TW494261B - Liquid crystal display device using in plane switching with high opening ratio - Google Patents

Liquid crystal display device using in plane switching with high opening ratio Download PDF

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Publication number
TW494261B
TW494261B TW085115891A TW85115891A TW494261B TW 494261 B TW494261 B TW 494261B TW 085115891 A TW085115891 A TW 085115891A TW 85115891 A TW85115891 A TW 85115891A TW 494261 B TW494261 B TW 494261B
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Taiwan
Prior art keywords
liquid crystal
electrode
signal line
electric field
film
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TW085115891A
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Chinese (zh)
Inventor
Masuyuki Ohta
Kauhiro Ogawa
Keiichiro Ashizawa
Kazuhiko Yanagawa
Masahiro Yanai
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Hitachi Ltd
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    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1343Electrodes
    • G02F1/134309Electrodes characterised by their geometrical arrangement
    • G02F1/134363Electrodes characterised by their geometrical arrangement for applying an electric field parallel to the substrate, i.e. in-plane switching [IPS]

Abstract

A liquid crystal display device using in plane switching with high opening ratio is disclosed, which can realize the viewing angle similar to the CRT to provide an active matrix liquid crystal display device with low power consumption having electric field control display screen parallel to the substrate surface, form the pixel electrodes and opposite electrodes for applying electric field parallel to the substrate surface; and, forming the pixel electrodes or opposite electrodes with transparent electrodes; and, forming the orientation of liquid crystal and the polarization axis of the polarization plate, so as to proceed the dark display without applying the electric field. The present invention can provide an active matrix liquid crystal display device using in plane switching with wide viewing angle, excellent contrast and hole diameter ratio, and the maximum transmission ratio.

Description

494261 A7 B7 經濟部智慧財產局員工消費合作社印製 五、 發明説明(1 ) 本 發 明 係 關 於 主 動 矩 陣 方 式 之 液 晶 顯 示 裝 置 1 尤 關 於 具 有 可 提 筒 開 □ 率 之 寬 視 野 角 特 性 之 橫 電 場 方 式 液 晶 顯 示 裝 置 〇 使 用 由 薄 膜 電 晶 體 Τ F T 代 表 之 主 動 元 件 之 主 動 矩 陣 型 液 晶 顯 示 裝 置 因 爲 具 有 薄 而 輕 之 特 徵 及 相 當 於 影 像 管 之 高 畫 質 故 逐 漸 被 廣 泛 應 用 於 〇 A 機 器 等 顯 示 終 端 裝 置 〇 該 液 晶 顯 示 裝 置 之 顯 示 方 式 大 致 上 有 如 下 之 2 種 〇 其 中 之 一 方 式 爲 以 形 成 透 明 電 極 之 2 片 基 板 挾 持 液 晶 以 施 加 於 透 明 電 極 之 電 壓 使 其 動 作 -QE1 m 變 穿 過 透 明 電 極 而 射 入 液 晶 之 光 線 而 顯 示 之 方 式 〇 巨 刖 普 及 之 方 式 大 部 分 屬 於 此 類 方 式 〇 另 一 種 方 式 係 以 大 致 上 平 行 於 形 成 在 同 一 基 板 上 之 2 個 電 極 間 之 基 板 面 之 電 場 使 液 晶 動 作 m 變 從 2 個 電 極 之 間 隙 射 入 液 晶 之 光 線 而 顯 示 之 方 式 〇 此 方 式 之 特 徵 爲 視 野 角 非 常 寬 大 j 係 關 於 主 動 矩 陣 型 液 晶 顯 示 裝 置 之 非 常 有 將 來 性 之 技 術 〇 一 般 稱 爲 橫 電 場 方 式 > 或 In -Plane Switch- i η g方式< > 後 者 之 特 徵 在 特 願 平 5 — 5 0 5 2 4 7 號 > 特 公 昭 6 3 — 2 1 9 0 7 號 9 特 開 平 6 一 1 6 0 8 7 8 號 中 有 記 載 〇 依 照 後 者 習 用 之 方 式 因 爲 係 將 不 透 明 金 屬 電 極 形 成 爲 梳 子 狀 故 使 光 線 穿 '•Hr 過 之 孔 □ 領 域 之 比 率 ( 孔 徑 率 非 常 低 > 依 照 後 者 之 習 用 方 式 之 主 動 矩 陣 型 液 晶 顯 示 裝 置 > 因 爲 顯 示 畫 面 昏 暗 或 爲 了 使 顯 示 畫 面 明 亮 必 須 使 用 消 耗 功 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -4 - 494261 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明(2 ) 率大之明亮背光,使得裝置之消耗功率增大。 