JP4322086B2 - Substrate processing apparatus and method - Google Patents

Description

  The present invention relates to a substrate processing apparatus and a method for performing substrate processing on a semiconductor substrate, a glass substrate of a liquid crystal display, a glass substrate for a photomask, and a substrate for an optical disk (hereinafter simply referred to as a substrate).

  In a conventional substrate processing apparatus, substrate processing conditions such as temperature / humidity and processing time conditions of a processing unit (unit) that performs substrate processing, a transfer order by a transfer mechanism that delivers a substrate to each processing unit, etc. A plurality of recipes for the flow to set the are registered. The operator (operator) selects these registered flow recipes and performs substrate processing.

These recipes can be sent and received (upload / download) between the processing station that controls the processing unit and the controller (management station) that controls the whole, and can also be changed on the management station side. (For example, see Patent Document 1).
JP-A-9-153441 (page 1-6, FIGS. 1 and 2)

  However, for example, (1) when substrate processing is performed while avoiding a processing unit undergoing a mechanical test, (2) when processing a substrate by designating a specific processing unit, or (3) When performing special substrate processing different from normal substrate processing, such as when a substrate is arbitrarily selected and a substrate is inspected in an inspection unit (inspection unit), there are the following problems.

  That is, the recipe for the normal substrate processing is ready-made, but the recipe for the special substrate processing described above needs to be changed from the conventional ready-made recipe or newly created. For example, when inspecting a substrate in the above-described inspection unit, the flow for delivering the substrate to the inspection unit and the inspection conditions related to the inspection unit are added to the ready-made recipe, or the values set in the ready-made recipe are rewritten. Alternatively, a new inspection recipe for handing over the substrate to the inspection unit is created. However, if the ready-made recipe is directly changed, there arises a problem such as a problem that has not occurred until then. In order to prevent such a problem, writing is prohibited so that a normal recipe cannot be changed. Also, it takes time and effort to create a dedicated recipe.

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide a substrate processing apparatus and a method for performing various substrate processing flexibly.

As a result of intensive studies to solve the above problems, the present inventors have obtained the following knowledge.
That is, in order to save the trouble of creating a new recipe without changing the ready-made recipe, a method of copying the ready-made recipe and changing the copied recipe can be considered. However, this method is not general in all of the special substrate processing, and when it is greatly different from a ready-made recipe, it is not different from the trouble of creating a new recipe. On the other hand, in order to solve such a problem, the present applicant has previously filed Japanese Patent Application No. 2003-111772 .

  In this application, as shown in FIG. 19, a main flow MF having options fa to fc related to substrate processing is created, and one option in the main flow MF is selected based on a designated processing unit, and a temporary flow is selected. Create Here, “PASS1” and “PASS3” in FIG. 19 are substrate mounting portions, “CP” is a cooling plate, “BARC” is a coating processing portion for antireflection film, “HP” is a heating plate, “WCP” indicates a water-cooled cooling plate. Options fa and fc are temporary flows that skip the heat treatment on the heating plate HP, and options fb are temporary flows that perform the heat treatment on the heating plate HP. These options fa to fc can be selected for each designated processing unit to create a temporary flow. As described above, since the main flow MF has the options fa to fc, the main flow MF itself can be created by one option in the main flow MF without recreating the main flow MF itself or changing the main flow MF itself. A temporary flow can be created. As a result, various substrate processes can be flexibly performed in accordance with the created temporary flow without recreating the main flow MF itself or changing the main flow MF itself.

  The present inventors have considered a method different from such an application. In recent substrate processing apparatuses, those having a variable recipe function capable of changing recipe values (for example, substrate processing conditions such as temperature / humidity and processing time of a processing unit) during substrate processing have been developed. It's getting on. The inventors of the present invention have focused on this function and conceived that a flag is attached to information for determining the transport order and processing skip is set by the flag. That is, it has been found that substrate processing is flexibly performed by processing information (a flag as an example of processing information) for setting whether or not to process a substrate for each processing unit. The present invention based on such knowledge has the following configuration.

That is, the invention described in claim 1 includes a plurality of processing units that perform substrate processing, a transport mechanism that transfers a substrate to each processing unit, and a control unit that controls the processing unit and the transport mechanism. A substrate processing apparatus, comprising: a transport order setting means for setting the transport order of the substrates by the transport mechanism; and a processing information setting means for setting the processing information of the substrates. The processing information is a processing section in each transport order. Whether to perform substrate processing for all processing units that can process a substrate is assigned by assigning one of “Perform substrate processing” or “Do not perform substrate processing” an information to the control means, based on the conveying order and processing information, controls the processing unit and the transport mechanism as follows, together with the receiving and transferring the substrates to the processing unit on the basis of (a) conveying the order When (B ₁₎ processing information is to set that "performing the processing of the substrate" performs processing of the substrate in the processing unit based on the processing information, (B ₂₎ processing information "of the substrate In the case of setting that “no processing is performed”, the substrate is transferred to the next processing unit without performing the processing of the substrate in the processing unit.

[Operation / Effect] According to the invention described in claim 1, the transfer order setting means sets the transfer order of the substrates by the transfer mechanism, and the processing information setting means sets the processing information of the substrates. The processing information is assigned to all processing units capable of processing a substrate by assigning one of “perform substrate processing” or “not perform substrate processing” for each processing unit in each transport order. This is information for setting whether or not to process a substrate. Based on the transfer order and the processing information, the control means (A) delivers the substrate to the processing unit based on the transfer order, and (B ₁ ) sets the processing information to “process the substrate”. If it is, the processing unit processes the substrate based on the processing information, and (B ₂ ) if the processing information is set to “do not process the substrate”, the processing The processing unit and the transport mechanism are controlled so that the substrate is transferred to the next processing unit without processing the substrate by the unit.

Since the processing information is information for setting whether or not to process the substrate for each processing unit, as described above (B ₁ ) and (B ₂ ), “processing the substrate” and “ Both “do not process substrate” (ie skip substrate processing) can be manipulated by processing information. In addition, as the processing information, any one of “perform substrate processing” or “not perform substrate processing” is assigned to each processing unit in each conveyance order, so it is necessary to change the conveyance order itself. Rather, various substrate processing can be flexibly performed according to the setting of processing information.
Further, by setting the processing information to set whether to perform processing of the substrate for all of the processing unit capable of processing a substrate, the maximum for all of the processing unit capable of processing a substrate Various substrate processes can be performed more flexibly so that the substrate can be processed and, at a minimum, only the transfer can be performed without performing the substrate processing on all the processing units. .

The invention described in claim 2 includes an inspection unit that inspects a substrate, a plurality of processing units that perform substrate processing, a transport mechanism that delivers the substrate to each of the processing units, and an inspection. A substrate processing apparatus comprising a control unit for controlling a transfer unit, a processing unit, and a transfer mechanism, a transfer order setting unit for setting a transfer order of substrates by the transfer mechanism, and a processing information setting for setting substrate processing information Means and inspection information setting means for setting substrate inspection information, and the processing information is either “perform substrate processing” or “not perform substrate processing” for each processing section in each transport order. When one is assigned, it is information for setting whether or not to process the substrate for all processing units capable of processing the substrate , and the inspection information is sent to the inspection unit in the transport order by “inspecting the substrate. Do " Is information for setting whether to perform by given in any one of allocated control means "not to inspect such substrates", the inspection of the substrate with respect to the inspection unit, the control means, Based on the transport order , processing information and inspection information, the inspection unit , the processing unit and the transport mechanism are controlled as follows. (C) While delivering the substrate to the inspection unit and the processing unit based on the transport order, (B ₁ ) When the processing information is set to “perform substrate processing”, the processing unit processes the substrate based on the processing information, and (B ₂ ) the processing information indicates “substrate processing”. If it is set to “do not process”, the substrate is transferred to the next processing unit without processing the substrate in the processing unit, and (D ₁ ) the inspection information is “substrate” Is set to "inspect" Expediently, when inspecting inspects the substrate in the inspection unit based on the information, and sets that (D ₂₎ inspection information is "not perform an inspection of the substrate", a substrate in the inspection unit The substrate is transferred to the next inspection unit or processing unit without performing the inspection.
[Operation / Effect] According to the invention described in claim 2, the transport order setting means sets the transport order of the substrates by the transport mechanism, and the inspection information setting means sets the inspection information of the substrates. The inspection information is assigned to the inspection unit in the transfer order by assigning one of “inspect substrate” or “not inspect substrate” to the control unit, so that the inspection unit is inspected. This is information for setting whether or not to perform inspection. The control means, based on the transport order , processing information and inspection information, (C) delivers the substrate to the inspection unit and the processing unit based on the transport order, and (D ₁ ) If it is set to “perform”, the inspection unit inspects the substrate based on the inspection information, and (D ₂ ) sets the inspection information to “do not inspect the substrate”. In this case, the inspection unit , the processing unit, and the transport mechanism are controlled so that the substrate is delivered to the next inspection unit or processing unit without performing the substrate inspection by the inspection unit.
Since the inspection information is information for setting whether or not to inspect the substrate with respect to the inspection unit, the “inspection of the substrate” and the “inspection of the substrate” are performed as described above in (D ₁ ) and (D ₂ ). Both “do not inspect” (ie skip substrate inspection) can be manipulated by inspection information. In addition, since any one of “inspect the substrate” or “do not inspect the substrate” is assigned to the inspection unit in the transport order, it is not necessary to change the transport order itself. Various substrate processing including the inspection unit can be flexibly performed according to the setting of the inspection information.
As in the case of the invention described in claim 1, by setting the processing information to set whether to perform processing of the substrate for all of the processing unit capable of processing a substrate, most Then, it is possible to process the substrate for all the processing units that can process the substrate, and at the minimum, it is possible to perform only the transfer without processing the substrate for all the processing units, Various substrate processing can be performed more flexibly.
The invention described in claim 3 includes an inspection unit that inspects a substrate, a plurality of processing units that perform substrate processing, a conveyance mechanism that delivers the substrate to each of the processing units, and an inspection unit. A substrate processing apparatus including a control unit for controlling a transport unit, a processing unit, and a transport mechanism, a transport order setting unit for setting a transport order of substrates by the transport mechanism, and an inspection information setting for setting substrate inspection information All of the inspection information can be inspected by assigning one of “inspect substrate” or “not inspect substrate” to each inspection unit in each transport order. Whether or not to inspect the substrate for the inspection unit is set , and the control means controls the inspection unit , the processing unit, and the transport mechanism as follows based on the transport order and the inspection information. (C) Transport order Performs transfer of a substrate with respect to the inspection unit and the processing unit on the basis of, (D ₁₎ when the test information is used to set that "inspecting the substrate", the examination unit based on the examination information (D ₂ ) If the inspection information is set to “do not inspect the substrate”, the inspection unit does not inspect the substrate and the next inspection unit or The substrate is transferred to the processing unit.

[Operation and Effect] According to the invention described in claim 3, the transfer order setting means sets the transfer order of the substrates by the transfer mechanism, and the inspection information setting means sets the inspection information of the substrates. The inspection information is assigned to all inspection units capable of inspecting the substrate by assigning one of “inspect substrate” or “not inspect substrate” to each inspection unit in each transport order. This is information for setting whether or not to inspect the substrate. The control means, based on the transport order and the inspection information, (C) delivers the substrate to the inspection unit and the processing unit based on the transport order, and (D ₁ ) the inspection information “inspects the substrate” If the inspection information is set to “do not inspect the substrate” (D ₂ ), the inspection unit inspects the substrate based on the inspection information. The inspection unit , the processing unit, and the transport mechanism are controlled so that the substrate is delivered to the next inspection unit or processing unit without inspecting the substrate by the inspection unit.

Since the inspection information is information for setting whether or not to inspect the substrate with respect to the inspection unit, the “inspection of the substrate” and the “inspection of the substrate” are performed as described above in (D ₁ ) and (D ₂ ). Both “do not inspect” (ie skip substrate inspection) can be manipulated by inspection information. In addition, as the inspection information, any one of “perform substrate inspection” or “not perform substrate inspection” is assigned to each inspection unit in each conveyance order, so it is necessary to change the conveyance order itself. Rather, various substrate processing including the inspection unit can be flexibly performed according to the setting of the inspection information.
Further, by setting the examination information to set whether or not to perform an inspection of the substrate for all of the inspection unit capable of inspecting a substrate, the maximum for all the inspection unit capable of inspecting a substrate In addition to being able to inspect substrates, at the very least, it is possible to carry out various substrate processing including inspection units so that only inspection can be carried out without inspecting all inspection units. Can be done.

In each of the above-described inventions, as an example of the substrate processing apparatus, the apparatus includes the processing unit and the transport mechanism, or includes the inspection unit, the processing unit, and the transport mechanism to form a single processing block. The processing blocks are arranged side by side, and each processing block has an entrance substrate mounting portion for mounting a substrate to receive the substrate in the processing block, and a substrate from the processing block. An exit substrate placement unit for placing a substrate is provided separately from each other, and a transfer mechanism for each processing block transfers a substrate through the entrance substrate placement unit and the exit substrate placement unit. (Invention of Claim 4 ).

  According to the above-described apparatus, substrate processing or substrate inspection is sequentially performed in a plurality of processing blocks arranged in parallel. In each processing block, each transport mechanism transfers the substrate in parallel to the inspection unit or each processing unit. That is, since the transfer mechanism of each processing block operates simultaneously and in parallel, the speed of substrate transfer to each processing unit or inspection unit is equivalently improved, so that the throughput of the substrate processing apparatus can be improved. In addition, since the entrance substrate placement unit and the exit substrate placement unit are provided separately, the substrate received in the processing block and the substrate dispensed from the processing block may interfere with each other in the substrate placement unit. In addition, the substrate can be smoothly transferred between the processing blocks.

As another example of the substrate processing apparatus, the apparatus includes the processing unit and the transport mechanism, or configures a single controlled unit including the inspection unit, the processing unit, and the transport mechanism. The controlled units are arranged in parallel, and each controlled unit has an inlet substrate mounting portion for mounting a substrate to receive the substrate in the controlled unit, and a substrate from the controlled unit. An exit substrate placement unit for placing a substrate to be dispensed is provided separately, and the transport mechanism of each controlled unit transfers the substrate via the entrance substrate placement unit and the exit substrate placement unit. was carried out, and includes a unit control means for controlling at least the substrate transfer operation of the transfer mechanism of the controlled units each controlled unit, each unit control means, respectively versus the one-to-one correspondence with each of the control unit And, each unit control means, transfer of the substrate to the processing section or the inspection section and the control according to a series of substrate transfer, including the transfer of the substrate relative to the substrate platform, only for the control unit to be a control Some of them are performed independently from other controlled units ( the invention according to claim 5 ).

The above-described apparatus is intended to improve the throughput of the substrate processing apparatus from the control aspect. The control method of this apparatus is so-called distributed control. For this purpose, the transfer of the substrate between the controlled units is performed via the distinguished entrance substrate placement portion and the exit substrate placement portion. As a result, the control means of each controlled unit need only perform a series of controls starting from receipt of the substrate placed on the entrance substrate placement unit and being completed by placing the substrate on the exit substrate placement unit. That is, it is not necessary to consider the movement of the transport mechanism of the adjacent controlled unit. Therefore, the burden on the control means of each controlled unit is reduced, and the throughput of the substrate processing apparatus can be improved. In addition, the number of controlled units can be increased or decreased relatively easily. On the other hand, in the conventional substrate processing ( the invention according to claim 4 ), the operation sequence of the transport mechanism, each processing unit, and the inspection unit is performed because the transport mechanism, each processing unit, and the inspection unit are centrally controlled. The determination work (scheduling) is complicated, which is one factor that hinders the improvement of throughput.

