505959 A7 B7 五、發明説明（1 ) 【發明領域】 (請先閲讀背面之注意事項再填寫本頁) 本發明係關於在例如液晶顯示裝置（LCD)用的玻璃基板 等的基板上形成光阻膜等的膜之前照射紫外線，對進行洗 淨處理的基板處理裝置以及基板照射紫外線在進行洗淨處 理後於基板上形成膜的膜形成裝置。 【發明背景】 【習知技藝之說明】 一般液晶顯示裝置（LCD)的製造工程爲了在玻璃基板的 表面形成例如ITO(銦錫氧化物，Indium Tin Oxide)的薄膜 或電路圖案（Pattern)，利用與半導體製造工程的情形一樣的 微影（Photolithography)技術。這種情形例如藉由光阻液塗佈 處理在玻璃基板表面塗佈光阻液，藉由曝光處理在玻璃基 板上的光阻膜使電路圖案曝光，藉由顯影處理使曝光於光 阻膜的電路圖案顯影。 經濟部智慧財產局員工消費合作社印製 在LCD的製造中，以LCD用的玻璃基板表面被淸淨化的 狀態爲前提進行各種處理。因此，在各處理前或各處理的 空檔進行被處理基板表面的洗淨，例如在微影工程於光阻 塗佈之前洗淨被處理基板的表面。 習知以來用以除去被處理基板表面的有機物之洗淨法 已知有利用紫外線照射的乾式洗淨技術。此紫外線照射洗 淨技術當使甩預定波長（紫外線光源使用低壓水銀燈時爲 185nm、254nm，電介質阻障（Barrier)放電燈爲172nm)的紫外 線使氧激發，藉由生成的臭氧或產生期的氧使基板表面上 ^紙張尺度適用中國國家標準（CNS ) A4規格（210><297公|^ ~ ~~ 505959 A7 B7 五、發明説明（2) 的有機物氧化、氣化而除去。 (请先閱讀背面之注意事項再填寫本頁) 一般用以進行利用這種紫外線照射的乾式洗淨的紫外 線照射洗淨裝置係在具有石英玻璃窗的燈室內，並列收容 一個或複數個成爲紫外線光源的燈，中介該石英玻璃窗在 接鄰燈室的洗淨處理室內配置被處理基板，令由燈室內的 燈發出的紫外線通過該石英玻璃窗，以照射到被處理基板 的被處理面。最近，對被處理基板的被處理面藉由相對地 使燈平行移動在被處理面上掃描紫外線，可謀求燈數的削 減或石英玻璃窗的小型化。 經濟部智慧財產局員工消費合作社印製 可是，在前述紫外線洗淨中，爲了在被處理基板的面 內獲得均等的洗淨效果，需要遍及基板的全面均等地保持 紫外線照射燈的照射面與被處理基板之間的距離，進行紫 外線照射。即若不遍及被處理基板的表面全體均等地照射 的話’會產生洗淨不均無法獲得充分的洗淨效果。但是， LCD的玻璃基板一般爲大型，因此，載置此LCD的玻璃基板 的台也爲大型’故台以及玻璃基板容易產生彎曲。因此， 很難遍及基板的表面全體均等地保持紫外線照射燈的照射 面與被處理基板之間的距離。 另一方面，在如上述的紫外線照射式洗淨裝置中，對 於獲得預期的洗淨效果，需要分別確保由紫外線燈照射到 被處理基板的紫外線照度以及光量於預定値以上，爲了滿 足這種紫外線照射條件規定裝置各部的規格。但是，紫外 線燈的亮度若隨時間變化而降低的話，對被處理基板的紫 外線照度乃至於光量會不足，有招致洗淨不良之虞.。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） e Η 505959 A7 B7_ 五、發明説明（3) 然而，習知的這種裝置並未具備正確地測定被處理基 板中的紫外線照度的手段，或適當地補償紫外線照度變化 (請先閲讀背面之注意事項再填寫本頁) 的手段’很難穩定地維持紫外線洗淨處理的品質以及效率 〇 而且，使用電介質阻障放電燈的裝置由該燈放射的波 長172nm的紫外受激準分子（ExcimeO光非常容易被氧吸收， 由石英玻璃窗射出後到達被處理基板表面的距離大而指數 函數地衰減。因此，最好儘可能地減少兩者（石英玻璃窗與 被處理基板）間的間隙，通常考慮尺寸誤差或機械精度的誤 差，設定成3〜7mm。但是，即使是這種小的間隙，紫外線 的照度也大幅地衰減到數分之一左右，能量效率降低。 經濟部智慧財產局員工消費合作社印製 再者’這種裝置在石英玻璃的外側表面（基板側的表面） 附著因紫外線所產生的反應生成物之現象變成問題。即被 處理基板的表面或附著或飄移於其附近的有機物或藥品等 以紫外線的光能量反應，其反應生成物附著於靠近面對基 板的石英玻璃，成爲白色的析出物，據此，石英玻璃的紫 外線透過特性降低，反應生成物或析出物由石英玻璃剝落 造成微粒（Particle)的原因。 【發明槪要】 本發明係鑒於相關的習知的問題點所進行的創作，其 目的爲提供可遍及基板的表面全體均等地保持紫外線照射 燈的照射面與被處理基板之間的距離，進行均等的紫外線 照射處理之基板處理裝置以及膜形成裝置。 本紙張尺度適用中國國家標準（CNS ) A4規格（210 X 29*7公釐） 505959 A7 B7 五、發明説明（4) (請先閲讀背面之注意事項再填寫本頁) 其他目的爲提供在紫外線照射處理中，適當地管理對 被處理基板的紫外線照度，以穩定地維持處理品質以及效 率的基板處理裝置。 再其他目的爲提供用以有效地自紫外線反應生成物保 .護紫外線照射用的窗構件的基板處理裝置。 如果依照本發明的第一觀點，提供一種基板處理裝置 ，其特徵包含： 台，載置被處理基板； 光照射部’在載置於台上的被處理基板表面照射光； 距離檢測手段，在被處理基板上的複數個點檢測光照 射部的照射面與被處理基板表面之間的距離； 照射距離調節手段，在複數個位置可調節該光照射部 的照射面與被處理基板表面之間的距離；以及 控制手段，根據來自距離該檢測手段的檢測資料，控 制該照射調節手段的動作，其中 藉由來自該光照射部的光照射，對該台上的被處理基 板進行洗淨處理。 經濟部智慧財產局員工消費合作社印製 如果依照本發明的第二觀點，提供一種膜形成裝置， 具備洗淨處理被處理基板表面的洗淨處理部，與藉由在洗 淨後的被處理基板表面塗佈塗佈液以形成膜的膜形成部， 其中該洗淨處理部其特徵包含： 台，載置被處理基板； 光照射部，在載置於台上的被處理基板表面照射光； 距離檢測手段，在被處理基板上的複數個點檢測光照 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐) ~ 505959 A7 _B7_ 五、發明説明（5) 射部的照射面與被處理基板表面之間的距離； (請先閲讀背面之注意事項再填寫本頁) 照射距離調節手段，在複數個位置可調節該光照射部 的照射面與被處理基板表面之間的距離；以及 控制手段，根據來自該距離檢測手段的檢測資料，控 .制該照射調節手段的動作，其中 藉由來自該光照射部的光照射，對該台上的被處理基 板進行洗淨處理。 如果依照本發明的第一觀點以及第二觀點，藉由距離 檢測手段在被處理基板上的複數個點檢測光照射部的照射 面與被處理基板表面之間的距離，根據來自此距離檢測手 段的檢測資料，藉由控制手段因可在複數位置調節該光照 射部的照射面與被處理基板表面之間的距離，故可遍及基 板的表面全體均等地保持光照射部的照射面與基板之間的 距離，獲得充分的洗淨效果。 經濟部智慧財產局員工消費合作社印製 如果依照本發明的第一觀點以及第二觀點，特別是控 制手段使光照射部的照射面與該台上的被處理基板表面之 間的距離遍及基板全面約略均等，以控制照射距離調節手 段的動作較佳。而且，自光照射部照射的光爲紫外線較佳 ，特別是爲紫外受激準分子光較佳。再者，更具備防止台 上的被處理基板表面與光照射部的照射面的接觸之接觸防 止手段也可以。在較佳實施形態中，照射距離調節手段具 有使台升降，調整台的高度之複數個升降軸。而且，照射 距離調節手段具有配設於台上，支持被處理基板的複數個 壓電元件也可以，具有對該台的表面突出陷入，使被處理 本紙張尺度適用中國國家標準（CNS ) A4規格（ 210X297公釐） "505959 A7 B7 V. Description of the invention (1) [Field of invention] (Please read the precautions on the back before filling out this page) The present invention relates to the formation of photoresist on substrates such as glass substrates for liquid crystal display devices (LCD) A film such as a film is irradiated with ultraviolet rays beforehand, and a substrate processing apparatus that performs a cleaning process and a film forming apparatus that irradiates the substrate with ultraviolet rays and performs a cleaning process to form a film on the substrate. [Background of the Invention] [Explanation of Known Techniques] In the general manufacturing process of liquid crystal display devices (LCD), in order to form a thin film or circuit pattern (ITO) such as ITO (Indium Tin Oxide) on the surface of a glass substrate, use Photolithography technology as in the case of semiconductor manufacturing engineering. In this case, for example, a photoresist liquid is applied to the surface of the glass substrate by a photoresist liquid coating process, a circuit pattern is exposed by a photoresist film exposed on the glass substrate, and a photoresist film exposed by a development process is exposed. The circuit pattern is developed. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs In the manufacture of LCDs, various processes are performed on the premise that the surface of the glass substrate for LCDs is cleaned. Therefore, the surface of the substrate to be processed is cleaned before each process or in each processing space, for example, the surface of the substrate to be processed is cleaned before the photolithography process is applied to the photoresist. Conventionally, a cleaning method for removing organic substances on the surface of a substrate to be processed is known as a dry cleaning technique using ultraviolet rays. This ultraviolet irradiation cleaning technology makes the ultraviolet rays excited at a predetermined wavelength (185nm, 254nm when the ultraviolet light source uses a low-pressure mercury lamp, and 172nm for a dielectric barrier (Barrier discharge lamp)). The generated ozone or the oxygen in the production period is excited. Make the paper size on the surface of the substrate conform to the Chinese National Standard (CNS) A4 specification (210 > < 297) | ^ ~ ~~ 505959 A7 B7 V. Description of the invention (2) Organic matter is oxidized and gasified and removed. (Please first (Please read the notes on the back and fill in this page again.) The ultraviolet irradiation cleaning device generally used for dry cleaning using this ultraviolet irradiation is housed in a lamp room with a quartz glass window and houses one or more lamps that become ultraviolet light sources side by side. The quartz glass window interposes the substrate to be processed in the cleaning processing room adjacent to the lamp room, and the ultraviolet light emitted by the lamp in the lamp room passes through the quartz glass window to irradiate the processed surface of the processed substrate. Recently, the By scanning the ultraviolet rays on the processing surface by moving the lamps in parallel to the processing surface of the processing substrate, it is possible to reduce the number of lamps or quartz glass. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. However, in the aforementioned ultraviolet cleaning, in order to obtain an equal cleaning effect on the surface of the substrate to be processed, it is necessary to keep the ultraviolet irradiation lamp uniformly throughout the entire substrate. The distance between the irradiated surface and the substrate to be processed is irradiated with ultraviolet light. That is, if the entire surface of the substrate to be processed is not irradiated uniformly, it will cause uneven cleaning and a sufficient cleaning effect will not be obtained. However, the glass substrate of LCD It is generally large. Therefore, the stage on which the glass substrate on which the LCD is placed is also large. Therefore, the stage and the glass substrate are prone to warp. Therefore, it is difficult to uniformly maintain the irradiation surface of the ultraviolet irradiation lamp and the substrate to be processed throughout the entire surface of the substrate. On the other hand, in the above-mentioned ultraviolet irradiation-type cleaning device, in order to obtain a desired cleaning effect, it is necessary to ensure that the ultraviolet illuminance and the amount of light irradiated by the ultraviolet lamp to the substrate to be processed are more than a predetermined range, In order to satisfy such ultraviolet irradiation conditions, the specifications of each part of the device are specified. However, If the brightness of the outside light decreases with time, the ultraviolet illuminance and even the amount of light on the substrate to be processed will be insufficient, which may cause poor cleaning. This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) ) E Η 505959 A7 B7_ V. Description of the invention (3) However, the conventional device does not have the means to correctly measure the ultraviolet illuminance in the substrate to be processed, or to properly compensate for the change in ultraviolet illuminance (please read the Note: Please fill in this page again.) It is difficult to maintain the quality and efficiency of the ultraviolet cleaning process stably. Also, a device using a dielectric barrier discharge lamp emits ultraviolet excimer (ExcimeO light with a wavelength of 172nm) emitted by the lamp. It is very easy to be absorbed by oxygen, and the distance from the quartz glass window to the surface of the substrate to be processed is large and decays exponentially. Therefore, it is best to reduce the gap between the two (the quartz glass window and the substrate to be processed) as much as possible. Generally, it is set to 3 to 7 mm in consideration of dimensional error or mechanical accuracy error. However, even with such a small gap, the illuminance of ultraviolet rays is greatly attenuated to about a fraction, and energy efficiency is reduced. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. Furthermore, the phenomenon that the reaction products generated by ultraviolet rays adhere to the outer surface of the quartz glass (the surface on the substrate side) becomes a problem. That is, the surface of the substrate to be treated or organic substances or medicines attached or drifting near it reacts with ultraviolet light energy. The reaction products adhere to the quartz glass facing the substrate and become white precipitates. According to this, quartz glass The ultraviolet transmission characteristics of the glass are reduced, and the reaction products or precipitates are exfoliated from the quartz glass and cause particles. [Summary of the Invention] The present invention is made in view of related conventional problems. The purpose of the present invention is to provide a uniform distance between the irradiation surface of the ultraviolet irradiation lamp and the substrate to be processed throughout the entire surface of the substrate. A substrate processing apparatus and a film forming apparatus for uniform ultraviolet irradiation treatment. This paper size applies to Chinese National Standard (CNS) A4 specification (210 X 29 * 7 mm) 505959 A7 B7 V. Description of the invention (4) (Please read the precautions on the back before filling this page) The other purpose is to provide UV light In the irradiation process, a substrate processing apparatus that appropriately manages ultraviolet irradiance to a substrate to be processed to stably maintain processing quality and efficiency. Still another object is to provide a substrate processing apparatus for effectively protecting a window member for ultraviolet irradiation from an ultraviolet reaction product. According to a first aspect of the present invention, there is provided a substrate processing apparatus including: a stage on which a substrate to be processed is placed; a light irradiating portion irradiates light on a surface of the substrate to be processed placed on the stage; A plurality of points on the processed substrate detect the distance between the irradiation surface of the light irradiation part and the surface of the processed substrate; the irradiation distance adjusting means can adjust the distance between the irradiation surface of the light irradiation part and the surface of the processed substrate at a plurality of positions. And a control means for controlling the operation of the irradiation adjusting means according to the detection data from the distance detecting means, wherein the substrate to be processed on the stage is cleaned by irradiation with light from the light irradiation section. According to the second aspect of the present invention, printed by an employee consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs provides a film forming apparatus including a cleaning processing section for cleaning the surface of a substrate to be processed, and a substrate to be processed after cleaning. A film forming portion that applies a coating liquid on the surface to form a film, wherein the cleaning treatment portion includes: a stage on which a substrate to be processed is placed; a light irradiation portion that irradiates light on the surface of the substrate to be treated placed on the stage; The distance detection means detects the light at a plurality of points on the substrate to be processed. The paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) ~ 505959 A7 _B7_ V. Description of the invention (5) The irradiation surface and the substrate of the emitter The distance between the surface of the processing substrate; (Please read the precautions on the back before filling this page) The irradiation distance adjustment means can adjust the distance between the irradiation surface of the light irradiation part and the surface of the substrate to be processed at a plurality of positions; and The control means controls the operation of the irradiation adjusting means according to the detection data from the distance detecting means, wherein the light is irradiated by the light from the light irradiating portion. Stage by washing the substrate to be processed. According to the first aspect and the second aspect of the present invention, the distance between the irradiation surface of the light irradiation part and the surface of the substrate to be processed is detected by a plurality of points on the substrate to be processed by the distance detecting means, Since the distance between the irradiation surface of the light irradiation section and the surface of the substrate to be processed can be adjusted at a plurality of positions by the control means, the irradiation surface of the light irradiation section and the substrate can be uniformly maintained throughout the entire surface of the substrate. The distance between them to obtain a full washing effect. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. According to the first and second viewpoints of the present invention, in particular, the control means makes the distance between the irradiation surface of the light irradiation unit and the surface of the substrate to be processed on the stage span the entire substrate Approximately equal, the action of the means for controlling the irradiation distance is better. In addition, it is preferable that the light irradiated from the light irradiating portion is ultraviolet light, and particularly that it is ultraviolet excimer light. Furthermore, a contact prevention means may be further provided to prevent contact between the surface of the substrate to be processed on the stage and the irradiation surface of the light irradiation portion. In a preferred embodiment, the irradiation distance adjusting means includes a plurality of lifting shafts for raising and lowering the table and adjusting the height of the table. In addition, the irradiation distance adjusting means may include a plurality of piezoelectric elements arranged on a stage and supporting a substrate to be processed, and may have a surface protruding into the stage, so that the paper size to be processed conforms to the Chinese National Standard (CNS) A4 specification. (210X297 mm) "
