JPH09148290A - Device for irradiating substrate with ultraviolet radiation and substrate processing system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To appropriately and precisely change total exposure in accordance with plural different film types. SOLUTION: A dielectric barrier discharge excimer lamp 41 is used as the light source of an ultraviolet irradiation device 23, and appropriate ultraviolet irradiation time corresponding to the thin film types of the substrate is stored in the internal memory 34a of a CPU for ultraviolet irradiation device 34. When the condition of the film type of the substrate to be processed is inputted, a control part 4 reads the appropriate irradiation time of ultraviolet rays in accordance with the condition and on/off-controls the power source 43 of the lamp 41 in the ultraviolet irradiation device 23 in accordance with the appropriate ultraviolet irradiation time.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for irradiating a substrate such as a glass substrate for a liquid crystal display or a semiconductor wafer with an ultraviolet ray for processing the substrate. The present invention also provides
The present invention relates to a substrate processing system having a plurality of processing units including an ultraviolet irradiation device.

[0002]

2. Description of the Related Art As is well known, in a manufacturing process of a liquid crystal display or a semiconductor device, a precision electronic substrate such as a glass substrate for a liquid crystal display or a semiconductor wafer (hereinafter simply referred to as "substrate") is subjected to a desired treatment. For this purpose, for example, a dry processing unit such as an ultraviolet irradiation device that decomposes organic substances adhering to the substrate surface by irradiating ultraviolet rays with a low-pressure mercury lamp, and then, while rotating the substrate, supply a cleaning liquid to the surface to supply the cleaning liquid. A wet processing unit such as a spin scrubber that cleans the surface is used. A plurality of these processing units may be combined to form a substrate processing system that continuously performs a series of processes. In such a case, for example, the substrate processing system is provided with a transfer robot for transferring the substrate therein, and the transfer robot sequentially circulates between the processing units,
The substrate W1 taken out from a certain processing unit U1 is carried to the next processing unit U2, and the next processing unit U
The processed substrate W2 is taken out from the substrate 2 and the brought-in substrate W1 is carried into the next processing unit U2. The substrate W2 is further carried into the next processing unit U3. In addition, the substrates are sequentially transported to perform a series of processing on each substrate. The dry processing unit is an apparatus portion that performs the surface treatment of the substrate surface without supplying the treatment liquid thereto, and corresponds to the hot plate, the cool plate, and the like in addition to the ultraviolet irradiation device described above. The wet processing unit is an apparatus portion that supplies a predetermined processing liquid to the surface of the substrate to perform the surface treatment. In addition to the spin scrubber described above, an ultrasonic cleaning device, a spin coater, a spin developer, an etching device and a peeling device. The device is applicable.

[0003]

When a certain substrate is subjected to ultraviolet irradiation processing by the above-mentioned ultraviolet irradiation device, the parameters of the processing conditions for determining the processing result include the illuminance of the light source, the distance between the light source and the substrate, and the irradiation. The irradiation amount is determined by the time, etc., and if the illuminance and the distance are constant, the irradiation amount is determined by the irradiation time. Then, the proper irradiation amount (the proper irradiation time when the above-mentioned illuminance and distance are constant), which is the processing condition for obtaining the optimum processing result, generally depends on the type of the thin film formed on the surface of the substrate. Will have different values.

On the other hand, in the above-described substrate processing system, the time required for the substrate processing system to process one substrate as a whole, in other words, until the transfer robot goes around each processing unit and returns. The time, that is, the system tact, is the processing time of the processing unit with the longest processing time among the processing units unless the time required for the transfer robot to transfer the substrate is taken into consideration. Rate limiting. For example, if the appropriate irradiation time in the ultraviolet irradiation device is 50 seconds and it takes 100 seconds to process the hot plate that requires the longest time, the system tact becomes 100 seconds, which is the longest time. . In this case, after the transfer robot carries in the substrate W2 to the ultraviolet irradiation device, the next substrate W1 is brought in, the processed substrate W2 is carried out, and the substrate W1 is carried back to the ultraviolet irradiation device. Since it takes 100 seconds, the substrate cannot be immediately carried out by the transfer robot even after the appropriate irradiation time of 50 seconds in the ultraviolet irradiation device, and therefore the substrate is not irradiated by the ultraviolet irradiation device until the system tact elapses. I stayed inside and waited.