Further, by combining this apparatus with the invention according to any one of claims 1 to 3 , the following effects are also obtained. That is, since it is not necessary to consider the movement of the transport mechanism of the adjacent controlled unit, it is any one of claims 1 to 3 as compared with the conventional substrate processing ( the invention according to claim 4 ). The influence of the respective controlled units (corresponding to the processing block in claim 4) caused by the flexible substrate processing including the inspection unit, which is the effect of the present invention, is unlikely to occur.

In each of the above-described inventions, the entrance substrate placement unit and the exit substrate placement unit are configured to place the substrate on the basis of one processing block (or a controlled unit). It captures the function of the department. In other words, an exit substrate placement portion of a certain processing block (or controlled unit) corresponds to an entrance substrate placement portion based on the processing block (or controlled unit) adjacent to the processing block. Thus, between the adjacent processing blocks (or controlled units), the exit substrate placement unit and the entrance substrate placement unit coincide.

The invention described in claim 6 is a substrate processing method for transferring a substrate to each processing unit and performing substrate processing in the transferred processing unit, for each processing unit in each transport order. A process for setting whether or not to process a substrate for all processing units capable of processing the substrate by assigning any one of “perform substrate processing” or “not perform substrate processing”. When information is set and (a) the substrate is delivered to the processing unit based on the transport order, and (b ₁ ) the processing information is set to “perform substrate processing”. Performs processing of the substrate by the processing unit based on the processing information. (B ₂ ) If the processing information is set to “do not perform processing of the substrate”, the processing unit processes the substrate. Of the substrate for the next processing section. It is characterized in that performing only pass.

[ Operation / Effect] According to the invention described in claim 6, any one of “perform substrate processing” or “not perform substrate processing” is assigned to each processing section in each transport order. Processing information for setting whether or not to process a substrate is set for all processing units capable of processing the substrate, and (a) the substrate is transferred to the processing unit based on the transport order. At the same time, when (b ₁ ) processing information is set to “perform substrate processing”, the processing unit processes the substrate based on the processing information, and (b ₂ ) processing information is “ If it is set to “do not process substrate”, the substrate is transferred to the next processing unit without processing the substrate in the processing unit, so that (b ₁ ) described above. , (b ₂₎ "performs the processing of the substrate" as and For both not processed substrate "(i.e. skips the processing of the substrate) can be operated on by processing information. In addition, as the processing information, any one of “perform substrate processing” or “not perform substrate processing” is assigned to each processing unit in each conveyance order, so it is necessary to change the conveyance order itself. Rather, various substrate processing can be flexibly performed according to the setting of processing information.

Further, by setting the processing information to set whether to perform processing of the substrate for all of the processing unit capable of processing a substrate, the maximum for all of the processing unit capable of processing a substrate Various substrate processes can be performed more flexibly so that the substrate can be processed and, at a minimum, only the transfer can be performed without performing the substrate processing on all the processing units. .
According to the seventh aspect of the present invention, the substrate is delivered to the inspection unit and each processing unit, the substrate is inspected by the delivered inspection unit, and the substrate processing is performed by the delivered processing unit. All substrate processing methods that can process a substrate by assigning one of “perform substrate processing” or “not perform substrate processing” for each processing unit in each transport order. The processing information for setting whether or not to process the substrate is set for the unit, and one of “inspect substrate” and “do not inspect substrate” is set in the inspection unit in the transport order. Inspection information for setting whether or not to inspect the substrate for the inspection unit is set, and (c) delivery of the substrate to the inspection unit and the processing unit based on the transport order. If you do Moni, (b ₁₎ when the processing information is used to set that "performing the processing of the substrate" performs processing of the substrate in the processing unit based on the processing information, the (b ₂₎ process information If it is set to “do not process the substrate”, the substrate is transferred to the next processing unit without processing the substrate in the processing unit, and (d ₁ ) inspection information Is set to “inspect the substrate”, the inspection unit inspects the substrate based on the inspection information, and (d ₂ ) the inspection information “does not inspect the substrate”. Is set, the substrate is transferred to the next inspection unit or processing unit without inspecting the substrate by the inspection unit.
[Operation / Effect] According to the invention described in claim 7, the inspection unit is assigned with one of "inspect substrate" and "do not inspect substrate" assigned to the inspection unit in the transport order. Inspection information for setting whether or not to inspect the substrate is set for (c) The substrate is delivered to the inspection unit and the processing unit based on the transport order, and (d ₁ ) inspection When the information is set to “inspect the substrate”, the inspection unit inspects the substrate based on the inspection information, and (d ₂ ) the inspection information “does not inspect the substrate”. If this is set, the substrate is transferred to the next inspection unit or processing unit without inspecting the substrate by the inspection unit, so that (d ₁ ), (d ₂ ) ) “Perform board inspection” and “ Both “do not inspect” (ie skip substrate inspection) can be manipulated by inspection information. In addition, since any one of “inspect the substrate” or “do not inspect the substrate” is assigned to the inspection unit in the transport order, it is not necessary to change the transport order itself. Various substrate processing including the inspection unit can be flexibly performed according to the setting of the inspection information.
In the case of the invention according to claim 7, as in the case of the invention described in claim 6, sets whether to perform the processing of the substrate for all of the processing unit capable of processing a substrate By setting the processing information in this way, the processing of the substrate can be performed for all processing units capable of processing the substrate at the maximum, and the processing of the substrate is performed for all the processing units at the minimum. Thus, various substrate processes can be performed more flexibly so that only the transfer can be performed.

In each of the above-described inventions, an example of the case where the processing information (b ₂ ) described above is set to “do not perform substrate processing”. In the state where the substrate is delivered to the processing unit, The substrate is transferred from the processing unit to the next processing unit without performing the processing ( the invention according to claim 8 ). Another example is passing the substrate without passing the substrate to the processing unit and transferring the substrate to the next processing unit ( the invention according to claim 9 ).

In the invention described in claim 10, the substrate is delivered to the inspection unit and each processing unit, the substrate is inspected by the delivered inspection unit, and the substrate processing is performed by the delivered processing unit. All inspections that can inspect a substrate by assigning any one of “inspect substrate” or “not inspect substrate” to each inspection unit in each transport order in the substrate processing method Inspection information for setting whether or not to inspect the substrate for the unit is set. (C) Deliver the substrate to the inspection unit and the processing unit based on the conveyance order, and (d ₁ ) When the inspection information is set to “inspect the substrate”, the inspection unit inspects the substrate based on the inspection information, and (d ₂ ) the inspection information “does not inspect the substrate. Is to set Expediently, without inspection of the substrate at the inspection unit, and is characterized in that for transferring the substrate for the next inspection unit or processing unit.

[Operation / Effect] According to the invention described in claim 10, any one of “perform substrate inspection” or “not perform substrate inspection” is assigned to each inspection unit in each transport order. Inspection information for setting whether or not to inspect the substrate is set for all inspection units that can inspect the substrate . (C) Based on the transport order, the inspection information and the processing unit are inspected. (D ₁ ) When the inspection information is set to “inspect the substrate”, the inspection unit inspects the substrate based on the inspection information, and (d ₂ ) inspection If the information is set to “do not inspect the substrate”, the inspection unit does not inspect the substrate, and the substrate is transferred to the next inspection unit or processing unit. described above (d _1), as in (d ₂₎ For both the substrate is inspected "and" not to inspect such substrates "(i.e. skip inspection of the substrate) can be operated by the examination information. In addition, as the inspection information, any one of “perform substrate inspection” or “not perform substrate inspection” is assigned to each inspection unit in each conveyance order, so it is necessary to change the conveyance order itself. Rather, various substrate processing including the inspection unit can be flexibly performed according to the setting of the inspection information.

Further, by setting the examination information to set whether or not to perform an inspection of the substrate for all of the inspection unit capable of inspecting a substrate, the maximum for all the inspection unit capable of inspecting a substrate In addition to being able to inspect substrates, at the very least, it is possible to carry out various substrate processing including inspection units so that only inspection can be carried out without inspecting all inspection units. Can be done.

In the above-described invention, an example of the case where the above-described inspection information (d ₂ ) is set to “do not inspect the substrate” is an example of inspecting the substrate with the substrate delivered to the inspection unit. In this case, the substrate is transferred from the inspection unit to the next inspection unit or processing unit. Another example is passing the substrate without passing the substrate to the inspection unit and transferring the substrate to the next inspection unit or processing unit (the invention according to claim 12).

In the above-described invention, the inspection information “inspect the substrate” is set until the inspection unit passes, the substrate is sequentially transferred to the inspection unit based on the transport order , and the inspection unit is based on the inspection information. If the board passes in the inspection section, set the inspection information to "Do not inspect the board", and for the subsequent board than the board that passed, do not inspect the board in the inspection section It is preferable that the substrate is transferred to the next inspection unit or processing unit (the invention according to claim 13). Since the substrate is passed to the inspection unit in order until it passes in the inspection unit, the inspection is performed, and if the substrate passes in the inspection unit, the inspection unit does not inspect the substrate subsequent to the substrate that passed, It is possible to correctly perform the inspection of the substrate, and it is possible to improve the throughput of the substrate processing including the inspection unit without transferring the substrate to the inspection unit with respect to the substrate subsequent to the passed substrate.

According to the substrate processing apparatus and method of the present invention, (A) / (a) the substrate is transferred to the processing unit based on the transport order, and (B ₁ ) / (b ₁ ) processing information is received. In the case of setting “to process the substrate”, the processing unit processes the substrate based on the processing information, and (B ₂ ) / (b ₂ ) processing information indicates that “the substrate processing is performed”. If it is set to “not perform”, the substrate is delivered to the next processing unit without processing the substrate in the processing unit. Alternatively, (C) / (c) the substrate is transferred to the inspection unit and the processing unit based on the transport order, and (D ₁ ) / (d ₁ ) inspection information indicates that “inspect the substrate”. If it is to be set, the substrate is inspected by the inspection unit based on the inspection information, and (D ₂ ) / (d ₂ ) inspection information is set to “do not inspect the substrate”. In some cases, the substrate is delivered to the next inspection unit or processing unit without inspecting the substrate by the inspection unit. In this way, both “perform substrate processing / inspection” and “not perform substrate processing / inspection” (that is, skip substrate processing / inspection) can be operated by processing information / inspection information. As the processing information / inspection information, any one of “perform substrate processing / inspection” or “not perform substrate processing / inspection” is assigned to each processing unit / inspection unit in each transport order. Therefore, there is no need to change the transport order itself, and various substrate processes including the inspection unit can be flexibly performed in accordance with the setting of the processing information / inspection information.
Further, by setting the processing information to set whether to perform processing / inspection of the substrate for all processor / inspection unit which may be treated / inspecting a substrate, the process / examine the substrate in most Substrate processing / inspection units can be processed / inspected for all possible processing units / inspection units, and at the minimum, all processing units / inspection units are not subjected to substrate processing / inspection units, but only transported. Therefore, various substrate processes including the inspection unit can be performed more flexibly.

Embodiment 1 of the present invention will be described below with reference to the drawings.
1 is a plan view of a substrate processing apparatus according to Embodiment 1, FIG. 2 is a front view thereof, and FIG. 3 is a front view of a heat treatment section.

  Here, a substrate processing apparatus that applies an antireflection film or a photoresist film to a semiconductor wafer (hereinafter simply referred to as a “substrate”) and performs chemical processing such as development processing on the exposed substrate is taken as an example. explain. Of course, the substrate which can be handled by the substrate processing apparatus according to the present invention is not limited to a semiconductor wafer, but includes various substrates such as a glass substrate for a liquid crystal display. Further, the chemical processing is not limited to coating formation processing such as a photoresist film and development processing, but includes various chemical processing.

  Please refer to FIG. The substrate processing apparatus according to the first embodiment is roughly divided into an indexer block 1 and three processing blocks (specifically, an antireflection film processing block 2 and a resist film processing) for performing a required chemical liquid processing on the substrate. The block 3 and the development processing block 4) and the interface block 5 are configured by arranging these blocks in parallel. The interface block 5 is provided with an exposure apparatus (stepper) STP that is an external apparatus separate from the substrate processing apparatus according to the first embodiment. Hereinafter, the configuration of each block will be described.

  First, the indexer block 1 will be described. The indexer block 1 is a mechanism for taking out the substrates from the cassette C that stores the substrates W in multiple stages and storing the substrates W in the cassette C. Specifically, the cassette mounting table 6 on which a plurality of cassettes C are placed side by side, and an indexer for sequentially taking out unprocessed substrates W from each cassette C and storing processed substrates W in each cassette C in order. And a transport mechanism 7. The indexer transport mechanism 7 includes a movable table 7a that can move horizontally along the cassette mounting table 6 (in the Y direction). A holding arm 7b for holding the substrate W in a horizontal posture is mounted on the movable table 7a. The holding arm 7b is configured to be able to move up and down (Z direction) on the movable table 7a, to turn in a horizontal plane, and to move back and forth in the turning radius direction.

  An antireflection film processing block 2 is provided adjacent to the indexer block 1 described above. As shown in FIG. 4, an atmosphere blocking partition wall 13 is provided between the indexer block 1 and the antireflection film processing block 2. Two substrate platforms PASS1 and PASS2 on which the substrate W is placed in order to transfer the substrate W between the indexer block 1 and the antireflection film processing block 2 are provided on the partition wall 13 close to each other in the vertical direction. Yes.

  The upper substrate platform PASS1 delivers the substrate W from the indexer block 1 to the antireflection film processing block 2, so that the lower substrate platform PASS2 transfers the substrate W from the antireflection film processing block 2 to the indexer block 1. Each is provided to return. Speaking on the basis of the antireflection film processing block 2, the substrate platform PASS1 corresponds to an entrance substrate platform for receiving the substrate W in the antireflection film processing block 2. In particular, when the transport direction of the substrate W flowing from the indexer block 1 toward the exposure apparatus STP is a forward direction, the substrate platform PASS1 uses the feeding entrance substrate mounting used when transporting the substrate W in the forward direction. It corresponds to the placement part. On the other hand, the substrate platform PASS2 is an exit substrate platform for delivering the substrate W from the antireflection film processing block 2, and in particular, the substrate W is moved in the reverse direction (in this embodiment, from the exposure apparatus STP to the indexer block). This corresponds to a return exit substrate mounting portion used when transporting in the transport direction of the substrate W flowing toward 1).

  The substrate platforms PASS1 and PASS2 are provided so as to partially penetrate the partition wall 13. The substrate platforms PASS1 and PASS2 are composed of a plurality of support pins fixedly installed, and this is the same for the other substrate platforms PASS3 to PASS10 described later. The substrate platforms PASS1 and PASS2 are provided with optical sensors (not shown) that detect the presence / absence of the substrate W. Based on the detection signals of the sensors, the indexer transport mechanism 7 and antireflection described later. The first main transport mechanism 10A of the film processing block 2 determines whether or not the substrate can be delivered to the substrate platforms PASS1 and PASS2. Similar sensors are also provided in the other substrate platforms PASS3 to PASS10.

  The antireflection film processing block 2 will be described. The antireflection film processing block 2 is a mechanism for applying and forming an antireflection film below the photoresist film in order to reduce standing waves and halation generated during exposure. Specifically, an antireflection film application processing unit 8 for applying an antireflection film on the surface of the substrate W, and an antireflection film heat treatment unit 9 for heat-treating the substrate W in connection with the formation of the antireflection film, And a first main transport mechanism 10A for delivering the substrate W to the antireflection film application processing unit 8 and the antireflection film heat treatment unit 9.

