TW495113U - LGA socket with reliable securing mechanism - Google Patents

LGA socket with reliable securing mechanism

Info

Publication number
TW495113U
TW495113U TW089219992U TW89219992U TW495113U TW 495113 U TW495113 U TW 495113U TW 089219992 U TW089219992 U TW 089219992U TW 89219992 U TW89219992 U TW 89219992U TW 495113 U TW495113 U TW 495113U
Authority
TW
Taiwan
Prior art keywords
securing mechanism
lga socket
reliable securing
reliable
lga
Prior art date
Application number
TW089219992U
Other languages
English (en)
Inventor
William B Wallkup
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Publication of TW495113U publication Critical patent/TW495113U/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/193—Means for increasing contact pressure at the end of engagement of coupling part, e.g. zero insertion force or no friction
TW089219992U 2000-07-25 2000-11-17 LGA socket with reliable securing mechanism TW495113U (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/625,233 US6280222B1 (en) 2000-07-25 2000-07-25 LGA socket with reliable securing mechanism

Publications (1)

Publication Number Publication Date
TW495113U true TW495113U (en) 2002-07-11

Family

ID=24505133

Family Applications (1)

Application Number Title Priority Date Filing Date
TW089219992U TW495113U (en) 2000-07-25 2000-11-17 LGA socket with reliable securing mechanism

Country Status (3)

Country Link
US (1) US6280222B1 (zh)
CN (1) CN2458750Y (zh)
TW (1) TW495113U (zh)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6501647B1 (en) * 2001-01-09 2002-12-31 Dell Products L.P. Computer with thermal cooling and a thermal cooling system and method
JP2003059602A (ja) * 2001-08-08 2003-02-28 Yamaichi Electronics Co Ltd 半導体装置用ソケット
US6538889B1 (en) * 2001-09-20 2003-03-25 Hewlett-Packard Company Heat dissipation device retention assembly
US6477051B1 (en) * 2001-09-20 2002-11-05 Hewlett-Packard Company Socket activation interlock
US6692280B2 (en) * 2001-09-28 2004-02-17 Intel Corporation Socket warpage reduction apparatus and method
FR2831018B1 (fr) * 2001-10-17 2003-12-19 Bull Sa Dispositif de maintien d'au moins deux composants electroniques disposes en vis-a-vis de part et d'autre d'une carte de connexion
US6501657B1 (en) * 2002-01-22 2002-12-31 Dell Products L.P. Torsional heat sink retention device
TW573753U (en) * 2002-02-08 2004-01-21 Foxconn Prec Components Co Ltd Heat sink disassembling device
JP3950795B2 (ja) * 2002-10-31 2007-08-01 タイコエレクトロニクスアンプ株式会社 Ｌｇａパッケージ用ソケット
JP3803099B2 (ja) 2002-12-17 2006-08-02 山一電機株式会社 半導体装置用ソケット
TW568455U (en) * 2003-05-09 2003-12-21 Hon Hai Prec Ind Co Ltd Electrical connector
TW568422U (en) 2003-05-14 2003-12-21 Hon Hai Prec Ind Co Ltd Electrical connector
TW568398U (en) * 2003-05-16 2003-12-21 Hon Hai Prec Ind Co Ltd Electrical connector
CN1868245B (zh) * 2003-09-12 2010-12-22 莫莱克斯公司 具有释放机构的存储器模块连接器
CN2664185Y (zh) * 2003-11-29 2004-12-15 鸿富锦精密工业（深圳）有限公司 散热装置组合
US20050207119A1 (en) * 2004-03-17 2005-09-22 Huang Ming T Heat dissipation module of an interface card
JP4073439B2 (ja) * 2004-04-16 2008-04-09 山一電機株式会社 半導体装置用ソケット
US7009844B2 (en) * 2004-06-18 2006-03-07 International Business Machines Corporation Wire form heat sink retention module
JP4312685B2 (ja) * 2004-08-31 2009-08-12 山一電機株式会社 半導体装置の着脱方法、それが用いられる半導体装置の着脱装置、および半導体装置用ソケット
JP4471941B2 (ja) * 2005-03-10 2010-06-02 山一電機株式会社 半導体装置用ソケット
US7258552B2 (en) * 2005-07-05 2007-08-21 Hewlett-Packard Development Company, L.P. Socket for holding a circuit board module
US7212409B1 (en) * 2005-12-05 2007-05-01 Hewlett-Packard Development Company, L.P. Cam actuated cold plate
TWM290584U (en) * 2005-12-05 2006-05-11 Inventec Corp Fastener for heat sink
US20080055865A1 (en) * 2006-08-30 2008-03-06 Inventec Corporation Heat sink fixing assembly
JP2009036679A (ja) * 2007-08-02 2009-02-19 Yamaichi Electronics Co Ltd 半導体装置用ソケット
US7567439B2 (en) * 2007-08-10 2009-07-28 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device having a rotatable fastener
JP4495200B2 (ja) * 2007-09-28 2010-06-30 山一電機株式会社 半導体装置用ソケット
JP2010118275A (ja) * 2008-11-13 2010-05-27 Yamaichi Electronics Co Ltd 半導体装置用ソケット
TWM370216U (en) * 2009-05-12 2009-12-01 Hon Hai Prec Ind Co Ltd Electrical connector assembly and heatsink module thereof
CN201576868U (zh) * 2009-05-25 2010-09-08 富士康(昆山)电脑接插件有限公司 电连接器
US8911244B2 (en) 2012-12-13 2014-12-16 International Business Machines Corporation Receptacle with heat management for electronic and optical systems
CN105492949B (zh) * 2013-09-13 2018-05-29 英特尔公司 用于电-光模块的落式栅格阵列插座
CN109616793A (zh) * 2017-06-20 2019-04-12 富士康(昆山)电脑接插件有限公司 电连接器组件
CN108281831B (zh) 2018-01-23 2020-05-12 泰科电子(上海)有限公司 插座组件和传热组件
US11449111B2 (en) 2018-03-30 2022-09-20 Intel Corporation Scalable, high load, low stiffness, and small footprint loading mechanism
US11291115B2 (en) 2018-03-30 2022-03-29 Intel Corporation Server microprocessor carrier with guiding alignment anti-tilt and automatic thermal interface material separation features for use in land grid array sockets
US11296009B2 (en) * 2018-03-30 2022-04-05 Intel Corporation Method and apparatus for detaching a microprocessor from a heat sink
US11387163B2 (en) 2018-03-30 2022-07-12 Intel Corporation Scalable debris-free socket loading mechanism
US11557529B2 (en) 2018-03-30 2023-01-17 Intel Corporation Mechanism combining fastener captivation and assembly tilt control for microprocessor thermal solutions
CN109445041B (zh) * 2018-10-26 2020-04-24 黄山市光锐通信股份有限公司 25g光模块的加工工艺
US10886647B2 (en) 2018-11-27 2021-01-05 International Business Machines Corporation Electronic circuitry socket structure