W 505959 A7 _____B7 五、發明説明（6) 基板升降的複數個升降插銷也可以。再者，距離檢測手段 係舉例說明典型上具有複數個光感測器者。再者而且，較 佳實施形態舉出：更具備在台與光照射部之間使相對移動 產生的驅動手段’該距離檢測手段測定與到達該光照射部 前的被處理基板的表面部位的該光照射部的照射面之間的 距離’該控制部藉由該驅動手段當該部位到達光照射部正 下方時’使與該光照射部的照射面之間的距離成爲預定的 距離，將指令發送到該照射距離調節手段。 如果依照本發明的第三觀點，提供一種基板處理裝置 ’係對被處理基板照射紫外線進行預定的處理，其特徵包 含： 載置台，載置、支持被處理基板； 紫外線照射手段，具有發出紫外線的燈與使紫外線透 過的窗構件，由該燈發出的紫外線經由該窗構件照射於該 載置台上的被處理基板； 紫外線照度測定手段，在預定位置接受來自該紫外線 照射手段的紫外線，測定該紫外線的照度；以及 照射距離調整手段，根據由該紫外線照度測定手段所 獲得的紫外線照度測定値，調整該紫外線照射手段與該載 置台之間的距離。 在上述本發明的第二觀點中，g卩使由紫外線照射手段 施加到載置台上的被處理基板的紫外線照度變化，因用以 藉由^外線照度測定手段檢測出照度變化，藉由照射距離 調整手段補償照度變化，而可變調整照射距離，故可一定 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） ---- (請先閲讀背面之注意事項再填寫本頁) 、?τ -S. 經濟部智慧財產局員工消費合作社印製 -9 - 經濟部智慧財產局員工消費合作社印製 505959 A7 ___ B7__ 五、發明説明（7 ) 或穩定地維持紫外線照度，可穩定地維持紫外線照射處理 的品質以及效率。 在上述本發明的第三觀點中，爲了提高照度調整的精 度’最好該紫外線照度測定手段爲了測定被照射於該載置 .台上的該被處理基板的紫外線照度，在不干涉該被處理基 板的位置包含配設於該載置台側的光感測器也可以。特別 是當進行掃描式的紫外線照射處理時，該光感測器在該掃 描方向中被配置於比該被處理基板還前面的位置較佳。 而且’照射距離調整手段包含依照被載置於該載置台 上的該被處理基板的板厚，可變調整該紫外線照射手段與 該載置台之間的距離之手段之構成也可以。如此，將被處 理基板的板厚當作照度調整的參數也在提高照度測定乃至 於照度調整的精度上有效。而且，爲了穩定地維持對基板 的紫外線照度於所希望的値，最好該照射距離調整手段具 有： 基準照度設定手段，設定所希望的基準照度；以及 相對位置調整手段，比較該紫外線照度測定値與該基 準照度’使其比較誤差接近零，以調整該載置台與該紫外 線照射手段之間的相對位置，之構成也可以。 而且，爲了進行穩定且良好的紫外線照射處理，最好 以照射距離調整手段具有： 最大間隔設定手段，關於窗構件與載置台或該載置台 上的被處理基板之間隔，設定最大値；以及 最大間隔限制手段，在該間隔的可變調整中預料於該 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） ---------0------,^1---- (請先閱讀背面之注意事項再填寫本頁) -10- 經濟部智慧財產局員工消費合作社印製 505959 A 7 B7_ 五、發明説明（8) 間隔達該最大値或超過最大値時，限制該間隔於該最大値 ，之構成也可以，具有： 最小間隔設定手段，關於窗構件與載置台或該載置台 上的被處理基板之間隔，設定最小値；以及 最小間隔限制手段，在該間隔的可變調整中預料於該 間隔達該最小値或低於最小値的情形，限制該間隔於該最 小値，之構成也可以。 如果依照本發明的第四觀點，提供一種基板處理裝置 ，係對被處理基板照射紫外線進行預定的處理，其特徵包 含： 載置台，載置、支持被處理基板； 紫外線照射手段’具有發出紫外線的燈與使紫外線透 過的窗構件，由該燈發出的紫外線經由該窗構件照射於該 載置台上的被處理基板；以及 手段’使惰性氣體在該窗構件與該載置台上的被處理 基板之間的間隙流動。 如果依照本發明的第五觀點，提供一種基板處理裝置 ’係對被處理基板照射紫外線進行預定的處理，其特徵包 含： 載置台，載置、支持被處理基板； 紫外線照射手段’具有發出紫外線的燈與使紫外線透 過的窗構件，由該燈發出的紫外線經由該窗構件照射於該 載置台上的被處理基板； 驅動手段，爲了來自該紫外線照射手段的紫外線掃描 本紙張尺度適用中國國家標準（CNS ) A4規格(210X 297公釐1~ ----—- ---------0-----—1T------^9. (請先閱讀背面之注意事項再填寫本頁) -11 - 505959 A7 B7 五、發明説明（9) 該載置台上的該被處理基板的被處理面，具有在預定的方 向使該載置台以及該紫外線照射手段的任一方或雙方移動 (請先閲讀背面之注意事項再填寫本頁) 惰性氣體噴射手段，由該紫外線照射手段看自第一方 位約略與該掃描方向平行，將惰性氣體送入該窗構件與該 載置台上的被處理基板之間的間隙；以及 •惰性氣體吸入手段，由該紫外線照射手段看在與該第 一方位相反側的第二方位，吸入、排出通過該間隙的惰性 氣體。 經濟部智慧財產局員工消費合作社印製 在上述本發明的第四觀點以及第五觀點中，藉由在窗 構件與載置台上的被處理基板之間的間隙流通惰性氣體， 因可由該間隙趕出空氣特別是氧而排除，故由紫外線照射 手段的窗構件射出的紫外線到達被處理基板，可降低被氧 吸收而衰減的程度。據此，用以獲得所希望的照度之燈的 消耗功率少即可完成，也能延長燈壽命。而且，因紫外線 反應生成物也隨惰性氣體的流動由間隙被排除，故難以附 著於窗構件。特別是如第五觀點，藉由從該紫外線照射手 段看自第一方位約略與該掃描方向平行，將惰性氣體送入 該窗構件與該載置台上的被處理基板之間的間隙之惰性氣 體噴射手段，與由該紫外線照射手段看在與該第一方位相 反側的第二方位，吸入、排出通過該間隙的惰性氣體之惰 性氣體吸入手段，來構成使惰性氣體流動的手段較佳。 【圖式之簡單說明】 本紙張尺度適用中國國家標準（CNS ) A4規格（210 X297公釐） -12 - 經濟部智慧財產局員工消費合作社印製 505959 A7 ___ B7_ 五、發明説明（19 圖1係模式地顯示搭載本發明的基板處理裝置之光阻塗 佈顯影處理系統的俯視圖。 圖2係顯示圖1的光阻塗佈顯影處理系統中的處理程序 之流程圖。 圖3係槪略地顯示與本發明之第一實施形態有關的紫外 線照射單元的剖面圖。 ..圖4係槪略地顯示與本發明之第一實施形態有關的紫外 線照射單元的俯視圖。 圖5係階段性地顯示紫外線照射單元的動作形態之槪略 圖。 圖6係槪略地顯示與本發明之第一實施形態的其他例子 有關的紫外線照射單元的俯視圖。 圖7係構成圖6的紫外線照射單元的台的剖面圖。 圖8係槪略地顯示與本發明之第一實施形態的再其他例 子有關的紫外線照射單元的俯視圖。 圖9係槪略地顯示與本發明之第二實施形態有關的紫外 線照射單元的剖面圖。 圖1 〇係顯示與本發明之第二實施形態有關的紫外線照 射單元中的照度測定用光感測器的安裝構造之斜視圖。 圖1 1係顯示與本發明之第二實施形態有關的紫外線照 射單元的主要控制系的構成之方塊圖。 圖1 2係顯示與本發明之第二實施形態有關的紫外線照 射單元中的照度調整部的一構成例之方塊圖。 圖1 3係顯示與本發明之第二實施形態有關的紫外線照 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐) :13 : " (請先閲讀背面之注意事項再填寫本頁) 505959 Α? Β7 五、發明説明（” 〜"·一 射單元中的主要動作程序之流程圖。 (請先閲讀背面之注意事項再填寫本頁) 圖1 4係顯示與本發明之第二實施形態有關的紫外線照 射單元中的照度調整的程序之流程圖。 圖1 5係顯示在與本發明之第二實施形態有關的紫外線 "、、射單兀中’使丨、胃性氣體在紫外線照射窗與基板之間的間 隙流動的方式的作用之部分側面圖。 圖1 6係顯示與本發明之第二實施形態的其他例子有關 的紫外線照射單元的構成之剖面圖。 圖1 7係顯示圖1 6所示的紫外線照射單元的主要部位之 俯視圖。 【符號說明】 38:主傳送裝置 UV:紫外線照射單元 61:台 62:紫外線照射室（光照射部） 63a、63b、63c:升降軸（照射距離調節手段） 65:距離檢測部 經濟部智慧財產局員工消費合作社印製 65a、65b:感測器 67a、67b、67c··紫外線燈 6 9:紫外線射出窗（照射面） 70:升降插銷（照射距離調節手段） 77··控制部 82:壓電元件（照射距離可調節手段） 本紙張尺度適用中國國家標準（CNS ) A4規格（210 X 297公釐） -Μ 505959 A7 B7 五、發明説明（1? 90·.外殼 (請先閲讀背面之注意事項再填寫本頁) 162:紫外線射出窗 164a、164b、164c:紫外線燈 166:燈室 168:洗淨處理室 172:惰性氣體噴射部 .174:惰性氣體吸入部 1 9 4:台 194a:基板載置區域 194b:台右側端部 1 9 8:台驅動部 204:光感測器 2 1 2:控制部 216:台升降驅動部 218:掃描驅動部 222:惰性氣體流驅動部 228:照度測定電路 230:板厚設定部 經濟部智慧財產局員工消費合作社印製 232:照度比較部 234•.基準照度設定部 236:台升降控制部 238:最大/最小間隔設定部 240:台驅動部 G:基板 本紙張尺度適用中國國家標準（CNS ) Α4規格（210X297公釐） -15 - 505959 A7 B7 五、發明説明（1? 【較佳實施例之詳細說明】 (請先閲讀背面之注意事項再填寫本頁) 以下，參照添附圖面來詳細說明本發明之實施形態。 圖1係模式地顯示搭載本發明的基板處理裝置之光阻塗 佈顯影處理系統的俯視圖。此光阻塗佈顯影處理系統係設 置於潔淨室（Clean room)內，例如以LCD基板當作被處理基 板，·在LCD製造過程中進行微影工程中的洗淨、光阻塗佈、 預先烘烤（Pre-bake)、顯影以及後烘烤（Post-bake)的各處理 。曝光處理係以接鄰此系統而設置的外部曝光裝置（未圖示） 來進行。 此塗佈顯影處理系統大致區分係由晶圓匣盒站（Cassette station)(C/S)10、製程站（Process station)(P/S)12、介面（ Interface)部（I/F)14 所構成。 經濟部智慧財產局員工消費合作社印製 設置於系統的一端部之晶圓匣盒站（C/S)10具備可載置 預定數例如到四個的收容複數片基板G的晶圓匣盒C之晶圓 匣盒站16，與關於此晶圓匣盒站16上的晶圓匣盒C進行基板 G的存取之傳送機構20。此傳送機構20具有可保持基板G的 手段例如傳送臂（Arm)，在X、Y、Z、0的四軸可動作，可 進行後述的製程站（P/S) 12側的主傳送裝置38與基板G的交付 〇 製程站（P/S) 12由上述晶圓匣盒站（C/S) 10側依次中介（夾 著）基板中繼部23、藥液供給單元25以及空間27，將洗淨製 程部22、塗佈製程部24以及顯影製程部26配設成橫一列。 洗淨製程部22包含兩個刷洗機（Scrubber)洗淨單元（SCR) -16- 本紙張尺度適用中國國家標準（CNS ) A4規格< 210 X 297公釐） 505959 Α7 Β7 五、發明説明（巧 28、上下兩段的紫外線照射/冷卻單元（UV/C〇l)3〇、加熱單 元（HP)32、冷卻單元（COL)34。 (請先閱讀背面之注意事項再填寫本頁) 塗佈製程部24包含光阻塗佈單元（CT)40、減壓乾燥單 兀（VD)42、邊緣洗淨劑（Edge remover)單元（ER)44、上下兩 段型附著（Adhesion)/冷卻單元（AD/C〇L)46、上下兩段型加 熱/冷卻單元（HP/C〇L)48、加熱單元（HP)50。 •顯影製程部26包含三個顯影單元（DEV)52、兩個上下兩 段型加熱/冷卻單元（HP/C〇L)55、加熱單元（HP)53。 在各製程部22、24、26的中央部於縱向配設傳送路徑 36、52、58，主傳送裝置38、54、60沿著各傳送路徑移動， 對各製程部內的各單元存取（Access)以進行基板G的傳入/傳 出或傳送。此外，此系統在各製程部22、24、26中，於傳 送路徑36、52、58的一方側配置旋轉器（Spinner)系的單元（ SCR、CT、DEV等），於他方側配置熱處理或照射處理系的 單元（HP、COL、UV等）。 設置於系統的他端部之介面部（I/F) 1 4在與製程站（P/S) 經濟部智慧財產局員工消費合作社印製 12接鄰的側配設伸展件（Extension)(基板交付部）57以及緩衝 台（Buffer stage)56，於與曝光裝置接鄰的側配設傳送機構 59 ° 圖2係顯示此塗佈顯影處理系統中的處理程序。首先， 在晶圓匣盒站（C/S) 10中，傳送機構20自台16上的預定晶圓 匣盒C之中取出一個基板G，傳送到製程站（P/S) 12的洗淨製 程部22的主傳送裝置38(步驟S1)。 在洗淨製程部22中基板G首先依次被傳入紫外線照射/ 本紙張尺度逍用中國國家標準（CNS〉A4規格（210X297公ϋ -17 - 505959 A7 B7 五、發明説明（π (請先閲讀背面之注意事項再填寫本頁) 冷卻單元（UV/COL)30，上段的紫外線照射單元（υν)實施藉 由紫外線照射的乾式洗淨，其次，下段的冷卻單元（c〇L)被 冷卻到預定溫度（步驟S2)。此紫外線照射洗淨基板表面的有 機物被除去。據此，基板G的潤濕性提高，可提高下一個工 程的刷洗（S c r u b b i n g)洗淨中的洗淨效果。 其次，基板G以刷洗機洗淨單元（SCR)28的一個接受刷 洗洗淨處理，由基板表面除去粒子狀的污垢（步驟S3)。刷洗 洗淨之後，基板G在加熱單元（HP)32 接受藉由加熱的脫水處理（步驟S4)，接著，在冷卻單元 (COL)34冷卻到一定的基板溫度（步驟S5)。據此，洗淨製程 部22中的前處理終了，基板G藉由主傳送裝置38中介基板中 繼部23傳送到塗佈製程部24。 在塗佈製程部24中，基板G首先依次被傳入附著/冷卻 單元（AD/C〇L)46，在最初的附著單元（AD)接受疏水化處理（ HMDS)(步驟S6)，在下一個冷卻單元（COL)冷卻到一定的基 板溫度（步驟S7)。 經濟部智慧財產局員工消費合作社印製 然後，基板G在光阻塗佈單元（CT)40被塗佈光阻液，接 著在減壓乾燥單元（VD)42接受利用減壓的乾燥處理，接著 ，在邊緣洗淨劑單元（ER)44除去基板周邊部多餘（不要）的光 阻（步驟S8)〇 其次，基板G依次被傳入加熱/冷卻單元（HP/COL)48， 在最初的加熱單元（HP)進行塗佈後的烘烤（預烘烤）（步驟S9) ，其次，在冷卻單元（COL)冷卻到一定的基板溫度（步驟S 10) 。此'外，此塗佈後的烘烤也能使用加熱單元（HP)50。 -18- 本紙張尺度適用中國國家標準（CNS ) A4規格{ 210 X297公釐） 505959 A7 B7 五、發明説明（ (請先閱讀背面之注意事項再填寫本頁) 上述塗佈處理之後，基板G藉由塗佈製程部24的主傳送 裝置54與顯影製程部26的主傳送裝置60，被傳送到介面部（ I/F) 14，由該處被傳送到曝光裝置（步驟S11)。在曝光裝置將 預定的電路圖案曝光到基板G上的光阻。而且，完成圖案曝 光的基板G由曝光裝置傳回到介面部（l/F)14。介面部（I/F)14 的傳送機構59將由曝光裝置接受的基板G中介伸展件57傳送 到製程站（P/S) 1 2的顯影製程部26(步驟S 1 1)。 在顯影製程部26中，基板G在顯影單元（DEV)52的任一 個接受顯影處理（步驟S1 2)，接著，依次被傳入加熱冷卻單 元（HP/C〇L)55的一個，在最初的加熱單元（HP)進行後烘烤（ 步驟S13)，其次，在冷卻單元（COL)冷卻到一定的基板溫度（ 步驟S14)。此後烘烤也能使用加熱單元（HP)53。 完成在顯影製程部26的一連處理的基板G藉由製程站（P /S)12內的主傳送裝置60、54、38返回到晶圓匣盒站（C/S)10 ，在該處藉由傳送機構20收容於任一個晶圓匣盒C(步驟S1) 〇 經濟部智慧財產局員工消費合作社印製 其次，說明關於搭載於如以上的光阻塗佈顯影處理系 統的紫外線照射單元（UV)的第一實施形態。圖3係槪略地顯 示與本發明之第一實施形態有關的紫外線照射單元（UV)的 剖面圖，而且，圖4係槪略地顯示該紫外線照射單元（UV)的 俯視圖。 紫外線照射單元（UV)具備形成洗淨室的外殻（Housing) 9 0，在外殼9 0內收容矩形的台6 1與紫外線照射室6 2。台6 1 具有載置基板G的載置面，可移動（滑動（Slide))於與傳送路 -19- 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 505959 A7 B7 五、發明説明（17 (請先閱讀背面之注意事項再填寫本頁) 徑36約略平行（X方向）。而且，紫外線照射室62係配置於台 6 1的移動路徑的途中，由台6 1的上側對載置於台6 1上的基 板G照射紫外線。 如圖4所示，台61係中介連結裝置73連結於與傳送路徑 36大略平行而延伸的導軌（Guide rail)72，並且，藉由台驅 動部75驅動，沿著導軌72可往復動作。具體上台61係藉由 例如來自台驅動部75的驅動訊號驅動的空氣汽缸（未圖示）的 伸縮動作或導桿（Ball screw)(未圖示）的旋轉動作等，在由 主傳送裝置38的臂38a接受基板G的起始位置（Home position) (在圖4以實線表示的第一位置）與大致完全通過紫外線照射 室62的返回位置（在圖4以一點鏈線表示的第二位置）之間往 復動作。 經濟部智慧財產局員工消費合作社印製 另一方面，紫外線照射室6 2在底面配設由當作照射面 發揮功能的石英玻璃所構成的紫外線射出窗69，在室內例 如三條圓柱狀紫外線燈6 7 a、6 7 b、6 7 c係在沿著台5 2的移動 方向（X方向）排列的狀態下配設。各燈67a、67b、67c可遍及 基板G的寬度全體無不均地照射紫外線，以預定的長度延伸 於對台61的移動方向略直交的方向（γ方向）。各燈67 &、67b 、67c係連接於照射驅動部78，藉由來自此照射驅動部78的 驅動訊號進行0N/0FF。 ^外線照射室62內的各燈67a、67b、67c例如可使用電 介質阻障放電燈，接受商用交流功率的供給而發光，對有 機污染的洗淨放射較佳的波長172nm的紫外線（紫外受激準 分子光）。在各燈67a、67b、67c的背後或上面配置橫剖面圓 本紙張尺度適用中國國家標準（CNS ) A4規格（210 X 297公釐） -20 - 505959 A7 B7 五、發明説明（Μ (請先閲讀背面之注意事項再填寫本頁) 弧狀的凹面反射鏡6 8，由各燈放射到上方乃至於側方的紫 外線在正上方的反射鏡凹面68反射，被朝向紫外線射出窗 69側。 在紫外線照射室62內配設例如以水冷方式冷卻紫外線 燈67a、67b、67c的冷卻封套（JacketK未圖示），或導入且使 其充滿用以防止吸收紫外線（因此使燈發光效率惡化）的氧進 入室內的惰性氣體例如N2氣體之氣體流通機構（未圖示）等也 可以。 經濟部智慧財產局員工消費合作社印製 在台6 1的移動路徑上側，檢測照射面的紫外線射出窗 69與基板G表面之間的距離之距離檢測部65係配設於比紫外 線照射室62還靠近位於起始位置側。此距離檢測部65係藉 由安裝部66而安裝於紫外線照射室62，在排列於Y方向（基 板G的寬度方向）的基板G上的複數點，應計測照射面的紫外 線射出窗69與基板G表面之間的距離，具有排列於Y方向的 例如由光感測器所構成的複數個感測器65 a、65b...。藉由距 離檢測部65的各光感測器所得到的檢測訊號係被輸入控制 台驅動部75與照射驅動部78以及後述的升降驅動部76的驅 動之控制部77。 在台61的下方配設當作照射距離調整手段的升降機構 63。升降機構63係用以調節照射面的紫外線射出窗69與基 板G表面之間的距離，由連結於台61底面的例如三個升降（ 伸縮）軸63a、63b、63c，與使這些升降軸63a、63b、63c升 降（伸縮）的馬達64a、64b、64c所構成。各馬達64a、64b、 64c係連接於升降驅動部76，藉由來自升降驅動部76的驅動 -21 - 本紙張尺度適用中國國家標準（CNS〉A4規格（210 X297公釐） 505959 A7 B7 五、發明説明（1? (請先閲讀背面之注意事項再填寫本頁) 訊號個別地被驅動，使對應的升降軸63a、63b、63c升降。 即升降軸63a、63b、63 c藉由來自升降驅動部76的驅動訊號 個別地被驅動，台6 1的高度即照射面的紫外線射出窗69與 基板G表面之間的距離被調節。因此，前述連結裝置73爲了 容許台61的升降動作，將台61連結於導軌72。 而且，遍及台61的全面調整（修正）其高度，爲了可均等 地遍及基板G的全面保持照射面的紫外線射出窗69與基板G 表面之間的距離，三個升降軸63a、63b、63c互相於台61的 寬度方向（Y方向）以及縱向（X方向）僅分離預定距離的狀態， 具體上以形成三角形的配置形態來配設。 而且，在台61對台61使基板G升降的複數個升降插銷70 由台61表面突出陷入自如地配設。這些升降插銷70係藉由 來自升降驅動部76的驅動訊號而控制其升降動作。 其次，說明關於如以上的構成之紫外線照射單元（UV) 的動作。 經濟部智慧財產局員工消費合作社印製 首先如前述，·由移動傳送路徑36的主傳送裝置38的臂 3 8a，基板G被交付到紫外線照射單元（UV)的台61上。這種 情形如圖5(a)所示，在預先使升降插銷70由台61表面突出到 預定高度的狀態下，使台61待機於起始位置。然後，在此 起始位置基板G由主傳送裝置38的臂38a被交付到升降插銷 70 〇 如圖5(a)所示，基板G被交付到升降插銷70，藉由升降 驅動部76使升降插銷70下降，基板G被載置於台61的載置面 上。然後如圖5(b)所示，爲了使紫外線照射室62的照射面與 本紙張尺度適用中國國家標準（CNS ) A4規格{ 210X297公釐） -22 - 505959 A7 B7 五、發明説明（29 基板G表面之間的距離變成預先決定的距離，藉由升降驅動 部76使升降軸63a、63b、63c上升。 以上的動作完了後，接著藉由台驅動部75使台61由起 始位置朝紫外線照射室62移動於X方向，由位於該移動方向 側的基板G表面依次面對照射面的紫外線射出窗69，進行利 用紫外線的有機物洗淨。 •但是爲了有機物除去，較佳的紫外受激準分子光即使 在紫外線之中也特別是短波長，因其空間傳達距離極短， 使用紫外受激準分子光爲了對基板G給予充分的洗淨效果， 需要設定基板G與照射面之間的距離於數百μ m〜數mm等級 。即對於藉由紫外受激準分子光進行有機物洗淨的情形， 嚴格地進行基板G與照射面的紫外線射出窗69之間的距離之 管理，若不遍及基板G的全面均等地照射紫外受激準分子光 的話，在基板G面內無法獲得均等且充分的洗淨效果。 但是，LCD用的玻璃基板最近大型化的傾向越來越強， 因此，載置此LCD用的玻璃基板的台61也大型化，故僅爲了 使紫外線照射室62的紫外線射出窗69與基板G表面之間的距 離變成預先決定的距離，而使升降軸63a、63b、63c上升， 實際上由於台6 1以及基板G所產生的彎曲使紫外線射出窗69 與基板G之間的距離遍及基板G的表面全體無法均等。 因此，本實施形態在基板G面對照射面的紫外線射出窗 69前，藉由距離檢測部65的各感測器預先檢測移動的基板G 與紫外線射出窗69之間的距離，根據其檢測値於台6 1的移 動中，藉由升降軸63a、63b、63c的升降逐次修正台61的高 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -23 - ------------ (請先閱讀背面之注意事項再填寫本頁) 訂 Ψ 經濟部智慧財產局員工消費合作社印製 經濟部智慧財產局員工消費合作社印製 505959 A7 B7 五、發明説明（2) 度，同時爲了使照射面的紫外線射出窗69與基板G表面之間 的距離遍及基板G的表面全體均等，將基板G送入面對紫外 線射出窗69的位置。 以下，詳細地說明此點。 首先，如圖3所示基板G以其寬度方向的列爲單位，藉 由距離檢測部65的各感測器在預定的時機（Timing)檢測與紫 外線射出窗69之間的距離。具體上藉由來自各感測器65a、 65b...所發出的光計測各感測器65a、65b…與面對各感測器 65a、65b的基板G上的點之間的距離，由其計測値與紫外線 射出窗69的已知高度，紫外線射出窗69與基板G上的計測點 之間的距離藉由控制部77演算。此時，對於設定紫外線射 出窗69與基板G上的計測點之間的距離爲L時，爲了修正不 滿足所設定的距離L的計測點中的基板高度，控制部77在藉 由距離檢測部65的各感測器而檢測的基板G的寬度方向的列 與照射面的紫外線射出窗69面對前，藉由升降驅動部76個 別地使各馬達64a、64b、64c驅動，以控制在寬度方向的列 之所有的計測點其與紫外線射出窗69之間的距離爲L。這種 動作係每次在預定的時機進行藉由距離檢測部65的各感測 器所進行的檢測時所進行，據此，其結果使照射面的紫外 線射出窗69與基板G表面之間的距離遍及基板G的表面全體 均等（距離L)，將基板G送入與紫外線射出窗69面對的位置（ 參照圖5(c))。而且，藉由根據來自距離檢測部65的檢測資 訊，靠近紫外線照射室62自馬達依次被驅動，即藉由依照 馬達64a、64b、64c的順序使其驅動，自其移動方向側端部 本紙張尺度適用中國國家標準（CNS > A4規格< 210X297公釐） -24 - (請先閱讀背面之注意事項再填寫本頁) 505959 A7 _B7_ 五、發明説明（2? {請先閲讀背面之注意事項再填寫本頁) 依次修正台61的高度也可以。此外，在由起始位置朝返回 位置的去程中，來自距離檢測部65的各感測器的檢測資料 被記憶於控制部77的記憶體。 如以上光照射係遍及基板G的全面而進行，當基板G到 達返回位置（圖4以一點鏈線表示的位置）後，此次台61係朝 起始位置移動於反方向。在此回程中，基板G也被由紫外線 照射室62照射紫外線，藉由與前述一樣的操作，遍及基板g 的表面全體均等地進行有機物洗淨。這種情形在前述的去 程根據被記憶於控制部77的記憶體的檢測資料修正台6 1的 高度，同時遍及基板G的表面全體均等地照射紫外線。然後 在基板G到達起始位置的階段，由紫外線照射單元（UV)的台 61上，基板G被交付到主傳送裝置38的臂38a。 經濟部智慧財產局員工消費合作社印製 而且，在本實施形態的紫外線照射單元（UV)爲了不因 升降軸63a、63b、63c的升降動作使基板G與照射面的紫外 線射出窗69接觸，配設規制升降軸63 a、63 b、63c的上升動 作的接觸防止連鎖（Interlock)機構。此接觸防止連鎖機構具 體上主要由距離檢測部65、控制部77以及升降驅動部76所 構成，由距離檢測部65所檢測的基板G與紫外線射出窗69之 間的距離比預定的臨界値還小若被控制部7 7認識的話，藉 由利用升降驅動部7 6的馬達6 4 a、6 4 b、6 4 c的驅動使升降軸 63a、63b、63c的上升停止，或者在基板G面對紫外線射出 窗69前，藉由利用升降驅動部76的馬達64a、64b、64c的驅 動使升降軸63 a、63b、63c僅下降預定量。而且，藉由實測 或模擬發現因基板G的彎曲使最有接近紫外線射出窗69的可 ^紙張尺度適用中國國家標準（CNS ) A4規格< 210X297公釐） :25 - 一 505959 A7 B7 五、發明説明（2$ (請先閱讀背面之注意事項再填寫本頁) 能性的基板G上的點，藉由距離檢測部的各感測器積極地檢 測該點，確認接觸的有無之可能性且將基板G滑動到紫外線 射出窗69側也可以。 如以上在本實施形態的紫外線照射單元（UV)中，在基 板G面對紫外線射出窗69前，藉由距離檢測部65預先檢測基 板G與紫外線射出窗69之間的距離，根據該檢測値藉由升降 軸6.3 a、63b、63c的升降逐次修正台61的高度，同時將基板 G送入與紫外線射出窗69面對的位置。具體上藉由在台61的 複數個位置調整台61的高度，以矯正因台61以及基板G的彎 曲所產生的照射面的紫外線射出窗69與基板G表面之間的距 離之不均衡，使紫外線射出窗69與基板G表面之間的距離遍 及基板G的表面全體均等。因此，可遍及基板G的全面均等 地照射紫外線，可避免洗淨不均，在基板G的面內可獲得均 等且充分的洗淨效果。 經濟部智慧財產局員工消費合作社印製 這種效果特別是對紫外線需要使用設定基板G與紫外線 射出窗69之間的距離於數百// m〜數mm等級的紫外受激準分 子光的情形有益。紫外受激準分子光如前述爲短波長，由 於其空間傳達距離極短，故需要比通常的紫外線還嚴格地 進行基板G與照射面之間的距離管理，同時與通常的紫外線 比較因ΟΝ/OFF的響應（Response)良好，故可提高產能（ Throughput)。因此，藉由紫外受激準分子光照射洗淨基板G ，且藉由前述距離檢測部65嚴格地進行基板G與紫外線射出 窗之間的距離管理的話，可提高產能且也能提高洗淨效果 ，可飛躍地提高之後的光阻膜形成處理的精度以及效率。 -26- 本紙張尺度逍用中國國家標準（CNS ) A4規格（210X297公釐） 505959 A7 B7 五、發明説明（24 (請先閱讀背面之注意事項再填寫本頁) 而且，本實施形態的紫外線照射單元（UV)因具備防止 基板G與紫外線射出窗69接觸的接觸防止連鎖機構，故可安 全且確實地進行基板G的洗淨。 此外，在由起始位置朝返回位置的去程僅進行藉由距 離檢測部65的檢測，在由返回位置朝起始位置的回程，首 先進行受激準分子UV光的照射也可以。即在由起始位置朝 返回位置的去程不進行紫外線的照射，藉由距離檢測部65 檢測基板G與紫外線射出窗69之間的距離，將其檢測資料記 憶於控制部7 7的記憶體，在由返回位置朝起始位置的回程 ，根據記憶於記憶體的檢測資料修正台6 1的高度，同時遍 及基板G的全面均等地照射紫外線也可以。 其次，參照圖6以及圖7說明本實施形態的其他例子。 此外，在本例中關於與之前的例子共通的構成部分，附加 同一符號省略其說明。 經濟部智慧財產局員工消費合作社印製 在圖3以及圖4所示的之前的例子，藉由利用升降軸63 a 、63b、63c的台61的高度調整，在基板G上的複數點間接地 使基板G的高度即紫外線射出窗69與基板G表面之間的距離 變化，惟本例藉由配設於台61上，支持基板G的多數個壓電 元件82直接地詳細地使基板G的高度即紫外線射出窗69與基 板G表面之間的距離變化。 具體上壓電元件82爲了形成例如沿著台61的寬度方向 以及縱向的多數列，被固定於台61的表面上。而且’各壓 電元件82與升降驅動部76電性連接，升降驅動部76對壓電 元件82可個別地或以寬度方向的列爲單位施加電壓。然後 本紙張尺度逍用中國國家標準（CNS ) A4規格（210 ><297ϋ - 27 - 505959 A7 B7___ 五、發明説明（ ，控制部77根據來自距離檢測部65的檢測結果控制由升降 驅動部76施加到壓電元件82的電壓。 (請先閱讀背面之注意事項再填寫本頁) 而且，爲了防止壓電元件82的變形所造成的基板G的偏 移，在台61設置對基板G的背面作用吸引力，用以使基板G 吸附於壓電元件82的多數個吸引孔80。此外，如圖7所示， 這些吸引孔80係中介吸引管路84連接於例如吸引泵85。 •本例的其他構成與上述圖3與圖4所示的例子相同。 如果依照這種構成，藉由伴隨著電壓的施加的壓電元 件82的機械的應變（變形），在與壓電元件82接觸的基板G上 的多數點調整基板G的高度。前述第一實施形態，在三個修 正點台61 (基板G)的高度被調整，惟本實施形態對應壓電元 件82的數目，修正點的數目與之前的例子比較飛躍地增大 ，該部分因基板G的高度被詳細地調整，故可飛躍地提高照 射距離的均等率。 其次，參照圖8說明本實施形態的再其他例子。此外， 在本例中關於與之前的兩個例子共通的構成部分，附加同 一符號省略其說明。 經濟部智慧財產局員工消費合作社印製 本例升降插銷70取代上述例子的壓電元件82。即藉由 個別地驅動多數個升降插銷70，使基板G的高度調整在基板 G上的多數點進行。除此之外的構成與上述圖6以及圖7所示 的例子相同，因此，可獲得與該例相同的作用功效。 此外，第一實施形態照射面的紫外線射出窗69被固定 ，基板G被朝紫外線射出窗69滑動，惟基板G被固定，紫外 線射出窗69朝基板G滑動的構成也可以。而且，雖然顯示利 本紙張尺度適用中國國家標準（CNS ) A4規格{ 210X297公釐) :28: ~ 505959 A7 _B7 五、發明説明（2令 用紫外線洗淨的例子，惟並非限定於此使用其他的光進行 洗淨也可以。 (請先閱讀背面之注意事項再填寫本頁) 其次，說明關於與本發明的第二實施形態有關的紫外 線照射單元（UV)。 如圖9所示，與本發明的第二實施形態有關的紫外線照 射單元（UV)其底面安裝由石英玻璃所構成的紫外線射出窗 162‘，具有在室內三條圓柱狀紫外線燈164a、164b、164c排 列於與燈的縱向直交的水平方向收容而成的燈室1 66，與鄰 接於此燈室166下而配設的洗淨處理室168。 在燈室166內，各紫外線燈164a、164b、164c例如爲電 介質阻障放電燈，由後述的燈電源部220接受商用交流功率 的供給而發光，對有機污染的洗淨放射較佳的波長172nm的 紫外線（紫外受激準分子光）。在各紫外線燈164a、164b、 164c的背後即上面配置橫剖面圓弧狀的凹面反射鏡i7〇，由 各燈164a、164b、164c放射到上方乃至於側方的紫外線在正 上方的反射鏡凹面部反射，被朝向紫外線射出窗1 62側。 經濟部智慧財產局員工消費合作社印製 在燈室1 66內也能配設例如以水冷方式冷卻紫外線燈 164a、164b、164c的冷卻封套（未圖示），或導入且使其充滿 用以防止吸收紫外線（因此使燈發光效率惡化）的氧進入室內 的惰性氣體例如N2氣體之氣體流通機構（未圖示）等。 在燈室1 66的兩側在紫外線洗淨處理中沿著紫外線射出 窗162的底面，配設用以流通氧或空氣排除用的惰性氣體例 如％氣體的惰性氣體噴射部1 72以及惰性氣體吸入部1 74。 惰性氣體噴射部172在圖9中於燈室166的右鄰即於後述 本紙^尺度適用中國國家標準（CNS ) A4規格（210父297公釐1 :29: "" 505959 A7 B7 五、發明説明（ 的掃描時的工作台（Table)移動方向（Y方向）中，配置於前方 側，具有：與紫外線燈164a、164b、164c平行延伸的氣體配 管176，與在此氣體配管176隔著一定的間隔，配設成一列 的多數個惰性氣體噴射口 178，與對氣體配管176以預定流 量以及壓力供給惰性氣體的惰性氣體供給部1 80，與將由各 惰性氣體噴射口 1 78噴射的惰性氣體導引到紫外線射出窗 162下的氣體導引構件182。 惰性氣體吸入部174在圖9中於燈室166的左鄰即於後掃 描時的工作台移動方向（Y方向）中，配置於後方側，具有： 與紫外線燈164a、164b、164c平行延伸的氣體配管184，與 在此氣體配管1 84隔著一定的間隔，配設成一列的多數個惰 性氣體吸氣口 186，與對氣體配管184施加負壓，並且排出 流入的氣體之氣體排氣部1 88，與用以將由惰性氣體噴射部 172流到紫外線射出窗162下的惰性氣體朝氣體吸氣口 186導 引的氣體導引構件190。此外，對燈室166使惰性氣體噴射 部172以及惰性氣體吸入部174的配置位置相反也可以。 接鄰惰性氣體噴射部172以及惰性氣體吸入部174的外 側，在此紫外線照射單元（UV)內的各部配設收容用以供給 所需的用力或控制訊號的用力供給部以及控制部的操作（ IJtility)單元 192 〇 在洗淨處理室168內配設用以載置、支持基板G的可水 平移動以及升降的台194。此實施形態在使用導桿196的自 走式台驅動部198上，於垂直方向（圖的Z方向)可升降地搭載 台194，台驅動部198沿著導桿196以及平行於導桿196而延伸 --------f, (請先閱讀背面之注意事項再填寫本頁) 訂 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -30 - 505959 A7 B7 五、發明説明（2争 的導件（Guide)200，於圖的Y方向即與燈排列方向平行地橫 越燈室1 66的正下方，以能可變控制的速度來往復移動而構 (請先閲讀背面之注意事項再填寫本頁) 成。 