  In the antireflection film processing block 2, the antireflection film coating processing unit 8 and the antireflection film heat treatment unit 9 are arranged to face each other with the first main transport mechanism 10 </ b> A interposed therebetween. Specifically, the coating treatment unit 8 is located on the front side of the apparatus, and the heat treatment unit 9 is located on the rear side of the apparatus. The point that the chemical solution processing unit and the heat processing unit are arranged to face each other across the main transport mechanism is the same in the other resist film processing block 3 and the development processing block 4. With such an arrangement, the chemical treatment unit and the heat treatment unit are separated from each other, so that the thermal influence on the chemical treatment unit from the heat treatment unit can be suppressed. Further, in the first embodiment, a thermal partition (not shown) is provided on the front side of the heat treatment part 9 to avoid thermal influence on the antireflection film coating treatment part 8. Similar thermal partition walls are provided in the other resist film processing block 3 and the development processing block 4.

  As shown in FIG. 2, the antireflection film application processing unit 8 includes three antireflection film application processing units 8 a to 8 c having the same configuration (hereinafter, indicated by reference numeral “8” unless otherwise distinguished). Are stacked in a vertical direction. Each coating processing unit 8 includes a spin chuck 11 that rotates while adsorbing and holding the substrate W in a horizontal posture, a nozzle 12 that supplies a coating liquid for an antireflection film onto the substrate W held on the spin chuck 11, and the like. It has.

  As shown in FIG. 3, the antireflection film heat treatment section 9 includes a plurality of heating plates HP for heating the substrate W to a predetermined temperature, and a plurality of cooling plates CP for cooling the heated substrate W to room temperature. In order to improve the adhesion between the resist film and the substrate W, a heat treatment part such as a plurality of adhesion treatment parts AHL for heat treating the substrate W in a vapor atmosphere of HMDS (hexamethyldisilazane) is included. A heater controller (CONT) is disposed at the lower part of these heat treatment parts 9, and a pipe wiring part and a spare space are provided at the upper part of the heat treatment part 9 (the portion indicated by “x” in FIG. 3). Space is allocated.

  The antireflection film heat treatment section 9 is configured by arranging the respective heat treatment sections (HP, CP, AHL) in a vertical stack, and a plurality of examples of a group of heat treatment sections arranged in layers (in this embodiment, two rows). ). The point that the chemical processing parts are stacked in the vertical direction and the group of heat processing parts that are stacked in the vertical direction are arranged in parallel in a plurality of rows also in the other resist film processing block 3 and the development processing block 4 It is the same.

  As described above, the chemical processing section and the heat treatment section are stacked one above the other in each processing block 2 to 4, thereby reducing the space occupied by the substrate processing apparatus. In addition, by arranging a group of heat treatment parts arranged in a stack over a plurality of rows, maintenance of the heat treatment part becomes easy, and it is not necessary to extend duct piping and power supply equipment necessary for the heat treatment part to a very high position. There is an advantage.

  The first main transport mechanism 10A will be described. The second, third, and fourth main transport mechanisms 10B, 10C, and 10D provided in the other resist film processing block 3, the development processing block 4, and the interface block 5 described later are configured in the same manner. ing. Hereinafter, the first to fourth main transport mechanisms 10 </ b> A to 10 </ b> D will be described as the main transport mechanism 10 when they are not particularly distinguished.

  Please refer to FIG. FIG. 4A is a plan view of the main transport mechanism 10 and FIG. The main transport mechanism 10 includes two holding arms 10a and 10b that hold the substrate W in a horizontal posture in close proximity to each other. The holding arms 10a and 10b have a "C" shape in a plan view, and a plurality of pins 10c projecting inward from the inside of the "C" -shaped arm. The periphery is supported from below. The base 10d of the main transport mechanism 10 is fixedly installed with respect to the apparatus base. A screw shaft 10e is rotatably supported on the base 10d. A motor 10f that rotationally drives the screw shaft 10e is provided on the base 10d. The lifting platform 10g is screwed to the screw shaft 10e, and the motor 10f rotationally drives the screw shaft 10e so that the lifting table 10g is guided up and down by the guide shaft 10j. An arm base 10h is mounted on the lifting platform 10g so as to be pivotable about the vertical axis. The lifting platform 10g is provided with a motor 10i that drives the arm base 10h to rotate. The above-mentioned two holding arms 10a and 10b are arranged above and below on the arm base 10h. Each holding arm 10a, 10b is configured to be able to move forward and backward independently in the turning radius direction of the arm base 10h by a drive mechanism (not shown) provided in the arm base 10h.

  A resist film processing block 3 is provided adjacent to the antireflection film processing block 2 described above. As shown in FIG. 4, an atmosphere blocking partition 13 is also provided between the antireflection film processing block 2 and the resist film processing block 3. Two substrate platforms PASS3 and PASS4 for transferring the substrate W between the antireflection film processing block 2 and the resist film processing block 3 are provided on the partition wall 13 close to each other in the vertical direction.

  As in the case of the above-described substrate platforms PASS1 and PASS2, the upper substrate platform PASS3 is used for dispensing the substrate W, and the lower substrate platform PASS4 is used for returning the substrate W. The substrate platforms PASS 3 and PASS 4 partially penetrate the partition wall 13. Here, the substrate platform PASS3 corresponds to the feed exit substrate platform if the antireflection film processing block 2 is used as a reference, and the feed entrance substrate if the resist film processing block 3 is used as a reference. Corresponds to the placement section. The substrate platform PASS4 corresponds to the return entrance substrate platform if the antireflection film processing block 2 is used as a reference, and the return exit substrate mount if the resist film processing block 3 is used as a reference. It corresponds to the placement part. Below these substrate platforms PASS3 and PASS4, two water-cooled cooling plates WCP are provided above and below the partition wall 13 to roughly cool the substrate W.

  The resist film processing block 3 will be described. The resist film processing block 3 is a mechanism for applying and forming a photoresist film on the substrate W on which an antireflection film has been applied. In this embodiment, a chemically amplified resist is used as the photoresist. The resist film processing block 3 includes a resist film coating processing unit 15 that coats and forms a photoresist film on a substrate W on which an antireflection film is coated, and a resist that heat-treats the substrate in connection with the coating formation of the photoresist film. A film heat treatment section 16 and a second main transport mechanism 10B for delivering the substrate W to the resist film coating treatment section 15 and the resist film heat treatment section 16 are provided.

  As shown in FIG. 2, the resist film coating processing unit 15 moves up and down three resist film coating processing units 15 a to 15 c (hereinafter denoted by reference numeral “15” unless otherwise distinguished). Are arranged in a stacked manner. Each coating processing unit 15 includes a spin chuck 17 that rotates while adsorbing and holding the substrate W in a horizontal posture, a nozzle 18 that supplies a coating liquid for a resist film onto the substrate W held on the spin chuck 17, and the like. I have.

  As shown in FIG. 3, the resist film heat treatment section 16 includes a plurality of heating sections PHP with a temporary substrate placement section that heats the substrate W to a predetermined temperature, and a plurality of cooling sections that cool the substrate W to room temperature with high accuracy. A heat treatment part such as a single cooling plate CP is included. The points where the heat treatment parts are stacked one above the other and arranged in parallel are the same as in the case of the anti-reflection film processing block 2.

A heating unit PHP with a temporary substrate placement unit will be described.
Please refer to FIG. The figure (a) is a fracture side view of heating part PHP, (b) is a fracture plan view. The heating unit PHP places the substrate W on the heating plate HP on which the substrate W is placed and performs the heat treatment, and the upper position or the lower position (upward position in this embodiment) far from the heating plate HP. A substrate temporary placement unit 19 and a local transport mechanism 20 for a heat treatment unit that transports the substrate W between the heating plate HP and the substrate temporary placement unit 19 are provided. The heating plate HP is provided with a plurality of movable support pins 21 that appear and disappear on the plate surface. Above the heating plate HP, there is provided an upper lid 22 that can be raised and lowered to cover the substrate W during the heat treatment. The temporary substrate placement portion 19 is provided with a plurality of fixed support pins 23 that support the substrate W.

  The local transport mechanism 20 includes a holding plate 24 that holds the substrate W in a horizontal posture. The holding plate 24 is moved up and down by a screw feed drive mechanism 25 and moved forward and backward by a belt drive mechanism 26. Yes. The holding plate 24 is formed with a plurality of slits 24 a so that the holding plate 24 does not interfere with the movable support pins 21 and the fixed support pins 23 when the holding plate 24 advances above the heating plate HP and the temporary substrate placement unit 19. The local transport mechanism 20 includes means for cooling the substrate in the process of transporting the substrate W from the heating plate HP to the temporary substrate placement unit 19. This cooling means is configured, for example, by providing a cooling water channel 24b inside the holding plate 24 and circulating the cooling water through the cooling water channel 24b.

  The local transport mechanism 20 described above is installed on the opposite side of the second main transport mechanism 10B, that is, on the back side of the apparatus, with the heating plate HP and the temporary substrate placement part 19 in between. An opening 19a that allows the second main transport mechanism 10B to enter the front side of the upper portion of the casing 27 that covers the heating plate HP and the temporary substrate placement portion 19, that is, the portion that covers the temporary substrate placement portion 19 is provided. However, an opening 19b that allows the local transport mechanism 20 to enter is provided on the back side thereof. Further, a lower part of the casing 27, that is, a part covering the heating plate HP is closed on the front side, and an opening 19c that allows entry of the local transport mechanism 20 is provided on the rear side.

  The substrate W is taken in and out of the heating unit PHP as described above. First, the main transport mechanism 10 (second main transport mechanism 10B in the case of the resist film processing block 3) holds the substrate W and places the substrate W on the fixed support pins 23 of the temporary substrate placement section 19. Put. Subsequently, the substrate W is received from the fixed support pins 23 by slightly rising after the holding plate 24 of the local transport mechanism 20 enters the lower side of the substrate W. The holding plate 24 holding the substrate W is withdrawn from the housing 27 and lowered to a position facing the heating plate HP. At this time, the movable support pin 21 of the heating plate HP is lowered and the upper lid 22 is raised. The holding plate 24 holding the substrate W advances above the heating plate HP. After the movable support pin 21 rises and receives the substrate W, the holding plate 24 is retracted. Subsequently, the movable support pins 21 are lowered to place the substrate W on the heating plate HP, and the upper lid 22 is lowered to cover the substrate W. In this state, the substrate W is heated. When the heat treatment is finished, the upper lid 22 rises and the movable support pin 21 rises to lift the substrate W. Subsequently, after the holding plate 24 advances below the substrate W, the movable support pin 23 descends, whereby the substrate W is delivered to the holding plate 24. The holding plate 24 holding the substrate W is withdrawn and further lifted to transport the substrate W to the temporary substrate placement unit 19. The substrate W supported by the holding plate 24 in the temporary substrate placement unit 19 is cooled by the cooling function of the holding plate 24. The holding plate 24 transfers the cooled substrate W (returned to room temperature) onto the fixed support pins 23 of the temporary substrate placement unit 19. The main transport mechanism 10 takes out and transports the substrate W.

  As described above, the main transport mechanism 10 only delivers the substrate W to the temporary substrate placement unit 19 and does not deliver the substrate to the heating plate HP, so the temperature of the main transport mechanism 10 rises. Can be avoided. Further, since the opening 19c for putting the substrate W in and out of the heating plate HP is located on the side opposite to the side on which the main transport mechanism 10 is disposed, the main transport is performed in a thermal atmosphere leaking from the opening 19c. The temperature of the mechanism 10 does not increase, and the resist film coating processing unit 15 is not adversely affected by the heat atmosphere leaked from the opening 19c.

  A development processing block 4 is provided adjacent to the resist film processing block 3 described above. As shown in FIG. 4, an atmosphere blocking partition 13 is also provided between the resist film processing block 3 and the development processing block 4, and the partition 13 has a substrate W between the processing blocks 3 and 4. Two substrate platforms PASS5, 6 for delivery and two water-cooled cooling plates WCP are provided in a stacked manner in order to cool the substrate W roughly. Here, the substrate platform PASS5 corresponds to the delivery exit substrate platform when the resist film processing block 3 is used as a reference, and the delivery entrance substrate placement when the development processing block 4 is used as a reference. It corresponds to the part. Further, the substrate platform PASS6 corresponds to a return entrance substrate platform if the resist film processing block 3 is used as a reference, and a return exit substrate platform if the development processing block 4 is used as a reference. It corresponds to.

  The development processing block 4 will be described. The development processing block 4 is a mechanism for performing development processing on the exposed substrate W. Specifically, with respect to the development processing unit 30 that performs development processing on the exposed substrate W, the development heat treatment unit 31 that heat-treats the substrate in relation to the development processing, and the development processing unit 30 and the development heat treatment unit 31 And a third main transport mechanism 10C for delivering the substrate W.

  As shown in FIG. 2, the development processing unit 30 is configured by stacking five development processing units 30a to 30e (hereinafter denoted by reference numeral “30” unless otherwise specified) having the same configuration. Has been. Each development processing unit 30 includes a spin chuck 32 that rotates by adsorbing and holding the substrate W in a horizontal posture, a nozzle 33 that supplies a developer onto the substrate W held on the spin chuck 32, and the like.

  As shown in FIG. 3, the development heat treatment section 31 includes heat treatment sections such as a plurality of heating plates HP, a heating section PHP with a temporary substrate placement section, and a cooling plate CP. The points where the heat treatment units are stacked one above the other and arranged in parallel are the same as in the other processing blocks 2 and 3. In order to transfer the substrate W between the development processing block 4 and the interface block 5 adjacent to the development processing block 4 in the row of the thermal processing units on the right side (side adjacent to the interface block 5) of the development thermal processing unit 31. These two substrate platforms PASS7 and PASS8 are provided close to each other in the vertical direction. The upper substrate platform PASS7 is for dispensing the substrate W, and the lower substrate platform PASS8 is for returning the substrate W. Here, the substrate platform PASS7 corresponds to the delivery exit substrate platform when the development processing block 4 is used as a reference, and the delivery platform substrate placement unit when the interface block 5 is used as a reference. Equivalent to. Further, the substrate platform PASS8 corresponds to the return entrance substrate platform when referred to the development processing block 4, and corresponds to the return exit substrate platform when referred to the interface block 5. To do.

  The interface block 5 will be described. The interface block 5 is a mechanism for delivering the substrate W to the exposure apparatus STP, which is an external apparatus separate from the substrate processing apparatus. In addition to the interface transport mechanism 35 for transferring the substrate W to and from the exposure apparatus STP, the interface block 5 in this embodiment apparatus exposes the peripheral portion of the substrate W coated with the photoresist 2. And a fourth main transport mechanism 10D that delivers the substrate W to the edge exposure unit EEW and the thermal processing unit PHP with a temporary substrate placement unit disposed in the development processing block 4 and the edge exposure unit EEW. .

  As shown in FIG. 2, the edge exposure unit EEW has a spin chuck 36 that rotates by sucking and holding the substrate W in a horizontal posture, and a light irradiator 37 that exposes the periphery of the substrate W held on the spin chuck 36. Etc. The two edge exposure portions EEW are stacked in the vertical direction at the center of the interface block 5. The fourth main transport mechanism 10D disposed adjacent to the edge exposure unit EEW and the heat processing unit of the development processing block 4 has the same configuration as the main transport mechanism 10 described in FIG.