By the way, in the conventional ultraviolet irradiation apparatus, the low-pressure mercury lamp, which is a light source of ultraviolet rays, is used while being constantly lit. However, in the treatment process of ultraviolet irradiation, as described above, whether or not a thin film is formed on the material of the substrate to be treated and its surface, and if it is formed, the film type, film thickness, etc. Depending on the conditions
The appropriate irradiation amount of the ultraviolet rays to be irradiated to obtain the optimum processing result is different. For example, in the case of a substrate on which a certain thin film is formed, if the irradiation time is too long or the like, irradiation of ultraviolet rays of a predetermined amount or more may cause inconvenience in the process, resulting in defective products. On the other hand, in the substrate processing system configured by combining a plurality of processing units as described above, the system tact is often determined by the conditions other than the ultraviolet irradiation device. Therefore, if the conventional UV irradiation device that keeps the UV light source constantly lit is used in the substrate processing system as described above, the optimum irradiation processing result is obtained by the system tact of the substrate processing system. It is limited to the extremely rare case where the optimum irradiation time is the optimum condition for the substrate. Otherwise,
For example, as in the previous example, the appropriate irradiation time, which is the optimum condition in the ultraviolet irradiation device, is 50 seconds and the system tact is 10 seconds.
In the case of 0 seconds, the transfer robot that transfers the substrate does not circulate to the ultraviolet irradiation device until the system tact elapses. Since the substrate has to be made to stand by in the apparatus, and the substrate is continuously irradiated with ultraviolet rays during the waiting, the process is inconvenient. For example, as shown in FIG. 8, when the system tact is T _w , the substrate loading / unloading time to / from the ultraviolet irradiation device is T _R , and the proper irradiation time is T _T , the substrate loading / unloading time T
Ultraviolet irradiation is also performed during _R , and ultraviolet irradiation is performed even after the appropriate irradiation time T _{T has} elapsed, so T _O1 and T in FIG.
_The time equivalent to _O2 is over irradiation time,
Ultraviolet rays are irradiated for a time longer than the proper irradiation time T _T , which causes a problem in the process. In the above description, the system tact has been described with respect to the substrate processing system in which the transfer robot circulates through each processing unit, but the system tact can be similarly considered in a so-called in-line type substrate processing system.

In view of the above problems, the present invention performs irradiation processing so that the irradiation amount of ultraviolet rays becomes an appropriate amount according to various processing conditions of a substrate, for example, the presence or absence of a thin film on the surface of the substrate and the film type thereof. It is an object of the present invention to provide an ultraviolet irradiation device for a substrate that can be used.

Further, according to the present invention, regardless of the system tact of the processing system, the irradiation amount of ultraviolet rays becomes an appropriate amount according to various processing conditions of the substrate, for example, the presence or absence of a thin film on the surface of the substrate and the kind of the film. It is an object of the present invention to provide a substrate processing system that can perform irradiation processing as described above.

[0008]

According to a first aspect of the present invention, there is provided a light source that emits ultraviolet rays, the irradiation mechanism for irradiating the substrate with the ultraviolet rays from the light source, and the input means for inputting the processing conditions of the substrate. A storage unit that stores an appropriate irradiation amount of ultraviolet rays according to the processing condition of the substrate, and a proper irradiation amount that corresponds to the processing condition of the substrate input by the input unit is read from the storage unit, and the appropriate irradiation amount is read. And a control device for controlling the irradiation mechanism according to the above.

With this, it is possible to read the proper irradiation amount from the storage means according to the processing conditions of the substrate and control the irradiation mechanism so that the irradiation amount of the ultraviolet rays becomes an appropriate amount, and to prevent the excessive irradiation of the ultraviolet rays. It can be prevented. Therefore, the process process can be executed under appropriate conditions, and the occurrence of product defects can be prevented.

The invention described in claim 2 is the apparatus for irradiating the substrate with ultraviolet light according to claim 1, wherein the kind of thin film on the surface of the substrate to be processed is an element representing the processing condition of the substrate, and each condition is satisfied. The appropriate irradiation amount of the ultraviolet ray according to the above is stored in the storage means.

This makes it possible to control the irradiation amount of the ultraviolet rays so that the irradiation amount of the ultraviolet rays becomes an appropriate amount according to the kind of the thin film on the surface of the substrate to be processed.