其他方面,依照習用方式,因爲使用金屬電極’故電 極之反射率高,由於電極之反射使得臉部影像出現在畫面 上,造成困擾。 本發明之目的爲提供一種可解決上述問題’採用可實 現相當於影像管之視野角之後者之顯示方式之主動矩陣型 液晶顯示裝置,亦即具有高開口率、明亮、消耗功率低、 反射低,容易觀賞之主動矩陣型液晶顯示裝置。 爲了達成上述目的,本發明第1結構之特徵爲:至少 圖素電極或對向電極爲透明電極,成爲未施加電場時進行 昏暗顯示之正常黑暗模態,未施加電場時之該可扭轉之液 晶層之初期配向狀態成爲均勻配向狀態’施加電場時該電 極間及電極上之液晶分子主動的平行於基板面旋轉’液晶 顯示面板之光穿透率之最大值爲4 · 0%以上,對比1 〇 比1以上之視野角範圍在與垂直於顯示面之方向成爲4 0 度以上傾斜之全方位範圍內。 第2結構之特徵爲:至少圖素電極或對向電極中之一 方爲透明電極,成爲在未施加電場時進行昏暗顯示之正常 黑暗模態,未施加電場時之可扭轉之液晶層之初期配向狀 態爲均勻配向狀態,扭轉彈性常數爲1 ο X 1 0_12N ( Newton )以下 ° 第3結構之特徵爲:至少圖素電極或對向電極中之一 方爲透明電極,成爲在未施加電場時進行昏暗顯示之正常 黑暗模態,未施加電場時之可扭轉之液晶層之初期配向狀 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 一 5 - 494261 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明( 3 ) 態 爲 均 勻 配 向 狀 態 液 晶 層 之 上 下 界 面 之 液 晶 分 子 之 初 期 預 傾 斜 角 爲 1 0 度 以 下 > 液 晶 層 內 之 液 晶 分 子 之 初 期 傾 斜 狀 態 爲 射 流 ( spray ) 狀態< 第 4 結 構 之 特 徵 爲 至 少 圖 素 電 極 或 對 向 電 極 中 之 一 方 爲 透 明 電 極 成 爲 在 未 施 加 電 場 時 進 行 昏 暗 顯 示 之 正 常 黑 暗 模 態 在 未 施 加 電 場 時 之 可 扭 轉 之 液 晶 層 之 初 期 配 向 狀 態 爲 均 勻 配 向 狀 態 透 明 電 極 上 之 液 晶 層 之 液 晶 分 子 之 平 均 傾 斜 角 在 未 施 加 電 場 時 仍 爲 小 於 4 5 度 〇 第 5 結 構 係 在 第 1 至 第 4 結 構 中 之 任 一 結 構 中 1 至 少 圖 素 電 極 或 對 向 電 極 係 使 用 透 明 電 極 及 不 透 明 金 屬 電 極 之 雙 層 構 造 〇 第 6 結 構 係 在 第 1 至 第 4 結 構 中 之 任 —. 結 構 中 使 用 鄰 接 之 對 向 電 壓 信 號 線 由 圖 素 內 之 對 向 電 極 經 由 穿 孔 連 接 之 構 造 〇 第 7 結 構 之 特 徵 爲 在 第 1 至 第 4 結 構 中 之 任 一 結 構 中 又 具 有 披 覆 主 動 矩 陣 元 件 之 保 護 膜 至 少 該 圖 素 電 極 或 該 對 向 電 極 中 之 一 方 係 形 成 在 該 保 護 膜 上 並 經 由 形 成 於 該 保 護 膜 上 之 穿 孔 連 接 於 主 動 矩 陣 元 件 或 對 向 電 壓 信 號 線 〇 第 8 結 稱 係 第 1 至 第 4 結 構 中 之 任 一 結 構 係 使 用 對 向 電 極 係 由 透 明 電 極 所 稱 成 贅 而 且 在 對 向 電 極 與 影 像 信 號 線 間 具 有 遮 光 I c<r| 圖 型 之 構 造 〇 第 9 結 構 係 第 1 、 2 3 4 或 5 結 構 中 連 接 對 向 電 極 間 之 對 向 電 極 信 號 線 爲 金 屬 〇 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) 一 6 - 494261 A7 B7 五、發明説明(4 ) ^ (請先閲讀背面之注意事項再填寫本頁) 第1 0結構係第1至第4結構中之任一結構係形成有 3支以上之對向電極,其中2支對向電極鄰接於影像信號 線,鄰接於影像信號線形成之對向電極不透明。 第1 1結構係第1至第4結構中之任一結構之透明電 極所使用之透明導電膜係銦錫氧化物(I TO)。 第1 2結構係第9結構之對向電壓信號線爲C r , Ta ,T i ,Mo,W,Aj?或其合金,或將以上元素層 疊之包層構造。 第1 3結構係第9結構中,對向電壓信號線係在C r ,丁 a ,Ti ,Mo ,W,A$或其合金上層疊ITO等 透明導電膜而成之包層構造。 第1 4結構之特徵爲:在第1至第4結構中之任一結 構上之該液晶層之初期扭轉角大致上爲0,初期配向角在 液晶材料之介電係數各向異性爲正時爲4 5度以上 9 0度以下,若介電係數各向異性Δε爲負時則爲〇度以 上4 5度以下。 經濟部智慧財產局員工消費合作社印製 第1製造方法之特徵爲:以透明之導電層形成至少掃 描信號線端子部’影像信號線端子部’或對向電極端子部 之最上層之導電層’及至少圖素電極或對向電極之一方, 並且在同一作業中形成。 以下說明本發明之作用。 第1結構之作用爲’至少將圖素電極或對向電極之一* 方形成爲透明’即可由穿透該部分之穿透光線提高進行明 亮(白色)顯示時之最大穿透率’故與電極爲不透明時比 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ297公釐) 494261 經濟部智慧財產局員工消費合作社印製 A7 B7五、發明説明(5 ) 較,可進行更明亮之顯示,液晶顯示面板之透光率從習用 方式之採用不透明電極時之3·0〜3·8%提高至最大 穿透率4 . 0%以上。亦即,假設背光射入光之亮度爲 3 0 0 0 c d/m2時,明亮顯示亮度之最大亮度值可達 1 2 0 c d / m 2以上。 未施加電壓時,液晶分子保持初期之均勻配向狀態, 故配置偏光板(形成爲正常黑暗模態)使其在該狀態顯示 昏暗(黑暗),則即使電極爲透明,仍不會穿透該部分之 光線,故可進行良質之昏暗顯示,可提高對比。 若形成爲正常白色時,則必須在未施加電壓時進行昏 暗顯示,在施加電壓時電極上部分不能完全遮斷光線,故 該部分之穿透光線使昏暗顯示之穿透率昇高,不能進行良 質之昏暗顯示。因此,不能達成充分之對比。 又因爲施加電壓時之該電極間及電極上之液晶分子主 動的平行於基板面旋轉,故可產生寬大之視野特性。 因此,可產生對比1 0比1以上之視野角範圍在以與 顯示面成爲垂直之方向成爲4 0度以上之角度傾斜之全方 位之範圍內,及寬大視野角特性。 第2結構之作用爲,在圖素電極與對向電極間施加電 壓時,因爲可扭轉之液晶層之扭轉彈性係數爲1 0 X 1 0_12N (Newton)以下,故在透明導電膜之電極上, 從初期配向方向旋轉之角度α增加,電極上之穿透率與電 極間之穿透率產生相補作用,實質上提高開口率。該扭轉 彈性係數Κ 2愈小愈佳。 $纸張尺度適用中國國家標準(CNS) A4規格(210X 297公釐) -8 - 494261 經濟部智慧財產局員工消費合作社印製 A7 ______B7__ 五、發明説明(6 ) 第3結構之作用爲,因爲液晶層之上下界面之液晶分 子之初期預傾斜角爲1 0度以下,液晶層內之液晶分子之 初期傾斜狀態成爲射流狀態,故液晶層之中央部分之液晶 分子之傾斜角大致上成爲0,可減小對顯示有影響之液晶 層之平均傾斜角’故即使在施加電壓時,仍可將電極間及 透明電極上之液晶分子之傾斜角設定爲較小,可實現提高 孔徑率及寬大視野角之目的。 