  Please refer to FIG. 2 and FIG. FIG. 5 is a side view of the interface block 5. A substrate return buffer RBF is provided below the two edge exposure units EEW, and two substrate platforms PASS9 and PASS10 are stacked on the lower side. When the development processing block 4 cannot perform the development processing of the substrate W due to a failure or the like, the buffer RBF for returning the substrate is subjected to the heat treatment after the exposure by the heating unit PHP of the development processing block 4. The substrate W is temporarily stored and stored. The buffer RBF is composed of a storage shelf that can store a plurality of substrates W in multiple stages. The substrate platforms PASS9 and PASS10 are used to transfer the substrate W between the fourth main transport mechanism 10D and the interface transport mechanism 35, and the upper side is for substrate feeding and the lower side is for substrate return. ing.

  As shown in FIGS. 1 and 5, the interface transport mechanism 35 includes a movable table 35a that can move horizontally in the Y direction, and a holding arm 35b that holds the substrate W is mounted on the movable table 35a. The holding arm 35b is configured to be capable of moving up and down, turning, and moving forward and backward in the turning radius direction. One end (position P1 shown in FIG. 5) of the transport path of the interface transport mechanism 35 extends to below the stacked substrate platforms PASS9 and PASS10, and between this position P1 and the exposure apparatus STP. Deliver the substrate W. At the other end position P2 of the transport path, the substrate W is transferred to the substrate platforms PASS9 and PASS10, and the substrate W is stored and taken out from the sending buffer SBF. The sending buffer SBF temporarily stores and stores the substrate W before the exposure processing when the exposure apparatus STP cannot accept the substrate W, and includes a storage shelf that can store a plurality of substrates W in multiple stages. ing.

  In the substrate processing apparatus configured as described above, clean air is supplied to the indexer block 1, the processing blocks 2, 3, 4, and the interface block 5 in a downflow state. Avoids adverse effects on the process caused by hoisting and airflow. In addition, the inside of each block is kept at a slightly positive pressure with respect to the external environment of the apparatus to prevent intrusion of particles and contaminants from the external environment. In particular, the atmospheric pressure in the antireflection film processing block 2 is set to be higher than the atmospheric pressure in the index block 1. As a result, the atmosphere in the indexer block 1 does not flow into the anti-reflection film processing block 2, so that the processing blocks 2, 3, and 4 can perform processing without being affected by the external atmosphere.

Next, a control system of the substrate processing apparatus according to the first embodiment, particularly a control method related to substrate transport will be described.
The above-described indexer block 1, anti-reflection film processing block 2, resist film processing block 3, development processing block 4, and interface block 5 are elements obtained by mechanically dividing the substrate processing apparatus according to the first embodiment. . Specifically, each block is assembled to an individual block frame (frame body), and the substrate processing apparatus is configured by connecting the block frames (see FIG. 8A).

  On the other hand, as one of the features of the present invention, the unit of the controlled unit related to substrate conveyance is configured separately from each block which is a mechanical element. That is, a single controlled unit is configured including a processing unit that performs a required process on the substrate and a single main transport mechanism that transfers the substrate to the processing unit, and the controlled units are arranged in parallel. And a substrate processing apparatus is configured. Each controlled unit has an entrance substrate placement section for placing a substrate to receive the substrate in the controlled unit, and an exit substrate placement section for placing a substrate to eject the substrate from the controlled unit And are provided separately. Then, the main transfer mechanism of each controlled unit transfers the substrates to each other via the inlet substrate mounting portion and the outlet substrate mounting portion, and performs the substrate transfer operation of the main transfer mechanism of each controlled unit. At least unit control means for controlling is provided for each controlled unit, and each unit control means performs control related to a series of substrate transport including delivery of a substrate to the processing unit and delivery of a substrate to the substrate mounting unit. It is designed to be done independently.

  Hereinafter, the unit of the controlled unit in the apparatus according to the first embodiment is referred to as “cell”. FIG. 8B shows the arrangement of each cell constituting the control system of the embodiment apparatus.

  The indexer cell C1 includes a cassette mounting table 6 and an indexer transport mechanism 7. The cell C1 has the same configuration as the indexer block 1 which is a mechanically divided element as a result. The antireflection film processing cell C2 includes an antireflection film application processing unit 8, an antireflection film heat treatment unit 9, and a first main transport mechanism 10A. The cell C2 also has the same configuration as the antireflection film processing block 2 which is a mechanically divided element. The resist film processing cell C3 includes a resist film coating processing unit 15, a resist film heat treatment unit 16, and a second main transport mechanism 10B. The cell C3 also has the same configuration as the resist film processing block 3 which is a mechanically divided element.

  On the other hand, the development processing cell C4 includes a development processing unit 30, a development heat treatment unit 31 excluding a heat treatment unit used in post-exposure heating (the heating unit PHP in the first embodiment), a third main transport mechanism 10C, including. The cell C3 is different from the development processing block 4 which is a mechanically divided element in that it does not include a heating part PHP used for post-exposure heating.

  The post-exposure heating processing cell C5 includes a post-exposure heating heat treatment section (in the embodiment, a heating section PHP provided in the development processing block 4) that heat-treats the exposed substrate W before development, and an edge exposure section. EEW and the fourth main transport mechanism 10D are included. The cell C5 extends over the development processing block 4 and the interface block 5 which are mechanically divided elements, and is a characteristic cell of the apparatus of this embodiment. As described above, since one cell is configured including the heat treatment section (heating section PHP) for post-exposure heating and the fourth main transport mechanism 10D, the exposed substrate is quickly carried into the heating section PHP. Heat treatment can be performed. This is suitable when a chemically amplified photoresist that requires rapid heating after exposure is used.

  The above-described substrate platforms PASS7 and PASS8 transfer the substrate W between the third main transport mechanism 10C of the development processing cell C4 and the fourth main transport mechanism 10D of the post-exposure heating processing cell C5. Intervene in. Here, the substrate platform PASS7 corresponds to the feed exit substrate platform if the development cell C4 is used as a reference, and the feed entrance substrate if the post-exposure heating cell C5 is used as a reference. Corresponds to the placement section. Further, the substrate platform PASS8 corresponds to a return inlet substrate platform if the development processing cell C4 is used as a reference, and the return exit substrate mounting if the post-exposure heating processing cell C5 is used as a reference. It corresponds to the placement part.

  The interface cell C6 includes an interface transport mechanism 35 that delivers the substrate W to the exposure apparatus STP that is an external apparatus. The cell C6 is different from the interface block 5 which is a mechanically divided element in that it does not include the fourth main transport mechanism 10D and the edge exposure unit EEW. The above-described substrate platforms PASS9 and PASS10 are interposed in the delivery of the substrate W between the fourth main transport mechanism 10D of the post-exposure heating processing cell C5 and the interface transport mechanism 35. Here, the substrate platform PASS9 corresponds to a feed outlet substrate platform if the post-exposure heating processing cell C5 is used as a reference, and the feed inlet substrate substrate is used if the interface cell C6 is used as a reference. It corresponds to the placement part. Further, the substrate platform PASS10 corresponds to the return entrance substrate platform if the post-exposure heating processing cell C5 is used as a reference, and the return exit substrate platform if the interface cell C6 is used as a reference. It corresponds to the part.

  The apparatus according to the first embodiment is configured by arranging the six cells C1 to C6 described above in parallel, and the transfer of the substrate between the cells C1 to C6 is performed via the substrate platform PASS1 to PASS10. Is called. In other words, a single controlled unit (cell) includes a single main transport mechanism, and the main transport mechanism receives a substrate received from a specific entrance substrate platform as a specific exit substrate platform. It is configured to include a processing unit that delivers a substrate before placing.

  As shown in FIG. 9 (a), the cells C1 to C6 include cell controllers (units) that at least control the substrate transfer operation of the main transport mechanism (including the indexer transport mechanism 7 and the interface transport mechanism 35) of each cell. Control means) CT1 to CT6 are provided individually. Each of the cell controllers CT1 to CT6 starts a series of controls starting from receiving a substrate placed on a predetermined entrance substrate placement unit and is completed by placing the substrate on the predetermined exit substrate placement unit. To do. Specifically, the cell controllers CT1 to CT6 of the cells C1 to C6 send information that the substrate is placed on a predetermined substrate placement unit to the cell controller of the adjacent cell, and the cell controller CT1 to CT6 receives the substrate. The cell controller exchanges information that information indicating that a substrate has been received from a predetermined substrate platform is returned to the cell controller of the original cell. Such information exchange is performed via a main controller (main control means) MC that is connected to the cell controllers CT1 to CT6 and collectively manages them. The main controller MC is connected to a data setting unit HC, which will be described later, and is configured to be able to communicate with the data setting unit HC.

  Each cell controller CT1 to CT6 advances the control only for the transfer of the substrate in each cell without considering the movement of the main transport mechanism in the adjacent cells. Accordingly, the control burden on each of the cell controllers CT1 to CT6 is reduced. On the other hand, according to the control method of the conventional substrate processing apparatus, as shown in FIG. 9B, each of the blocks 1 to 5 gives information related to substrate transport to the controller CT0 for schedule management of the substrate processing. Since the controller CT0 comprehensively manages the substrate conveyance, the burden on the controller CT10 increases.

  As described above, according to the first embodiment, since the control burden on the controllers CT1 to CT6 of each cell is reduced, the throughput of the substrate processing apparatus can be improved accordingly. In addition, according to the conventional control method shown in FIG. 9B, when a processing unit is newly added, it is necessary to significantly modify the schedule management program of the controller CT0. Therefore, even if a new cell is added, the adjacent cells are not affected, so that the cell can be easily added. The type of cell to be added is not particularly limited. For example, the thickness of the resist film applied to the substrate W is inspected between the resist film processing cell C3 and the development processing cell C4, or the developed resist film. An inspection cell for inspecting the line width may be added. In this case, like the other cells of the apparatus in the first embodiment, the inspection cell includes a substrate inspection unit that inspects the substrate, and a main conveyance mechanism for substrate inspection that conveys the substrate to the inspection unit. It is comprised including. Further, the transfer of the substrate between the inspection cell and the adjacent cell is performed via the inlet substrate mounting portion and the outlet substrate mounting portion.

  The control method shown in FIG. 9A is called so-called distributed control. In the first embodiment, the present invention is applied to this distributed control. However, the present invention can also be applied to the conventional control method shown in FIG. 9B.

  Next, a specific configuration of the data setting unit HC will be described with reference to FIG. The input unit 38 of the data setting unit HC is configured by a pointing device such as a mouse, a keyboard 38a, a touch panel 38b, and buttons, and transfers data input by the operator to the main controller MC and further to the cell controllers CT1 to CT6. Then, the substrate control for each cell is performed. Further, the main controller MC includes a storage unit represented by a RAM (Random Access Memory) (not shown) and stores various data.

  The screen of the data setting unit HC is displayed on the touch panel 38b. According to the operation display on the touch panel 38b, the operator directly inputs the data by touching the touch panel 38b.

  In the case of the first embodiment, when an operator inputs to the input unit 38 of the data setting unit HC, parameters (for example, processing information such as a skip control flag and a substrate processing condition) in a flow recipe (see FIG. 12) described later. ) Is changed, and the changed parameters are transferred to the main controller MC and further to the cell controllers CT1 to CT6 for each flow recipe. The flow recipe is stored in the storage unit described above, and is provided with a variable recipe function for appropriately reading out as necessary and changing parameters in the read flow recipe. The input unit 38 such as a mouse, a keyboard 38a, a touch panel 38b, and buttons corresponds to the transport order setting unit and the processing information setting unit in the present invention, and the main controller MC corresponds to the control unit in the present invention.

  Next, a basic operation of the substrate processing apparatus according to the first embodiment will be described with reference to FIG. FIG. 11A is a flowchart of the substrate relating to the antireflection film processing cell C2, FIG. 11B is a flowchart of the substrate relating to the resist film processing cell C3, and FIG. 11C is a flowchart of the substrate relating to the development processing cell C4. FIG. 11D is a flowchart of the substrate relating to the post-exposure heating processing cell C5.

  First, the indexer transport mechanism 7 of the indexer cell C1 (indexer block 1) moves horizontally to a position facing a predetermined cassette C. Subsequently, when the holding arm 7b moves up and down and moves forward and backward, the unprocessed substrate W stored in the cassette C is taken out. With the substrate W held by the holding arm 7b, the indexer transport mechanism 7 moves horizontally to a position facing the substrate platforms PASS1 and PASS2. Then, the substrate W on the holding arm 7b is placed on the upper substrate platform PASS1 for delivering the substrate. When the processed substrate W is placed on the lower substrate platform PASS2 for returning the substrate, the indexer transport mechanism 7 receives the processed substrate W on the holding arm 7b, The processed substrate W is stored in the cassette C. Thereafter, similarly, an operation of taking out the unprocessed substrate W from the cassette C and transporting it to the substrate platform PASS1 and receiving the processed substrate W from the substrate platform PASS2 and storing it in the cassette C is repeated.

  As shown in FIG. 11 (a), in the antireflection film processing cell C2, in the forward direction, the substrate platform PASS1 (referred to as the “antireflection film processing cell C2” is referred to as “feed inlet substrate platform”). ”), The cooling plate CP, the antireflection film coating processing section 8, the heating plate HP, the cooling plate WCP, the substrate mounting section PASS3 (referring to the processing cell C2 for the antireflection film,“ the outlet substrate mounting for feeding ” The substrate W is processed in the order of “parts”). In the reverse direction, PASS4 (“return entrance substrate mounting portion” if referred to with respect to the antireflection film processing cell C2), and substrate mounting portion PASS2 (referring to the antireflection film processing cell C2 as a reference). The substrates W are processed in the order of “return exit substrate mounting portion”). In addition, the code | symbol BARC in Fig.11 (a) has shown the application | coating process part 8 for anti-reflective films.

  When the unprocessed substrate W is placed on the substrate platform PASS1, the first main transport mechanism 10A of the cell C2 raises and lowers the holding arms 10a and 10b integrally to a position facing the substrate platforms PASS1 and PASS2. Turn and move. Then, the processed substrate W held on one holding arm 10b is placed on the lower return substrate platform PASS2, and then placed on the upper feed inlet substrate platform PASS1. Transfer operation of the processed substrate W and the unprocessed substrate W using only the holding arm 10b, in which the one holding arm 10b in an empty state is driven again to receive the processing substrate W on the holding arm 10b. I do.

  Specifically, the holding arm 10b is moved forward to place the processed substrate W on the return exit substrate platform PASS2. The holding arm 10b that has passed the processed substrate W moves back to the original position. Subsequently, after the holding arms 10a and 10b are slightly raised together, the holding arm 10b that has been emptied is moved forward again to move the unprocessed substrate W on the feeding inlet substrate platform PASS1 to the holding arm 10b. Receive on. The holding arm 10b that has received the substrate W moves back to the original position.

  As described above, in the first embodiment, the transfer operation of the processed substrate W and the unprocessed substrate W to the substrate platforms PASS1, PASS2 is performed using only the holding arm 10b. After the substrate W held on one holding arm 10a is transferred to the substrate platform PASS2, both the holding arms 10a and 10b are in an empty state, so that no matter which holding arm 10a or 10b is used. The substrate W of the substrate platform PASS1 can be received. However, in the first embodiment, as will be apparent from the description to be described later, the substrate W that has been processed by the heating plate HP and heated is received by the holding arm 10a disposed on the upper side, so that it is originally in an empty state. Instead of using the holding arm 10a, the holding arm 10b is re-driven to receive the substrate W of the substrate platform PASS1. The delivery of the unprocessed substrate W and the processed substrate W to the substrate platforms PASS1, PASS2 corresponds to the transport step (1) of the first main transport mechanism 10A shown in FIG.