The invention described in claim 3 is the apparatus for irradiating the substrate with ultraviolet rays according to claim 1 or 2, wherein the substrate is appropriately irradiated with an appropriate amount of ultraviolet rays according to the processing conditions of the substrate to be processed. The control means controls the ultraviolet irradiation time to the substrate according to the proper irradiation time read from the storage means.

Thus, by controlling the irradiation time of the ultraviolet rays according to the processing conditions of the substrate to be processed, it is possible to easily control the irradiation so that the irradiation amount becomes an appropriate amount.

The invention according to claim 4 is the ultraviolet irradiation device for a substrate according to any one of claims 1 to 3, wherein the appropriate irradiation amount of the ultraviolet rays according to the processing conditions of the substrate to be processed. Is stored in the storage means according to the lighting time of the light source,
The control means controls the turning on / off of the light source according to the lighting time of the light source read from the storage means.

Thus, by controlling the lighting time of the ultraviolet light source according to the processing conditions of the substrate to be processed,
It is possible to easily control the irradiation so that the irradiation amount becomes an appropriate amount. Further, since the light source is turned on for a lighting time that provides an appropriate irradiation amount, the light source is not unnecessarily deteriorated as compared with the case where the light source is always turned on.

The invention described in claim 5 is the ultraviolet irradiation device for a substrate according to any one of claims 1 to 4, wherein a dielectric barrier discharge excimer lamp is used as a light source. .

As a result, the irradiation amount of ultraviolet rays on the substrate is
By turning on and off the light source, it is possible to easily control the appropriate irradiation amount.

According to a sixth aspect of the present invention, there is provided a plurality of processing units including an ultraviolet irradiation device, and a transfer means for transferring a substrate between the plurality of processing units, wherein the ultraviolet irradiation device emits ultraviolet light. An irradiation mechanism that has a light source that emits light, irradiates the substrate with ultraviolet rays from the light source, an input unit that inputs the processing conditions of the substrate, and a storage unit that stores an appropriate irradiation amount of the ultraviolet rays according to the processing conditions of the substrate, A substrate processing system, comprising: a controller that reads a corresponding proper irradiation amount from the storage unit according to a substrate processing condition input by the input unit and controls the irradiation mechanism according to the proper irradiation amount. .

As a result, regardless of the setting of the system tact, and even if the system tact changes due to a change in the processing condition of the processing unit other than the ultraviolet irradiation device, the proper irradiation amount from the storage means can be obtained according to the processing condition of the substrate. Can be read and the irradiation mechanism can be controlled so that the irradiation amount of ultraviolet rays becomes an appropriate amount, and excessive irradiation of ultraviolet rays can be prevented. Therefore, the process process can be executed under appropriate conditions, and the occurrence of product defects can be prevented.

[0020]

BEST MODE FOR CARRYING OUT THE INVENTION

<Structure> A substrate processing system according to an embodiment of the present invention will be described by taking a substrate cleaning system as an example. FIG. 1 is a perspective view showing a substrate processing system according to this embodiment. As shown in FIG. 1, the substrate processing system includes an indexer section 1, a surface processing section 2, a transfer section 3, and a control section 4 (FIG. 2).

As shown in FIG. 1, the indexer unit 1 functions as a substrate supply unit and a substrate discharge unit, and three cassettes 11 capable of accommodating a plurality of substrates are placed on the cassette placing unit 12. Therefore, it is possible to take out the substrate from the cassette 11 and store the substrate in the cassette 11 by the transport unit 3. The cassette 11 is delivered to the indexer unit 1 through the recess 13 by an AGV (auto guided vehicle) (not shown).

In the surface treatment section 2, a hot plate 21a for heating the substrate and a cool plate 21b for cooling the substrate.
And a spin scrubber (hereinafter, referred to as a “spin unit”) 22 that supplies a cleaning liquid while rotating the substrate and cleans the cassette 11 in a state of being separated from the indexer unit 1 by a predetermined distance. They are arranged so as to face each other substantially parallel to the arrangement direction. In addition, above the heat treatment section 21, ultraviolet irradiation is performed to perform a cleaning process of irradiating the substrate surface with ultraviolet rays in an oxygen atmosphere to generate ozone and decompose organic substances on the substrate surface into water and carbon dioxide, that is, dry cleaning. Device 2
3 are arranged. In this way, the surface treatment unit 2 has
Multiple surface treatment units (hereinafter referred to as hot plate 21
a, the cool plate 21b, the spin unit 22, and the ultraviolet irradiation device 23 are collectively used), and the transfer robot 27, which will be described later, arranges the substrates in an appropriate order among the surface treatment units. The substrate is processed by each surface processing unit while being transported by, and cleaning processing is performed.