在台194當基板G的傳入/傳出時，用以以水平姿勢支持 基板G的複數根（例如6根）提升插銷（Lift ριη)202垂直地貫通 。此實施形態各提升插銷202在基板交付用的預定高度位置 被固定，當基板G的傳入/傳出時，在對這些固定的提升插 銷202台194不妨礙基板G的像入/傳出的退避用下限高度位 置Kb與台194自身用以載置、支持基板G的以一點鏈線表示 的上限高度位置Ha之間，可藉由升降機構（未圖示）升降。 台194係形成比基板G還大一圈的尺寸，在載置基板G的 中心部附近的預定區域（基板載置區域）194a，配設用以支持 基板G的多數支持插銷（未圖示）或用以吸引保持基板G的真 空夾頭（Chuck)吸引口（未圖示）。然後，在圖9中在位於基板 載置區域194a的右鄰，更詳細如圖1〇所示於台往復方向（γ 方向）的前鄰的台右側端部194b上，配設用以測定由燈室166 照射到台194上的基板G的紫外線照度的光感測器204。 經濟部智慧財產局員工消費合作社印製 在圖9中於接鄰於台194的Y方向原點位置的洗淨處理室 168的側壁，安裝用以在靠近固定提升插銷202的上端部的 高度位置傳入/傳出基板G的可開關的快門（Shutter)(門）206 。此快門206係面對洗淨製程部22的傳送路徑36(參照圖1)， 以由傳送路徑36上通過主傳送裝置38爲開狀態的快門206， 可進行基板G的傳入/傳出到洗淨處理室168內。 在洗淨處理室168的側壁或底面配設一個或複數個排氣 本紙張尺度適用中國國家標準( CNS ) A4規格（210X297公釐） .31 - 一 505959 A7 B7 五、發明説明（2亨 (請先閲讀背面之注意事項再填寫本頁) 口 208，各排氣口 208係中介排氣管210與排氣導管（Duct)等 的排氣系統（未圖示）連接。而且，在洗淨處理室1 68的適當 位置配設外氣吸入口也可以（未圖示）。 暨11係顯示此紫外線照射單元（U V)中的控制系的構成 。控制部2 1 2係由微電腦以及所需的周邊電路所構成，在內 藏的記憶體儲存用以控制本單元內的各部以及全體的所需 程式，中介適當的介面連接於總括本塗佈顯影處理系統的 全體的處理程序之主控制器（未圖示）或本紫外線照射單元（ UV)內的控制系的各部。 在本實施形態中與控制部2 1 2有關係的本紫外線照射單 元（UV)內的主要部分爲用以開關驅動快門206的快門驅動部 214、用以在Z方向升降驅動台194的台升降驅動部216、用 ，以在Y方向水平驅動或掃描驅動升台194的掃描驅動部218、 用以點燈驅動燈室166內的紫外線燈164a、164b、164c的燈 電源部220、用以在燈室166的紫外線射出窗162下製造惰性 氣體流的惰性氣體流驅動部222、用以檢測裝置內的各部狀 態或狀態量的感測器類224等。 經濟部智慧財產局員工消費合作社印製 台升降驅動部2 1 6以及掃描驅動部2 1 8例如具有伺服馬 達當作個別的驅動源，配設於台驅動部1 9 8內。惰性氣體流 驅動部2 2 2係關閉驅動分別配設於惰性氣體噴射部1 7 2的惰 性氣體供給部180以及惰性氣體吸入部174的氣體排氣部188 的開關閥。在感測器類224包含設置於台194的右側端部 194b的上述光感測器204。 圖1 2係顯示在本紫外線照射單元（U V)中用以調整由燈 本紙張尺度適用中國國家標準（CNS ) A4規格（210 >< 297公釐） -32 - 505959 A7 B7 五、發明説明（ (請先閱讀背面之注意事項再填寫本瓦) 室166照射到台194上的基板G的紫外線的照度於預定値的照 度調整部的構成。在此照度調整部中除了步感測器204以及 台升降驅動部2 1 6外，以下所示的部分2 2 8〜2 3 8包含於控制 部 2 1 2。 光感測器204的輸出訊號（例如光電流）輸入照度測定電 路228。照度測定電路228係以光感測器204的輸出訊號値與 光感測器2 04的受光面與基板G的表面之間的高度位置的偏 移（Offset)d爲變數，以所需的訊號處理或演算處理求出台 1 9 4上的基板G表面中的紫外線照度的測定値（或推定値也可 以）E。此處，以台194的基板載置面194a爲基準面，光感測 器204的受光面高度位置Sh爲一定，基板G的板厚Gt在此塗 佈顯影處理系統，係當作與現在流過（正接受處理）的被處理 基板有關的條件資料或屬性資料之一被裝配（S e t)於板厚設 定部230。因此，上述高度位置偏移d被以d = Gt-Sh給予。 經濟部智慧財產局員工消費合作社印製 由照度測定電路228所獲得的紫外線照度測定値e係給 予照度比較部2 3 2。照度比較部2 3 2係比較紫外線照度測定 値E與來自基準照度設定部234的基準照度Es，求出兩者的 差分即誤差δ E。此處’基準照度Es在預定的掃描速度下設 定於可保證所希望的紫外線洗淨效果的適當的照度也可以 〇 台升降控制部2 36係依照來自照度比較部23 2的照度誤 差（5 E，使誤差5 E接近零而驅動控制台升降驅動部2 1 6，改 變台194的基板載置用高度位置Ha。據此，由照度測定電路 2 2 8所得到的紫外線照度測定値E在與基準照度E s —致之處 本紙張尺度適用中國國家標準( CNS ) A4規格{ 210X297公釐） :33 -~_ 505959 A7 B7 五、發明説明（3) 使台高度位置的可變調整停止。 (請先閱讀背面之注意事項再填寫本頁) 但是，台升降控制部236係由表示來自預定的位置感測 器（未圖示）等的台高度位置之位置資訊，與來自板厚設定部 230的基板板厚（Gt)資料，監控台194上的基板G與燈室166的 紫外線射出窗162之間的間隔D，並且關於此間隔D，由最大 /最小間隔設定部2 3 8接受最大値Dm ax以及最小値Dmin的資 料。然後，在依照來自照度比較部232的照度誤差5 E改變 台194的高度位置的過程，間隔D達到最大値Dmax(例如7mm )或最小値Dmin(例如3mm)時，在該處強制地停止台194的高 度調整，以限制或固定保持間隔D於最大値Dmax或最小値 Dmin 〇 圖13係顯示本紫外線照射單元（UV)中的主要動作程序 。首先，接受來自上述主控制器的指示，包含控制部2 1 2使 單元內的各部初期化（步驟A〇。在此初期化中，台194在Y方 向被定位於接近快門2 0 6的預定原點位置，在Z方向被下降 到退避用的高度位置（Hb)。 經濟部智慧財產局員工消費合作社印製 主傳送裝置38(參照圖1)若由晶圓匣盒站（C/S)10將處理 前的基板G傳送到本紫外線照射單元（UV)之前的話，控制部 2 12係用以進行主傳送裝置38與基板G的交付而控制該各部（ 步驟A2)。 更詳細首先控制快門驅動部2 1 4使快門2 0 6打開。主傳 送裝置38具有一對傳送臂，在一方的傳送臂搭載洗淨前的 基板G ’令他方的傳送臂在空的（無基板）狀態下朝本紫外線 照射單元（UV)移動。當本紫外線照射單元（uv)內無洗淨完 I紙張尺度適财關家料（CNS > A4«^ ( 21GX297公釐)~ 一 505959 A7 _B7__ 五、發明説明（3; (請先閲讀背面之注意事項再填寫本頁) 成的基板G時，使支持洗淨前的基板G方的傳送臂原封不動 地通過開狀態的快門2 0 6，延伸到洗淨處理室1 6 8內，將該 未洗淨基板G移載到固定提升插銷202上。當本紫外線照射 單元（UV)內有洗淨完成的基板G時，以最初空的傳送臂傳出 該洗淨完成的基板G後，與上述一樣傳入未洗淨基板G。如 上述本紫外線照射單元（UV)應接受紫外線洗淨處理的基板G 被主傳送裝置38傳入載置於固定提升插銷202上的話，關閉 快門206。 其次，控制部21 2控制台升降驅動部2 16使台194上升到 基板載置用的基準高度位置HaO(步驟As)。此時，在台194上 升期間開始真空夾頭部的吸引，使台194到達基板載置用的 基準高度位置Ha。，同時可吸引保持基板G也可以。此外， 在基板載置用的基準高度位置HaO與固定提升插銷202的前 端高度位置之間，可設定適當的裕度（Margin)。 經濟部智慧財產局員工消費合作社印製 其次，控制部212控制燈電源部220使紫外線燈164a、 164b、164c點亮（步驟A4)，並且控制惰性氣體流驅動部222 使惰性氣體噴射部172以及惰性氣體吸入部174動作（步驟A5) 。據此，藉由在燈室166右側的惰性氣體噴射部17 2朝紫外 線射出窗162下送入惰性氣體（N2氣體），在燈室166左側或下 流側惰性氣體吸入部1 74吸入惰性氣體，沿著紫外線射出窗 162的底面形成與台移動方向（Y方向）平行的惰性氣體流（流 動）。 其次，控制部2 1 2在紫外線洗淨處理前進行照度調整（ 步驟Αό) 〇 本紙張尺度適用中國國家標準（CNS ) Α4規格（210X297公釐） -35 - 505959 A7 B7 五、發明説明（3夺 (請先閱讀背面之注意事項再填寫本I) 圖14係顯示照度調整的程序之一例。首先，對燈室丨66 若需要照度測定用光感測器2 04的對位的話，進行此對位（ 步驟B!)。例如在圖9的Y方向原點位置若台右側端部194b上 的光感測器2 0 4由紫外線射出窗1 6 2正下方的紫外線照射區 域脫離的話，令台194在Y方向移動少許，使光感測器204放 入該紫外線照射區域之中。而且，在Z方向中設定與上述基 板載置用的基準高度位置Ha。不同的照度調整用的基準位置 Ha! ’也能使台194配合其高度位置Ha!。 如上述對燈室166裝配光感測器204於預定位置後，藉 由上述照度控制部（參照圖12)中的照度測定電路22 8以及板 厚設定部230，測定對台194上的基板G的紫外線照度（步驟B2 )。其次’利用照度比較部232以及基準照度設定部234求出 對基準照度Es的照度測定値E的誤差5 E (5 E = Es-E)(步驟Bs )° 然後，台升降控制部236判定此誤差5 E的極性以及絕 對値（步驟B4)，控制台升降驅動部216選擇地可變調整台194 的高度位置（步驟B 5〜B 1 1 )。 經濟部智慧財產局員工消費合作社印製 即本例當（5 E<0時，即當照度測定値E比基準照度Es還 大時判斷間隔D是否達到最大値Dmax(步驟B6)，對於未達到 的通常情形，僅將台高度位置Ha下降預定間距（Pitch)(例如 0.1mm) ’紫外線射出窗162與台194上的基板G的間隔D僅擴 大該間距（步驟b7)，然後返回照度測定（步驟b!2、B2)。但是 ’當預期間隔D由最大/最小間隔設定部2 3 8到達所給予的最 大値Dmax或超過此最大値Dmax時，在間隔D固定於最大値 -36- 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐〉 505959 A7 _B7_ 五、發明説明（3$ (請先閲讀背面之注意事項再填寫本頁)W 505959 A7 _____B7 V. Description of the invention (6) A plurality of lifting pins for lifting the substrate can also be used. In addition, the distance detection means is exemplified by a person having a plurality of light sensors. Furthermore, in a preferred embodiment, the driving means for generating a relative movement between the stage and the light irradiating section is further provided. The distance detecting means measures and measures the surface portion of the substrate to be processed before reaching the light irradiating section. The distance between the irradiated surfaces of the light irradiated portion 'When the control unit uses the driving means when the portion reaches directly below the light irradiated portion', the distance from the irradiated surface of the light irradiated portion becomes a predetermined distance, and the instruction Send to this irradiation distance adjustment means. According to a third aspect of the present invention, a substrate processing apparatus is provided for performing predetermined processing on a substrate to be processed by irradiating ultraviolet rays. The characteristics include: a mounting table to mount and support a substrate to be processed; A lamp and a window member that transmits ultraviolet rays, and the ultraviolet rays emitted from the lamp are irradiated to the substrate to be processed on the mounting table via the window member; the ultraviolet illuminance measuring means receives ultraviolet rays from the ultraviolet irradiation means at a predetermined position, and measures the ultraviolet rays. And an irradiation distance adjusting means for adjusting the distance between the ultraviolet irradiation means and the mounting table based on the ultraviolet illuminance measurement method obtained by the ultraviolet illuminance measuring means. In the second aspect of the present invention described above, g 卩 changes the ultraviolet illuminance of the substrate to be processed applied to the mounting table by the ultraviolet irradiation means, and is used to detect the change in illuminance by the external illuminance measuring means, and the irradiation distance The adjustment method compensates for the change in illumination and the variable adjustment of the irradiation distance, so the Chinese paper standard (CNS) A4 (210X297 mm) can be applied to this paper size ---- (Please read the precautions on the back before filling this page) 、? Τ -S. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs -9-Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 505959 A7 ___ B7__ V. Description of the invention (7) Or UV light intensity can be maintained stably Maintain the quality and efficiency of UV irradiation treatment. In the third aspect of the present invention described above, in order to improve the accuracy of illuminance adjustment, it is preferable that the ultraviolet illuminance measuring means measures the ultraviolet illuminance of the substrate to be processed, which is irradiated on the mounting table, without interfering with the processed substrate. The position of the substrate may include a photo sensor disposed on the mounting table side. In particular, when a scanning type ultraviolet irradiation process is performed, the photo sensor is preferably arranged in a position in front of the substrate to be processed in the scanning direction. In addition, the 'irradiation distance adjusting means may include a means for variably adjusting a distance between the ultraviolet irradiation means and the mounting table in accordance with a plate thickness of the substrate to be processed placed on the mounting table. In this way, using the thickness of the processed substrate as a parameter for illuminance adjustment is also effective in improving the accuracy of illuminance measurement and even the illuminance adjustment. Furthermore, in order to stably maintain the ultraviolet illuminance of the substrate at a desired level, it is preferable that the irradiation distance adjustment means includes: a reference illuminance setting means to set a desired reference illuminance; and a relative position adjustment means to compare the ultraviolet illuminance measurement 値The comparison error with the reference illuminance 'is close to zero to adjust the relative position between the mounting table and the ultraviolet irradiation means. In addition, in order to perform stable and good ultraviolet irradiation treatment, it is preferable that the irradiation distance adjustment means includes: a maximum interval setting means for setting a maximum interval between a window member and a mounting table or a substrate to be processed on the mounting table; and Means for limiting the interval, in the variable adjustment of the interval, it is expected that the paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) --------- 0 ------, ^ 1 ---- (Please read the notes on the back before filling this page) -10- Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 505959 A 7 B7_ V. Description of the invention (8) The interval reaches this maximum or exceeds the maximum In a case where the interval is limited to the maximum interval, the configuration may include: minimum interval setting means for setting a minimum interval between the window member and the mounting table or a substrate to be processed on the mounting table; and a minimum interval limitation method In the variable adjustment of the interval, it is expected that when the interval reaches the minimum 値 or is lower than the minimum 値, and the interval is limited to the minimum 値, the constitution may also be made. According to a fourth aspect of the present invention, there is provided a substrate processing apparatus for irradiating ultraviolet rays on a substrate to be processed to perform a predetermined process. The characteristics include: a mounting table for placing and supporting a substrate to be processed; and an ultraviolet irradiation means' having ultraviolet rays. A lamp and a window member that transmits ultraviolet rays, and the ultraviolet rays emitted by the lamp are irradiated to the substrate to be processed on the mounting table via the window member; and a means for causing an inert gas between the window member and the substrate to be processed on the mounting table. The gap flows. According to a fifth aspect of the present invention, a substrate processing apparatus is provided for performing predetermined processing on a substrate to be processed by irradiating ultraviolet rays, and the features include: a mounting table for mounting and supporting a substrate to be processed; and ultraviolet irradiating means' having ultraviolet rays. A lamp and a window member that transmits ultraviolet rays, and the ultraviolet rays emitted by the lamp are irradiated to a substrate to be processed on the mounting table via the window member; a driving means for scanning the ultraviolet rays from the ultraviolet irradiation means; CNS) A4 specification (210X 297mm 1 ~ --------- --------- 0 -----— 1T ------ ^ 9. (Please read the note on the back first Please fill in this page again for details) -11-505959 A7 B7 V. Description of the invention (9) Any one of the processing surface of the processing substrate on the mounting table has the mounting table and the ultraviolet irradiation means in a predetermined direction. Or both sides move (please read the precautions on the back before filling this page) The inert gas injection means, viewed from the first direction by the ultraviolet irradiation means, is approximately parallel to the scanning direction, and sends the inert gas into the window member A gap between the substrates to be processed on the mounting table; and an inert gas inhalation means for inhaling and exhausting the inert gas passing through the gap when viewed from a second position opposite to the first position by the ultraviolet irradiation means. In the fourth and fifth aspects of the present invention described above, the Ministry of Intellectual Property Bureau employee consumer cooperative prints inert gas through the gap between the window member and the substrate to be processed on the mounting table. Air is eliminated by oxygen in particular. Therefore, the ultraviolet rays emitted from the window member of the ultraviolet irradiation means reach the substrate to be processed, which can reduce the degree of absorption and attenuation by oxygen. Accordingly, the power consumption of a lamp to obtain a desired illuminance is small. It can be completed and the life of the lamp can be extended. In addition, since the ultraviolet reaction products are also eliminated from the gap by the flow of the inert gas, it is difficult to attach to the window member. In particular, according to the fifth aspect, it can be seen from the ultraviolet irradiation means. The first orientation is approximately parallel to the scanning direction, and an inert gas is sent into the window member and the substrate to be processed on the mounting table. The inert gas injection means for the gap between the inert gas inhalation means for inhaling and discharging the inert gas passing through the gap and the inert gas inhalation means for inhaling and discharging the inert gas passing through the gap and the second orientation viewed from the ultraviolet irradiation means on the side opposite to the first orientation. [Simplified description of the diagram] This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X297 mm) -12-Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 505959 A7 ___ B7_ V. Invention Explanation (19 FIG. 1 is a plan view schematically showing a photoresist coating development processing system equipped with the substrate processing apparatus of the present invention. FIG. 2 is a flowchart showing a processing procedure in the photoresist coating development processing system of FIG. 1. FIG. Section 3 is a schematic cross-sectional view showing an ultraviolet irradiation unit according to the first embodiment of the present invention. Fig. 4 is a plan view schematically showing an ultraviolet irradiation unit according to the first embodiment of the present invention. Fig. 5 is a schematic diagram showing the operation mode of the ultraviolet irradiation unit in stages. Fig. 6 is a plan view schematically showing an ultraviolet irradiation unit according to another example of the first embodiment of the present invention. FIG. 7 is a cross-sectional view of a stage constituting the ultraviolet irradiation unit of FIG. 6. Fig. 8 is a plan view schematically showing an ultraviolet irradiation unit according to still another example of the first embodiment of the present invention. Fig. 9 is a sectional view schematically showing an ultraviolet irradiation unit according to a second embodiment of the present invention. Fig. 10 is a perspective view showing a mounting structure of a light sensor for illuminance measurement in an ultraviolet irradiation unit according to a second embodiment of the present invention. Fig. 11 is a block diagram showing a configuration of a main control system of an ultraviolet irradiation unit according to a second embodiment of the present invention. Fig. 12 is a block diagram showing a configuration example of an illuminance adjusting section in an ultraviolet irradiation unit according to a second embodiment of the present invention. Figure 13 shows that the UV standard paper related to the second embodiment of the present invention is sized according to the Chinese National Standard (CNS) A4 (210X 297 mm): 13: " (Please read the precautions on the back before filling (This page) 505959 Α? Β7 V. Description of the invention ("~" Flow chart of the main action procedures in the Yi shot unit. (Please read the precautions on the back before filling this page) Figure 1 4 shows the invention The flowchart of the procedure for adjusting the illuminance in the ultraviolet irradiation unit according to the second embodiment. Fig. 15 shows the ultraviolet rays in the ultraviolet radiation unit according to the second embodiment of the present invention. Partial side view of the effect of the manner in which the neutral gas flows in the gap between the ultraviolet irradiation window and the substrate. Fig. 16 is a sectional view showing the structure of an ultraviolet irradiation unit according to another example of the second embodiment of the present invention. 