  When the delivery of the substrate W to the substrate platforms PASS1 and PASS2 is finished, the first main transport mechanism 10A includes an empty holding arm 10a that does not hold the substrate W and a holding arm that holds the unprocessed substrate W. 10b is moved up and down and swiveled together to oppose a predetermined cooling plate CP of the heat treatment section 9 for antireflection film. Usually, this cooling plate CP contains a substrate W which has been subjected to a preceding process. First, the empty holding arm 10a is moved forward to receive the cooled substrate W on the cooling plate CP on the holding arm 10a. Subsequently, the holding arm 10b holding the unprocessed substrate W is moved forward to place the unprocessed substrate W on the cooling plate CP. The substrate W placed on the cooling plate CP is accurately cooled to room temperature while the main transport mechanism 10A performs another transport operation. The delivery of the substrate W to the cooling plate CP corresponds to the transport step (2) of the first main transport mechanism 10A shown in FIG.

  When the transfer of the substrate W to the cooling plate CP is completed, the holding arm 10a holding the cooled substrate W and the empty holding arm 10b are moved up and down and swiveled together to perform a predetermined antireflection film coating process. It is made to oppose the part 8. In general, the anti-reflection coating application unit 8 contains a substrate W that has been subjected to a preceding process. Therefore, first, the empty holding arm 10b is moved forward to receive the processed substrate W on the spin chuck 11 in the antireflection film coating processing unit 8 on the holding arm 10b. Subsequently, the holding arm 10 a holding the substrate W is moved forward to place the substrate W on the spin chuck 11. The substrate W placed on the spin chuck 11 is coated with an antireflection film while the main transport mechanism 10A performs another transport operation. The delivery of the substrate W to the spin chuck 11 corresponds to the transfer step (3) of the first main transfer mechanism 10A shown in FIG.

  When the delivery of the substrate W to the spin chuck 11 is completed, the holding arm 10a in an empty state and the holding arm 10b holding the substrate W coated with the antireflection film are moved up and down and swiveled together to form a predetermined Oppose to heating plate HP. Usually, since the substrate W that has been pre-processed is also contained in the heating plate HP, first, the empty holding arm 10a is moved forward to move the processed substrate W on the heating plate HP onto the holding arm 10a. To receive. Subsequently, the holding arm 10b is moved forward to place the substrate W on the heating plate HP. The substrate W placed on the heating plate HP is heat-treated while the main transport mechanism 10A performs another transport operation, and the excess solvent contained in the antireflection film on the substrate W is removed. The delivery of the substrate W to the heating plate HP corresponds to the transfer step (4) of the first main transfer mechanism 10A shown in FIG.

  When the transfer of the substrate W to the heating plate HP is finished, the holding arm 10a holding the heat-treated substrate W and the empty holding arm 10b are moved up and down and swung together to be installed on the partition wall 13. It is made to oppose to the water cooling type cooling plate WCP. As described above, first, the empty holding arm 10b is moved forward to receive the processed substrate W on the cooling plate WCP on the holding arm 10b. Subsequently, the holding arm 10a is moved forward to place the substrate W on the cooling plate WCP. The substrate W placed on the cooling plate WCP is roughly cooled while the main transport mechanism 10A performs another transport operation. The delivery of the substrate W to the cooling plate WCP corresponds to the transfer step (5) of the first main transfer mechanism 10A shown in FIG.

  When the transfer of the substrate W to the cooling plate WCP is finished, the empty holding arm 10a and the holding arm 10b holding the roughly cooled substrate W are raised together so as to be above the cooling plate WCP. It is made to oppose the board | substrate mounting part PASS3 and PASS4 which are arrange | positioned. Then, the holding arm 10b is moved forward to place the substrate W on the upper substrate platform PASS3. Usually, the developed substrate W sent from the development processing cell C4 via the resist film processing cell C3 is placed on the lower substrate platform PASS4. Therefore, after the holding arms 10a and 10b are slightly lowered together, the empty holding arm 10b is moved forward again to bring the developed substrate W on the substrate platform PASS4 onto the holding arm 10b. receive. The delivery of the substrate W to the substrate platforms PASS3 and PASS4 corresponds to the transport step (6) of the first main transport mechanism 10A shown in FIG.

  The first main transport mechanism 10A provided in the anti-reflection film processing cell C2 repeatedly performs the transport processes described above. Here, if the forward direction and the reverse direction shown in FIG. 11 (a) are summed, six transport steps are borne.

  As is apparent from the above description, the substrate W that has been heat-treated by the heating plate HP is always held by the upper holding arm 10a. Since the thermal influence from the heated substrate W is strongly exerted upward, it is possible to suppress the temperature increase of the lower holding arm 10b due to the influence of the heated substrate W. Since the lower holding arm 10b that is not significantly affected by this thermal effect is used, the substrate W is discharged from the antireflection film processing cell C2 to the next resist film processing cell C3. The temperature fluctuation of the substrate W subjected to the coating process can be suppressed.

  In addition, the processing cell C2 for antireflection film of the first embodiment has an even number of times between the delivery of the substrate W to the substrate platforms PASS1, PASS2 and the delivery of the substrate W to the substrate platforms PASS3, PASS4. Delivery of the substrate W (that is, delivery of the substrate W accompanying each process represented by “CP”, “BARC”, “HP”, “WCP” in FIG. 11A) is performed. Thus, it is not necessary to transfer the substrate W to the substrate platforms PASS1 to PASS4 using only one holding arm 10b, but to the substrate platforms PASS1 and PASS2 and the substrate platforms PASS3 and PASS4. Even when the substrate W is transferred using the two holding arms 10a and 10b, the holding arm that holds the substrate W immediately after the heat treatment is placed on one of the holding arms 10a and 10b. It can be fixed to the lifting arm 10a.

  However, the number of times the substrate W is transferred between the substrate platform PASS1, PASS2 and the substrate platform PASS3, PASS4 is an odd number of times (the number of processes involving the substrate transfer). Two holding arms for both the substrate platform PASS1, PASS2 and the substrate platform PASS3, PASS4 as described above when the rotation is performed (in the case of a post-exposure heating processing cell C5 described later). When the substrate W is delivered using 10a and 10b (the same applies when only one holding arm is used), the holding arms that handle the substrate W are alternately replaced every cycle of the transfer process. The processed substrate W cannot be handled by only one holding arm 10a. As a result, the two holding arms 10a and 10b receive heat from the heated substrate W and accumulate heat, which causes a problem that the other substrates W are adversely affected by heat.

  On the other hand, in the first embodiment, when the substrate W is transferred to the two substrate platforms while the substrate W is held on either of the two holding arms 10a and 10b, one holding is performed. Since the two holding arms 10a and 10b are temporarily emptied by passing the substrate W on the arm first to one of the substrate platforms, the substrate W on the other substrate platform is It can also be received using the holding arms 10a and 10b. Therefore, when there is an odd number of times of delivery of the substrate W (processing involving delivery of the substrate) between the delivery of the substrate W to the substrate platform PASS1, PASS2 and the delivery of the substrate W to the substrate platform PASS3, PASS4 In this case, one holding arm (for example, the holding arm 10b) is provided for one of the two substrate mounting portions (for example, the feeding inlet substrate mounting portion and the return outlet substrate mounting portion that are arranged close to each other in the vertical direction). ) Is used to transfer the substrate W, and the two holding arms 10a and 10b are attached to the other two substrate placement portions (for example, the sending exit substrate placement portion and the return entrance substrate placement portion). By using and transferring the substrate W, it is possible to always transfer the substrate W accompanying each process using the same holding arm. That is, among the holding arms 10a and 10b, the empty holding arms 10a and 10b are configured so as to satisfy the condition that the holding arm that receives the substrate W that has been heated by the heating plate HP is the same in each transport cycle. One of them is driven to receive the substrate placed on the entrance substrate mounting portion. Therefore, it is possible to suppress the thermal influence exerted on the substrate W from the holding arms 10a and 10b, and even if there is any thermal influence on the substrate W from the holding arms 10a and 10b, the thermal influence is exerted. Does not fluctuate from one substrate W to another, and the “fluctuation” of the thermal effect on the substrate W can be minimized, thereby stabilizing the quality of substrate processing.

  The method for delivering the substrate W to the two substrate platforms as described above using only one holding arm 10b is the following other processing cells C2 to C4 (however, the post-exposure heating processing cell C5). The same applies to (except for). Note that the present invention is not limited to such a delivery method of the substrate W, and in the case where it is not necessary to consider the thermal influence exerted on the substrate W from the holding arm, all the substrate mounting portions are applied. The substrate W may be transferred using two holding arms.

  As shown in FIG. 11B, in the resist film processing cell C3, in the forward direction, the substrate platform PASS3 (“feed inlet substrate platform” on the basis of the resist film processing cell C3). , The cooling plate CP, the resist film coating processing section 15, the heating section PHP, the cooling plate CP, and the substrate platform PASS5 (“outlet substrate mounting section for feeding” based on the resist film processing cell C3). The substrate W is processed in order. In the reverse direction, the substrate platform PASS6 (“return entrance substrate platform” on the basis of the resist film processing cell C3), and the substrate platform PASS4 (based on the resist film processing cell C3). In other words, the substrates W are processed in the order of “return exit substrate mounting portion”). Note that the symbol PR in FIG. 11B indicates the resist film coating processing section 15.

  When the substrate W coated with the antireflection film is placed on the substrate platform PASS3, the second main transport mechanism 10B of the cell C3 is similar to the first main transport mechanism 10A described above. The development-processed substrate W held on the holding arm 10b is placed on the substrate platform PASS4. Then, the substrate W on the substrate platform PASS3 is received again on the holding arm 10b. The delivery of the substrate W to the substrate platforms PASS3 and PASS4 corresponds to the transport process (1) of the second main transport mechanism 10B shown in FIG.

  When the delivery of the substrate W to the substrate platforms PASS3 and PASS4 is finished, the second main transport mechanism 10B moves the holding arm 10a in the empty state and the holding arm 10b holding the substrate W into the resist film heat treatment unit 16. To a position facing a predetermined cooling plate CP. First, the empty holding arm 10a is moved forward to receive the cooled substrate W on the cooling plate CP, and then the holding arm 10b is moved forward to move the unprocessed substrate W to the cooling plate CP. put on top. The delivery of the substrate W to the cooling plate CP corresponds to the transport step (2) of the second main transport mechanism 10B shown in FIG.

  When the transfer of the substrate W to the cooling plate CP is completed, the holding arm 10a holding the cooled substrate W and the empty holding arm 10b are opposed to a predetermined resist film coating processing unit 15. Move to. First, the empty holding arm 10b is moved forward to receive the processed substrate W on the spin chuck 17 in the resist film coating processing section 15, and the holding arm 10a holding the substrate W is moved forward. The substrate W is placed on the spin chuck 17. The substrate W placed on the spin chuck 17 is coated with a resist film while the main transport mechanism 10B performs another transport operation. The delivery of the substrate W to the spin chuck 17 corresponds to the transfer step (3) of the second main transfer mechanism 10B shown in FIG.

  When the delivery of the substrate W to the spin chuck 17 is finished, the holding arm 10a in an empty state and the holding arm 10b holding the substrate W on which a resist film is applied and formed are heated to a heating unit with a predetermined temporary substrate placement unit. Opposite to PHP. First, the empty holding arm 10a is moved forward to receive the processed substrate W placed on the temporary substrate placement part 19 on the heating part PHP. Subsequently, the holding arm 10 b is moved forward to place the unprocessed substrate W on the temporary substrate placement unit 19. The substrate W placed on the temporary substrate placement unit 19 is placed on the heating plate HP of the heating unit PHP by the local transport mechanism 20 of the heating unit PHP while the main transport mechanism 10B performs another transport operation. To be heat treated. The substrate W that has been heat-treated on the heating plate HP is returned to the temporary substrate placement unit 19 by the same local transport mechanism 20. The substrate W is held by the holding plate 24 of the local transport mechanism 20 and returned to the temporary substrate placement unit 19, and is cooled by the cooling mechanism of the holding plate 24 in the substrate platform 20. The delivery of the substrate W to the heating unit PHP corresponds to the transport process (4) of the second main transport mechanism 10B shown in FIG.

  When the transfer of the substrate W to the heating unit PHP is completed, the holding arm 10a holding the heat-treated substrate W and the empty holding arm 10b are opposed to the cooling plate CP of the resist film heat-treating unit 16. Then, the empty holding arm 10b is moved forward to receive the processed substrate W on the cooling plate CP, and the holding arm 10a is moved forward to place the unprocessed substrate W on the cooling plate CP. The delivery of the substrate W to the cooling plate CP corresponds to the transport step (5) of the second main transport mechanism 10B shown in FIG.

  When the transfer of the substrate W to the cooling plate CP is completed, the empty holding arm 10a and the holding arm 10b holding the cooled substrate W are opposed to the substrate platforms PASS5 and PASS6. Subsequently, the holding arm 10b is moved forward to place the substrate W on the upper substrate loading portion PASS5 and the development processing placed on the lower substrate returning portion PASS6. The used substrate W is received again by the holding arm 10b. The delivery of the substrate W to the substrate platforms PASS5 and PASS6 corresponds to the transport step (6) of the second main transport mechanism 10B shown in FIG.

  The second main transport mechanism 10B provided in the resist film processing cell C3 repeatedly performs the transport processes described above. Here, when the forward direction and the reverse direction shown in FIG. 11B are summed, six transport steps are borne similarly to the first main transport mechanism 10A.

  As shown in FIG. 11C, in the development cell C4, in the forward direction, the substrate platform PASS5 (“feeding substrate substrate platform” on the basis of the development cell C4), the substrate platform Substrate W is processed in the order of part PASS7 (“exit substrate mounting part for sending” on the basis of development processing cell C4). In the reverse direction, PASS8 (“return entrance substrate mounting portion” on the basis of the development processing cell C4), cooling plate CP, development processing portion 30, heating plate HP, cooling plate WCP, substrate mounting portion PASS6. The substrates W are processed in the order of “returning exit substrate mounting portion” based on the development processing cell C4. Note that the symbol SD in FIG. 11C indicates the development processing unit 30.

  When the substrate W coated with the resist film is placed on the substrate platform PASS5, the third main transport mechanism 10C of the cell C4 first places the developed substrate W held on the holding arm 10b on the substrate platform. Then, the substrate W on the substrate platform PASS5 is received again on the holding arm 10b. The delivery of the substrate W to the substrate platforms PASS5 and PASS6 corresponds to the transport step (1) of the third main transport mechanism 10C shown in FIG.

  When the delivery of the substrate W to the substrate platforms PASS5 and PASS6 is finished, the third main transport mechanism 10C transfers the empty holding arm 10a and the holding arm 10b holding the substrate W to the developing heat treatment unit 31. The substrate is moved to a position facing the substrate platforms PASS7 and PASS8 disposed in the laminated structure. Subsequently, the holding arm 10b is moved forward to place the substrate W on which the resist film is applied on the upper substrate discharge portion PASS7, and then the lower substrate return substrate placement. The post-exposure heat-treated substrate W placed on the part PASS8 is received again by the holding arm 10b. The delivery of the substrate W to the substrate platforms PASS7 and PASS8 corresponds to the transport step (2) of the third main transport mechanism 10C shown in FIG.