The transfer section 3 has a transfer robot 27 that reciprocates in the transfer path 26 between the indexer section 1 and the surface treatment section 2. The transfer robot 27 is provided at the bottom of the transfer path 26 by a robot drive mechanism (not shown). The substrate moves along a fixed guide rail (not shown), circulates between the surface treatment units and between the indexer unit 1 and conveys the substrate in order.

As shown in FIG. 2, the control section 4 mainly controls the surface processing section 2 and the transport section 3 in accordance with a predetermined processing procedure called a recipe, so that an operator inputs and outputs data. Master computer 32 connected to a personal computer system (hereinafter abbreviated as “personal computer”) 31, and a plurality of local CPs such as a UV irradiation device CPU 34, a spin unit CPU 35, a hot plate CPU 36, and a cool plate CPU 37.
U and. These local CPUs 34-37 are
It controls the operation of each corresponding surface treatment unit, and is connected to the master CPU 32 through a local area network (hereinafter abbreviated as “LAN”) 33. Further, the personal computer 31 is connected with a main panel 38 as an input / output device for displaying various information and for allowing an operator to input various information.

The master CPU 32 has an internal memory 32a, and the internal memory 32a stores a first procedure table indicating the contents of a plurality of processing procedures. FIG. 3 shows such a first procedure table. In the first procedure table, each processing procedure is given a processing procedure number (hereinafter referred to as “recipe No.”),
Further, for each processing procedure, information indicating the processing content to be executed for each surface processing unit (hereinafter, referred to as “process data No.”) is stored. In this embodiment, each processing procedure of the first procedure table shows the content of appropriate processing corresponding to each type of thin film formed on the surface of the substrate to be processed, and the experiment is performed in advance. Are determined, input, and stored based on the rule of thumb or an empirical rule.

Each of the local CPUs has an internal memory, and the internal memory has a second procedure table and a third procedure table showing the processing contents to be executed by the surface processing unit corresponding to the respective local CPUs. Is remembered. FIG. 4 shows an example of the second procedure table, and FIG. 5 shows an example of the third procedure table, which particularly shows the one stored in the internal memory 34a of the CPU 34 for the ultraviolet irradiation device. This second procedure table is the first procedure stored in the internal memory 32a of the master CPU 32.
The procedure table is divided into the corresponding local CPUs, transmitted through the LAN 33, and stored in the internal memory. The recipe No. and the surface treatment unit corresponding to the recipe No. are executed. It consists of a process data number that indicates the processing content to be performed. The third procedure table corresponds to the process data No. in the second procedure table and indicates the contents of the processing to be executed by the surface treatment unit when the process data No. is designated. The proper irradiation time in the ultraviolet irradiation device 23 corresponding to each processing content of the process data No. is stored. Although only the proper irradiation time is defined in the procedure table shown in FIG. 5, if the distance between the light source and the substrate can be adjusted, data on the irradiation distance may be added. If the illuminance can be adjusted, data regarding the illuminance may be added. Further, in FIG. 5, only the procedure table relating to the CPU 34 for the ultraviolet irradiation device is shown, but also in the procedure table relating to the other CPU, for example, the CPU 35 for the spin unit, the data of the proper processing conditions such as the rotation speed and the rotation speed are stored. Stored in association with process data No.

