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) -11-495842 A7 _____B7 V. Description of the invention (9) (Please read the precautions on the back before filling this page) Fig. 2 is a flowchart showing a processing procedure of the smear developing processing system. First, in the cassette station (C / S) 10, the transfer mechanism 20 takes out a substrate G from a predetermined cassette C on the stage 16 and transfers it to the cleaning of the program station (P / S) 12. The main transfer device 38 of the program section 22 (step S 1). In the cleaning program section 22, the 'substrate G will first be sequentially carried into the ultraviolet irradiation / cooling unit (UV / COL) 30, and then the upper stage ultraviolet irradiation unit (UV) will be subjected to dry cleaning by ultraviolet irradiation, Next, the cooling unit (COL) in the lower stage is cooled to a predetermined temperature (step S 2). Organic matter on the surface of the substrate will be removed under this ultraviolet irradiation and cleaning. Thereby, the wettability of the substrate G is improved, and the cleaning effect of scraping and cleaning in the next process can be improved. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Secondly, the substrate G is subjected to one of the scrubbing cleaning units (SRC) 2 8 for scraping and cleaning, and the substrate surface is used to remove particulate dirt (step S 3). After scraping and cleaning, the substrate G is subjected to a heating dehydration process in the heating unit (ΗP) 3 2 (step S 4). Next, the cooling unit (COL) 34 is cooled to a certain substrate temperature (step S5). This completes the pre-processing of the cleaning program section 22, and then the substrate G is transferred to the coating program section 24 through the substrate transfer section 23 of the main transfer device 38. In the coating program section 24, the substrate G is first transferred into the adhesion / cooling unit (AD / COL) 46 in order, and the first adhesion unit (AD) is subjected to a hydrophobization treatment (ΗMDS) (step S6). The second cooling unit (COL) is cooled down to a certain substrate temperature. The paper size applies the Chinese National Standard (CNS) A4 specification (21 × 297 mm) -12- 495842 A7 _B7___ 5. Description of the invention (β (step S 7 ). (Please read the precautions on the back before filling this page.) Then, the substrate G will be coated with a photoresist in the photoresist coating unit (C T) 4 0, followed by a vacuum drying unit (VD) 4 2 The substrate is subjected to a reduced-pressure drying process, and then the excess (unwanted) photoresist is removed from the peripheral portion of the substrate in the film remover unit (ER) 44 (Step S 8). Next, the substrate G is sequentially moved into the heating / Cooling unit (HP / COL) 4 8. The first heating unit (ΗP) is subjected to a baking treatment (pre-baking) after coating (step S9), and then cooled in a cooling unit (COL) to Up to a certain substrate temperature (step S10), and the baking process after coating The heating unit (HP) can also be printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. After the above coating process, the substrate G will use the main transfer device 54 and the development program unit 26 of the coating process unit 24. The main conveying device 60 is conveyed to the interfacial surface (I / F) 14 and then conveyed to the exposure device (step S 1 1). The exposure device exposes the photoresist on the substrate G into a predetermined circuit pattern. Then, The substrate G after the pattern exposure is returned from the exposure device to the interface portion (I / F) 14. The transfer mechanism 5 of the interface portion (I / F) 14 receives the self-exposure device through the substrate transfer unit 57. The substrate G is transferred to the development program section 26 of the program station (P / S) 1 2 (step S 1 1). In the development program section 26, the substrate G is placed in the development unit (D E V). One of the 52 is subjected to a development process (step S12), and then one of the heating / cooling units (HP / COL) 5 and 5 are sequentially loaded, and the first heating unit (ΗP) is subjected to a post-baking process (step this Paper size applies Chinese National Standard (CNS) A4 specification (210 × 297 mm) -13- 495842 A7 ___B7_ 1. Description of the invention (1) (Please read the precautions on the back before filling out this page) 5 1 3), and then cool to a certain substrate temperature in the cooling unit (COL) (step S 14). Bake processing after this The heating unit (HP) 53 can also be used in the process. The substrate G, which has completed a series of processing in the development program section 26, is returned to the card by the conveying devices 60, 54, 38 in the program station (P / S) 12. The cassette station (C / S) 10 is accommodated in one of the cassettes C by the transfer device 20 (step S1). Next, an ultraviolet irradiation unit (U V) according to an embodiment of the present invention mounted on the above-mentioned coating development processing system will be described with reference to FIGS. 3 to 7. As shown in FIG. 3, the ultraviolet irradiation unit (UV) of the present embodiment is equipped with quartz glass underneath, and has a cylindrical ultraviolet lamp 6 4 (1) in the room. , 6 4 (2) ,,,, 6 4 (η) are housed side by side in the length of the lamp. The lamp chamber 6 6 in the horizontal direction and the vertical direction, and the washing treatment chamber 6 8 adjacent to the lamp chamber 66 disposed below the lamp chamber 6. Within the lamp chamber 6 6, each ultraviolet lamp 6 4 (i) (i = 1 (2 ,, printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, etc.), for example, may be a dielectric barrier discharge lamp, which uses a lamp power supply section (96) described below to receive commercial AC power and emit light, It emits ultraviolet rays (ultraviolet excimer light) with a wavelength of 17 2 nm suitable for cleaning by organic pollution. Further, a concave reflecting mirror 70 having a circular arc-shaped cross section is arranged on the back or upper surface of each of the ultraviolet lamps 64 (i). The ultraviolet rays radiated from above to the side by the ultraviolet lamps 64 (i) are reflected on the concave surface of the mirror directly above, so that they can face the quartz glass window 62 side. This paper size applies to Chinese National Standard (CNS) A4 specification (210X297 mm) 14-495842 Α7 Β7 V. Description of the invention (β (Please read the precautions on the back before filling this page) In this example, they are used separately The light-emitting states of the monitoring lamps 6 4 (1) to 6 4 (η) can be photoelectrically converted into a plurality (η) of light sensors 72 (1) to 72 (η). It can be installed in a suitable position in the lamp room 66, for example, directly above each lamp 6 4 (1) to 6 4 (η). It can also be installed in the lamp room 6 6: for example, cooling the lamp 64 (1) by water cooling. ~ 64 (η) cooling water jacket (not shown), and a gas circulation mechanism (for inert gas (for example, Ν 2)) for introducing oxygen for preventing the absorption of ultraviolet rays (which deteriorates the luminous efficiency of the lamp) into the room (Not shown in the figure) and the like. Application units 74 are provided on both sides of the lamp room 66, and the application unit 74 contains a unit for supplying a required force or a control signal to each unit in the ultraviolet irradiation unit (UV). The force supply unit and the control unit are inputted according to various sensors (for example, Sensors 7 2 (1) to 7 2 (η)) can also be installed in the application unit 7 4 with various measurement or monitoring circuits that perform the required signal processing, etc. Consumption by employees of the Intellectual Property Bureau of the Ministry of Economic Affairs The cooperative prints that there is a horizontally movable and liftable stage 7 6 provided in the cleaning processing chamber 6 8 for supporting the substrate G and supporting it. In this embodiment, the self-propelled screw 7 8 is used. The mounting stage driving part 80 enables the mounting stage 76 to be mounted in a vertical direction (Z direction in the figure), and the 'mounting stage driving part 80 will move along the screw 7 8 and the guide member 8 2 extending parallel thereto. It can move back and forth in the predetermined horizontal direction ((direction in the figure), that is, the original paper size that can cross-cut (parallel to the direction in which the lamps are aligned) in the lamp room 6 6 applies the Chinese National Standard (CNS) Α4 specification (210 × 297) (Centi) -15- 495842 Μ _________ Β7_ 5. Description of the invention (the way below d to move back and forth. At this moment the speed of movement is variable control speed 0 (Please read the precautions on the back before filling this page) in the bearing platform 7 6 Vertical penetrations are: When loading / unloading the substrate G, a plurality of lifting pins (for example, 6) which are supported in a horizontal posture are provided 8.  4. In this embodiment, each lifting pin 8 4 is fixed at a predetermined height position for substrate transfer, and these fixed lifting pins 8 4 can be lifted and lowered on the supporting table 7 6 by a lifting mechanism (not shown). The lower limit height position H b for retreating to prevent the carrying in / out of the substrate G is between the upper limit height position H a (shown by a dotted line) on which the support base 7 6 itself is placed for supporting the substrate G. Further, a plurality of support pins (not shown) for supporting the substrate G and a vacuum chuck suction (not shown) for attracting and holding the substrate G are provided on the upper surface of the stage 76. An opening / closing baffle for carrying in and out of the substrate G at a position near the upper end of the fixed lifting pin 8 4 is attached to a side wall of the cleaning processing chamber 68 adjacent to the Y-direction origin position of the stage 7 6. (Gate) 8 6. This baffle 86 is a conveyance path 36 for the washing procedure department 22 (printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economy 1), and the main conveying device 3 8 can be accessed through the open baffle 8 6 The substrate G is carried into the cleaning processing chamber 68 on the transfer path 36, and the substrate G is carried out from the cleaning processing chamber 68. Next, the control system configuration of this ultraviolet irradiation unit (UV) is demonstrated with reference to FIG. The control unit 88 may be constituted by a microcomputer, and a built-in memory and a body store required programs for controlling the units and the entire unit in the unit, and are connected to the entire integrated image development processing system through an appropriate interface. The main controller of the processing program (not shown) and the standard of this UV paper are applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) _ '-16- 495842 Α7 Β7 V. Description of the invention (14) Irradiation unit Each part of the control system in (UV). (Please read the precautions on the back before filling this page.) In this embodiment, the main part of the ultraviolet irradiation unit (UV) related to the control unit 8 8 is: a baffle for driving the baffle 8 6 The driving part 90 is provided for the loading and unloading driving part 9 2 for driving the loading platform 76 in the Z direction, and the scanning driving part 9 4 is used for horizontally driving or scanning driving the loading platform 76 in the Y direction for