  When the delivery of the substrate W to the substrate platforms PASS7 and PASS8 ends, the third main transport mechanism 10C includes an empty holding arm 10a and a holding arm 10b that holds the heated substrate W after the exposure. Is moved to a position facing a predetermined cooling plate CP of the heat treatment section 31 for development. First, the empty holding arm 10a is moved forward to receive the cooled substrate W on the cooling plate CP, and then the holding arm 10b is moved forward to move the unprocessed substrate W to the cooling plate CP. put on top. The delivery of the substrate W to the cooling plate CP corresponds to the transfer step (3) of the third main transfer mechanism 10C shown in FIG.

  When the delivery of the substrate W to the cooling plate CP is finished, the holding arm 10a holding the cooled substrate W and the holding arm 10b in an empty state are moved to a position facing a predetermined development processing unit 30. . First, the empty holding arm 10b is moved forward to receive the processed substrate W on the spin chuck 32 in the development processing unit 30, and the holding arm 10a holding the substrate W is moved forward to move the substrate. W is placed on the spin chuck 32. The substrate W placed on the spin chuck 32 is developed while the main transport mechanism 10C performs another transport operation. The delivery of the substrate W to the spin chuck 32 corresponds to the transport step (4) of the third main transport mechanism 10C shown in FIG.

  When the delivery of the substrate W to the spin chuck 32 is finished, the empty holding arm 10a and the holding arm 10b holding the developed substrate W are opposed to a predetermined heating plate HP of the development heat treatment section 31. Let First, the empty holding arm 10a is moved forward to receive the processed substrate W placed on the heating plate HP. Subsequently, the holding arm 10b is moved forward to place the unprocessed substrate W on the heating plate HP. The delivery of the substrate W to the heating plate HP corresponds to the transfer step (5) of the third main transfer mechanism 10C shown in FIG.

  When the transfer of the substrate W to the heating plate HP is completed, the holding arm 10a holding the heated substrate W and the empty holding arm 10b are placed on the partition wall 13 on the resist film processing cell C3 side. It is made to oppose the installed water cooling type cooling plate WCP. Then, the empty holding arm 10b is moved forward to receive the processed substrate W on the cooling plate WCP, and the holding arm 10a is moved forward to place the unprocessed substrate W on the cooling plate WCP. The delivery of the substrate W to the cooling plate WCP corresponds to the transfer step (6) of the third main transfer mechanism 10C shown in FIG.

  The third main transport mechanism 10C provided in the development processing cell C4 repeatedly performs the transport processes described above. Here, when the forward direction and the reverse direction shown in FIG. 11C are summed, six transport steps are borne in the same manner as the first and second main transport mechanisms 10A and 10B.

  As shown in FIG. 11 (d), in the post-exposure heating processing cell C5, in the forward direction, the substrate platform PASS7 (“feed inlet substrate platform” is referred to based on the post-exposure heating processing cell C5). ”), The substrate W is processed in the order of the edge exposure unit EEW, the cooling plate CP, and the substrate platform PASS9 (“ exit substrate mounting unit for feeding ”on the basis of the post-exposure heating processing cell C5). In the reverse direction, the substrate platform PASS10 (“return entrance substrate platform” on the basis of the post-exposure heating process cell C5), the heating unit PHP, and the substrate platform PASS8 (post-exposure heating process) Speaking on the basis of the cell C5, the substrates W are treated in the order of “return exit substrate mounting portion”). In addition, the code | symbol PEB in FIG.11 (d) has shown the heating part PHP for heating the exposed substrate W, and is for performing post-exposure heating (Post Exposure Bake).

  When the substrate W coated with the resist film is placed on the substrate platform PASS7, the fourth main transport mechanism 10D of the cell C5 mounts the post-exposure heat-treated substrate W held on the holding arm 10b on the substrate. Then, the substrate W on the substrate platform PASS7 is received again on the holding arm 10b. The delivery of the substrate W to the substrate platforms PASS7 and PASS8 corresponds to the transport step (1) of the fourth main transport mechanism 10D shown in FIG.

  When the delivery of the substrate W to the substrate platforms PASS7 and PASS8 is finished, the fourth main transport mechanism 10D moves the holding arm 10a in an empty state and the holding arm 10b holding the substrate W into a predetermined edge exposure unit EEW. Move to a position opposite to. First, the empty holding arm 10a is moved forward to receive the peripherally exposed substrate W on the spin chuck 36 of the edge exposure unit EEW, and then the holding arm 10b is moved forward to move the unprocessed substrate. W is placed on the spin chuck 36. The peripheral portion of the substrate W placed on the spin chuck 36 is exposed while the main transport mechanism 10D performs another transport operation. The delivery of the substrate W to the spin chuck 36 corresponds to the transport step (2) of the fourth main transport mechanism 10D shown in FIG.

  When the transfer of the substrate W to the spin chuck 36 is finished, the fourth main transport mechanism 10D transfers the holding arm 10a holding the peripherally exposed substrate W and the empty holding arm 10b to the developing heat treatment section 31. Move to a position facing a certain cooling plate CP. Then, the empty holding arm 10b is moved forward to receive the processed substrate W on the cooling plate CP, and the holding arm 10a is moved forward to place the peripherally exposed substrate W on the cooling plate CP. . The delivery of the substrate W to the cooling plate CP corresponds to the transport process (3) of the fourth main transport mechanism 10D shown in FIG.

  When the delivery of the substrate W to the cooling plate CP is finished, the fourth main transport mechanism 10D transfers the holding arm 10a in an empty state and the holding arm 10b holding the cooled substrate W to the substrate platform PASS9. And move to a position facing the PASS 10. Subsequently, the holding arm 10b is moved forward to place the substrate W on the upper substrate placement portion PASS9 for substrate ejection, and the exposure is carried on the lower substrate placement portion PASS10 for returning the substrate. The substrate W exposed by the apparatus STP is received by the holding arm 10a. The delivery of the substrate W to the substrate platforms PASS9 and PASS10 corresponds to the transport step (4) of the fourth main transport mechanism 10D shown in FIG.

  In this embodiment, the substrate W is delivered only to the substrate platforms PASS9 and PASS10 using the two holding arms 10a and 10b. As described in the processing cell C2 for the antireflection film, this is because the transfer of the substrate W to the substrate platforms PASS9 and PASS10 and the heating of the substrate W to the heating unit PHP described later between the substrate platforms PASS7 and PASS8. When the substrate is transferred using only one holding arm 10b to the substrate platforms PASS9 and PASS10 in a relationship of performing delivery (once: odd number of times), the substrate W is transferred to the substrate platforms PASS7 and PASS8. This is to avoid this because the holding arm used for delivery is replaced every cycle of the transfer process.

  When the delivery of the substrate W to the substrate platforms PASS9 and PASS10 is finished, the fourth main transport mechanism 10C causes the holding arm 10a holding the exposed substrate W and the holding arm 10b in an empty state to heat treatment for development. It moves to the position which opposes the heating part PHP with the predetermined | prescribed board | substrate temporary placement part in the part 31. FIG. First, the empty holding arm 10b is moved forward to receive the post-exposure heat-treated substrate W in the heating unit PHP (specifically, on the temporary substrate placement unit 19), and then hold it. The arm 10a is moved forward to place the exposed substrate W on the heating unit PHP (specifically, on the temporary substrate placement unit 19). The substrate W placed on the temporary substrate placement unit 19 is transferred to the heating plate HP by the local transport mechanism 20 and subjected to heat treatment while the main transport mechanism 10D performs another transport operation, and then is also transported locally. The mechanism 20 returns the substrate to the temporary substrate placement portion 19 and cools the temporary substrate placement portion 19. The delivery of the substrate W to the heating unit PHP corresponds to the transport process (5) of the fourth main transport mechanism 10D shown in FIG.

  The fourth main transport mechanism 10D provided in the post-exposure heating processing cell C5 repeatedly performs the transport processes described above. Here, if the forward direction and the reverse direction shown in FIG. 11 (d) are summed, five transport steps, which are one less than the first to third main transport mechanisms 10A to 10C, are borne.

  The operation of the interface cell C6 will be described. When the peripherally exposed substrate W is placed on the substrate platform PASS9 (“feeding inlet substrate platform” on the basis of the interface cell C6), the interface transport mechanism 35 of the interface cell C6 causes the substrate platform to be placed. The substrate W is received from the part PASS9 and transferred to the adjacent exposure apparatus STP. Further, the interface transport mechanism 35 receives the exposed substrate W from the exposure apparatus STP, and the substrate is returned to the substrate platform PASS10 for returning the substrate (referring to the interface cell C6 as “return exit substrate mounting”). Place it on the mounting section)). The interface transport mechanism 35 repeatedly performs such a substrate transport operation.

  Next, a flow recipe and parameters will be described with reference to FIG. FIG. 12A is a diagram showing an overview of the entire flow recipe, FIG. 12B is a diagram showing the contents of each flow recipe and parameters, and FIG. It is a figure which shows the content of the parameter which concerns on conditions. The flow recipe sets the substrate processing conditions such as the temperature / humidity of the processing unit and the processing time, the transfer order for transferring the substrate W to each processing unit, and the parameters are, for example, Processing information such as a skip control flag, which will be described later, and the substrate processing conditions described above, can be changed during the substrate processing.

  As shown in FIG. 12A, the flow recipe 39 is composed of a recipe number and each flow recipe, and is configured so that each flow recipe can be set and registered for the type of the recipe number. . As described above, the flow recipe 39 is stored in the storage unit provided in the main controller MC, and each flow recipe can be set by the input unit 38 such as a mouse, a keyboard 38a, a touch panel 38b, or a button.

  As shown in FIG. 12B, each flow recipe 40 is composed of information for determining the transfer order and parameters associated therewith, and the parameters are composed of substrate processing conditions and a skip control flag. ing. The skip control flag sets whether to process the substrate W for each processing unit. For example, the flow shown in FIGS. 11A to 11D is set as the transport order. In the transport order of FIG. 12B, the forward flow related to the antireflection film processing cell C2 of FIG. 11A is registered in the recipe number “1”, and the recipe number “2” is registered in the recipe number “2”. A forward flow relating to the resist film processing cell C3 in FIG. 11B is registered.

  Of the parameters, parameters relating to the substrate processing conditions are assigned numbers for each transport order, and the assigned numbers are further added to specific substrate processing conditions 41 as shown in FIG. Assigned. For example, in the transfer order “CP” of the recipe number “1”, the number “1” is assigned to the column of the substrate processing condition as shown in FIG. Regarding the substrate processing condition 41, as shown in FIG. 12C, “cooling temperature”, “cooling time”, and the like are described, and “cooling temperature” and “ Specific substrate processing conditions 41 such as “cooling time” are further assigned. Similarly, in the transfer order “BARC” of the recipe number “1”, the number “2” is assigned to the substrate processing condition column as shown in FIG. As for the typical substrate processing conditions 41, as shown in FIG. 12C, “type of coating solution”, “rotation number of spin chuck”, etc. are described, and the location corresponding to the assigned number “2”. Specific substrate processing conditions 41 such as “type of coating solution” and “rotation number of spin chuck” are further assigned. That is, these specific substrate processing conditions 41 shown in FIG. 12C correspond to the substrate processing conditions shown in FIG.

  Among the parameters, one of “ON” and “OFF” is assigned to the skip control flag for each processing unit in each conveyance order, and when the flag is “OFF”, processing in the flag is performed. When the processing of the substrate is performed and the flag is “ON”, the processing of the substrate in the flag is not performed, and the substrate W is transferred to the next processing unit. That is, when the flag is “ON”, the processing unit in the flag skips. For example, in the case of skipping the heating process on the heating plate HP in the forward flow related to the antireflection film processing cell C2 in FIG. 11A, the recipe number “1” shown in FIG. In the flow recipe 40, the flag in the transport order “HP” is “ON”, and the other flags in the other transport orders “PASS1”, “CP”, “BARC”, “WCP”, “PASS3” are “OFF”. Become. When skipping the cooling process on the cooling plate CP in the forward flow related to the resist film processing cell C3 in FIG. 11B, the flow recipe 40 in the recipe number “2” shown in FIG. Then, the flag in the transport order “CP” is “ON”, and the other flags in the other transport orders “PASS3”, “PR”, “PHP”, and “PASS5” are “OFF”. In the case of the recipe number “2”, the cooling process on the cooling plate CP is “CP” between “PASS3” and “PR” and “CP” between “PHP” and “PASS5”. There are two. For example, when “CP” between “PHP” and “PASS5” is performed by skipping “CP” between “PASS3” and “PR”, between “PASS3” and “PR” The flag in “CP” of “CP” may be set to “ON”, and the flag in “CP” between “PHP” and “PASS5” may be set to “OFF”.

  Parameters such as the transport order and the skip control flag can be changed during the substrate processing, and each parameter can be set and changed by the input unit 38 such as a mouse, a keyboard 38a, a touch panel 38b, or a button. In the first embodiment, since the substrate W is transferred between the cells arranged side by side, the substrate W always passes through the substrate platforms PASS1, PASS3, and PASS5. Therefore, in the first embodiment, it is preferable that the flags in “PASS1”, “PASS3”, and “PASS5” are always “OFF” regardless of the setting of the input unit 38.

  The parameters such as the substrate processing conditions and the skip control flag set in this way are attached to the information for determining the transfer order, and the flow recipe 39 stored in the storage unit is read and rewritten with these set parameters. . Taking the skip control flag as an example, as shown in FIG. 13, “ON” or “OFF” is set according to the setting from the input unit 38, and the main controller MC is attached to the information for determining the transport order. Given, the flow recipe 39 stored in the storage unit is read out, and the set flag is rewritten to “ON” or “OFF”.

  Each flow recipe 40 in the rewritten flow recipe 39 is sent to the cell controllers CT1 to CT6 corresponding to each cell. For example, in each flow recipe 40, the recipe number “1” indicates a forward flow related to the anti-reflection film processing cell C2 of FIG. 11A, and the recipe number “2” indicates FIG. 11B. Although the forward flow for the resist film processing cell C3 is registered, as shown in FIG. 13, the flow recipe 40 associated with the recipe number “1” corresponds to the antireflection film processing cell C2. While being sent to the controller CT2, the flow recipe 40 related to the recipe number “2” is sent to the cell controller CT3 corresponding to the resist film processing cell C3. At this time, the parameters in each flow recipe 40 are also sent to the cell controllers CT1 to CT6 along with the information for determining the transfer order. Accordingly, the skip control flag “ON”, which is a command to skip, or the skip control flag “OFF”, which is a command to process the substrate W, is also attached to the cell controllers CT1 to CT6 along with the information for determining the transport order. Sent. Transmission to each cell controller CT1-CT6 regarding the flow recipe 40 is performed at the time of the start of a substrate process.

  Also, these parameters can be changed during substrate processing as described above. That is, the parameters in each flow recipe 40P sent to the cell controllers CT1 to CT6 via the main controller MC at the start of substrate processing are temporarily stored in a storage unit (not shown) in each cell controller CT1 to CT6. These parameters are stored and can be rewritten during substrate processing. Taking the skip control flag as an example, in the flow recipe 40 related to the recipe number “2”, the skip control flag “ON” (see FIG. 12B) for the cooling plate CP set before the substrate processing is set. While being changed to “OFF” during the substrate processing, the skip control flag “OFF” in the resist film application processing unit 15 set before the substrate processing (“PR” in FIG. 12B is the resist film application processing). When the unit 15) is changed to “ON” during the substrate processing, “ON” or “OFF” is set according to the setting from the input unit 38 during the substrate processing, and the transfer order “CP”, “ "PR" is sent to the cell controller CT3 corresponding to the resist film processing cell C3 via the main controller MC, and the recipe number stored in the storage unit in the cell controller CT3 is stored. It reads the flow recipe 40 according to the 2 "is rewritten to" ON "or" OFF "with respect to the set flag.