FIG. 6 is a schematic control block diagram showing the structure of the ultraviolet irradiation device 23. Here, a dielectric barrier discharge excimer lamp 41 is used as the ultraviolet light source of the ultraviolet irradiation device 23. The dielectric barrier discharge excimer lamp 41 can perform lighting / extinguishing operations in a relatively short time. By using this, the lighting / extinguishing timing is adjusted for substrates of different film types, and the irradiation amount is adjusted. It can be precisely adjusted to the desired proper value. Specifically, in the case of a filament type lamp, it takes about 10 seconds to turn on and off, whereas the dielectric barrier discharge excimer lamp 41
In the case of, it takes only about 1 second until the lighting and extinguishing operations become stable. Therefore, even when the required processing time is relatively short such as 5 seconds or 6 seconds, the error of the irradiation amount is negligible. Further, inside the ultraviolet irradiation device 23, the substrate W is positioned near the substrate transfer position (indicated by a broken line in the figure) with respect to the transfer robot 27 of the transfer unit 3 and the dielectric barrier discharge excimer lamp 41, and is suitable for ultraviolet irradiation. Position (in the figure,
A substrate moving mechanism including an air cylinder 28 that moves between the air cylinder 28 and a solid line), and a substrate movement control unit 29 that controls the air cylinder are provided. UV irradiation device C
The PU 34 drives the substrate moving mechanism 28 through the substrate movement control unit 29 to move the substrate to a position suitable for UV irradiation, and at the same time as the required processing time obtained, the lamp power supply adjustment unit 42 causes the lamp power supply 43 to operate. Is switched on and off to control lighting and extinguishing operations of the dielectric barrier discharge excimer lamp 41. The control timing at this time will be described in detail later.

<Operation> The operation of the substrate processing system having the above configuration will be described. In this embodiment mode, the substrate is cleaned by performing dry cleaning by ultraviolet irradiation, wet cleaning, heating, and cooling in this order. Since the respective treatments are performed by the ultraviolet irradiation device 23, the spin unit 22, the hot plate 21a, and the cool plate 21b, when the substrate is taken out of the cassette 11 of the indexer unit 1, each surface treatment is performed in this order by the transfer robot 27. It is transported in order between the units. In addition, in each surface treatment unit, the substrates are simultaneously processed, and as a result, the plurality of substrates are simultaneously processed. The transfer order is the order that the worker inputs in advance to the personal computer 31 and is stored in the master CPU, and the transfer robot 27 transfers the transfer under the control of the transfer robot CPU 45 instructed to transfer in that order by the master CPU 32. To execute.

An operator using this substrate processing system considers the processing conditions of the substrate such as the presence or absence of a thin film on the surface of the substrate to be cleaned and the type thereof, and sets the processing conditions to the main panel 38 according to the recipe number. Operate PC 3
1 to the master CPU 32. Such a recipe
By entering the No., the optimum processing conditions for the substrate will be specified. In each surface treatment unit, the local CPU corresponding to the surface treatment unit receives the recipe No. and executes the processing of the processing content specified by the process data No. corresponding to the recipe specified by the recipe No. To do.

Here, focusing on the processing in the ultraviolet irradiation device 23, description will be made according to the flowchart of FIG. First, the transfer robot 2 that receives the substrate from the indexer unit 1
7 conveys the substrate to the ultraviolet irradiation device 23. At the same time, the master CPU 32 specifies the recipe No. to be processed in the first procedure table (FIG. 3) as LAN 33.
To the CPU 34 for the ultraviolet irradiation device via the. The ultraviolet irradiation device 23 receives the substrate from the transfer robot 27, and at the same time, the ultraviolet irradiation device CPU 34 receives the recipe number (step S1).

The ultraviolet irradiation device CPU 34 refers to the received recipe number and reads out the process data number corresponding thereto from the second procedure table (FIG. 4) (step S2). Then, referring to this process data No., the corresponding proper irradiation time is read from the third procedure table (FIG. 5) stored in advance in the internal memory 34a (step S3).

Next, the air cylinder 28 is driven through the substrate movement control unit 29 to move the substrate to a predetermined ultraviolet irradiation position in the ultraviolet irradiation device 23 (step S4). Then, the dielectric barrier discharge excimer lamp 41 is turned on (step S5), and ultraviolet irradiation processing is performed until the appropriate irradiation time read in step S3 has elapsed (step S).
6). That is, here, the appropriate irradiation time is set to the dielectric barrier discharge excimer lamp 4 which is the light source of the ultraviolet irradiation device 23.
It is treated as a proper lighting time of 1. Then, after the appropriate irradiation time (appropriate lighting time) has elapsed, the lamp power adjustment unit 4
The lamp power supply 43 is turned off via 2 to turn off the dielectric barrier discharge excimer lamp 41 to prevent excessive ultraviolet irradiation of the substrate (step S7).