individual points. The lamp drives the lamp power supply unit 96 of the ultraviolet lamps 6 4 (1) to 6 4 (η) in the lamp room 6 6 for individually monitoring the lighting status of these ultraviolet lamps 6 4 (1) to 6 4 (η). Lamp monitoring section 9 8 and so on. Further, each of the stage lifting driving section 92 and the scanning driving section 94 has a driving source (for example, a servo motor), and is provided in the stage driving section 80. The lamp power supply unit 96 and the lamp monitoring unit 98 are provided in the application unit 74 together with the control unit 8 8. Fig. 5 is a schematic diagram showing an example configuration of one of the lamp power supply section 96 and the lamp monitoring section 98. The lamp power supply section 96 includes a commercial AC power supply 100, and power terminals electrically connected to the AC power supply 100 and each of the ultraviolet lamps 6 4 (1) to 6 4 (η) in the lamp room 66. The switches between the electrode terminals 10 2 (1) to 1 0 2 (η). In addition, the employees' cooperatives printed by the Intellectual Property Bureau of the Ministry of Economic Affairs of each shutter printed 10 2 (1) to 10 2 (η) are individually performed according to control signals G 1 to G η from the control unit 88. FF control. In this way, the lamp power supply unit 96 can be used to individually control the turning on / off of all the ultraviolet lamps 6 4 (1) to 6 4 (η) in the lamp room 66. The lamp monitoring unit 9 8 includes a light sensor 7 2 (1) to 7 that receives ultraviolet light from each of the ultraviolet lamps 6 4 (1) to 6 4 (η) in the lamp room 66 and converts them into electrical signals. 2 (η), and the Chinese paper standard (CNS) A4 specification (210X 297 mm) is applied according to the light-sensing paper size. -17- 495842 A7 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs (1) to 72 (η) The output signals L1 to Ln are used to measure or estimate the brightness of each UV lamp 6 4 (1) to 6 4 (η) to determine the light-emitting state of the photometric circuit 104. An appropriate light-shielding portion 10 6 is provided around each light sensor 7 2 (i) in the room. The light-shielding portion 106 can allow each light sensor 7 2 (corresponding ultraviolet lamp 6 4 (i)). UV light can be received selectively or intensively than UV light from other purple lamps. Next, the main operation procedure of this UV irradiation unit (u) will be described with reference to Fig. 6. First, the instruction unit from the main controller is accepted. Each part (including the control part 8 8) is initialized (Step A 1 In this initialization, the The stage 76 is positioned at a predetermined origin position of the receiving plate 86 in the Y direction, and is lowered in the z direction to the retreat position (H b). In addition, the control unit 88 can move the stage 76 to the Y position. The speed in the direction, that is, the initial speed of the scanning speed, is set in a predetermined register based on the scanning speed F s used when the ultraviolet 64 (1) to 64 (η) are all normal. Device 3 8 (picture 1) transfers the substrate G before processing from the cassette station (c / S) 10 to the ultraviolet irradiation unit (υ ν). Transfer between the conveying device 38 and the substrate G (step a 2). More specifically, the control unit 88 will first output a control signal for opening the shutter 86 to the shutter driving unit 90, and the shutter The plate 86 is opened. In addition, the main transfer device 38 has a pair of transfer arms, so that the substrate G before cleaning is carried on one transfer arm, and the other transfer arm is left empty (baseless measurement condition, outside line V). ) Indicates,) ° The height of the near gear is moved by the line of light-{Please read the precautions on the back before filling in this page) Order ... This paper ruler Applicable to China National Standard (CNS) A4 specifications (210x297), -18-495842 A7 __________ B7_ V. Description of the invention (16 > (Please read the precautions on the back before filling this page) board) toward the UV The unit (UV) moves. When the ultraviolet rays irradiate the substrate g that has not been cleaned in the unit (UV), the transport arm supporting the substrate G before cleaning is stretched through the baffle 8 6 that is kept open. In the cleaning processing chamber 6 8, the uncleaned substrate G is transferred to the upper surface of the fixed lifting pin 8 4. When the cleaned substrate G is contained in the ultraviolet irradiation unit (UV), the cleaned substrate G is initially carried out with an empty transfer arm, and then the uncleaned substrate G is carried in as described above. In this way, once the substrate G to be subjected to the ultraviolet cleaning treatment in the ultraviolet irradiation unit (UV) is carried into the fixed lifting pin 8 4 by the main transfer device 38, the shutter 8 6 is closed. Next, the control unit 88 controls the stage lifting drive unit 92 to raise the stage 76 to the height position H a for substrate placement (step A 3). At this moment, during the ascent of the stage 76, the vacuum chuck will start to be attracted. When the stage 76 reaches the height position H a for substrate placement, the substrate G can be attracted and held at the same time. Secondly, the control section 88 will be turned on. The entire shutter of the lamp power supply unit 96 is 102 (1) to 102 (η), and the entire UV lamp 64 (printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 1) ~ 6 4 (η) points Starting (step A 4). Then, the light emitting states of each of the ultraviolet lamps 6 4 (1) to 6 4 (η) are individually checked based on the photometric or monitoring information from the photometric circuit 1 0 4 of the lamp monitoring unit 98, and the ultraviolet rays are performed based