第4結構之作用爲,在施加電場時,液晶電極上之液 晶層之液晶分子之平均傾斜角仍爲4 5度以下,故可實現 提高開口率及寬大視野角之目的。 第5結構之作用爲,因爲圖素電極或對向電極係使用 透明電極及不透明金屬電極之雙層構造,故可防止該電極 之斷線,對大畫面化極有利。 第6結構之作用爲,因爲使用鄰接之對向電壓信號線 由圖素內之對向電極經由穿孔連接之構造,故可將各對向 電壓信號線連接成網目狀,因此可減小對向電壓信號線之 電阻,即使發生斷線不良亦不會造成重大缺陷。 因所而 ,可 場極造 阻故 電電構 電, 之明之 之真 上透型 線失 子 由圖 號之 分係光 信壓 晶。極遮 壓電 液壓電有 電少 在電向具 向減 加動對間 對, 施驅用之 低達 制低採號 降傳 抑降爲信 爲間 可可因像 因極 爲,爲影 爲電 用點用與 用向 作缺作極 作對 之之之電。之在 構低構向率構利 結降結對 口結順 7 而 8 在開 9 壓 第膜第,高第電 護 成提 使 保 構可 可 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 494261 經濟部智慧財產局員工消費合作社印製 A7 B7五、發明説明(7 ) 抑制水平方向之串音。 第10結構之作用爲鄰接於影像信號線之對向電極爲 不透明,故可抑制隨著影像信號而產生之串音。以下說明 其理由。 因爲鄰接於影像信號線形成透明對向電極,故影像信 號線所產生之電場(電力線)被對向電極吸收,影像信號 線所產生之電場不會對圖素電極與對向電極間之電場發生 影響,故可明顯的抑制隨著影像信號而產生之串音,尤其 可抑制基板上下方向之串音之發生。然而’鄰接於影像信 號線之對向電極上之液晶分子之動作因影像信號之變動而 成爲不穩定,若鄰接於影像信號線之對向電極爲透明電極 ,則由於其電極部分之穿透光’可能發生串音。因此’鄰 接於影像信號線之對向電極若採用不透明電極’即可抑制 隨著影像信號而產生之串音。 第1 1結構之作用爲,因爲透明導電膜係銦錫氧化物 (I T 0 ),故適合於提高穿透率。 第1 2、1 3結構之作用爲,因爲對向電壓信號線係 層疊之包層構造,故可減少電阻值’可減少發生斷線不良 〇 第1 4結構之作用爲,若液晶層之初期扭轉角大致上 爲0 ,初期配向角在液晶材料之介電係數各方異性爲 正時爲4 5°以上9 0°以下,若介電係數各向異性Δε 爲負時,則大於0 °小於4 5 ° ’故可抑制磁疇,及設定 適當之最大施加電壓之範圍’提高對比’而且又可設定適 本紙張尺度適用中國國家標準(CNS ) Α4規格(210X297公釐) -10 - 494261 A7 ____B7 五、發明説明(8 ) 當之響應速度。 第1製造方法之作用爲,同時形成掃描信號線端子部 ,影像信號線端子部,或對向電極端子部之最上層之透明 導電層與圖素電極或對向電極之透明導電膜,即可不增加 作業而以透明導電膜形成圖素電極及對向電極。 本發明之液晶顯示裝置中,圖素電極或對向電極中之 至少一方係由透明導電膜構成,其與Richard A. Soref,494261 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the Invention (1) The present invention relates to an active matrix liquid crystal display device 1 and particularly to a transverse electric field method with a wide viewing angle characteristic capable of raising the opening rate of the tube Liquid crystal display device 〇 Active matrix liquid crystal display devices using active elements represented by thin film transistors TT FT are gradually being widely used in display terminals such as OA devices because of their thin and light features and high image quality equivalent to image tubes. Device 〇 The display mode of the liquid crystal display device is roughly the following two. One of the methods is to hold the liquid crystal on two substrates forming a transparent electrode to apply a voltage to the transparent electrode to make it operate-QE1 m changes through the transparent electrode. The method of displaying light that enters the liquid crystal. It belongs to this method. The other method is a display method in which the liquid crystal operation m is changed by the electric field substantially parallel to the substrate surface formed between two electrodes on the same substrate. 〇This method is characterized by a very wide viewing angle. J is a very futuristic technology for active matrix liquid crystal display devices. 〇It is generally called the transverse electric field method > or In-Plane Switch-i η g < > the latter method. The characteristics are described in Takashihei 5-5 0 5 2 4 7 > Takashiho 6 3-2 1 9 0 7 9 Takkai Hei 6 1 6 0 8 7 8 According to the latter's customary method, because The opaque metal electrode is formed in the shape of a comb, so that light passes through the hole area through which the Hr passes. (The aperture ratio is very low> according to the latter's customary method. Moving matrix type liquid crystal display device> Because the display screen is dim or the display screen must be bright, it is necessary to use a power consumption paper. The paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -4-494261 A7 B7 Intellectual Property Bureau of the Ministry of Economic Affairs Printed by the employee consumer cooperative. V. Invention Description (2) The bright backlight with a large rate makes the power consumption of the device increase. In other respects, according to the conventional method, because the metal electrode is used, the reflectivity of the electrode is high, and the reflection of the electrode causes the face image to appear on the screen, causing confusion. The object of the present invention is to provide an active matrix liquid crystal display device that can solve the above-mentioned problem. The display method adopts a display method equivalent to the viewing angle of the image tube, that is, has a high aperture ratio, bright, low power consumption, and low reflection. , Easy to watch active matrix liquid crystal display device. In order to achieve the above object, the first structure of the present invention is characterized in that at least the pixel electrode or the counter electrode is a transparent electrode, and becomes a normal dark mode for dim display when no electric field is applied, and the reversible liquid crystal when no electric field is applied. The initial alignment state of the layer becomes a uniform alignment state. 'When the electric field is applied, the liquid crystal molecules between the electrodes and on the electrodes actively rotate parallel to the substrate surface.' The maximum light transmittance of the liquid crystal display panel is 4.0% or more, compared with 1. The viewing angle range of 0 to 1 is in an all-round range of 40 degrees or more inclination with the direction perpendicular to the display surface. The second structure is characterized in that at least one of the pixel electrode or the counter electrode is a transparent electrode, which becomes a normal dark mode for performing a dim display when an electric field is not applied, and an initial orientation of a reversible liquid crystal layer when an electric field is not applied. The state is a uniformly aligned state, and the torsional elastic constant is 1 ο X 1 0_12N (Newton) or less. The third structure is characterized in that at least one of the pixel electrode or the counter electrode is a transparent electrode, and becomes dim when no electric field is applied. Normal dark mode shown, initial orientation of the reversible liquid crystal layer when no electric field is applied. The paper dimensions are applicable to China National Standard (CNS) A4 specifications (210X297 mm). 5-494261 A7 B7 Employees of Intellectual Property Bureau, Ministry of Economic Affairs Printed by a consumer cooperative. 5. Description of the invention. (3) The initial pretilt angle of the liquid crystal molecules in the liquid crystal layer above and below the liquid crystal layer is uniformly aligned. The initial tilt angle of the liquid crystal molecules in the liquid crystal layer is spray. ) State < Characteristic of the 4th structure is At least one of the pixel electrode or the counter electrode is a transparent electrode, which becomes a normal dark mode for dim display when no electric field is applied. The initial alignment state of the twistable liquid crystal layer when no electric field is applied is a uniform alignment state on the transparent electrode. The average tilt angle of the liquid crystal molecules of the liquid crystal layer is less than 45 degrees when no electric field is applied. The fifth structure is in any of the first to fourth structures. 