At this time, in this embodiment, since the dielectric barrier discharge excimer lamp is used as the light source for the ultraviolet irradiation, it is stabilized in a short time after lighting compared with the conventional device using the low pressure mercury lamp. be able to. Therefore, even if it is applied when the required processing time of ultraviolet rays is as short as 5 to 6 seconds, the time required for the lighting and extinguishing to stabilize becomes short. It is possible to prevent a situation in which the values are significantly different. That is, the accuracy of the exposure amount can be improved, and the quality of substrate processing can be improved.

Thereafter, the substrate movement control unit 29 is driven through the substrate movement mechanism 28 to move the substrate to the substrate delivery position (step S8) and further to the transfer robot 27 (step S9), and the substrate is subjected to the next process. Transport. Then, the process returns to step S1 to receive the next substrate.

As described above, a dielectric barrier discharge excimer lamp that can be turned on and off for a short time is used as a light source for irradiating ultraviolet rays, and an appropriate irradiation time of ultraviolet rays according to the kind of thin film on the surface of the substrate is used. Since UV irradiation is performed by an appropriate amount obtained from the procedure table, even for substrates on which thin films of film types A, B, and C having different appropriate irradiation times T _T are formed as shown in FIG. The dielectric barrier discharge excimer lamp 41 is turned on only during the proper irradiation time T _T , and during the rest of the time, during the loading / unloading time T _R of the substrate to the ultraviolet irradiation device, and after the proper irradiation time T _{T has} elapsed. By turning off the dielectric barrier discharge excimer lamp 41 (hatched portion in FIG. 9), it is possible to perform irradiation processing so that the irradiation amount of ultraviolet rays becomes an appropriate amount. Thereby, it is possible to easily prevent excessive irradiation of ultraviolet rays to any kind of film. Therefore, the occurrence of process defects can be prevented and the quality of substrate processing can be improved. In addition, since it is only necessary to turn on the light for the required processing time, deterioration of the light source can be slowed down as compared with the case where the light is always turned on, and the life of the light source can be extended. Further, even if the system tact changes due to a change in the processing conditions of a processing unit other than the ultraviolet irradiation device, the ultraviolet irradiation device turns on the dielectric barrier discharge excimer lamp 41 for an appropriate irradiation time to emit the ultraviolet light. Irradiation treatment can be performed so that the amount becomes an appropriate amount.

Although the substrate processing system for cleaning the substrate has been described above, the application of the present invention is not limited to this, and it is applicable to the substrate processing system for performing resist coating and the substrate processing system for developing in general. Of course, you can

Although three cassettes 11 are shown in FIG. 1, the number of cassettes 11 is not limited to this, and the arrangement and shape of the transfer passage 26 and the number of transfer robots 27 are also shown in FIG. It is not limited to what is shown. For example, another surface processing unit or another substrate processing unit may be arranged at both ends of the transfer passage 26, and the substrate may be transferred by one or more transfer robots.

In the above description, the dielectric barrier discharge excimer lamp was used as the light source.
Since it takes time to stabilize the low-pressure mercury lamp when it is turned on and off, it is intended to reduce the error from the proper irradiation time. However, depending on the film type, the appropriate irradiation time may be sufficiently long, and even if it takes time to stabilize the low-pressure mercury lamp when it is turned on and off, the error can be ignored with respect to the appropriate irradiation time. Then, a low-pressure mercury lamp may be used as the light source. Alternatively, depending on the type of film, the error itself of the exposure amount may be acceptable. Also in this case, a low pressure mercury lamp can be used.

Although the lighting time of the light source is controlled in order to control the ultraviolet ray to the substrate to a proper irradiation amount, the invention is not limited to this. For example, some shutter may be provided while the light source is still lit, or Alternatively, the proper irradiation amount may be obtained by changing the distance between the substrate and the light source, adjusting the illuminance of the light source, or the like.