on the inspection results. Change of predetermined parameters (such as scanning speed, irradiation time, etc.) for ultraviolet cleaning processing of the irradiation unit (UV) (step A 5). Figure 7 shows the parameter change processing of this embodiment (step A 5 paper size). Applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) I ~ -19- 495842 A7 ___B7 V. Description of the invention (17) (Please read the precautions on the back before filling this page)) detailed procedures. First, the ultraviolet illuminance of each of the photo sensors 72 (1) to 72 (η) is measured in the lamp chamber 66 (step B1). Since each light sensor 7 2 (1) to 7 2 (η) selectively or focusedly receives ultraviolet light from the corresponding ultraviolet lamp 6 4 (1) to 6 4 (η), each light sensor The ultraviolet illuminance received by the detectors 7 2 (1) to 7 2 (η) is proportional to the brightness of the corresponding ultraviolet lamps 6 4 (1) to 6 4 (η). Therefore, the brightness of each UV lamp 6 4 (1) to 6 4 (η) can be taken out from the output signals L1 to Ln of each of the light sensors 7 2 (1) to 72 (η). B 2), to determine whether the use is lower than the lower limit 値, that is, to determine whether the use is appropriate (step B 3). When the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs printed the above-mentioned lamp monitoring inspection (steps B 1 to B 3) when it was found that there was an ultraviolet lamp 6 4 (i) whose brightness was below a certain lower limit (including the state of no lighting) , This ultraviolet lamp 6 4 (i) will be regarded as an abnormal lamp with poor light emission, and then the current switch 1 0 2 (i) in the lamp power supply section 9 6 will be switched to 0FF state, and the control section 8 8 will The control suspends the use of the abnormal light 6 4 (i) (step B 4). Here, even if you do not light, use a part of the UV lamp (. i), it is still possible to modify a predetermined parameter (scanning speed, etc.) in the ultraviolet irradiation treatment (step A 6) of the next process, so that a sufficient ultraviolet irradiation amount (light amount) can be given to the substrate G (step B 5). For example, in a configuration including three ultraviolet lamps 6 4 (1) to (3), when one lamp 6 4 (1) has a poor inspection result, the control unit 88 will turn off the lamp power unit 9 6. Shutter 1 0 2 (1) This paper size applies Chinese National Standard (CNS) A4 (210X297 mm) -20-Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 495842 A7 B7 V. Description of the invention (18), and The power supply to the lamp 6 4 (1) is stopped. Then, with respect to the substrate G on the stage 7 6, the ultraviolet irradiation amount of the remaining ultraviolet lamps 6 4 (2) to 64 (η) in a normal state is not lower than a predetermined lower limit 値 which can ensure the processing quality. The scanning speed of the ultraviolet irradiation process is corrected to a speed F k which is slower by a predetermined ratio than the reference speed when the entire lamp is normal. Roughly speaking, the number of lamps used will be reduced from three to two during normal operation. Therefore, the scanning speed F k can be corrected to be two-thirds of the reference speed F s in a manner that the ultraviolet irradiation time is 3/2 times. Times. More finely, it is possible to control the brightness of the normal lights 6 4 (2), 6 4 (3). For example, when the brightness of the normal lamps 64 (2) and 64 (3) is lower than the initial threshold at the beginning of use, in order to compensate for the low brightness, the speed can be reduced to obtain the correction scanning speed F k. Then, the obtained corrected scanning speed F k is replaced with the reference scanning speed F s set in the initializing (step A 1). When no abnormal lamp is found in the lamp monitoring inspection (steps B1 to B3), the reference scanning speed Fs set in the initialization (step A1) is adopted (maintained) as it is (step B6). Next, in FIG. 6, after the above-mentioned parameter changing process (step A 5) is completed, the substrate G is subjected to an ultraviolet cleaning process (step A 6). In order to perform this ultraviolet cleaning process, the control unit 88 will make the carrier stage 7 6 unidirectional between the origin position and the moving position shown by the dotted line 7 6 ′ by the scanning drive unit 94 of the carrier stage driving unit 80. Move or back and forth in the Y direction. By moving the loading platform 76 in the Y direction, the substrate G on the loading platform will be at a predetermined height position Ha directly below the lamp room 66 (that is, the Chinese national standard (CNS) A4 specification (210X297) applies to this paper size) Mm) Order H (Please read the precautions on the back before filling this page) -21- 495842 A7 __B7 V. Description of the invention (19) (Please read the precautions on the back before filling this page; > Quartz glass window 6 2 at a predetermined interval) transverse to the Y direction, so that the ultraviolet rays (wavelength 17 2 nm) emitted from the quartz glass window 62 of the lamp chamber 6 6 toward a substantially vertical downward direction can be scanned from one end of the substrate G to the other end ( γ direction) to irradiate the entire substrate surface. In this way, the substrate G can be irradiated with ultraviolet rays having a wavelength of 17 2 nm, so that oxygen existing near the substrate surface can be converted into ozone by the ultraviolet rays, and ozone 03 will This ultraviolet light excites and generates an oxygen atom group 0 *. This oxygen group is used to decompose organic matter adhering to the surface of the substrate G into carbon dioxide and water to remove it from the surface of the substrate. In the ultraviolet cleaning process of the scanning method in this way The amount of ultraviolet irradiation or light on the substrate G is inversely proportional to the moving speed (scanning speed) F of the stage 76. That is, the faster the scanning speed F, the shorter the ultraviolet irradiation time on the substrate g. In contrast, the slower the scanning speed F is, the longer the ultraviolet irradiation time on the substrate G is, and the more the ultraviolet irradiation amount is. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. When the light emitting states of the ultraviolet lamps 6 4 (1) to 6 4 (η) are all normal, of course, the expected cleaning effect can be ensured, but even if some of the lamps are not emitting normally, the above parameter change processing (steps) A 5) to set the most appropriate scanning speed F (in accordance with the current light-emitting state of the normal lamp), so that the substrate g can be irradiated with a required and sufficient amount of ultraviolet light to ensure the desired cleaning effect. Therefore, in this ultraviolet In the irradiation unit (UV), it is possible to continue the proper ultraviolet cleaning without stopping the operation. Here, when one of the abnormal lamps 6 4 (i) with poor light emission is detected, the paper ruler is detected. Applicable to China National Standard (CNS) A4 specification (21〇297297) 22- 495842 A7 ____B7 V. Description of the invention (20) 'Control section 8 8 can also be accessed via display or buzzer (not shown) To send an alarm message or signal (informing of abnormal or fault conditions). (Please read the precautions on the back before filling this page} If the UV cleaning of substrate G is completed, the control unit 88 will turn off the lamp power supply unit 96 The entire shutters 102 (1) to 102 (η) are turned off, and the entire ultraviolet lamps 64 (1) to 64 (η) are turned off (step A 7). Next, after the vacuum chuck is brought to an FF state at the origin position in the Y direction, the stage 76 is lowered to the retreating height position Hb by the stage elevation driving section 92 (step A8), and the substrate G is supported at Fixed lifting pin 8 4. This completes the entire process of one substrate G in the ultraviolet irradiation unit (UV) and waits for the arrival of the main transfer device 38 (Fig. 1). As described above, in this embodiment, even if a part of the ultraviolet lamp 64 in the lamp room 66 fails to emit light, an appropriate ultraviolet cleaning treatment operation can be continued, so it is possible to stably maintain the requirements of the ultraviolet irradiation unit (UV). Production capacity, which in turn can ensure the production capacity of this coating development processing system. In addition, since a lamp with poor light emission can be replaced with a normal lamp during regular maintenance, it can be stored in a planned manner. The Intellectual Property Bureau of the Ministry of Economic Affairs 8 (printed by the industrial and consumer cooperatives. In the above embodiment, although the lamp power supply unit 96 supplies a certain amount of AC power to each ultraviolet lamp 6 4 (1) to 6 4 (η), It is also possible to use a lamp power supply device (not shown) for supplying electric power to each of the ultraviolet lamps 6 4 (1) to 6 4 (η). In this case, the above parameter changing process (step A 5) can be used The parameters set by the line can also use the lamp power or lamp brightness. That is, as described above, when abnormal light failure is found in the lamp monitoring inspection of steps B 1 to B 3, the paper size can be controlled to apply to China. Standard (CNS) A4 specification (210X297 mm) -23- 495842 A7 _______B7_ V. Description of invention (21) (Please read the precautions on the back before filling this page) Part 8 8 to suspend the use of the abnormal lamp, by The correction of the lamp power input or the lamp brightness allows the substrate G to be given a sufficient amount of ultraviolet irradiation (light amount) during the ultraviolet irradiation process, and thus the same effect can be obtained. Also, in the above embodiment, the ultraviolet irradiation process The parameters that can be set again by the above parameter changing process (step A 5) can also use ultraviolet irradiation time. That is, as described above, when abnormal light failure is found in the lamp monitoring and inspection of steps B 1 to B 3 The control unit 88 can be used to stop the use of the abnormal lamp, and the ultraviolet irradiation time can be corrected to allow the substrate G to be given sufficient ultraviolet irradiation amount (light amount) in the ultraviolet irradiation process, so that the same effect can be obtained as such. In the above-mentioned embodiment, although the scanning method is adopted in which the ultraviolet lamps 6 4 (1) to 6 4 (η) are fixed and the substrate G side is moved parallel to the lamp alignment direction, a substrate may also be used. A scanning method in which the G side is fixed at a predetermined position and the UV lamp 6 4 (1) to 6 4 (η) side moves parallel to the substrate surface. The scanning driving mechanism is not limited to a screw mechanism, and may be a belt type or a roller. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, it is not limited to scanning methods, but can also be arranged opposite to the fixed UV lamp 6 4 (1) to 64 (η) and the substrate G. In this case, the parameters that can be set again by the above-mentioned parameter changing process (step A 5) can adopt the above-mentioned ultraviolet irradiation time or lamp input power, etc., and can also be installed in the lamp room 6 6 of the ultraviolet lamp 6 Part of 4 (1) to 6 4 (η) is used as a preparation lamp, and it is left unused under normal conditions, and when other lamps fail to emit light, the use of the defective lamp is stopped. This paper applies Chinese national standards (CNS) ) Α4 size (210 × 297 mm) > -24- 495842 Α7 B7 5. Description of the invention (22), replaced by a reserve lamp. In this case, you can change the combination of UV lamps used for lighting as a parameter. (Please read the precautions on the back before filling this page.) Also, the parameters can be set by the above parameter change processing. Although it is used alone, it is also possible to use a combination of two or more groups of parameters. For example, both the scanning speed and the ultraviolet irradiation time may be set. In the above-mentioned embodiment, the lighting use of the lamp with poor light emission is stopped. That is, because such an abnormal lamp cannot be controlled substantially, that is, the ultraviolet irradiation amount from the lamp room 66 cannot be managed according to the setting, it is best to exclude it from the used lamp group, but if the safety surface There is no special problem, and the abnormal light can also be used continuously according to the needs of changing the above parameters. In addition, even if 尙 does not reach the level of the abnormal lamp, and only it is confirmed that the brightness of the lamp has decreased, the parameter can be corrected. This type of control is not limited to the case where a plurality of lamps are provided, and it can also be applied to a case where one is installed. Even if the plurality of lamps are provided, it can be performed under individual monitoring light-emitting states. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, and in order to maximize the continuous operation of the ultraviolet irradiation unit (UV), it is also suitable for each ultraviolet lamp 6 4 (1) ~ in the lamp room 6 6 6 4 (η) installation and removal structure, such as a modular lamp unit or housing (not shown). When the use of the abnormal lamp is stopped, even if the remaining normal lamps are turned on with all the maximum input power, the ultraviolet irradiance to the substrate G may be lower than a predetermined lower limit to ensure a desired cleaning effect. Therefore, when the correction parameters are also invalid, the required alarm information can also be issued to stop the operation of the ultraviolet irradiation unit (U V). This paper size is applicable to Chinese National Standard (CNS) A4 specification (210 X 297 mm) -25- 495842 A7 B7 V. Description of the invention (23) Inside the lamp room 6 6 or cleaning treatment room 6 8 The structure of the UV lamp is especially 64 (1) ~ 64 (η), and the load is ^ (Please read the precautions on the back before filling in this page) 7 6 'The structure of the drive unit 80, etc. is an example. Various changes are made in each part. The above-mentioned embodiment is related to an ultraviolet irradiation cleaning device (υ ν). However, the substrate processing apparatus of the present invention can also be applied to a purpose other than the removal of organic contamination, and processes in which ultraviolet rays are irradiated to a substrate to be processed. For example, in the above-mentioned coating development processing system, in the process of irradiating ultraviolet rays to the substrate G for the purpose of hardening the photoresist after the post-baking treatment (step s3), the same as the above embodiment can be used. UV irradiation device. In addition, the substrate to be processed in the present invention is not limited to L CD, but may be a semiconductor wafer, a CD substrate, a glass substrate, a photomask, a printed substrate, or the like. [Effects of the invention] As described above, printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, if the present invention is used, even if the ultraviolet lamp has abnormal light emission, it can continue to perform normal ultraviolet irradiation treatment, so that it can be avoided. Reduced production capacity. And, even if a part of the ultraviolet lamp is not emitting well, It is not necessary to stop the operation immediately, so that it can be stored in a planned manner. [Brief Description of Drawings] Fig. 1 is a plan view showing the configuration of a coating development processing system applicable to the substrate processing apparatus of the present invention. Figure 2 shows the processing procedure of the smear development processing system according to the embodiment. The paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -26- 495842 A7 B7 V. Description of the invention (24) Sequence flow chart . Fig. 3 is a perspective view showing a configuration of an ultraviolet irradiation unit according to the embodiment. Fig. 4 is a block diagram showing a configuration of a main control system of the ultraviolet irradiation unit according to the embodiment. Fig. 5 is a diagram showing a configuration example of a lamp power supply unit and a lamp monitoring unit of the ultraviolet irradiation unit according to the embodiment. Fig. 6 is a flowchart showing a main operation procedure of the ultraviolet irradiation unit according to the embodiment. Fig. 7 is a flowchart showing a detailed procedure of parameter changing processing of the ultraviolet irradiation unit according to the embodiment. — 1 ^ 1 ----- LP! (Please read the notes on the back before filling out this page) Order printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs [Description of Symbols] 3 8: Main conveying device UV: UV irradiation Unit 6 2: Quartz glass windows 64 (1), 64 (2), ..., 64 6 6: Lamp room 6 8: Washing treatment room 72 (1), 72 (2), 72, 6 7: Stage 7 8: Screw 80: Stage driving section 8 2: Guide member: Ultraviolet lamp: Light sensor Φ.  This paper size applies to Chinese National Standard (CNS) A4 (210X297 mm) -27-495842 A7 B7 V. Description of the invention (25) 8 4: Fixed lifting pin section, moving source drive, power down section, 1 road lifting section Traffic, the Ministry of the Ministry of Electric Power and the Ministry of Vision} light board on-board tracing electricity monitors 1 gear control scanning lamp: {: • · · · · · · 0. 013 2 //-* 68246800 device ο 88999911 closed 1 2ο