1 At least the pixel electrode or the counter electrode system is used. Double-layer structure of transparent electrode and opaque metal electrode. The 6th structure is any of the 1st to 4th structures.-The structure using adjacent opposing voltage signal lines in the structure to connect the opposing electrodes in the pixel through perforations 〇The seventh structure is characterized by having a covering in any one of the first to fourth structures. At least one of the pixel electrode or the counter electrode is formed on the protective film of the active matrix element and is formed on the protective film and connected to the active matrix element or the opposite voltage signal line through a through hole formed in the protective film. The structure of any of the first to fourth structures is a structure in which a counter electrode system is called a transparent electrode and has a light-shielding I c < r | pattern between the counter electrode and the image signal line. 9 The structure is the first, 2 3 4 or 5 structure. The opposite electrode signal line connecting the opposite electrodes is metal. 0 This paper size applies the Chinese National Standard (CNS) A4 specification (210X 297 mm)-6-494261 A7 B7 V. Description of the invention (4) ^ (Please read the precautions on the back before filling in this page) The 10th structure is any one of the 1st to 4th structures with more than 3 counter electrodes, of which 2 counter electrodes are adjacent to the image Line adjacent to the video signal line to the form of the transparent electrode. The first 11 structure is a transparent conductive film used for the transparent electrode of any of the first to fourth structures is indium tin oxide (I TO). The twelfth structure is the opposite voltage signal line of the ninth structure, which is C r, Ta, T i, Mo, W, Aj? Or its alloy, or a cladding structure in which the above elements are laminated. The thirteenth structure is the ninth structure, and the opposing voltage signal line is a cladding structure formed by laminating a transparent conductive film such as ITO on C r, D a, Ti, Mo, W, A $ or an alloy thereof. The feature of the 14th structure is that the initial twist angle of the liquid crystal layer on any of the first to fourth structures is approximately 0, and the initial alignment angle is positive when the dielectric anisotropy of the liquid crystal material is positive. It is 45 degrees or more and 90 degrees or less, and when the dielectric anisotropy Δε is negative, it is 0 degrees or more and 45 degrees or less. The first manufacturing method printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs is characterized in that at least the scanning signal line terminal portion 'image signal line terminal portion' or the uppermost conductive layer of the opposite electrode terminal portion is formed with a transparent conductive layer. And at least one of the pixel electrode or the counter electrode is formed in the same operation. The effect of the present invention will be described below. The function