  Next, conveyance when the skip control flag is “ON”, that is, when substrate processing is skipped, will be described by taking the antireflection film processing cell C2 as an example. Here, in the case of skipping the heating process on the heating plate HP in the forward flow related to the antireflection film processing cell C2 (see FIG. 12B), that is, in the flow recipe 40 in the recipe number “1”. In the case where the control flag in the order “HP” is set to “ON” and the other flags in the transfer order “PASS1”, “CP”, “BARC”, “WCP”, “PASS3” are set to “OFF”. The conveyance will be described. The substrate W is transferred and processed in the order of “PASS1”, “CP”, and “BARC”. The transfer of the substrate W in the transfer here is the basic of the substrate processing apparatus described with reference to FIG. Since it is the same as the operation, its description is omitted.

  The holding arm 10b receives “BARC”, that is, the processed substrate W on the spin chuck 11 in the coating processing unit 8 for the antireflection film, and subsequently moves the holding arm 10a holding the unprocessed substrate W forward. Then, when the substrate W is placed on the spin chuck 11, the empty holding arm 10a and the holding arm 10b holding the substrate W coated with the antireflection film are moved up and down and swung together to heat the substrate W. Opposite the plate HP. Then, the empty holding arm 10a is moved forward to receive the processed substrate W on the heating plate HP on the holding arm 10a, and then the holding arm 10b is moved forward to move the substrate W to the heating plate HP. put on top. In normal substrate processing, the substrate W placed on the heating plate HP is heat-treated while the main transport mechanism 10A performs another transport operation, and an excess solvent contained in the antireflection film on the substrate W. However, since the control flag in the transfer order “HP” is “ON” and skips without performing the heating process on the heating plate HP, the substrate is placed on the heating plate HP during another transfer operation. The heater controller (CONT) (see FIG. 3) of the heating plate HP is controlled so that the heat treatment is not performed in a state where W is placed.

  Thereafter, the substrate W is transferred and processed in the order of “WCP” and “PASS3”. The transfer of the substrate W in the transfer here is the same as the basic operation of the substrate processing apparatus described in FIG. Since it is the same, the description is omitted. In the case of skipping without performing the process, the substrate W is not placed on the heating plate HP to be skipped but passes through the heating plate HP, and “WCP”, which is the next transport order of “HP”. That is, the substrate W may be transferred to the water-cooled cooling plate WCP.

As described above, according to the first embodiment, the input unit 38 sets the flow recipe 39 and the flow recipes 40 including the transfer order of the substrates W by the main transfer mechanisms 10A to 10D, and processes the substrates W. Information parameters are also set. As shown in FIG. 12B, parameters accompanying the information for determining the transport order are transferred and given to the main controller MC. The main controller MC given these pieces of information is based on the information for determining the transport order and the parameters that are the processing information accompanying the information, and (α) the substrate to the processing unit based on the information for determining the transport order. In the case where W is transferred and the parameter (β ₁ ) is set to “process the substrate”, that is, in the first embodiment, the skip control flag which is one of the parameters is set to “OFF”. In the case where the substrate W is processed by the processing unit in the flag based on the flag and the (β ₂ ) parameter is set to “do not perform substrate processing”, that is, in the present embodiment In Example 1, when the skip control flag is set to “ON”, the substrate W is delivered to the next processing unit without processing the substrate W by the processing unit in the flag. As controls processing unit and a main transport mechanism 10A to 10D.

Since the skip control flag is information for setting whether or not to process the substrate W for each processing unit, “process the substrate” is performed as in (β ₁ ) and (β ₂ ) described above. Both “do not process the substrate” (that is, skip the processing of the substrate W) can be operated by the skip control flag. Further, since the skip control flag is attached to the information for determining the transport order, there is no need to change the transport order itself, and further, the flow recipe 39 and each flow recipe 40 as a whole, according to the setting of the skip control flag. Various substrate processing can be performed flexibly.

  In the first embodiment, since the present invention is applied to the distributed control shown in FIG. 9A, it is not necessary to consider the movement of the main transport mechanisms 10A to 10D between adjacent cells. That is, when the present invention is applied to the conventional control method shown in FIG. 9B, the influence of mutual cells (blocks in the conventional case) caused by flexible substrate processing is likely to occur. For example, in FIG. 12B, when skipping the heating process on the heating plate HP in the forward flow related to the anti-reflection film processing cell C2, “PASS1”, “CP”, “BARC”, “WCP” , “PASS3” in order, and when the cooling process on the cooling plate CP is skipped in the forward flow related to the resist film processing cell C3, “PASS3”, “PR”, “PHP”, “ Transport is performed in the order of “PASS5”, and the number of transport processes differs between blocks. On the other hand, in the case of distributed control, the waiting time caused by the difference in the number of transfer processes is absorbed by placing the substrate W on the substrate placing portion between the cells. Compared with the technique, even if the number of transport steps differs between cells, the influence of each cell caused by flexible substrate processing is less likely to occur.

  In the first embodiment, the forward flow related to the antireflection film processing cell C2 and the forward flow related to the resist film processing cell C3 have been described as examples, but the reverse flow or other cells are described. The same applies to the forward flow or reverse flow.

  Next, a second embodiment of the present invention will be described with reference to FIG. FIG. 14A is a front view in which a substrate inspection part T1 is added to the resist film heat treatment part 16 in the resist film processing cell C3, and FIG. 14B is an antireflection film process. It is the front view which added and arrange | positioned the board | substrate test | inspection part T1 to the board | substrate mounting parts PASS3 and PASS4 between the cell C2 and the processing cell C3 for resist films.

  The parameters in the second embodiment include not only processing information on the substrate W but also inspection information for setting whether or not to inspect the substrate W. In addition, the skip control flag in the first embodiment described above sets whether or not to process the substrate W for each processing unit, but the skip control flag in the second embodiment is as follows. In addition to the function of the flag in the first embodiment, information for setting whether or not to inspect the substrate W with respect to the substrate inspection unit is also provided. Therefore, the input unit 38 in the second embodiment corresponds to the transport order setting unit, the processing information setting unit, and the inspection information setting unit in the present invention.

  In Example 2, as shown in FIG. 14A, a substrate inspection unit T1 for inspecting the thickness of the antireflection film applied to the substrate W is provided in the resist film heat treatment unit 16 in the resist film processing cell C3. It is arranged. Specifically, in order to prevent the influence of heat due to the heating part PHP, the cooling plate CP, etc., a piping wiring part and a spare empty space (locations indicated by “x” in FIG. 14A) are provided. A substrate inspection portion T1 is disposed at the uppermost portion with a gap therebetween. It consists of a scanning microscope (SEM) that measures the film thickness by measuring the film thickness or a spectroscope that measures the film thickness based on the spectral reflection spectrum from the region where the film thickness is formed and the region where it is an exception. Yes. As shown in FIG. 14B, close to the upper or lower portion of the substrate platforms PASS3 and PASS4 for transferring the substrate W between the antireflection film processing cell C2 and the resist film processing cell C3. A substrate inspection unit T may be provided.

  Next, the flow recipe and parameters in the second embodiment will be described with reference to FIG. 15, and the procedure for setting the skip control flag will be described with reference to FIG. FIG. 15 is a diagram showing the contents of the flow recipe and parameters when the board inspection unit T1 is added. FIG. 15A shows the contents when the skip control flag is set to “OFF”, and FIG. FIGS. 16A and 16B are diagrams showing contents when the skip control flag is set to “ON”, and FIG. 16 is a flowchart showing setting of the skip control flag.

  The flow recipe 40 related to the recipe number “2” shown in FIG. 15 is similar to the flow recipe 40 related to the recipe number “2” shown in FIG. In addition to parameters associated therewith, the parameters include substrate processing conditions and a skip control flag. The transfer order is such that the transfer order “T1” is added to the transfer order shown in FIG. 12B, and the substrate inspection part T1 is provided in the resist film heat treatment part 16 (FIG. 14A). 15) is set so that the thickness of the antireflection film is inspected by the substrate inspection unit T1 after the delivery by the substrate platform PASS3 and before the cooling process by the cooling plate CP as shown in FIG. Has been. In the case where the substrate inspection unit T is provided close to the upper or lower portion of the substrate platforms PASS3 and PASS4 (see FIG. 14B), the substrate inspection unit before the delivery at the substrate platform PASS3. What is necessary is just to set a conveyance order so that the test | inspection by T1 may be performed, or the inspection by the board | substrate test | inspection part T1 may also be used for delivery. Hereinafter, the case where the substrate inspection portion T1 is disposed in the resist film heat treatment portion 16 will be described.

  Prior to the start of substrate processing, as shown in FIG. 15A, the skip control flag is set to “OFF” in all the transport orders including the transport order “T1” (step S1). Thus, during the substrate processing, the substrate W is transported in the order of “PASS3”, “T1”, “CP”, “PR”, “PHP”, “CP”, and “PASS5” for inspection and processing. With these settings, the flow recipe 40 is transmitted to the cell controller CT3 corresponding to the resist film processing cell C3, and substrate inspection and substrate processing are started. When the substrate processing is started and the first substrate W after the formation of the antireflection coating is placed on the substrate platform PASS3, the first substrate W is received from the substrate platform PASS3 (step S2).

  It is determined whether or not the substrate W on which the series of reflection film coating processes has passed the inspection by the substrate inspection unit T1 (step S3). If the substrate W does not pass, the subsequent substrate W after the formation of the antireflection film needs to be inspected, so the skip control flag in the transport sequence “T1” remains “OFF”. Set with. When the subsequent substrate W is placed on the substrate platform PASS3, the subsequent substrate W is received from the substrate platform PASS3 (step S4). Then, returning to step S3, the subsequent substrate W is also inspected. Steps S3 and S4 are repeated until the substrate W passes. At the time of inspection, the inspection is performed under conditions different from those of the previous substrate W. Further, the rejected substrate W is set in a standby state so as not to perform the resist film coating process.

  If the substrate W has passed, there is no need to inspect the substrate W for the subsequent substrate W, so the skip control flag in the transport order “T1” is changed to “ON” (step S5). At this point, since the substrate is being processed, the variable recipe function is used. That is, the parameters in the flow recipe 40 sent to the cell controller CT3 via the main controller MC at the start of substrate processing are temporarily stored in a storage unit (not shown) in the cell controller CT3 and skipped during substrate processing. When the setting of the control flag “ON” is changed, the flag is rewritten from “OFF” to “ON”. The flow recipe 40 and parameters at this time are as shown in FIG. When the skip control flag is changed to “ON”, the input may be manually performed from the input unit 38, or the cell may be automatically set to “ON” after the substrate W is passed. A program of a procedure to be transmitted to the controller CT3 may be stored in the data setting unit HC and executed from the program.

  The skip control flag in the transfer order “T1” is changed to “ON”, the inspection in the substrate inspection unit T1 is skipped for the subsequent substrate W, and the subsequent substrate W for which the inspection is skipped is used for a normal resist film In order to perform the coating process, “CP”, “PR”, “PHP”, “CP”, and “PASS5” are conveyed and processed in this order (step S6).

  As is clear from this, a skip control flag for “inspecting the substrate” is set until the board inspection unit T1 passes, that is, the flag in the substrate inspection unit T1 is set to “OFF”, and the substrate inspection unit T1 The substrate inspection unit T1 sequentially performs the inspection based on the flag, and if the substrate inspection unit T1 passes the substrate W, the “no substrate inspection” skip control flag is set. That is, the flag in the substrate inspection unit T1 is set to “ON”, and the substrate inspection unit T1 does not inspect the substrate W in the subsequent substrate W, and the substrate inspection unit does not inspect the substrate W. If it is, the substrate is transferred to the next substrate inspection unit or processing unit (“CP”, “PR”, “PHP”, “CP”, “PASS5” in the second embodiment). The substrates W are sequentially transferred to the substrate inspection unit T1 until the substrate inspection unit T1 passes the inspection, and if the substrate W passes the substrate inspection unit T1, the substrate W subsequent to the substrate W that has passed the substrate is checked. Since the inspection of the substrate W is not performed in the inspection unit T1, the inspection of the substrate W can be performed correctly, and the substrate W is transferred to the substrate inspection unit T1 with respect to the substrate W subsequent to the passed substrate W. In addition, the throughput of the substrate processing including the substrate inspection unit T1 can be improved.

As described above, according to the second embodiment, the input unit 38 sets the flow recipe 40 including the transport order of the substrates W by the main transport mechanisms 10A to 10D, and the processing information / inspection information of the substrates W. Some parameters are also set. As shown in FIG. 12B, the information for determining the transport order is accompanied by a parameter which is substrate processing information / inspection information, and is transferred to the main controller MC. The main controller MC to which the information is given, based on the information for determining the transport order and the parameters which are the processing information / inspection information accompanying the information, (γ) the substrate inspection unit based on the information for determining the transport order When the substrate W is delivered to the processing unit and the parameter (δ ₁ ) is set to “inspect the substrate”, that is, one of the parameters in the second embodiment. When the skip control flag is set to “OFF”, the substrate inspection unit in the flag inspects the substrate W based on the flag, and the parameter (δ ₂ ) is set to “do not inspect the substrate”. In this case, that is, when the skip control flag is set to “ON” in the second embodiment, the substrate inspection unit in the flag does not inspect the substrate W, and the substrate査部 to perform the transfer of the substrate W for the next substrate inspection unit or the processing unit if there is the other, the substrate inspection unit, and controls the processing unit, and the main transport mechanisms 10A to 10D.

The skip control flag is information for setting whether or not to process the substrate W for each processing unit, and information for setting whether or not the substrate inspection unit is to inspect the substrate W. Therefore, as in the above (δ ₁ ) and (δ ₂ ), both “perform substrate inspection” and “do not perform substrate inspection” (that is, skip inspection of the substrate W) are operated by the skip control flag. can do. Further, since the skip control flag is attached to the information for determining the transport order, it is not necessary to change the transport order itself or the entire flow recipe 40, and includes a board inspection unit according to the setting of the skip control flag. Various substrate processing can be performed flexibly.

  When the substrate W is transferred to the next substrate inspection unit or processing unit without performing the substrate inspection by the substrate inspection unit T1, the substrate W is placed on the substrate inspection unit T1. Without inspecting the substrate W in the state, the substrate W may be delivered from the substrate inspection unit T1 to the next substrate inspection unit or processing unit, or the substrate W is not delivered to the substrate inspection unit T1. And the substrate W may be delivered to the next substrate inspection unit or processing unit. However, since the processing that does not inspect the substrate W is normal substrate processing, it is preferable to pass the substrate W without passing it to the substrate inspection unit T1 as in the latter, and to transfer the substrate W. Throughput can be improved.