開 η /IV 2ο IX (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ29?公釐) -28-On η / IV 2ο IX (Please read the precautions on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs This paper applies the Chinese National Standard (CNS) A4 specification (210 × 29? Mm) -28-

Claims (1)

495842 A8 B8 C8 D8 六、申請專利範圍 1 . 一種基板處理裝置,是屬於一種供以將紫外線照 射於被處理基板而來進行預定的處理之基板處理裝置,其 特徵是具有: (請先閲讀背面之注意事項再填寫本頁) 一支撐機構;該支撐機構是供以支撐上述被處理基板 ;及 一紫外線照射機構;該紫外線照射機構是具備複數個 接受電力的供給而來發射紫外線的燈,且將由上述燈所發 射出的紫外線照射於上述被處理基板;及 一燈監視機構;該燈監視機構是供以個別監視上述複 數値燈的各發光狀態;及 一控制機構;該控制機構是供以根據來自上述燈監視 機構的監視資訊來控制上述紫外線照射處理的預定參數。 2 ·如申請專利範圍第1項之基板處理裝置,其中具 有一驅動機構,該驅動機構是供以使上述支撐機構及上述 燈的其中一方或雙方移動於預定方向,而使來自上述紫外 線照射機構的紫外線能夠掃描被支撐於上述支撐機構上的 上述被處理基板的被處理面。 經濟部智慧財產局員工消費合作社印製 3 ·如申請專利範圍第2項之基板處理裝置,其中上 述控制機構具有掃描速度控制機能,該掃描速度控制機能 是根據來自上述燈監視機構的監視資訊來可變控制上述掃 描的速度。 4 ·如申請專利範圍第3項之基板處理裝置,其中上 述控制機構是在其中之一上述燈的發光狀態異常的監視資 訊由上述燈監視機構所測出時,會以能夠中止該異常燈之 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 495842 A8 B8 ' C8 D8 六、申請專利範圍 ^ ^ 方式來控制上述紫外線照射機構,同時根據該上述掃描速 度控制機能來設定成:使上述掃描速度形成只比預定的基 準値慢預定比例的値。 (請先閲讀背面之注意事項再填寫本頁} 5·如申請專利範圍第1項之基板處理裝置,其中上 述控制機構具有紫外線照射時間控制機能,該紫外線照射 時間控制機能是根據來自上述燈監視機構的監視資訊來可 變控制上述紫外線的照射時間。 6 ·如申請專利範圍第5項之基板處理裝置,其中上 述控制機構是在其中之一上述燈的發光狀態異常的監視資 訊由上述燈監視機構所測出時,會以能夠中止該異常燈之 方式來控制上述紫外線照射機構,同時根據該上述紫外線 照射時間控制機能來設定成:使該上述紫外線照射時間形 成只比預定的基準値長預定比例的値。 7 ·如申請專利範圍第1項之基板處理裝置,其中上 述控制機構具有燈亮度控制機能,該亮度控制機能是根據 來自上述燈監視手段的監視資訊來個別控制上述燈的亮度 〇 經濟部智慧財產局員工消費合作社印製 8 ·如申請專利範圍第7項之基板處理裝置,其中上 述控制機構是在其中之一上述燈的發光狀態異常的監視資 訊由上述燈監視機構所測出時,會以能夠中止該異常燈之 方式來控制上述紫外線照射機構,同時根據該上述燈亮度 控制機能來設定成:使正常狀態之上述燈的亮度形成只比 預定的基準値高預定比例的値。 9 ·如申請專利範圍第1項之基板處理裝置,其中上 本紙張尺度逋用中國國家標準(CNS ) A4規格(210X297公瘦1 -30- 495842 A8 · B8 C8 D8 六、申請專利範圍 (請先閲讀背面之注意事項再填寫本頁) 述控制機構具有投入電力控制機能,該投入電路控制機能 是根據來自上述燈監視機構的監視資訊來個別對上述燈控 制投入電力。 1 〇 ·如申請專利範圍第9項之基板處理裝置,其中 上述控制機構是在其中之一上述燈的發光狀態異常的監視 資訊由上述燈監視機構所測出時,會以能夠中止該異常燈 之方式來控制上述紫外線照射機構,同時根據該上述投入 電力控制機能來設定成:使正常狀態之投入上述燈的電力 形成只比預定的基準値高預定比例的値。 1 1 ·如申請專利範圍第1項之基板處理裝置,其中 以上述紫外線照射機構的上述複數個燈中的一部份作爲預 備燈來保持於非點燈使用狀態,其他其中之一上述燈的發 光狀態爲異常的監視資訊由上述監視機構所測出時,上述 控制機構會取代該異常燈,而以能夠點燈使用上述預備燈 之方式來控制上述紫外線照射機構。 經濟部智慧財產局員工消費合作社印製 1 2 · —種基板處理裝置,是屬於一種供以將紫外線 照射於被處理基板而來進行預定的處理之基板處理裝置, 其特徵是具有: 一支撐機構;該支撐機構是供以支撐上述被處理基板 ;及 一紫外線照射機構;該紫外線照射機構是具備接受電 力的供給而來發射紫外線的燈,且將由上述燈所發射出的 紫外線照射於上述被處理基板;及 一燈監視機構;該燈監視機構是供以個別監視上述燈 本紙張从適用巾關家樣準(CNs ) Μ規格(210x297公釐) · 一 -31 - 495842 A8 B8 C8 ___ _ D8 六、申請專利範圍 的發光狀態;及 (請先閲讀背面之注意事項再填寫本頁) 一控制機構;該控制機構是供以根據來自上述燈監視 機構的監視資訊來控制上述紫外線照射處理的預定參數。 1 3 · —種基板處理方法,是屬於一種供以由複數個 燈來將紫外線照射於被處理基板而來進行預定的處理之基 板處理方法,其特徵是具有: 個別監視上述複數個燈的發光狀態之過程;及 根據上述監視過程的監視資訊來控制紫外線照射處理 的預定參數之過程。 14·一種基板處理方法,是屬於一種供以由複數個 燈來將紫外線照射於被處理基板而來進行預定的處理之基 板處理方法,其特徵是具有: 個別監視上述複數個燈的發光狀態之過程;及 在上述監視的過程中,任何上述燈的發光狀態被確認 出爲異常時,控制紫外線照射處理的預定參數,使能夠停 止該異常燈的使用,而藉由殘餘的燈來進行正常照射之過 程。 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐)495842 A8 B8 C8 D8 6. Scope of patent application 1. A substrate processing device is a substrate processing device for performing predetermined processing by irradiating ultraviolet rays to a substrate to be processed, which is characterized by: (Please read the back first (Notes on this page are to be completed on this page) A support mechanism; the support mechanism is used to support the substrate to be processed; and an ultraviolet irradiation mechanism; the ultraviolet irradiation mechanism is provided with a plurality of lamps that emit ultraviolet rays by receiving a supply of electric power, and Irradiating the ultraviolet light emitted by the lamp to the substrate to be processed; and a lamp monitoring mechanism; the lamp monitoring mechanism is used to individually monitor each light-emitting state of the plurality of chirped lamps; and a control mechanism; the control mechanism is provided for The predetermined parameters of the ultraviolet irradiation process are controlled based on monitoring information from the lamp monitoring mechanism. 2 · The substrate processing apparatus according to item 1 of the scope of patent application, which has a driving mechanism for moving one or both of the supporting mechanism and the lamp in a predetermined direction, so that the ultraviolet irradiation mechanism comes from the ultraviolet irradiation mechanism. The ultraviolet rays can scan the processing surface of the processing target substrate supported on the supporting mechanism. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs3. If the substrate processing device of the second scope of the patent application, the above-mentioned control mechanism has a scanning speed control function, which is based on the monitoring information from the above-mentioned lamp monitoring mechanism. The speed of the scanning can be controlled variably. 4 · If the substrate processing device of item 3 of the patent application scope, wherein the above-mentioned control mechanism is one of the above-mentioned lamps, the monitoring information of the light-emitting state abnormality is detected by the above-mentioned lamp monitoring mechanism, and the abnormal light can be suspended. This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) 495842 A8 B8 'C8 D8 VI. Application for patent scope ^ ^ The way to control the above-mentioned ultraviolet irradiation mechanism, and at the same time set according to the above-mentioned scanning speed control function: The above-mentioned scanning speed is made to be slower than a predetermined reference frame by a predetermined ratio. (Please read the precautions on the back before filling in this page} 5. If the substrate processing device of the first patent application scope, the above control mechanism has the function of controlling the ultraviolet irradiation time, which is based on the monitoring from the lamp The monitoring