of the first structure is to 'make at least one of the pixel electrode or the counter electrode * the square becomes transparent', and the maximum transmittance for bright (white) display can be improved by the penetrating light that penetrates this part. For opacity, it applies the Chinese National Standard (CNS) A4 specification (210 × 297 mm) when compared to the paper size. 494261 A7 B7 printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. The invention description (5) can be displayed more brightly. The light transmittance of the liquid crystal display panel is increased from 3.0 · 3 to 8% when the opaque electrode is used in a conventional manner to a maximum transmittance of 4.0% or more. That is, assuming that the brightness of the backlight's incident light is 3 0 0 c d / m2, the maximum brightness value of the bright display brightness can reach more than 120 c d / m 2. When no voltage is applied, the liquid crystal molecules maintain an initial uniform alignment state, so a polarizing plate (formed into a normal dark mode) is configured to display dim (dark) in this state, even if the electrode is transparent, it will not penetrate the part. The light can be used for good dim display, which can improve the contrast. If it is normally white, it must be dimly displayed when no voltage is applied, and the upper part of the electrode cannot completely block the light when the voltage is applied. Therefore, the penetrating light of this part will increase the transmittance of the dim display and cannot be performed. Dim display of good quality. Therefore, sufficient contrast cannot be reached. Since the liquid crystal molecules between the electrodes and on the electrodes are actively rotated parallel to the substrate surface when a voltage is applied, a wide field of view characteristic can be generated. Therefore, a contrast angle range of 10 to 1 or more can be generated within a range of full azimuth inclined at an angle of 40 degrees or more in a direction perpendicular to the display surface, and a wide viewing angle characteristic. The function of the second structure is that when a voltage is applied between the pixel electrode and the counter electrode, since the torsional elastic coefficient of the torsionable liquid crystal layer is less than 1 0 X 1 0_12N (Newton), it is on the electrode of the transparent conductive film. The angle α rotated from the initial alignment direction increases, and the transmittance on the electrodes complements the transmittance between the electrodes, which substantially improves the aperture ratio. The smaller the torsional elastic coefficient K 2 is, the better. $ Paper size applies the Chinese National Standard (CNS) A4 specification (210X 297 mm) -8-494261 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 ______B7__ 5. Description of the invention (6) The function of the third structure is because The initial pretilt angle of the liquid crystal molecules at the upper and lower interfaces of the liquid crystal layer is 10 degrees or less. The initial tilt state of the liquid crystal molecules in the liquid crystal layer becomes a jet state, so the tilt angle of the liquid crystal molecules in the central portion of the liquid crystal layer becomes approximately 0. Can reduce the average tilt angle of