Further, as is clear from the first and second embodiments, the number of transport steps differs between the first embodiment and the second embodiment by adding the inspection of the substrate W by the substrate inspection section T. The normal substrate process is a process according to the first embodiment in which the inspection of the substrate W is not performed, and the process according to the second embodiment is a special process in which an inspection is added. Therefore, if it is going to perform the process which added the test | inspection which concerns on Example 2 with the flow recipe which concerns on Example 1, you must create a new flow recipe. This is not limited to the inspection of the substrate, and the same can be said when a special processing is performed by newly adding a processing of the substrate. So considering such special processing to set whether to perform processing of the substrate for all of the processing unit capable of processing a substrate W, or to all the substrate inspection unit capable of inspecting a substrate W It is preferable to set the skip control flag so as to set whether or not to inspect the substrate. That is, it is preferable to create a flow recipe in consideration of special substrate processing. When normal substrate processing is performed, the skip control flag of the transfer order related to special substrate processing is set to “ON”, and when special substrate processing is performed, the transfer order related to special substrate processing is changed. The skip control flag may be set to “OFF”.

Is this way, sets whether to perform the processing of the substrate for all of the processing unit capable of processing a substrate W, or inspecting the substrate for all the substrate inspection unit capable of inspecting a substrate W By setting the skip control flag so as to set whether or not, the following effects can be obtained. That is, in the case of the processing unit, the processing of the substrate W can be performed on all processing units capable of processing the substrate W at the maximum, and the processing of the substrate W on all processing units is performed at the minimum. Various substrate processing can be performed more flexibly so that only the transfer can be performed without performing the above. In the case of the substrate inspection unit, the substrate W can be inspected for all substrate inspection units that can inspect the substrate W at the maximum, and the substrate W for all substrate inspection units at the minimum. Various substrate processing including the substrate inspection unit can be performed more flexibly so that only the conveyance can be performed without performing the inspection.

  In the second embodiment, the substrate inspection unit T1 that inspects the thickness of the antireflection film applied to the substrate W has been described as an example. The same applies to the inspection section for inspecting the thickness of the resist film or for inspecting the line width of the resist film after development. The present invention can also be applied to a case where two or more substrate inspection units are provided in the same cell.

  The present invention is not limited to the embodiment described above, and can be modified as follows, for example.

  (1) In the first and second embodiments described above, each cell controller CT1 to CT6 is a control only for the transfer of the substrate in each cell, so-called distributed control, but the processing blocks are arranged in parallel. The present invention can also be applied to a configured substrate processing apparatus. In this case, the processing is sequentially performed by a plurality of processing blocks arranged in parallel. In each processing block, each main transport mechanism transports the substrate received from the adjacent processing block via the entrance substrate mounting unit, transfers the substrate to the processing unit, and places the exit substrate on the adjacent processing block. The substrate to be dispensed through the unit is transported in parallel. That is, the main transport mechanism of each processing block operates simultaneously in parallel.

  (2) In the first and second embodiments described above, parameters are attached to the information for determining the transfer order for the flow recipes in the cells C1 to C6. However, when each cell is viewed as a unit of the processing unit, the substrate The processing includes the indexer cell C1, the antireflection film processing cell C2, the resist film processing cell C3, the post-exposure heating processing cell C5, the interface cell C6, the post-exposure heating processing cell C5, the development processing cell C4, and the indexer cell C1. It can be said that it consists of a flow recipe processed in this order. Therefore, as shown in FIG. 17, the flow recipe 42 may be configured with information for determining the transfer order between cells and parameters associated therewith. As described in the first embodiment, the parameters are configured by the substrate processing conditions and the skip control flag. For example, when a series of antireflection film coating processes in the antireflection film processing cell C2 are skipped, the skip control flag may be set to “ON” as shown in FIG. Further, when an inspection cell is added between cells, if the cell is handled as a substrate inspection unit, a skip control flag can be set for the inspection cell as in the second embodiment.

  (3) You may combine Example 1, 2 mentioned above, and a modification (2). That is, as shown in FIG. 18 (a), the flow recipe 42 is composed of information for determining the transfer order with respect to the cell and the accompanying skip control flag as in the modification (2). Each recipe number is associated with each other. Then, as shown in FIG. 18B, each flow recipe 43 corresponding to the recipe in each cell is further configured with a conveyance order and parameters associated therewith as in the first and second embodiments. FIG. 18B illustrates a flow recipe relating to the recipe number “3”, that is, a forward flow relating to the resist film processing cell C3.

It is the top view which showed schematic structure of the substrate processing apparatus which concerns on one Example of this invention. 1 is a front view showing a schematic configuration of an apparatus in Example 1. FIG. It is a front view of a heat treatment part. It is a fracture | rupture front view which shows the periphery structure of the board | substrate mounting part provided in the partition. It is a side view which shows schematic structure of an interface block. (A) is a top view which shows schematic structure of a main conveyance mechanism, (b) is the front view. (A) is a fracture | rupture side view of the heating part with a substrate temporary placement part, (b) is a fracture | rupture top view. FIG. 2A is a plan view showing a block arrangement of the apparatus in the first embodiment, and FIG. 2B is a plan view showing a cell arrangement of the apparatus in the first embodiment. (A) is the block diagram which showed the control system of the apparatus in Example 1, (b) is the block diagram of the control system of the conventional apparatus shown for the comparison. It is the figure which showed the structure of the data setting part of the apparatus in Example 1. FIG. (A)-(d) is a flowchart with which it uses for description of the fundamental operation | movement of a substrate processing apparatus. (A) is a figure which shows the outline | summary of the whole flow recipe, (b) is a figure which shows the content of each flow recipe and a parameter, (c) is the content of the parameter which concerns on substrate processing conditions FIG. It is a figure which shows the flow of each data in a control system. (A) is the front view which added and arrange | positioned the board | substrate test | inspection part in the heat processing part for resist films in the processing cell for resist films, (b) is the antireflection film processing cell and the resist film processing cell It is the front view which added and arrange | positioned the board | substrate test | inspection part to the board | substrate mounting part in between. (A) is a figure which shows the content at the time of setting "OFF" of a skip control flag, (b) is a figure which shows the content at the time of setting "ON" of a skip control flag. 10 is a flowchart illustrating setting of a skip control flag according to the second embodiment. It is a figure which shows the content of the flow recipe and parameter which concern on a modification. (A), (b) is a figure which shows the content of the flow recipe and parameter which concern on the further modification. It is a flowchart of the board | substrate which concerns on invention different from this invention.

Explanation of symbols

CT1 to CT6 ... cell controller MC ... main controller HC ... data setting part 38 ... input part 39, 40 ... flow recipe W ... substrate

Claims (13)

A substrate processing apparatus comprising a plurality of processing units that perform substrate processing, a transport mechanism that transfers a substrate to each processing unit, and a control unit that controls the processing unit and the transport mechanism,
A transport order setting means for setting the transport order of the substrates by the transport mechanism;
Processing information setting means for setting the processing information of the substrate,
Processing information is assigned to all processing units capable of processing a substrate by assigning one of “perform substrate processing” or “not perform substrate processing” for each processing unit in each transport order. Information for setting whether or not to process the substrate ,
The control means controls the processing unit and the transport mechanism as follows based on the transport order and the processing information.
(A) While delivering a board | substrate with respect to a process part based on a conveyance order,
(B ₁ ) When the processing information is set to “perform processing of the substrate”, the processing unit processes the substrate based on the processing information,
(B ₂ ) When the processing information is set to “do not process substrate”, the substrate is transferred to the next processing unit without processing the substrate in the processing unit. A substrate processing apparatus. Controls an inspection unit that inspects a substrate, a plurality of processing units that perform substrate processing, a conveyance mechanism that delivers a substrate to the inspection unit and each processing unit, and an inspection unit, a processing unit, and a conveyance mechanism A substrate processing apparatus comprising a control means,
A transport order setting means for setting the transport order of the substrates by the transport mechanism;
Processing information setting means for setting processing information of the substrate;
Including inspection information setting means for setting inspection information of the substrate,
Processing information is assigned to all processing units capable of processing a substrate by assigning one of “perform substrate processing” or “not perform substrate processing” for each processing unit in each transport order. Information to set whether or not to process the substrate ,
The inspection information is assigned to the inspection unit by assigning one of “inspect substrate” or “not inspect substrate” to the inspection unit in the transport order, and inspecting the inspection unit with respect to the inspection unit. is information for setting whether to perform,
The control means controls the inspection unit , the processing unit, and the transport mechanism as follows based on the transport order , processing information, and inspection information .
(C) While delivering a board | substrate with respect to an inspection part and a process part based on a conveyance order,
(B ₁ ) When the processing information is set to “perform processing of the substrate”, the processing unit processes the substrate based on the processing information,
(B ₂ ) If the processing information is set to “do not process the substrate”, the substrate is transferred to the next processing unit without processing the substrate in the processing unit. ,
(D ₁ ) If the inspection information is set to “perform substrate inspection”, inspect the substrate at the inspection unit based on the inspection information,
(D ₂ ) If the inspection information is set to “do not inspect the substrate”, the inspection unit does not inspect the substrate and the next inspection unit or processing unit is inspected. A substrate processing apparatus that performs delivery. Controls an inspection unit that inspects a substrate, a plurality of processing units that perform substrate processing, a conveyance mechanism that delivers a substrate to the inspection unit and each processing unit, and an inspection unit, a processing unit, and a conveyance mechanism A substrate processing apparatus comprising a control means,
A transport order setting means for setting the transport order of the substrates by the transport mechanism;
Including inspection information setting means for setting inspection information of the substrate,
The inspection information is assigned to any inspection unit that can inspect a substrate by assigning one of “inspect substrate” or “not inspect substrate” for each inspection unit in each transport order. Information to set whether or not to inspect the board ,
The control means controls the inspection unit , the processing unit, and the transport mechanism as follows based on the transport order and the inspection information.
(C) While delivering a board | substrate with respect to an inspection part and a process part based on a conveyance order,
(D ₁ ) If the inspection information is set to “perform substrate inspection”, inspect the substrate at the inspection unit based on the inspection information,
(D ₂ ) If the inspection information is set to “do not inspect the substrate”, the inspection unit does not inspect the substrate and the next inspection unit or processing unit is inspected. A substrate processing apparatus that performs delivery. In the substrate processing apparatus in any one of Claims 1-3,
The apparatus includes the processing unit and the transport mechanism, or includes a single processing block including the inspection unit, the processing unit, and the transport mechanism, and is configured by arranging the processing blocks in parallel.
Each processing block is divided into an inlet substrate mounting portion for mounting the substrate to receive the substrate in the processing block and an outlet substrate mounting portion for mounting the substrate to eject the substrate from the processing block. It is provided separately,
A substrate processing apparatus, wherein the transfer mechanism of each processing block delivers a substrate via an entrance substrate placement portion and an exit substrate placement portion. In the substrate processing apparatus in any one of Claims 1-3,
The apparatus includes the processing unit and the transport mechanism, or includes the inspection unit, the processing unit, and the transport mechanism to form a single controlled unit, and is configured by arranging the controlled units in parallel. And
Each controlled unit has an entrance substrate placement section for placing a substrate to receive the substrate in the controlled unit, and an exit substrate placement section for placing a substrate to eject the substrate from the controlled unit And is provided separately,
The transport mechanism of each controlled unit delivers the substrate via the entrance substrate placement unit and the exit substrate placement unit,
In addition, each controlled unit is provided with unit control means for controlling at least the substrate transfer operation of the transport mechanism of each controlled unit,
Each unit control means corresponds to each controlled unit on a one-to-one basis, and each unit control means includes a series of substrate transports including substrate delivery to the processing unit or inspection unit and substrate delivery to the substrate mounting unit. The substrate processing apparatus is characterized in that the control according to the above is performed only on the controlled unit to be controlled, and is independently performed from the other controlled units. A substrate processing method for transferring a substrate to each processing unit and performing substrate processing in the transferred processing unit,
The processing of the substrate is performed on all processing units capable of processing the substrate by assigning one of “perform substrate processing” or “not perform substrate processing” for each processing unit in each transport order. Processing information to set whether or not to perform is set,
(A) While delivering a board | substrate with respect to a process part based on a conveyance order,
(B ₁ ) When the processing information is set to “perform processing of the substrate”, the processing unit processes the substrate based on the processing information,
(B ₂ ) When the processing information is set to “do not process substrate”, the substrate is transferred to the next processing unit without processing the substrate in the processing unit. And a substrate processing method. A substrate processing method for delivering a substrate to an inspection unit and each processing unit, inspecting a substrate with the passed inspection unit, and performing substrate processing with the passed processing unit,
The processing of the substrate is performed on all processing units capable of processing the substrate by assigning one of “perform substrate processing” or “not perform substrate processing” for each processing unit in each transport order. Processing information to set whether to perform or not , and
Inspection information for setting whether or not to inspect a substrate to the inspection unit by assigning any one of “inspect substrate” or “not inspect substrate” to the inspection unit in the transport order Is set,
(C) While delivering a board | substrate with respect to an inspection part and a process part based on a conveyance order,
(B ₁ ) When the processing information is set to “perform processing of the substrate”, the processing unit processes the substrate based on the processing information,
(B ₂ ) When the processing information is set to “do not process the substrate”, the substrate is transferred to the next processing unit without processing the substrate in the processing unit. ,
(D ₁ ) When the inspection information is set to “inspect the substrate”, the inspection unit inspects the substrate based on the inspection information,
(D ₂ ) If the inspection information is set to “do not inspect the substrate”, the inspection unit does not inspect the substrate, and the next inspection unit or processing unit is inspected. The substrate processing method characterized by performing delivery. In the substrate processing method of Claim 6 or Claim 7,
If the processing information of (b ₂ ) is set to “do not process the substrate”, the processing is performed without processing the substrate while the substrate is delivered to the processing unit. A substrate processing method comprising transferring a substrate from one section to the next processing section. In the substrate processing method of Claim 6 or Claim 7,
When the processing information of (b ₂ ) is set to “do not process the substrate”, the processing information is passed to the next processing unit without passing the substrate to the processing unit. A substrate processing method comprising transferring a substrate to the substrate. A substrate processing method for delivering a substrate to an inspection unit and each processing unit, inspecting a substrate with the passed inspection unit, and performing substrate processing with the passed processing unit,
All inspection units that can inspect a substrate are inspected by assigning one of “inspect substrate” or “not inspect substrate” to each inspection unit in each transport order. Inspection information to set whether or not to perform is set,
(C) While delivering a board | substrate with respect to an inspection part and a process part based on a conveyance order,
(D ₁ ) When the inspection information is set to “inspect the substrate”, the inspection unit inspects the substrate based on the inspection information,
(D ₂ ) If the inspection information is set to “do not inspect the substrate”, the inspection unit does not inspect the substrate, and the next inspection unit or processing unit is inspected. The substrate processing method characterized by performing delivery. The substrate processing method according to claim 10,
When the inspection information of (d ₂ ) is set to “do not inspect the substrate”, the inspection is performed without inspecting the substrate in a state where the substrate is delivered to the inspection unit. A substrate processing method characterized in that a substrate is transferred from one section to the next inspection section or processing section. The substrate processing method according to claim 10,
When the inspection information of (d ₂ ) is set to “do not inspect the substrate”, the inspection unit passes without passing the substrate to the next inspection unit or A substrate processing method comprising delivering a substrate to a processing unit. In the substrate processing method in any one of Claims 10-12,
Set inspection information to “inspect the substrate” until it passes by the inspection unit, sequentially pass the substrate to the inspection unit based on the transport order, and sequentially inspect the inspection unit based on the inspection information Done
If the board passes the inspection section, set the inspection information to "Do not inspect the board". Subsequent to the board that has passed, the inspection section does not inspect the board, and the next inspection section or A substrate processing method comprising delivering a substrate to a processing unit.

Images