17 is a plan view showing the main parts of the ultraviolet irradiation unit shown in Fig. 16. [Symbols] 38: Main conveyor UV: Ultraviolet irradiation unit 61: Stage 62: Ultraviolet irradiation chamber (light Departments) 63a, 63b, 63c: Lifting shaft (irradiation distance adjustment means) 65: Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, Ministry of Economic Affairs 65a, 65b: Sensors 67a, 67b, 67c ·· UV lamp 6 9: Ultraviolet light emission window (irradiation surface) 70: Lifting pin (irradiation distance adjustment means) 77 ·· Control unit 82: Piezoelectric element (irradiation distance adjustment means) This paper size applies Chinese National Standard (CNS) A4 specification (210 X 297 Mm) -M 505959 A7 B7 V. Description of the invention (1? 90 ·. Case (please read the precautions on the back before filling this page) 162: UV emission windows 164a, 164b, 164c: UV light 166: Lamp room 168 : Cleaning process chamber 172: Inert gas injection unit. 174: Inert gas suction unit 1 9 4: Stage 194a: Substrate mounting area 194b: Stage right end 1 9 8: Stage driving unit 204: Photo sensor 2 1 2: Control section 216: Stage lift drive section 218: Scanning drive section 222: Inert gas flow drive section 228: Illuminance measurement circuit 230: Board thickness setting section Printed by employee consumer cooperative of Intellectual Property Bureau of Ministry of Economic Affairs 232: Illumination comparison section 234 . Reference Illumination Setting Unit 236: Stage Lift Control 238: Maximum / minimum interval setting unit 240: Unit driving unit G: Substrate This paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) -15-505959 A7 B7 V. Description of the invention (1? [Better implementation Detailed description of the example] (Please read the precautions on the back before filling out this page) The following describes the embodiments of the present invention in detail with reference to the attached drawings. Fig. 1 is a plan view schematically showing a photoresist coating development processing system equipped with a substrate processing apparatus of the present invention. This photoresist coating and development processing system is installed in a clean room. For example, the LCD substrate is used as the substrate to be processed. · During the LCD manufacturing process, cleaning, photoresist coating, and photolithography are performed in advance. Each process of pre-bake, development, and post-bake. The exposure processing is performed by an external exposure device (not shown) provided adjacent to the system. This coating development system is roughly divided into Cassette station (C / S) 10, Process station (P / S) 12, Interface (I / F) 14 Made up. Printed on a cassette box station (C / S) 10 installed at one end of the system by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, which is provided with a cassette box C capable of holding a predetermined number of, for example, four substrates G The cassette cassette station 16 and the transfer mechanism 20 for accessing the substrate G with respect to the cassette cassette C on the cassette cassette station 16. This transfer mechanism 20 has a means capable of holding the substrate G, such as a transfer arm (Arm), is operable in four axes of X, Y, Z, and 0, and can perform a main transfer device 38 on a process station (P / S) 12 side described later Delivery to the substrate G. The process station (P / S) 12 mediates (sandwiches) the substrate relay section 23, the chemical liquid supply unit 25, and the space 27 in order from the above-mentioned cassette cassette station (C / S) 10 side. The cleaning process part 22, the coating process part 24, and the developing process part 26 are arrange | positioned in a horizontal line. The washing process section 22 includes two Scrubber washing units (SCR). -16- This paper size applies to China National Standard (CNS) A4 < 210 X 297 mm) 505959 Α7 Β7 V. Description of the invention (Qiao 28, UV irradiation / cooling unit (UV / C0l) 30, heating unit (HP) 32, cooling unit (COL) 34. (Please read the precautions on the back before filling this page) The coating process section 24 includes a photoresist coating unit (CT) 40, a reduced pressure drying unit (VD) 42, and an edge cleaner unit. (ER) 44, Adhesion / Cooling Unit (AD / C0L) 46, Adhesion / Cooling Unit (HP / C0L) 48, Heating Unit (HP) 50. The developing process section 26 includes three developing units (DEV) 52, two upper and lower two-stage heating / cooling units (HP / COL) 55, and a heating unit (HP) 53. In each of the process sections 22, 24, and 26, The central portion is provided with conveying paths 36, 52, and 58 in the longitudinal direction. The main conveying devices 38, 54, and 60 move along each conveying path, and access (access) each unit in each process part to transfer / transmit the substrate G. In addition, this system is equipped with a spinner unit on one side of the transmission path 36, 52, and 58 in each of the process sections 22, 24, and 26. SCR, CT, DEV, etc.), and heat treatment or irradiation treatment units (HP, COL, UV, etc.) are arranged on the other side. The mesial surface (I / F) on the other end of the system is installed at the process station ( P / S) The Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs prints 12 extensions (substrate delivery department) 57 and buffer stage 56 adjacent to the side, and is arranged on the side adjacent to the exposure device. Set the transfer mechanism 59 ° Figure 2 shows the processing procedure in this coating and development processing system. First, in the cassette box station (C / S) 10, the transfer mechanism 20 starts from a predetermined cassette box C on the stage 16. One substrate G is taken out and transferred to the main transfer device 38 of the cleaning process section 22 of the processing station (P / S) 12 (step S1). In the cleaning process section 22, the substrate G is firstly sequentially introduced with ultraviolet radiation / The paper size is in accordance with Chinese national standard (CNS> A4 specification (210X297) -17-505959 A7 B7 V. Invention description (π (Please read the precautions on the back before filling this page)) Cooling unit (UV / COL) 30 The upper ultraviolet irradiation unit (υν) performs dry cleaning by ultraviolet irradiation. The cooling unit (c0L) in the lower stage is cooled to a predetermined temperature (step S2). The organic matter on the surface of the substrate cleaned by the ultraviolet radiation is removed. Accordingly, the wettability of the substrate G is improved, and the scrubbing of the next process can be improved. (S crubbing) Washing effect during washing. Next, the substrate G is subjected to a brush cleaning process in one of the brush cleaning unit (SCR) 28 to remove particulate dirt from the substrate surface (step S3). After brushing and cleaning, the substrate G is subjected to a dehydration treatment by heating in a heating unit (HP) 32 (step S4), and then cooled to a constant substrate temperature in a cooling unit (COL) 34 (step S5). Accordingly, the pre-processing in the cleaning process section 22 is completed, and the substrate G is transferred to the coating process section 24 through the substrate transfer section 23 via the main transfer device 38. In the coating process part 24, the substrate G is first transferred to the adhering / cooling unit (AD / COL) 46 in order, and the first adhering unit (AD) is subjected to a hydrophobization treatment (HMDS) (step S6). The cooling unit (COL) is cooled to a certain substrate temperature (step S7). Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Then, the substrate G is coated with a photoresist liquid in a photoresist coating unit (CT) 40, and then subjected to a drying process under reduced pressure in a reduced pressure drying unit (VD) 42. In the edge cleaner unit (ER) 44, the excess (unnecessary) photoresist on the substrate periphery is removed (step S8). Second, the substrate G is sequentially transferred to the heating / cooling unit (HP / COL) 48, and is initially heated. The unit (HP) performs baking (pre-baking) after coating (step S9), and then, the cooling unit (COL) is cooled to a certain substrate temperature (step S10). In addition, a heating unit (HP) 50 can be used for the baking after coating. -18- This paper size applies Chinese National Standard (CNS) A4 specification {210 X297 mm) 505959 A7 B7 V. Description of the invention ((Please read the precautions on the back before filling this page) After the above coating process, the substrate G The main transfer device 54 of the coating process unit 24 and the main transfer device 60 of the development process unit 26 are transferred to the interface portion (I / F) 14 and transferred from there to the exposure device (step S11). The device exposes a predetermined circuit pattern to the photoresist on the substrate G. Further, the substrate G that has completed the pattern exposure is transferred back to the interface portion (l / F) 14 by the exposure device. The transfer mechanism 59 of the interface portion (I / F) 14 The substrate G intermediary stretcher 57 received by the exposure device is transferred to the development process section 26 of the process station (P / S) 1 2 (step S 1 1). In the development process section 26, the substrate G is in the development unit (DEV) 52. Any one of them is subjected to a development process (step S1 2), and then is successively introduced into one of the heating and cooling unit (HP / COL) 55, and is post-baked in the first heating unit (HP) (step S13), followed by , The cooling unit (COL) is cooled to a certain substrate temperature (step S14). Thereafter The heating unit (HP) 53 can also be used for baking. The substrate G that has been processed in a series in the developing process section 26 is returned to the wafer cassette by the main transfer devices 60, 54, 38 in the process station (P / S) 12. Station (C / S) 10, where any cassette box C is accommodated by the transfer mechanism 20 (step S1). ○ Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. The first embodiment of the ultraviolet irradiation unit (UV) of the resist coating development processing system. Fig. 3 is a cross-sectional view schematically showing the ultraviolet irradiation unit (UV) according to the first embodiment of the present invention. The top view of the ultraviolet irradiation unit (UV) is shown slightly. The ultraviolet irradiation unit (UV) includes a housing 90 forming a cleaning room, and a rectangular table 61 and an ultraviolet irradiation room are housed in the housing 90. 6 2. The table 6 1 has a mounting surface on which the substrate G is mounted, and can be moved (slide) on the conveying path-19- This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) 505959 A7 B7 V. Invention Description (17 (Please read the notes on the back first) Please fill in this page again) The diameter 36 is approximately parallel (X direction). In addition, the ultraviolet irradiation chamber 62 is arranged in the middle of the movement path of the stage 61, and the substrate G placed on the stage 61 is faced by the upper side of the stage 61. As shown in FIG. 4, the stage 61-series intermediary connection device 73 is connected to a guide rail 72 extending substantially parallel to the conveyance path 36, and is driven by the stage driving unit 75 to reciprocate along the guide rail 72. action. Specifically, the upper stage 61 is driven by, for example, a telescopic movement of an air cylinder (not shown) driven by a drive signal from the stage driving unit 75 or a rotary movement of a ball screw (not shown). The arm 38a receives the home position of the substrate G (the first position shown by a solid line in FIG. 4) and the return position that passes almost completely through the ultraviolet irradiation chamber 62 (the second position shown by a one-dot chain line in FIG. 4) Position). Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. On the other hand, the ultraviolet irradiation room 62 is provided with an ultraviolet emission window 69 made of quartz glass which functions as an irradiation surface on the bottom surface. For example, three cylindrical ultraviolet lamps 6 are arranged in the room. 7 a, 6 7 b, and 6 7 c are arranged in a state of being aligned along the moving direction (X direction) of the stage 5 2. Each of the lamps 67a, 67b, and 67c can irradiate ultraviolet rays uniformly over the entire width of the substrate G, and extend a predetermined length in a direction slightly orthogonal to the moving direction of the stage 61 (γ direction). Each of the lamps 67 &, 67b, 67c is connected to the irradiation driving section 78, and 0N / 0FF is performed by a driving signal from the irradiation driving section 78. ^ Each of the lamps 67a, 67b, and 67c in the external irradiation chamber 62 can use, for example, a dielectric barrier discharge lamp, which emits light by receiving commercial AC power, and emits ultraviolet rays (ultraviolet excited) with a wavelength of 172 nm which is better for cleaning organic pollution. Excimer light). Beside or above each lamp 67a, 67b, 67c, a cross-section round paper size is applicable to Chinese National Standard (CNS) A4 (210 X 297 mm) -20-505959 A7 B7 V. Description of the invention (M (please first Read the notes on the back and fill in this page again.) The arc-shaped concave mirror 6 8 reflects the ultraviolet rays radiated from each lamp to the top and even to the side on the mirror concave surface 68 directly above, and is directed toward the ultraviolet emission window 69 side. The ultraviolet irradiation chamber 62 is provided with a cooling envelope (not shown in JacketK) for cooling the ultraviolet lamps 67a, 67b, and 67c in a water-cooled manner, for example, or introducing and filling oxygen to prevent absorption of ultraviolet rays (thus deteriorating the light emitting efficiency of the lamp). An inert gas entering the room, such as a gas distribution mechanism of N2 gas (not shown), etc. may be printed on the upper side of the moving path of the stage 61 by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, and the ultraviolet emission window 69 and the substrate for detecting the irradiation surface are detected. The distance detection section 65 for the distance between the G surfaces is disposed closer to the home position than the ultraviolet irradiation chamber 62. The distance detection section 65 is secured by the mounting section 66. The plural points mounted on the substrate G in the ultraviolet irradiation chamber 62 are arranged in the Y direction (the width direction of the substrate G). The distance between the ultraviolet emission window 69 on the irradiation surface and the surface of the substrate G should be measured. For example, a plurality of sensors 65a, 65b, etc. composed of light sensors. The detection signals obtained by the light sensors of the distance detection section 65 are input to the console driving section 75 and the irradiation. A driving unit 78 and a driving control unit 77 of a lifting driving unit 76 described later. A lifting mechanism 63 serving as an irradiation distance adjusting means is provided below the stage 61. The lifting mechanism 63 is an ultraviolet emission window 69 and The distance between the surfaces of the substrate G is, for example, three lifting (retractable) shafts 63a, 63b, 63c connected to the bottom surface of the stage 61, and motors 64a, 64b, 64c that lift (retract) the lifting shafts 63a, 63b, 63c. Each of the motors 64a, 64b, and 64c is connected to the elevating drive unit 76, and is driven by the elevating drive unit 76.-This paper is in accordance with the Chinese national standard (CNS> A4 specification (210 X297 mm) 505959 A7 B7 V. Invention Theory (1? (Please read the precautions on the back before filling in this page) The signals are individually driven to raise and lower the corresponding lifting shafts 63a, 63b, 63c. That is, the lifting shafts 63a, 63b, 63c are sent from the lifting drive unit 76 The driving signal is individually driven, and the height of the stage 61, that is, the distance between the ultraviolet emission window 69 on the irradiation surface and the surface of the substrate G is adjusted. Therefore, the aforementioned connection device 73 connects the stage 61 in order to allow the ascent and descent of the stage 61.上 Rail 72. Moreover, its height is adjusted (corrected) throughout the stage 61, so that the distance between the ultraviolet emission window 69 and the surface of the substrate G can be uniformly maintained throughout the entire surface of the substrate G, and three lift shafts 63a, 63b and 63c are separated from each other by a predetermined distance from the width direction (Y direction) and the longitudinal direction (X direction) of the stage 61, and specifically, they are arranged in a triangular configuration. In addition, a plurality of lifting pins 70 for lifting and lowering the substrate G from the stage 61 to the stage 61 protrude from the surface of the stage 61 and are freely arranged. These lifting pins 70 control the lifting operation by a driving signal from the lifting driving unit 76. Next, the operation of the ultraviolet irradiation unit (UV) configured as described above will be described. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs First, as described above, the substrate G is delivered to the stage 61 of the ultraviolet irradiation unit (UV) by the arm 38a of the main transfer device 38 of the mobile transfer path 36. In this case, as shown in Fig. 5 (a), in a state where the lifting pin 70 is projected from the surface of the table 61 to a predetermined height in advance, the table 61 is left at the starting position. Then, at this starting position, the substrate G is delivered to the lifting pin 70 by the arm 38a of the main conveying device 38. As shown in FIG. 5 (a), the substrate G is delivered to the lifting pin 70, and is raised and lowered by the elevator driving unit 76. The latch 70 is lowered, and the substrate G is placed on the mounting surface of the stage 61. Then, as shown in FIG. 5 (b), in order to make the irradiation surface of the ultraviolet irradiation chamber 62 and the paper size apply the Chinese National Standard (CNS) A4 specification {210X297 mm) -22-505959 A7 B7 V. Description of the invention (29 substrates) The distance between the G surfaces becomes a predetermined distance, and the lifting shafts 63a, 63b, and 63c are raised by the lifting driving unit 76. After the above operations are completed, the table 61 is moved from the starting position toward the ultraviolet rays by the table driving unit 75. The irradiation chamber 62 moves in the X direction, and the surface of the substrate G located on the side of the moving direction faces the ultraviolet emission window 69 in order to clean the organic matter using ultraviolet rays. Molecular light is particularly short-wavelength even in ultraviolet light. Because of its extremely short spatial transmission distance, the use of ultraviolet excimer light in order to give a sufficient cleaning effect to substrate G requires setting the distance between substrate G and the irradiation surface. On the order of several hundred μm to several mm. That is, in the case of organic matter cleaning by ultraviolet excimer light, strictly between the substrate G and the ultraviolet emission window 69 of the irradiation surface It is impossible to obtain uniform and sufficient cleaning effect in the G surface of the substrate unless the ultraviolet excimer light is uniformly irradiated across the entire surface of the substrate G. However, the glass substrate for LCDs has recently tended to become larger. As the size of the stage 61 on which the glass substrate for the LCD is mounted becomes larger, the distance between the ultraviolet emission window 69 of the ultraviolet irradiation chamber 62 and the surface of the substrate G becomes a predetermined distance. The lift shafts 63a, 63b, and 63c are raised. Actually, the distance between the ultraviolet emission window 69 and the substrate G cannot be equalized over the entire surface of the substrate G due to the bending of the stage 61 and the substrate G. Therefore, this embodiment is Before the substrate G faces the ultraviolet emission window 69 of the irradiation surface, each sensor of the distance detection unit 65 detects the distance between the moving substrate G and the ultraviolet emission window 69 in advance, and detects the movement of the stage 61 in accordance with the detection. In China, the high paper size of the successive correction station 61 by the lifting of the lifting shafts 63a, 63b, and 63c applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -23------------ -(Please read first Note on the back, please fill in this page again.) Ψ Printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs and printed by the Consumers ’Cooperatives of the Ministry of Economic Affairs and Intellectual Property Bureau ’s printed by 505959 A7 B7. 5. Description of invention (2) The distance between the emission window 69 and the surface of the substrate G is uniform throughout the entire surface of the substrate G, and the substrate G is sent to a position facing the ultraviolet emission window 69. This will be described in detail below. First, the substrate G is shown in FIG. 3 The distance from the ultraviolet detection window 69 is detected by each sensor of the distance detection unit 65 at a predetermined timing (Timing) in units of its width-wise columns. Specifically, the distance between each sensor 65a, 65b ... and a point on the substrate G facing each sensor 65a, 65b is measured by light emitted from each sensor 65a, 65b ... The known height of the measurement chirp and the ultraviolet emission window 69, and the distance between the ultraviolet emission window 69 and the measurement point on the substrate G are calculated by the control unit 77. At this time, when the distance between the ultraviolet emission window 69 and the measurement point on the substrate G is set to L, in order to correct the height of the substrate at the measurement point that does not satisfy the set distance L, the control unit 77 uses the distance detection unit. The rows of the substrate G in the width direction detected by the 65 sensors and the ultraviolet emission windows 69 on the irradiation surface face each other, and the motors 64a, 64b, and 64c are individually driven by the lift driving unit 76 to control the width. The distance between all measurement points in the direction column and the ultraviolet emission window 69 is L. This operation is performed each time a detection is performed by each sensor of the distance detection unit 65 at a predetermined timing, and as a result, the distance between the ultraviolet emission window 69 on the irradiation surface and the surface of the substrate G is caused. The distance is uniform throughout the entire surface of the substrate G (distance L), and the substrate G is sent to a position facing the ultraviolet emission window 69 (see FIG. 5 (c)). In addition, based on the detection information from the distance detection unit 65, the motor is driven sequentially from the motor near the ultraviolet irradiation chamber 62, that is, by driving the motors 64a, 64b, and 64c in this order, the paper is moved from the side to the end of the paper. Standards apply to Chinese National Standards (CNS > A4 specifications < 210X297 mm) -24-(Please read the notes on the back before filling in this page) 505959 A7 _B7_ V. Description of the invention (2? {Please read the notes on the back before filling in this page) Correct the stage 61 in turn Height is ok. In addition, the detection data from each sensor of the distance detection unit 65 is stored in the memory of the control unit 77 during the journey from the home position to the return position. As described above, the light irradiation is performed throughout the entire surface of the substrate G. When the substrate G reaches the return position (the position indicated by a one-dot chain line in FIG. 4), the stage 61 is moved in the opposite direction to the starting position. In this return, the substrate G is also irradiated with ultraviolet rays from the ultraviolet irradiation chamber 62, and organic matter is uniformly cleaned over the entire surface of the substrate g by the same operation as described above. In this case, in the aforementioned process, the height of the stage 61 is corrected based on the detection data stored in the memory of the control unit 77, and at the same time, the entire surface of the substrate G is uniformly irradiated with ultraviolet rays. Then, at the stage where the substrate G reaches the starting position, the substrate G is delivered to the arm 38a of the main transfer device 38 on the stage 61 of the ultraviolet irradiation unit (UV). Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. In addition, in this embodiment, the ultraviolet irradiation unit (UV) does not contact the substrate G with the ultraviolet emission window 69 on the irradiation surface due to the lifting operation of the lifting shafts 63a, 63b, and 63c. An Interlock mechanism is provided to regulate the lifting operation of the lifting shafts 63a, 63b, and 63c. Specifically, the contact preventing interlocking mechanism is mainly composed of a distance detecting section 65, a control section 77, and an elevating driving section 76. The distance between the substrate G and the ultraviolet emission window 69 detected by the distance detecting section 65 is lower than a predetermined threshold. If it is recognized by the control section 7 7, the lifting of the lifting shafts 63 a, 63 b, and 63 c is stopped by driving the motors 6 4 a, 6 4 b, and 6 4 c of the lifting driving section 76, or on the G surface of the substrate. In front of the ultraviolet emission window 69, the lift shafts 63a, 63b, and 63c are lowered by a predetermined amount by driving the motors 64a, 64b, and 64c of the lift driving unit 76. Moreover, it is found through actual measurement or simulation that the bendable substrate G is closest to the ultraviolet emission window 69. ^ The paper size applies the Chinese National Standard (CNS) A4 specification. < 210X297 mm): 25-one 505959 A7 B7 V. Description of the invention (2 $ (please read the precautions on the back before filling this page) The point on the functional substrate G is determined by the distance from the sensing unit. The detector actively detects this point, confirming the possibility of contact, and sliding the substrate G to the ultraviolet emission window 69 side. As described above, in the ultraviolet irradiation unit (UV) of this embodiment, the substrate G faces ultraviolet rays. In front of the emission window 69, the distance between the substrate G and the ultraviolet emission window 69 is detected in advance by the distance detection unit 65. Based on this detection, the height of the stage 61 is successively corrected by the elevation of the elevation axes 6.3a, 63b, 63c, and simultaneously The substrate G is fed into a position facing the ultraviolet emitting window 69. Specifically, the height of the stage 61 is adjusted at a plurality of positions of the stage 61 to correct the ultraviolet emitting window of the irradiation surface caused by the bending of the stage 61 and the substrate G. The unevenness of the distance between 69 and the surface of the substrate G makes the distance between the ultraviolet emission window 69 and the surface of the substrate G equal throughout the entire surface of the substrate G. Therefore, ultraviolet rays can be irradiated uniformly throughout the entire surface of the substrate G, which can be avoided Non-uniform cleaning, uniform and sufficient cleaning effect can be obtained on the surface of the substrate G. This effect is printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Especially for ultraviolet rays, it is necessary to use the setting substrate G and the ultraviolet emission window 69. The distance between the ultraviolet excimer light in the order of several hundred / m to several mm is beneficial. The ultraviolet excimer light has a short wavelength as mentioned above, and because of its extremely short spatial transmission distance, it needs to be more than ordinary ultraviolet light. It also strictly manages the distance between the substrate G and the irradiation surface. At the same time, the response (ON / OFF) is good compared with ordinary ultraviolet rays, so the throughput can be improved. Therefore, the UV excimer light If the substrate G is irradiated and cleaned, and the distance management between the substrate G and the ultraviolet emission window is strictly performed by the distance detection unit 65, the productivity can be improved, and the cleaning effect can be improved. The subsequent photoresist film can be greatly improved. The precision and efficiency of the forming process. -26- The paper size is in accordance with the Chinese National Standard (CNS) A4 specification (210X297 mm) 505959 A7 B7 V. Description of the invention (24 (Please Read the precautions on the back before filling in this page.) Furthermore, the ultraviolet irradiation unit (UV) of this embodiment is equipped with a contact prevention interlock mechanism that prevents the substrate G from contacting the ultraviolet emission window 69, so that the substrate G can be safely and reliably carried out. In addition, the distance from the starting position to the return position is only detected by the distance detection unit 65, and the return from the return position to the starting position may be performed by first irradiating the excimer UV light. That is, the ultraviolet rays are not irradiated during the journey from the starting position to the returning position, and the distance between the substrate G and the ultraviolet emission window 69 is detected by the distance detecting section 65, and the detection data is stored in the memory of the control section 7-7. On the return journey from the return position to the start position, the height of the stage 61 may be corrected based on the detection data stored in the memory, and ultraviolet rays may be uniformly irradiated throughout the entire surface of the substrate G. Next, another example of this embodiment will be described with reference to FIGS. 6 and 7. In addition, in this example, the same components as those in the previous example are denoted by the same reference numerals and their descriptions are omitted. The previous examples shown in Figures 3 and 4 are printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. By adjusting the height of the stage 61 using the lifting shafts 63 a, 63 b, and 63 c, the plural points on the substrate G are indirectly The height of the substrate G, that is, the distance between the ultraviolet emission window 69 and the surface of the substrate G is changed. However, in this example, the plurality of piezoelectric elements 82 supporting the substrate G directly and in detail make the substrate G The height, that is, the distance between the ultraviolet emission window 69 and the surface of the substrate G changes. Specifically, the piezoelectric elements 82 are fixed to the surface of the stage 61 in order to form a plurality of rows along the width direction and the longitudinal direction of the stage 61, for example. Further, each of the piezoelectric elements 82 is electrically connected to the elevating driving unit 76, and the elevating driving unit 76 may apply a voltage to the piezoelectric elements 82 individually or in units of columns in the width direction. Then this paper standard uses Chinese National Standard (CNS) A4 specification (210 > < 297ϋ-27-505959 A7 B7___ 5. Description of the Invention (The control section 77 controls the voltage applied to the piezoelectric element 82 by the lift driving section 76 based on the detection result from the distance detection section 65. (Please read the precautions on the back first (Please fill in this page again.) In addition, in order to prevent the displacement of the substrate G caused by the deformation of the piezoelectric element 82, the stage 61 is provided with an attractive force to the back surface of the substrate G so that the substrate G is attracted to the majority of the piezoelectric element 82. 7 suction holes 80. In addition, as shown in FIG. 7, these suction holes 80 are connected to, for example, a suction pump 85 via an intermediate suction pipe 84. • The other structures of this example are the same as the examples shown in FIG. 3 and FIG. 4 described above. According to this configuration, the height of the substrate G is adjusted at a plurality of points on the substrate G that is in contact with the piezoelectric element 82 by mechanical strain (deformation) of the piezoelectric element 82 accompanying the application of a voltage. The aforementioned first embodiment The height of the stage 61 (substrate G) is adjusted at three correction points, but this embodiment corresponds to the number of piezoelectric elements 82. The number of correction points has increased dramatically compared with the previous example. This part is due to the height of the substrate G Detailed Therefore, the equalization rate of the irradiation distance can be greatly improved. Next, another example of this embodiment will be described with reference to FIG. 8. In addition, in this example, the same components as those in the previous two examples are denoted by the same reference numerals and omitted. The consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs prints the lifting pin 70 of this example instead of the piezoelectric element 82 of the above example. That is, by driving a plurality of lifting pins 70 individually, the height of the substrate G is adjusted on the substrate G. Many points are performed. The rest of the structure is the same as the example shown in FIG. 6 and FIG. 7, so that the same function and effect as in this example can be obtained. In addition, the ultraviolet emission window 69 of the irradiation surface of the first embodiment is fixed. The substrate G is slid toward the ultraviolet emission window 69, but the substrate G is fixed, and the configuration in which the ultraviolet emission window 69 is slid toward the substrate G may also be used. Moreover, although the paper size of the display is applicable to the Chinese National Standard (CNS) A4 specification {210X297 male (Centi): 28: ~ 505959 A7 _B7 V. Description of the invention (2 examples of washing with ultraviolet rays, but it is not limited to washing with other light (Please read the precautions on the back before filling this page.) Next, the ultraviolet irradiation unit (UV) related to the second embodiment of the present invention will be described. As shown in FIG. 9, the second embodiment of the present invention The ultraviolet radiation unit (UV) related to the form is equipped with an ultraviolet emission window 162 'made of quartz glass on the bottom surface, and three cylindrical ultraviolet lamps 164a, 164b, and 164c are arranged in the room and arranged in a horizontal direction orthogonal to the longitudinal direction of the lamp. The lamp chamber 1 66 and a washing treatment chamber 168 disposed adjacent to the lamp chamber 166 are disposed below the lamp chamber 166. In the lamp chamber 166, each of the ultraviolet lamps 164a, 164b, and 164c is, for example, a dielectric barrier discharge lamp. The power supply unit 220 emits light upon receiving the supply of commercial AC power, and emits ultraviolet rays (ultraviolet excimer light) having a wavelength of 172 nm which is preferable for cleaning organic pollution. A concave concave mirror i7 with a cross-section circular arc is arranged on the back of each ultraviolet lamp 164a, 164b, 164c, that is, on the upper surface, and the concave surfaces of the mirrors where ultraviolet rays radiated from each lamp 164a, 164b, 164c to the upper side or directly above are directly above. It is partially reflected and is directed toward the ultraviolet emission window 162 side. The consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs can print a cooling envelope (not shown) for cooling the ultraviolet lamps 164a, 164b, and 164c in the lamp room 1 66, or introduce and fill it to prevent it. Oxygen that absorbs ultraviolet rays (and therefore deteriorates the luminous efficiency of the lamp) enters the room with an inert gas such as a gas flow mechanism (not shown) of N2 gas or the like. On both sides of the lamp room 1 66, in the ultraviolet cleaning process, along the bottom surface of the ultraviolet emission window 162, an inert gas injection unit 1 72 for circulating oxygen or air exclusion inert gas, such as a% gas, and an inert gas intake are provided. Department 1 74. The inert gas injection unit 172 is located next to the right side of the lamp chamber 166 in FIG. 9, which is to be described later. The paper applies the Chinese National Standard (CNS) A4 specification (210 parent 297 mm 1:29: " " 505959 A7 B7. DESCRIPTION OF THE INVENTION In the movement direction (Y direction) of the Table during scanning, the gas pipe 176 extends parallel to the ultraviolet lamps 164a, 164b, and 164c, and is separated from the gas pipe 176. A plurality of inert gas injection ports 178 arranged in a row at a certain interval, an inert gas supply unit 1 80 for supplying an inert gas to the gas pipe 176 at a predetermined flow rate and pressure, and an inert gas to be injected from each of the inert gas injection ports 1 78 The gas is guided to the gas guide member 182 under the ultraviolet emission window 162. The inert gas suction part 174 is arranged in the moving direction (Y direction) of the table adjacent to the left side of the lamp chamber 166 in FIG. The rear side includes gas pipes 184 extending parallel to the ultraviolet lamps 164a, 164b, and 164c, and a plurality of inert gas suction ports 186 arranged in a row at a certain interval from the gas pipes 184. And a gas exhaust portion 188 that applies a negative pressure to the gas pipe 184 and discharges the inflowing gas, and an inert gas that guides the inert gas flowing from the inert gas injection portion 172 under the ultraviolet emission window 162 toward the gas suction port 186 The gas guide member 190. It is also possible to reverse the arrangement positions of the inert gas injection portion 172 and the inert gas suction portion 174 to the lamp chamber 166. Adjacent to the outside of the inert gas injection portion 172 and the inert gas suction portion 174 are ultraviolet rays. Each unit in the irradiation unit (UV) is provided with an IJtility unit 192 for accommodating a force supplying unit for supplying a required force or a control signal, and an IJtility unit 192 of the control unit. A washing processing chamber 168 is provided for placing, A stage 194 capable of horizontal movement and elevation of the substrate G is supported. In this embodiment, the stage 194 and the stage driving unit are mounted on the self-propelled stage driving unit 198 using the guide rod 196 in a vertical direction (Z direction in the figure). 198 extends along the guide rod 196 and parallel to the guide rod 196 ---- f, (Please read the precautions on the back before filling in this page) Order the printed copy of the staff consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Paper size applies to China National Standard (CNS) A4 (210X297 mm) -30-505959 A7 B7 V. Description of the invention (Guide) 200, which is horizontal in the Y direction of the figure and parallel to the direction of lamp arrangement Just below the lamp room 1 66, it is reciprocated at a variable controllable speed (please read the precautions on the back before filling this page). At the stage 194, when the substrate G is transferred in / out, A plurality of (for example, six) lifting pins 202 for supporting the substrate G in a horizontal posture penetrate vertically. In this embodiment, each of the lifting pins 202 is fixed at a predetermined height position for substrate delivery. When the substrate G is transferred in / out, the fixed lifting pins 202 194 do not hinder the image in / out of the substrate G. The evacuation lower limit height position Kb and the upper limit height position Ha indicated by a one-point chain line on which the stage 194 itself is used to place and support the substrate G can be raised and lowered by a lifting mechanism (not shown). The stage 194 has a size larger than that of the substrate G. A plurality of supporting pins (not shown) for supporting the substrate G are provided in a predetermined region (substrate mounting region) 194a near the center of the substrate G. Or, a suction port (not shown) for sucking a vacuum chuck (Chuck) holding the substrate G. Then, in FIG. 9, a right-side end portion 194b of the table adjacent to the right side of the substrate placement region 194a, as shown in FIG. 10, is located on the right side of the table in front of the table reciprocating direction (γ direction). The light chamber 166 irradiates the photo sensor 204 with the ultraviolet illuminance of the substrate G on the stage 194. The side wall of the cleaning processing chamber 168 printed in FIG. 9 by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs is located adjacent to the origin of the Y direction of the stage 194 in FIG. 9 and is installed near the upper end of the fixed lifting pin 202 A switchable shutter (door) 206 for the incoming / outgoing substrate G. The shutter 206 faces the conveying path 36 (see FIG. 1) of the cleaning process unit 22. The shutter 206 opened by the main conveying device 38 on the conveying path 36 can transfer the substrate G to and from the substrate G. The inside of the processing chamber 168 is cleaned. One or more exhausts are arranged on the side or bottom of the cleaning treatment chamber 168. The paper size is applicable to the Chinese National Standard (CNS) A4 (210X297 mm). 31-505959 A7 B7 V. Description of the invention (2 Henry ( Please read the precautions on the back before filling this page.) Ports 208, each exhaust port 208 is an intermediate exhaust pipe 210 connected to an exhaust system (not shown) such as an exhaust duct (Duct). It is also possible to provide an external air suction port at an appropriate position in the processing chamber 1 68 (not shown). The 11 series shows the structure of the control system in this ultraviolet irradiation unit (UV). The control unit 2 1 2 is composed of a microcomputer and required It is composed of peripheral circuits. The built-in memory stores the required programs to control the various parts and the entire unit in the unit. The appropriate interface is connected to the main controller that summarizes the entire processing program of the coating and development processing system. (Not shown) or each part of the control system in the ultraviolet irradiation unit (UV). In this embodiment, the main part in the ultraviolet irradiation unit (UV) that is related to the control unit 2 1 2 is used for switching driving. Shutter 206 The door driving section 214, the table lifting driving section 216 for lifting and lowering the driving table 194 in the Z direction, the scanning driving section 218 for horizontally driving or scanning driving the lifting table 194 in the Y direction, and driving the lamp room 166. The lamp power supply unit 220 of the ultraviolet lamps 164a, 164b, and 164c, the inert gas flow driving unit 222 for manufacturing an inert gas flow under the ultraviolet emission window 162 of the lamp chamber 166, and the status or state quantity of each part in the device Sensors 224, etc. The Intellectual Property Bureau, Ministry of Economic Affairs, Employee Consumer Cooperative Print Station Lifting Drive Unit 2 1 6 and Scanning Drive Unit 2 1 8 For example, it has a servo motor as an individual drive source, and is arranged in the stage drive unit 1 9 8. The inert gas flow driving section 2 2 2 is a shut-off valve that drives the inert gas supply section 180 and the inert gas suction section 174 of the inert gas injection section 172 and 174, respectively. The device type 224 includes the above-mentioned light sensor 204 provided on the right end 194b of the stage 194. Fig. 12 is shown in the ultraviolet irradiation unit (UV) to adjust the paper size of the lamp to the Chinese National Standard (CNS) A4 Regulation (210 > < 297 mm) -32-505959 A7 B7 V. Description of the invention ((Please read the precautions on the back before filling in this tile) The irradiance of the ultraviolet rays of the substrate G on the stage 194 on the stage 194 is adjusted at the predetermined level In addition to the step sensor 204 and the stage lifting drive unit 2 1 6 in this illuminance adjustment unit, the portions 2 2 8 to 2 3 8 shown below are included in the control unit 2 1 2. Light sensor The output signal (eg, photocurrent) of 204 is input to the illuminance measurement circuit 228. The illuminance measurement circuit 228 uses the height signal between the output signal 光 of the light sensor 204 and the light receiving surface of the light sensor 204 and the surface of the substrate G. The offset (Offset) d is a variable, and the required signal processing or calculation processing is used to obtain the measurement (or estimation) of the ultraviolet illuminance in the surface of the substrate G on the stage 194 (E). Here, the stage The substrate mounting surface 194a of 194 is a reference surface, the light receiving surface height position Sh of the photo sensor 204 is constant, and the plate thickness Gt of the substrate G is coated and developed here. ) Conditions or attributes related to the substrate being processed One is assembled (S et) on the plate thickness setting section 230. Therefore, the above-mentioned height position shift d is given as d = Gt-Sh. The consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs prints the ultraviolet rays obtained by the illuminance measurement circuit 228 The illuminance measurement 値 e is given to the illuminance comparison unit 2 3 2. The illuminance comparison unit 2 3 2 compares the ultraviolet illuminance measurement 値 E with the reference illuminance Es from the reference illuminance setting unit 234 and finds the difference δ E between them. The reference illuminance Es is set at a predetermined scanning speed to an appropriate illuminance that can ensure the desired ultraviolet cleaning effect. The lifting control unit 2 36 is based on the illuminance error (5 E, The console 5 is driven to raise and lower the error 5E to close the error 2E, and the height position Ha for substrate placement of the stage 194 is changed. Based on this, the ultraviolet illuminance measurement 値 E obtained by the illuminance measurement circuit 2 2 8 is in line with the reference Illumination E s — Where this paper applies The Chinese National Standard (CNS) A4 specification {210X297 mm): 33-~ _ 505959 A7 B7 V. Description of the invention (3) Stop the variable adjustment of the height of the table. Please first (Please read the cautions on the back and fill in this page.) However, the table lift control section 236 is based on the position information indicating the table height position from a predetermined position sensor (not shown), etc., and the board from the board thickness setting section 230. Sheet thickness (Gt) data, the interval D between the substrate G on the monitor 194 and the ultraviolet emission window 162 of the lamp chamber 166, and the maximum / minimum interval setting unit 2 3 8 receives the maximum 値 Dm ax regarding this interval D And the minimum 値 Dmin data. Then, when the height position of the stage 194 is changed in accordance with the illuminance error 5 E from the illuminance comparison section 232, when the interval D reaches the maximum 値 Dmax (for example, 7mm) or the minimum 値 Dmin (for example, 3mm), the table is forcibly stopped there. The height of 194 is adjusted to limit or keep the interval D at the maximum 値 Dmax or the minimum 値 Dmin. Figure 13 shows the main operation procedure in the ultraviolet irradiation unit (UV). First, an instruction from the main controller is received, and the control unit 2 1 2 initializes each unit in the unit (step A0. In this initialization, the stage 194 is positioned in the Y direction to be close to the shutter 2 06 The origin position is lowered to the retreat height position (Hb) in the Z direction. The main conveyance device 38 (see Fig. 1) printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs is transferred from the cassette box station (C / S). 10 When the substrate G before the processing is transferred to the ultraviolet irradiation unit (UV), the control unit 2 12 controls the respective units by delivering the main transfer device 38 and the substrate G (step A2). In more detail, first control the shutter The driving section 2 1 4 opens the shutter 2 06. The main transfer device 38 has a pair of transfer arms, and one of the transfer arms is equipped with a substrate G before cleaning, so that the other transfer arms face in an empty (no substrate) state. The ultraviolet irradiation unit (UV) moves. When the ultraviolet irradiation unit (uv) is not cleaned, the paper size is suitable for household use (CNS > A4 «^ (21GX297 mm) ~ One 505959 A7 _B7__ V. Invention Instructions (3; (Please read the notes on the back first (Fill in this page) When the substrate G is completed, the transfer arm supporting the substrate G before cleaning is passed through the open shutter 2 6 and extended into the cleaning processing chamber 1 6 8 to clean the unwashed substrate. The substrate G is transferred to the fixed lifting pin 202. When the cleaned substrate G is present in the ultraviolet irradiation unit (UV), the cleaned substrate G is conveyed by an initially empty transfer arm, and then the same is transmitted as described above. The uncleaned substrate G is inserted. As described above, the substrate G that should be subjected to ultraviolet cleaning by the ultraviolet irradiation unit (UV) is introduced into the fixed lifting pin 202 by the main transfer device 38, and the shutter 206 is closed. Next, the control unit 21 2 Console lifting drive unit 2 16 Raises the stage 194 to the reference height position HaO (step As) for substrate placement. At this time, the suction of the vacuum chuck head is started during the stage 194 ascent, so that the stage 194 reaches the substrate stage. The reference height position Ha for placement can also attract and hold the substrate G. In addition, an appropriate margin can be set between the reference height position HaO for substrate placement and the front end height position of the fixed lift pin 202 (Margin ). Ministry of Economic Affairs Printed by the Intellectual Property Cooperative Consumer Cooperative, the control unit 212 controls the lamp power supply unit 220 to turn on the ultraviolet lamps 164a, 164b, and 164c (step A4), and controls the inert gas flow driving unit 222 to cause the inert gas injection unit 172 and the inert gas The suction unit 174 operates (step A5). Accordingly, the inert gas injection unit 172 on the right side of the lamp chamber 166 sends an inert gas (N2 gas) under the ultraviolet emission window 162, and is inert on the left side or downstream side of the lamp chamber 166. The gas suction unit 1 74 sucks inert gas, and forms an inert gas flow (flow) parallel to the stage moving direction (Y direction) along the bottom surface of the ultraviolet emission window 162. Secondly, the control unit 2 1 2 adjusts the illuminance before ultraviolet cleaning (step Αό) 〇 This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -35-505959 A7 B7 V. Description of the invention (3 (Please read the notes on the back before filling in this I) Figure 14 shows an example of the procedure for adjusting the illuminance. First, the lamp room 丨 66 If the alignment of the light sensor 2 04 for illuminance measurement is required, perform this Alignment (step B!). For example, at the origin position in the Y direction in FIG. 9, if the light sensor 2 0 4 on the right end 194b of the stage is separated from the ultraviolet irradiation area directly under the ultraviolet emission window 1 62, The stage 194 is moved a little in the Y direction, and the photo sensor 204 is placed in the ultraviolet irradiation area. In addition, the reference height position Ha for the substrate mounting is set in the Z direction. The reference position for illuminance adjustment is different. Ha! 'Also, the stage 194 can be matched to its height position Ha !. After the light sensor 204 is assembled to the lamp room 166 at a predetermined position as described above, the illuminance measurement circuit 22 in the illuminance control section (see FIG. 12) is used. And plate thickness setting section 230, The ultraviolet illuminance of the substrate G on the counter stage 194 is determined (step B2). Next, the error 5 E (5 E = Es-) of the illuminance measurement 値 E of the reference illuminance Es is obtained using the illuminance comparison unit 232 and the reference illuminance setting unit 234. E) (Step Bs) ° Then, the table lifting control section 236 determines the polarity and absolute value of the error 5 E (Step B4), and the console lifting driving section 216 selectively adjusts the height position of the table 194 (Step B 5 to 5) B 1 1). Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs (5 E < 0, that is, when the illuminance measurement 値 E is larger than the reference illuminance Es, it is judged whether the interval D has reached the maximum 値 Dmax (step B6). For the normal case that has not been reached, only the table height position Ha is lowered by a predetermined pitch (Pitch) (For example, 0.1 mm) The distance D between the ultraviolet emission window 162 and the substrate G on the stage 194 is increased by this distance (step b7), and then the illuminance measurement is returned (steps b! 2 and B2). However, when the expected interval D is reached by the maximum / minimum interval setting unit 2 3 8 or exceeds the given maximum 値 Dmax, the interval D is fixed at the maximum 値 -36- This paper size applies the Chinese National Standard (CNS ) A4 specification (210X297 mm> 505959 A7 _B7_ V. Description of the invention (3 $ (Please read the precautions on the back before filling this page)
Dmax的高度位置固定台194(步驟B8)。通常間隔D被調整到 最大値Dmax附近爲燈室166側的燈亮度爲最大時，即紫外線 燈164a、164b、164c的使用開始緊接著或更換緊接著。 當5 E>0時，即當照度測定値E比基準照度Es還小時判 斷間隔D是否達到最小値Dmin(步驟B9)，對於未達到的通常 情形，僅將台高度位置Ha提升預定間距（例如0.1 mm)，紫外 線射出窗162與台194上的基板G的間隔D僅縮小該間距（步驟 Βΐ〇)，然後返回照度測定（步驟Bl2、B2)。但是，當預期間隔 D由最大/最小間隔設定部23 8到達所給予的最小値Dmin，或 比此最小値Dmin小時，在間隔D固定於最小値Dmin的高度 位置固定台194(步驟Bh)。再者，如此間隔D被調整到最小 値Dmin由於燈室166中的紫外線燈164a、164b、164c的亮度 因隨著時間劣化等而相當地降低，故發出用以催促燈更換 等的維修保養（Maintenance)的警報（Alarm)也可以（步驟Βι!) 。當發出這種警報時，終止紫外線洗淨也可以。 經濟部智慧財產局員工消費合作社印製 當照度測定値E與基準照度Es—致時（5 E = 0)，不改變 台194的高度位置Ha，返回照度測定（步驟B5、B2)。此外， 令基準照度Es的値具有適當的寬度或範圍，在照度測定値e 收斂於該範圍時也能視兩者爲一致（(5 E = 0)。 此例因到照度測定値E與基準照度Es—致爲止施加反饋 (Feedback)，故可進行精度高的照度調整。但是，演算依照 來自照度比較部23 2的比較誤差（5 E的間隔或台高度位置的 調整目標値’以到達該調整目標値’可利用開環控制（〇 p e η loop control)來調整台194的高度位置。 -37- 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 505959 A7 B7 五、發明説明（3$ (請先閱讀背面之注意事項再填寫本頁) 在進行如上述的照度調整（步驟A 6 )的期間，對紫外|泉身寸 出窗162與台右側端部194b的間隙P，以與紫外線照射洗淨 處理時大致相同的條件，由惰性氣體噴射部1 72朝惰性氣體 吸入部1 7 4流通惰性氣體（N 2氣體）。此惰性氣體流(圖1 2)具 有有效地由間隙P排除空氣特別是氧的作用。據此，由燈室 166的紫外線射出窗162放射到垂直下方的紫外線（紫外受激 準分子光）到達光感測器204的受光面爲止，被氧吸收衰減 的程度大幅地被減輕，與無惰性氣體流比較大大地提升在 相同間隔D的台上的照度。此外，惰性氣體流F最好比台側 靠近紫外線射出窗162側流動。 經濟部智慧財產局員工消費合作社印製 在如上述的照度調整（步驟A6)後，實行對台194上的基 板G的紫外線洗淨處理（步驟A7)。爲了進行此紫外線洗淨處 理，控制部212藉由台驅動部198內的掃描驅動部218使台194 在原點位置與以虛線表示的往動位置194’之間，於Y方向單 向移動或往復移動。此台移動台194係藉由在之前的照度調 整（步驟A6)所決定的高度位置於Y方向橫越燈室166的正下方 ，由燈室166的紫外線射出窗162朝大致垂直下方放射的波 長172nm的紫外線，以和基準照度約略相等的照度照射基板 G，同時在與台移動方向（Y方向）相反的方向由基板的一端 掃描到他端。 如此，藉由對基板G照射波長172nm的紫外線使存在於 基板表面附近的氧藉由該紫外線變成臭氧〇3，再者，此臭 氧Ch被該紫外線激發生成氧原子原子團（Radical)O*。藉由 此氧原子原子團〇3附著於基板G表面的有機物分解成二氧化 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐) -38- 505959 A7 _B7_ 五、發明説明（39 碳與水’自基板表面被除去。分解、氣化的有機物被由排 氣口 208排氣。 (請先閲讀背面之注意事項再填寫本頁j 在這種掃描式紫外線洗淨處理中，對基板G的紫外線照 射量或累計光量與台194的移動速度（掃描速度）成反比。即 令掃描速度越快，對基板G的紫外線照射時間變短、紫外線 照射量變少，相反地令掃描速度越慢，對基板G的紫外線照 射時間變長、紫外線照射量變多。在一定限度內，紫外線 照射量越多被由基板G表面除去的有機物也越多。 本實施形態因如上述在藉由照度調整（步驟A6)調整由燈 室166施加給台194上的基板G的紫外線照度於基準照度附近 的値後’進行如上述的掃描式紫外線洗淨處理（步驟A7)，故 燈室166中的紫外線燈164 a、164b、164c的亮度即使因隨著 時間劣化等而降低’也能保持紫外線照射時間以及掃描速 度於設定値（因此，不降低產能），可維持良好的洗淨處理品 質。 經濟部智慧財產局員工消费合作社印製 而且’在紫外線洗淨處理中如圖1 5所示，藉由惰性氣 體噴射部172以及惰性氣體吸入部174在燈室166的紫外線射 出窗1 62與台1 94上的基板G之間的間隙P形成惰性氣體（N2氣 體）流F。與之前的照度調整（步驟A6)時一樣，此惰性氣體流 F具有有效地由間隙P排除空氣特別是氧的作用。而且，附 著或漂浮於基板G表面附近的氧未被那樣地被排除，充分地 確保紫外線洗淨處理用的臭養生成所需的氧。 如此，藉由惰性氣體流F自間隙P除去空氣中的氧，由 燈室166的紫外線射出窗162放射到垂直下方的紫外線（紫外 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） _ 39 - 505959 A7 B7 五、發明説明（3? (請先閱讀背面之注意事項再填寫本頁) 受激準分子光）可未那樣地衰減而到達基板表面的各部。因 此，在燈室1 66側可降低該部分燈投入功率，並且可延長紫 外線燈164a、164b、164c的壽命。再者，因使附隨於紫外線 洗淨處理而生成的紫外線反應生成物捲入惰性氣體流F，被 吸入惰性氣體吸入部174而排出到外部，故具有難以附著於 紫外線射出窗162的優點。 •對如上述的台1 94上的基板G的掃描式紫外線洗淨處理 完成後，控制部212控制燈電源部220使紫外線燈164a、164b 、164c燈熄（步驟As)。然後，緊接著控制惰性氣體流驅動部 222，停止紫外線射出窗162正下方的惰性氣體流F(步驟A9) 〇 接著，控制部212將台194返回到起始（Start)位置（步驟 An)。此實施形態首先藉由掃描驅動部218使台Γ94復動，其 次，在Y方向原點位置於關閉真空夾頭後藉由台升降驅動部 2 16將台194下降到退避用的高度位置（Hb)，使基板G被支持 於固定提升插銷202。如此，對一片基板G的本紫外線照射 單元（UV)內的全工程終了，等待主傳送裝置38(圖1)的到來 〇 經濟部智慧財產局員工消費合作社印製 如本實施形態對於以掃描式進行紫外線洗淨處理的情 形，當台194上的照度測定用的光感測器204通過燈室166的 紫外線射出窗162時，令照度調整部（圖12)的照度監控功能 作用，也能測定乃至於監控紫外線射出窗1 62正下方的紫外 線照度（分布）。藉由此照度監控功能可由台194側監控燈室 166內的各紫外線燈164a、164b、164c的亮度，可檢測亮度 -40- 本紙張尺度適用中周國家標準（CNS ) A4規格（21〇X 297公釐） 505959 A7 __B7_ 五、發明説明（3§ 異常地低的燈或無法點燈的燈。 (請先閲讀背面之注意事項再填寫本頁) 上述構成係固定燈室166使台194側與基板G的表面平行 而移動的掃描方式。但是，在預定位置固定台194側使燈室 1 6 6側與基板G的表面平行而移動的掃描方式也可能。 而且’也能以旋轉運動實現爲了紫外線掃描的燈室.1 66 與台194之間的相對移動。圖16以及圖17係顯示旋轉掃描式 的裝置構成例。圖中具有與上述實施形態所述者一樣的構 成或功能的部分附加相同的符號。此構成例在台驅動部240 配設台升降機構與旋轉機構（未圖示），進行紫外線照射處理 時該旋轉機構動作，使台194以及基板G以預定速度繞台中 心鉛直軸0旋轉移動。此外，固定台194側使燈室166側旋轉 移動的構成也可以。 如果依照這種旋轉掃描方式，因台194或燈室166的平 面空間以必要最小限就能完成，故可實現裝置空間的小型 化。而且，如圖17所示可縮短燈室166內的紫外線燈164a、 164b、164c的所需長度尺寸。 經濟部智慧財產局員工消費合作社印製 第二實施形態中的燈室1 66內或洗淨處理室內的構成， 特別是紫外線射出窗162、紫外線燈164a、164b、164c、台 194、台驅動部198、240、照度調整部（圖12)等的構成也爲 一例，關於各部種種的變形爲可能。 上述第二實施形態因將照度測定用的光感測器204配置 於最接近台194上的基板G的位置，根據光感測器204的輸出 訊號測定基板G中的紫外線照度，故可進行精度高的照度測 定。但是，精度下降有可能將這種照度測定用的光感測器 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -41 - 505959 A7 B7_ ___ 五、發明説明（3$ 2 04配置於其他的場所例如台194的外側，或者使受光面露 出埋設配置於台194上的基板載置區域194a ° (請先閱讀背面之注意事項再填寫本頁) 而且，上述第二實施形態爲了可變調整燈室166與台 1 9 4的距離（照明距離）而固定配置燈室1 6 6、可變S周整台ί 9 4 的高度位置。但是，相反地固定台1 94的高度位置’可變調 整燈室1 66的高度位置的構成也可能，或者分別可變調整雙 方的位置也可能。 再者，上述第二實施形態因進行依照載置於台194上的 基板G的板厚Gt的照度測定乃至於台高度位置調整’故可實 現更高精度的照度調整。但是，精度變低即使無視基板G的 板厚Gt可變調整燈室166與台194的距離（照明距離）’實用上 充分的照度調整仍爲可能。 經濟部智慧財產局員工消費合作社印製 再者而且，上述第二實施形態係顯示適用於紫外線照 射單元（UV)的例子，惟也能適用於以有機污染除去以外的 目的對被處理基板照射紫外線的處理。例如，在如上述的 塗佈顯影處理系統中，在後烘烤（步驟S!3)後以使光阻硬化 的目的於對基板G照射紫外線的工程，可使用與上述實施形 態一樣的紫外線照射裝置。 雖然上述任一個實施形態都顯示關於使用LCD的玻璃基 板的例子當作被處理基板，惟並非限定於此，也能適用於 半導體晶圓、CD基板、滤色器（Color filter)基板、光罩（ Photo mask)、印刷（Print)基板等、其他的基板。 以上所說明的實施樣態只不過是意圖明瞭本發明的技 術內容’本發明並非僅限定於這種具體例而解釋，在本發 本紙張尺度適用中國國家標準（CNS ) A4規格（210 X 297公釐） -42 - 505959 A7 ._______B7 五、發明説明（49 明的精神與申請專利範圍所述的範圍，當可實施種種的變 更。 【發明的功效】 如以上所說明的如果依照本發明，可遍及基板的表面 全體均等地保持光照射部的照射面與基板之間的距離，獲 得充分的洗淨功效。 而且’在紫外線照射處理中可適當地管理對被處理基 板的紫外線照度，可穩定地維持處理品質以及效率。再者 ’也能有效地自紫外線反應生成物保護紫外線照射用的窗 構件。 