the liquid crystal layer that affects the display, so even when a voltage is applied, the tilt angle of the liquid crystal molecules between the electrodes and on the transparent electrode can be set to be small, which can improve the aperture ratio and wide field of view The purpose of the horn. The function of the fourth structure is that when an electric field is applied, the average tilt angle of the liquid crystal molecules of the liquid crystal layer on the liquid crystal electrode is still 45 degrees or less, so that the purpose of improving the aperture ratio and wide viewing angle can be achieved. The function of the fifth structure is that, since the pixel electrode or the counter electrode system uses a double-layer structure of a transparent electrode and an opaque metal electrode, disconnection of the electrode can be prevented, which is extremely advantageous for large screens. The function of the sixth structure is that the adjacent opposing voltage signal lines are connected by the opposing electrodes in the pixel through the perforations, so that the opposing voltage signal lines can be connected in a mesh shape, so the opposing direction can be reduced. The resistance of the voltage signal line will not cause major defects even if the disconnection occurs. For this reason, the field electrode can hinder the formation of electricity, and the truth of the truth is that the top-transmissive line loss is based on the optical letter and pressure crystal of the figure. The extremely shielded piezoelectric hydraulic power has less electricity, and the electric direction is reduced to increase the number of pairs. The driving system is used to reduce the number of transmissions. Point-to-use and use-to-use as the opposite of electricity. The low orientation rate of the structure of the low-rate structure and the low-equivalent structure of the knot 7 and 8 at the 9th pressure of the film, the high-grade electric protection to promote the construction of cocoa This paper dimensions apply the Chinese National Standard (CNS) A4 specifications (210X297 (Mm) 494261 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Invention Description (7) Suppress horizontal crosstalk. The function of the tenth structure is that the opposite electrode adjacent to the video signal line is opaque, so that crosstalk generated with the video signal can be suppressed. The reason will be described below. Because the transparent counter electrode is formed adjacent to the image signal line, the electric field (electric power line) generated by the image signal line is absorbed by the counter electrode, and the electric field generated by the image signal line does not occur to the electric field between the pixel electrode and the counter electrode. Influence, so it can obviously suppress the crosstalk generated with the video signal, especially the crosstalk in the up and down direction of the substrate. However, the movement of the liquid crystal molecules on the opposite electrode adjacent to the image signal line becomes unstable due to the change of the image signal. If the opposite electrode adjacent to the image signal line is a transparent electrode, the light is transmitted through the electrode part. 