Further, in the above description, only the ultraviolet irradiating device for irradiating the one side of the substrate with the ultraviolet ray has been described, but the device for irradiating the both sides of the substrate with the ultraviolet ray may be used. In this case, depending on the conditions of the front surface and the back surface of the substrate, the proper irradiation amount may be different from each other, but in such a case, the information on the proper irradiation time for both sides is recorded in the first to third procedure tables. You can include it. An embodiment of the ultraviolet irradiation device having such a configuration is shown in a schematic control block diagram of FIG. 10 and a third procedure table of FIG. In this embodiment, in addition to the dielectric barrier discharge excimer lamp 41 which is provided above the substrate W and irradiates ultraviolet rays on the upper surface thereof, the lamp power supply 43, and the lamp power supply adjustment unit 42, the lower surface provided below the substrate W is also provided. A dielectric barrier discharge excimer lamp 41a for irradiating ultraviolet rays, a lamp power source 43a for the same, and a lamp power source adjusting unit 42a are provided.
In this embodiment, since both sides of the substrate W purple are irradiated with ultraviolet rays, a robot hand 28a is provided as a structure corresponding to the air cylinder 28 of the above-described embodiment. The robot hand 28a supports only the peripheral portion of the substrate W, and has a structure that does not hinder the irradiation of the substrate W with ultraviolet rays. Other configurations are similar to those of the above-described embodiment. Here, C for ultraviolet irradiation device
The third procedure table shown in FIG. 11 is stored in the internal memory 34a of the PU 34. This third procedure table includes a dielectric barrier discharge excimer lamp 41 for the upper surface.
And a combination of lighting times of the dielectric barrier discharge excimer lamp 41a for the lower surface are stored in correspondence with the process data No. Then, in the processing procedure of the recipe No. corresponding to the processing condition of the substrate W to be irradiated with ultraviolet rays, if the lighting time at which both sides of the substrate W have an appropriate irradiation amount is designated by the process data No. In the third procedure table, the proper irradiation amount of ultraviolet rays according to the processing conditions of the substrate W to be processed is stored by the lighting time of the dielectric barrier discharge excimer lamps 41 and 41a. Then, in the processing of the substrate W,
The dielectric barrier discharge excimer lamp 41 for the upper surface and the dielectric barrier discharge excimer lamp 41a for the lower surface are lighted on their respective surfaces for an appropriate irradiation time. As a result, for example, even for a substrate with a proper irradiation time that is long on the front side and short on the back side, or for a substrate that requires UV irradiation only on the front surface and does not require the back surface, the same UV irradiation device can be used Can be irradiated.

Further, in the above description, the ultraviolet irradiation apparatus and the substrate processing system of the present invention are used for the dry cleaning processing, but the present invention can also be used for the processing of curing the photoresist film by the ultraviolet irradiation, for example. it can.

In the above embodiment, the dielectric barrier discharge excimer lamps 41 and 41a serve as a light source, the light source, the air cylinder 28 and the robot hand 28a serve as an irradiation mechanism, and the main panel 38 serves as an input means. The memories 32a and 34a are storage means, the control unit 4 is control means,
Equivalent to each.

[0043]

According to the first aspect of the present invention, the appropriate irradiation dose corresponding to the substrate processing conditions input by the input device is read from the storage device, and the irradiation mechanism is activated in accordance with the appropriate irradiation amount. Since the control is performed, the irradiation mechanism can be controlled so that the irradiation amount of ultraviolet rays becomes an appropriate amount, and excessive irradiation of ultraviolet rays can be prevented. As a result, the process process can be executed under appropriate conditions and the occurrence of product defects can be prevented.

According to the second aspect of the present invention, since the appropriate irradiation amount of the ultraviolet rays according to the kind of the thin film on the substrate surface which is the processing condition of the substrate is stored in the storage means, the substrate surface to be processed is stored. The irradiation amount of the ultraviolet rays can be controlled to be an appropriate amount according to the type of the thin film.

According to the third aspect of the present invention, the proper irradiation amount of the ultraviolet rays according to the processing conditions of the substrate to be processed is stored as the proper irradiation time, and the ultraviolet rays depending on the processing conditions of the substrate to be processed. By controlling the irradiation time of, it is possible to easily control the irradiation so that the irradiation amount becomes an appropriate amount.

According to the fourth aspect of the present invention, the proper irradiation amount of the ultraviolet ray according to the processing condition of the substrate to be processed is stored by the lighting time of the light source, and it is stored according to the processing condition of the substrate to be processed. By controlling the lighting time of the ultraviolet light source, it is possible to easily control the irradiation so that the irradiation amount becomes an appropriate amount. In addition, since the light source is turned on for the lighting time that provides the proper irradiation amount, the light source is not unnecessarily deteriorated.

According to the invention described in claim 5, since the dielectric barrier discharge excimer lamp is used as the light source, the irradiation amount of the ultraviolet rays to the substrate is easily and properly irradiated by turning on and off the light source. The amount can be controlled.