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 -43- 本紙張尺度適用中國國家標準（CNS ) A4規格（21〇Χ297公釐）Dmax's height position fixing table 194 (step B8). Normally, the interval D is adjusted to the maximum 値 Dmax when the lamp brightness on the lamp room 166 side is the maximum, that is, the use of the ultraviolet lamps 164a, 164b, and 164c starts immediately after replacement or replacement. When 5 E > 0, that is, when the illuminance measurement 値 E is smaller than the reference illuminance Es, it is judged whether the interval D has reached the minimum 値 Dmin (step B9). For the general case that is not reached, only the platform height position Ha is raised by a predetermined distance (for example 0.1 mm), the distance D between the ultraviolet emission window 162 and the substrate G on the stage 194 is only reduced by that distance (step Bΐ0), and then the illuminance measurement is returned (steps B12, B2). However, when the expected interval D reaches the given minimum 値 Dmin by the maximum / minimum interval setting unit 23 8 or is smaller than the minimum 値 Dmin, the stage 194 is fixed at the height at which the interval D is fixed to the minimum 値 Dmin (step Bh). In addition, the interval D is adjusted to the minimum value 値 Dmin. Since the brightness of the ultraviolet lamps 164a, 164b, and 164c in the lamp room 166 is considerably reduced due to deterioration over time, etc., maintenance is performed to urge lamp replacement or the like ( Maintenance (Alarm) is also possible (step B!). When such an alarm is issued, it is also possible to terminate the ultraviolet cleaning. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. When the illuminance measurement 値 E is equal to the reference illuminance Es (5 E = 0), the height position Ha of the stage 194 is not changed, and the illuminance measurement is returned (steps B5, B2). In addition, if the reference illuminance Es 値 has an appropriate width or range, when the illuminance measurement 値 e converges within this range, the two can be regarded as the same ((5 E = 0). In this example, the illuminance measurement 値 E and the reference Illuminance Es—Feedback is applied until it is reached, so high-accuracy illuminance adjustment can be performed. However, the calculation follows the comparison error from the illuminance comparison unit 23 2 (the interval of 5 E or the adjustment target of the stage height position 値 'to reach the The adjustment target 値 'can use the open loop control to adjust the height position of the table 194. -37- This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) 505959 A7 B7 V. Invention Explanation (3 $ (please read the precautions on the back before filling this page) During the adjustment of the illuminance as described above (step A 6), the gap P between the UV | spring body window 162 and the right end 194b of the stage P The inert gas (N 2 gas) flows from the inert gas injection portion 1 72 to the inert gas suction portion 1 7 4 under substantially the same conditions as in the ultraviolet irradiation cleaning treatment. This inert gas flow (Figure 1 2) has an effective Row P It removes the effect of air, especially oxygen. Based on this, ultraviolet rays (ultraviolet excimer light) radiated vertically by the ultraviolet emission window 162 of the lamp chamber 166 reach the light receiving surface of the photo sensor 204, and are absorbed and attenuated by oxygen. The degree is greatly reduced, and the illuminance on the table at the same interval D is greatly improved compared with the non-inert gas flow. In addition, the inert gas flow F is preferably closer to the ultraviolet emission window 162 side than the table side. Staff of the Intellectual Property Bureau of the Ministry of Economic Affairs The consumer cooperative prints the ultraviolet cleaning process (step A7) for the substrate G on the stage 194 after the illumination adjustment (step A6) as described above. In order to perform this ultraviolet cleaning process, the control unit 212 uses a stage driving unit The scan driving unit 218 in 198 causes the stage 194 to move unidirectionally or reciprocally in the Y direction between the origin position and the forward position 194 'indicated by the dashed line. This stage moving stage 194 is adjusted by the previous illumination ( The height position determined in step A6) is directly below the lamp room 166 in the Y direction, and the ultraviolet light emitted by the ultraviolet emission window 162 of the lamp room 162 is emitted at a substantially vertical downward direction with a wavelength of 172 nm, and The quasi-illuminance is irradiated to the substrate G, and is scanned from one end of the substrate to the other in a direction opposite to the stage moving direction (Y direction). In this way, the substrate G is irradiated near the surface of the substrate by 172 nm ultraviolet light. The oxygen is converted into ozone 03 by the ultraviolet rays, and the ozone Ch is excited by the ultraviolet rays to generate oxygen atomic radicals (Radical) O *. By this, the organic substances attached to the surface of the substrate G are decomposed into dioxide. This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -38- 505959 A7 _B7_ V. Description of the invention (39 Carbon and water 'are removed from the surface of the substrate. The decomposed and gasified organic matter is exhausted through the exhaust port 208. (Please read the precautions on the back before filling in this page. J In this scanning ultraviolet cleaning process, the amount of ultraviolet radiation or accumulated light on the substrate G is inversely proportional to the moving speed (scanning speed) of the stage 194. That is, the scanning speed The faster, the shorter the ultraviolet irradiation time to the substrate G, and the smaller the ultraviolet irradiation amount, the slower the scanning speed, the longer the ultraviolet irradiation time to the substrate G, and the larger the ultraviolet irradiation amount. Within a certain limit, the more ultraviolet irradiation amount Many organic substances are removed from the surface of the substrate G. In this embodiment, as described above, the ultraviolet illuminance applied to the substrate G on the stage 194 by the lamp chamber 166 is adjusted by the illuminance adjustment (step A6). Then, after performing the above-mentioned scanning ultraviolet cleaning process (step A7), the brightness of the ultraviolet lamps 164a, 164b, and 164c in the lamp chamber 166 can be maintained even if the brightness is reduced with time. The scanning speed is set to 値 (therefore, the production capacity is not reduced), which can maintain good cleaning and processing quality. Intellectual Property Bureau, Ministry of Economic Affairs, Consumer Cooperation In the ultraviolet cleaning process, as shown in FIG. 15, the substrates G on the ultraviolet emission windows 1 62 and the stage 1 94 of the lamp chamber 166 are passed through the inert gas injection unit 172 and the inert gas suction unit 174 as shown in FIG. 15. The gap P between them forms an inert gas (N2 gas) flow F. As with the previous illumination adjustment (step A6), this inert gas flow F has the effect of effectively removing air, especially oxygen, from the gap P. Moreover, it attaches or floats Oxygen in the vicinity of the surface of the substrate G is not eliminated in this way, and sufficient oxygen is generated for the odor generation for ultraviolet cleaning treatment. In this way, the oxygen in the air is removed from the gap P by the inert gas flow F and the lamp is used. The ultraviolet emission window 162 of the chamber 166 emits ultraviolet rays vertically below (ultraviolet paper standards are applicable to Chinese National Standard (CNS) A4 specifications (210X297 mm) _ 39-505959 A7 B7 V. Description of the invention (3? (Please read the back first) Please fill out this page again) Excimer light) can reach the various parts of the substrate surface without being attenuated in this way. Therefore, in the lamp room 1 66 side, the power input of this part of the lamp can be reduced, and ultraviolet rays can be extended. The life of the lamps 164a, 164b, and 164c. In addition, since the ultraviolet reaction product generated by the ultraviolet cleaning process is drawn into the inert gas flow F, it is sucked into the inert gas suction portion 174 and discharged to the outside, so it has difficulty Advantages of being attached to the ultraviolet emission window 162. • After the scanning ultraviolet cleaning process for the substrate G on the stage 1 94 described above is completed, the control section 212 controls the lamp power supply section 220 to turn off the ultraviolet lamps 164a, 164b, and 164c ( Step As). Next, the inert gas flow driving unit 222 is controlled to stop the inert gas flow F immediately below the ultraviolet emission window 162 (step A9). Next, the control unit 212 returns the stage 194 to the Start position ( Step An). In this embodiment, the stage Γ94 is first moved by the scan driving unit 218, and the vacuum chuck is closed at the origin in the Y direction, and then the stage 194 is lowered to the retreat height position by the stage lifting driving unit 2 16 (Hb ), So that the substrate G is supported by the fixed lift pin 202. In this way, the entire process in the ultraviolet irradiation unit (UV) of one substrate G is finished, waiting for the arrival of the main conveyor 38 (Fig. 1). In the case of ultraviolet cleaning, when the light sensor 204 for illuminance measurement on the stage 194 passes through the ultraviolet emission window 162 of the lamp room 166, the illuminance monitoring function of the illuminance adjustment unit (FIG. 12) can also be used to measure. Even the ultraviolet illuminance (distribution) directly under the ultraviolet emission window 1 62 is monitored. With this illuminance monitoring function, the brightness of each of the ultraviolet lamps 164a, 164b, and 164c in the lamp room 166 can be monitored on the stage 194 side, and the brightness can be detected -40- This paper standard is applicable to the National Standard (CNS) A4 specification (21〇X) 297 mm) 505959 A7 __B7_ 5. Description of the invention (3§ Lights that are abnormally low or cannot be lit. (Please read the precautions on the back before filling out this page) The above structure fixes the lamp room 166 to the 194 side A scanning method that moves parallel to the surface of the substrate G. However, a scanning method that moves the lamp room 16 6 side in parallel with the surface of the substrate G at the fixed stage 194 side at a predetermined position is also possible. Moreover, it can also be achieved by a rotary motion The relative movement between the lamp room for UV scanning. 1 66 and the stage 194. Fig. 16 and Fig. 17 show examples of the structure of the rotary scanning type device. The figure has the same structure or function as that described in the above embodiment. The same reference numerals are attached. In this configuration example, the table driving unit 240 is provided with a table lifting mechanism and a rotation mechanism (not shown), and the rotation mechanism operates when the ultraviolet irradiation process is performed, so that the table 194 and the substrate G are at a predetermined speed. The vertical movement of the vertical axis 0 about the center of the table is 0. In addition, a configuration in which the fixed table 194 side is rotated and the lamp room 166 side is also possible. It can be completed, so that the device space can be miniaturized. Moreover, as shown in FIG. 17, the required length of the ultraviolet lamps 164a, 164b, and 164c in the lamp room 166 can be shortened. The structure in the lamp room 1 66 or the cleaning processing room in the second embodiment, in particular, the ultraviolet emission window 162, the ultraviolet lamps 164a, 164b, and 164c, the stage 194, the stage driving units 198, 240, and the illumination adjustment unit (FIG. 12) The other configuration is also an example, and various deformations of various parts are possible. In the second embodiment described above, the light sensor 204 for illuminance measurement is arranged at the position closest to the substrate G on the stage 194, and the light sensor 204 is based on the light sensor 204. The output signal of the device measures the ultraviolet illuminance in the substrate G, so high-accuracy illuminance measurement can be performed. However, it is possible that the light sensor used for this illuminance measurement can be applied to the paper scale due to the decrease in accuracy. National Standard (CNS) A4 specification (210X297 mm) -41-505959 A7 B7_ ___ V. Description of the invention (3 $ 2 04 Placed on the outside of the stage 194, or the light receiving surface is exposed and buried on the stage 194 The substrate mounting area 194a ° on the top (please read the precautions on the back before filling this page). In the second embodiment, the lamp is fixedly arranged to adjust the distance (illumination distance) between the lamp room 166 and the stage 1 94. Room 1 6 6. The height of the whole Taiwan can be changed to 9 4. However, conversely, a configuration in which the height position of the fixed stage 1 94 'is adjustable and the height position of the lamp room 1 66 may be adjusted, or the positions of both sides may be adjusted separately. Furthermore, in the second embodiment described above, illuminance measurement is performed in accordance with the thickness Gt of the substrate G placed on the stage 194 and the stage height position is adjusted ', so that illuminance adjustment with higher accuracy can be achieved. However, even if the accuracy is reduced, the distance (illumination distance) between the lamp chamber 166 and the stage 194 can be adjusted irrespective of the thickness Gt of the substrate G. Practically, sufficient illumination adjustment is possible. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Furthermore, the above-mentioned second embodiment shows an example that is applicable to ultraviolet irradiation units (UV), but it can also be applied to the substrate to be irradiated with ultraviolet rays for purposes other than removal of organic pollution. Processing. For example, in the coating and development processing system as described above, in the process of irradiating the substrate G with ultraviolet rays for the purpose of curing the photoresist after post-baking (step S! 3), the same ultraviolet irradiation as in the above embodiment may be used. Device. Although any of the above embodiments shows an example of a glass substrate using an LCD as a substrate to be processed, it is not limited to this, and it can also be applied to semiconductor wafers, CD substrates, color filter substrates, and photomasks. (Photo mask), Print substrate, etc., and other substrates. The embodiment described above is only intended to clarify the technical content of the present invention. The present invention is not limited to such specific examples for explanation. The paper standards of this publication apply the Chinese National Standard (CNS) A4 specification (210 X 297). (Mm) -42-505959 A7 ._______ B7 V. Description of the invention (49 The spirit of the Ming and the scope described in the patent application scope, when various changes can be implemented. [Effect of the invention] As explained above, if according to the present invention, The distance between the irradiation surface of the light irradiating part and the substrate can be maintained uniformly throughout the entire surface of the substrate, and sufficient cleaning effect can be obtained. In addition, the ultraviolet irradiance to the substrate to be processed can be appropriately managed in the ultraviolet irradiation treatment, which can stabilize To maintain the processing quality and efficiency. Furthermore, it can also effectively protect the window members for ultraviolet irradiation from the ultraviolet reaction products. (Please read the precautions on the back before filling out this page) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs -43- This paper size is applicable to China National Standard (CNS) A4 (21〇297mm)