information of the mechanism can be used to variably control the above-mentioned ultraviolet irradiation time. 6 · For the substrate processing device of the scope of patent application No. 5, wherein the control mechanism is one of the monitoring information of the abnormal light emitting state of the lamp, which is monitored by the lamp. When measured by the mechanism, the ultraviolet irradiation mechanism is controlled in such a manner that the abnormal lamp can be stopped, and at the same time, the ultraviolet irradiation time control function is set to make the ultraviolet irradiation time longer than a predetermined reference time. Proportion 値. 7) The substrate processing device according to item 1 of the patent application range, wherein the control mechanism has a lamp brightness control function, and the brightness control function is to individually control the brightness of the lamp according to the monitoring information from the lamp monitoring means. Employee Consumption of Intellectual Property Bureau, Ministry of Economic Affairs Printed by Sakusho 8 · If the substrate processing device of the scope of patent application No. 7 is applied, the above-mentioned control mechanism is one of which the monitoring information of the abnormal light emitting state of the lamp is detected by the above-mentioned lamp monitoring mechanism, so that it can be suspended The abnormal lamp mode controls the ultraviolet irradiation mechanism, and at the same time, the brightness control function of the lamp is set to set the brightness of the lamp in a normal state to a predetermined ratio 预定 higher than a predetermined reference 値. The substrate processing device of the first item, in which the upper paper size adopts the Chinese National Standard (CNS) A4 specification (210X297 male thin 1 -30- 495842 A8 · B8 C8 D8) 6. Scope of patent application (please read the note on the back first) (Please fill in this page again for details) The control mechanism has the function of power input control, and the input circuit control function is based on the monitoring information from the lamp monitoring mechanism to individually control the input power to the lamp. The substrate processing apparatus, wherein the control mechanism is one of the monitoring information for abnormal light emission states of the lamp When measured by the lamp monitoring mechanism, the ultraviolet irradiation mechanism is controlled in such a manner that the abnormal lamp can be stopped, and at the same time, it is set based on the input power control function so that the power input to the lamp in a normal state is only compared with that of the lamp. The predetermined reference 値 is higher than the predetermined ratio 1 1 1 · The substrate processing apparatus according to item 1 of the patent application scope, wherein a part of the plurality of lamps of the ultraviolet irradiation mechanism described above is maintained as a non-lighting lamp. In use status, one of the other monitoring information of the light emitting state of the lamp is abnormal. When the monitoring mechanism measures the monitoring information, the control mechanism will replace the abnormal lamp and control the ultraviolet rays in a manner capable of lighting and using the preparatory lamp. Irradiation mechanism. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. 1 ·· A substrate processing device is a substrate processing device for irradiating ultraviolet rays to a substrate to be processed for predetermined processing. The characteristics are: A support mechanism; the support mechanism is for supporting the substrate to be processed; and a purple Outside light irradiating mechanism; the ultraviolet irradiating mechanism is provided with a lamp that emits ultraviolet rays by receiving the supply of electric power, and irradiates the ultraviolet rays emitted from the lamp to the substrate to be processed; and a lamp monitoring mechanism; Individually monitor the above-mentioned papers from the applicable towels (CNs) M specifications (210x297 mm) · -31-495842 A8 B8 C8 ___ _ D8 VI. The light-emitting state of the scope of patent application; and (Please read the back first (Notes to fill in this page again) a control mechanism; the control mechanism is used to control the predetermined parameters of the ultraviolet irradiation process according to the monitoring information from the lamp monitoring mechanism. 1 3 · A substrate processing method belongs to a substrate processing method for performing predetermined processing by irradiating ultraviolet rays on a substrate to be processed by a plurality of lamps, and is characterized in that: the light emission of the plurality of lamps is individually monitored; A state process; and a process of controlling predetermined parameters of the ultraviolet irradiation process based on the monitoring information of the above-mentioned monitoring process. 14. A substrate processing method, which belongs to a substrate processing method for performing predetermined processing by irradiating ultraviolet rays on a substrate to be processed by a plurality of lamps, and comprising: individually monitoring the light-emitting states of the plurality of lamps; Process; and during the above-mentioned monitoring process, when any of the above-mentioned lamps is confirmed to be abnormal, the predetermined parameters of the ultraviolet irradiation treatment are controlled so that the use of the abnormal lamp can be stopped and the remaining lamps are used for normal irradiation Process. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs This paper is sized to the Chinese National Standard (CNS) A4 (210X297 mm)
TW090110980A 2000-05-25 2001-05-08 Substrate treating device and substrate treating method TW495842B (en)

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