According to the sixth aspect of the present invention, regardless of the setting of the system tact, even if the system tact changes due to a change in the processing condition of a processing unit other than the ultraviolet irradiation device, the processing condition of the substrate does not change. Accordingly, the proper irradiation amount can be read out from the storage means, and the irradiation mechanism can be controlled so that the irradiation amount of the ultraviolet rays becomes an appropriate amount, and the excessive irradiation of the ultraviolet rays can be prevented. Therefore, the process process can be executed under appropriate conditions, and the occurrence of product defects can be prevented.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a substrate processing system according to an embodiment of the present invention.

FIG. 2 is a control block diagram showing a substrate processing system according to an embodiment of the present invention.

FIG. 3 is a diagram showing an example of a first procedure table processed by a master CPU.

FIG. 4 is a diagram showing an example of a second procedure table processed by a CPU for an ultraviolet irradiation device.

FIG. 5 is a diagram showing an example of a third procedure table processed by a CPU for an ultraviolet irradiation device.

FIG. 6 is a control block diagram according to an embodiment of the present invention.

FIG. 7 is a flowchart showing an operation of the substrate processing system according to the embodiment of the present invention.

FIG. 8 is a time chart showing the relationship between the proper irradiation time for one substrate of the ultraviolet irradiation device and the device tact.

FIG. 9 is a time chart showing the relationship between proper irradiation time and device tact for substrates of a plurality of film types.

FIG. 10 is a control block diagram according to another embodiment of the present invention.

FIG. 11 is a diagram showing an example of a third procedure table in another embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Indexer part 2 Surface treatment part 3 Transfer part 4 Control part 22 Spin part 23 Ultraviolet irradiation device 27 Transfer robot 28 Air cylinder 29 Substrate movement control part 31 Personal computer 32 Master CPU 33 LAN 34 Ultraviolet irradiation device CPU 35 Spin part CPU 36 CPU for hot plate 37 CPU for cool plate 38 Main panel 41 Dielectric barrier discharge excimer lamp 42 Lamp power supply adjustment unit 43 Lamp power supply

Claims (6)

[Claims] 1. An irradiation mechanism having a light source for emitting ultraviolet rays, which irradiates the substrate with ultraviolet rays from the light source, input means for inputting processing conditions of the substrate, and an appropriate irradiation amount of ultraviolet rays according to the processing conditions of the substrate. And a controller for reading the appropriate irradiation dose corresponding to the processing conditions of the substrate input by the input device from the storage device and controlling the irradiation mechanism according to the appropriate irradiation amount. An apparatus for irradiating ultraviolet rays onto a substrate, which is characterized by being provided. 2. The storage means stores the proper irradiation amount of ultraviolet rays corresponding to each of the conditions as the element representing the processing condition of the substrate, the kind of thin film on the surface of the substrate to be processed. UV irradiation device to the substrate of the. 3. The storage means stores a proper irradiation amount of ultraviolet rays in accordance with a processing condition of a substrate to be processed by a proper irradiation time, and the control means stores the proper irradiation time read from the storage means. The ultraviolet irradiation device for a substrate according to claim 1 or 2, which controls the irradiation time of the ultraviolet light to the substrate according to the above. 4. The storage means stores an appropriate irradiation amount of ultraviolet rays according to a processing condition of a substrate to be processed by a lighting time of the light source, and the control means stores the light source read from the storage means. The ultraviolet irradiation device for a substrate according to any one of claims 1 to 3, which controls the turning on and off of the light source according to the lighting time. 5. An apparatus for irradiating ultraviolet rays onto a substrate according to claim 1, wherein a dielectric barrier discharge excimer lamp is used as a light source. 6. A plurality of processing units including an ultraviolet irradiation device, and a transfer means for transferring a substrate between the plurality of processing units, wherein the ultraviolet irradiation device has a light source for emitting ultraviolet rays, An irradiation mechanism for irradiating the substrate with ultraviolet rays from a light source, an input means for inputting processing conditions of the substrate, a storage means for storing an appropriate irradiation amount of ultraviolet rays according to the processing conditions of the substrate, and the input means A substrate processing system, comprising: a controller that reads a corresponding proper irradiation amount from the storage unit according to a processing condition of the substrate and controls the irradiation mechanism according to the proper irradiation amount.