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3904262A (en) * 1974-09-27 1975-09-09 John M Cutchaw Connector for leadless integrated circuit packages
US4063791A (en) * 1976-12-27 1977-12-20 Cutchaw John M Connector for leadless integrated circuit packages
US5256080A (en) * 1992-06-12 1993-10-26 The Whitaker Corporation Bail actuated ZIF socket
US5302853A (en) * 1993-01-25 1994-04-12 The Whitaker Corporation Land grid array package
US5482471A (en) * 1993-02-24 1996-01-09 Texas Instruments Incorporated Socket apparatus for IC package testing
US5569045A (en) * 1994-02-10 1996-10-29 Hsu; Fu-Yu Electrical connector
GB2286490A (en) * 1994-02-10 1995-08-16 Hsu Fu Yu Contact for ZIF socket
US5489218A (en) * 1994-03-24 1996-02-06 Hon Hai Precision Industry Co., Ltd. ZIF PGA socket and contact therein
JPH0864732A (ja) * 1994-08-26 1996-03-08 Mitsubishi Electric Corp 半導体集積回路装置
US5600540A (en) * 1995-05-15 1997-02-04 Blomquist; Michael L. Heat sink and retainer for electronic integrated circuits
US5547389A (en) * 1995-05-23 1996-08-20 Hsu; Feng-Chien Integrated circuit chip socket
US5679020A (en) * 1995-09-29 1997-10-21 Hon Hai Precision Ind. Co., Ltd. Stopper for use with ZIF PGA socket
US5602719A (en) * 1995-11-13 1997-02-11 Intel Corporation No handle zip socket
US5688140A (en) * 1995-12-28 1997-11-18 Hon Hai Precision Ind. Co., Ltd. Chip carrier socket
US6083022A (en) * 1997-10-15 2000-07-04 Hon Hai Precision Ind. Co., Ltd. System for connecting daughter and mother boards
JPH11176546A (ja) * 1997-12-12 1999-07-02 Otax Co Ltd 電子部品用ソケット
US6086387A (en) * 1998-05-14 2000-07-11 International Business Machines Corporation Cover assembly for a socket adaptable to IC modules of varying thickness used for burn-in testing
US6021045A (en) * 1998-10-26 2000-02-01 Chip Coolers, Inc. Heat sink assembly with threaded collar and multiple pressure capability
US6191480B1 (en) * 1999-09-07 2001-02-20 International Business Machines Corporation Universal land grid array socket engagement mechanism

Also Published As

Publication number Publication date
US6280222B1 (en) 2001-08-28
CN2458750Y (zh) 2001-11-07

Similar Documents

Publication Publication Date Title
TW495113U (en) LGA socket with reliable securing mechanism
TW438067U (en) LGA socket
TW453545U (en) Socket connector
TW454993U (en) Socket connector
GB2368731B (en) Connector with lock ensuring mechanism
TW461612U (en) Socket connector
TW454982U (en) Socket connector
TW456610U (en) Socket connector
TW456592U (en) Socket connector
TW502882U (en) ZIF socket with improved lever mechanism
HK1044073A1 (zh) 電氣插座
TW501799U (en) Socket connector
TW477479U (en) Socket connector
TW438132U (en) Socket connector
GB2359202B (en) Socket device
TW470239U (en) Socket connector
TW471722U (en) Socket connector
TW509412U (en) ZIF socket
TW461606U (en) ZIF socket
TW532593U (en) ZIF socket having lever retention means
EP1229615A4 (en) LAMP SOCKET
TW425950U (en) Improved socket structure
TW445925U (en) Improved socket structure
TW493807U (en) Socket connector
TW472967U (en) Socket connector

Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004