'Crosstalk may occur. Therefore, if an opaque electrode is used as the counter electrode adjacent to the image signal line, crosstalk generated by the image signal can be suppressed. The function of the first structure is that since the transparent conductive film is indium tin oxide (I T 0), it is suitable for improving the transmittance. The function of the 12th and 13th structures is that because of the cladding structure of the opposing voltage signal lines, the resistance value can be reduced. 'The occurrence of disconnection defects can be reduced. The effect of the 14th structure is that if the liquid crystal layer is in the initial stage, The twist angle is approximately 0, and the initial alignment angle is 45 ° to 90 ° when the anisotropy of the dielectric constant of the liquid crystal material is positive. If the dielectric anisotropy Δε is negative, it is greater than 0 ° and less than 4 5 ° 'It can suppress the magnetic domains and set the appropriate maximum applied voltage range' improve the contrast 'and can also set the paper size Applicable to China National Standard (CNS) Α4 size (210X297 mm) -10-494261 A7 ____B7 5. Description of the invention (8) The response speed. The function of the first manufacturing method is to form the scanning signal line terminal portion, the image signal line terminal portion, or the uppermost transparent conductive layer of the counter electrode terminal portion and the transparent conductive film of the pixel electrode or the counter electrode at the same time. The pixel electrode and the counter electrode are formed of a transparent conductive film with increased work. In the liquid crystal display device of the present invention, at least one of the pixel electrode or the counter electrode is made of a transparent conductive film, which is related to Richard A. Soref,

Proceedings of the IEEE, 12月,1974,PP-1710-1711( 以後稱文獻1 )所記載之液晶顯示元件之結構不同之處如 下。 文獻1中,對應於圖素電極及對向電極之梳齒電極係 由透明導電膜構成。 然而,在形成液晶分子之初期配向狀態時,以8 5度 角度將S i 0予以斜向蒸著,而在各電極與液晶層之界面 於液晶分子故意的形成較高之預傾斜角。因此,如文獻1 中第1 ( b )圖所示,藉著在梳齒電極間施加電壓而從在 經濟部智慧財產局員工消費合作社印製 初期配向狀態下扭轉9 0度之均勻配向形成在電極間爲大 致上平行於基板面之均勻配向狀態,及在電極上垂直於基 板面之垂直(Homeotropic)配向狀態,做爲再配向狀態 〇 然而,依照這種結構,隨著電場之增加,2種液晶分 子之再配向狀態發生相補作用’可進行更明亮之顯示,但 因爲必須平均的增大液晶分子之傾斜角,故其視野角特性 變成狹小。 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) -11 - 494261 經濟部智慧財產局員工消費合作社印製 A7 ___B7_五、發明説明(9 ) 依照本發明之橫電場方式之液晶顯示裝置,即使爲了 產生寬視野角特性及良好之孔徑率而在圖素電極與對向電 極之間施加電壓,對顯示像發生影響之液晶分子之再配向 之部分儘可能保持平行於基板面之均勻配向狀態,而在透 明導電膜之電極上則對應於從初期配向方向旋轉之角度α ,電極上之穿透率與電極間之穿透率發生相補作用,實質 上可提高開口率。 本說明書中,所謂均勻配向狀態係指液晶層內之液晶 分子具有儘可能的平行於基板面或液晶層之界面之傾斜( 上昇)角之狀態。具體言之,從基板面或液晶層之界面傾 斜之傾斜角小於4 5度之狀態。因此,所謂垂直配向狀態 係指從基板面或液晶層之界面傾斜之傾斜角超過4 5度之 狀態。 第4 1 Α圖表示在基板面產生平行方向之電場之電極 結構中之液晶層內之電位分布圖。 圖中實線表示等電位線,電場向量朝向垂直於等電位 線之方向。電場向量E在電極中心上只產生垂直於基板面 之方向之成分Ey,但在中心部以外則又可產生水平於基 板面之成分E X。如第4 1 B、4 1 C圖所示,在該水平 成分亦即產生橫電場成分E X之領域內,電極間之液晶分 子從初期配向方向RDR朝向橫電場E X方向只旋轉旋轉 角α 〇 電極上之液晶分子因液晶中之彈性場而隨著電極間之 液晶分子之旋轉而旋轉。因此,電極上之中心之液晶分子 I紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ297公釐) -12 - 494261 A7 B7 五、發明説明(10 ) 未施加橫電場,但因彈性場而朝向與其周圍之液晶分子相 同之方向旋轉。亦即旋轉角α在電極間較大,在電極上則 減小,在電極中央部上成爲最小。 第4 2 Α〜C圖表示模擬其狀態之結果。 本實施例之模擬係利用液晶層之初期扭轉角大致上爲 零,初期配向方向RDR與施加電場E X所形成之初期配 向角炎L C = 7 5度,將液晶層之上下界面附近之液晶分 子之初期預傾斜角設定爲零度而做爲液晶分子之初期均勻 配向狀態,又使偏光板之一方之穿透軸與該初期配向方向 RD R成爲一致,並與另一偏光板之穿透軸成爲直角相交 ,以複折射模態顯示之結構例實施。 此時之光穿透率T/T。可由下式表示。 T/T〇=s i η2(2α eff) · s i η 2 ( π d e f f ·Δη/λ) ...... (1) 經濟部智慧財產局員工消費合作社印製 上式中,a e f f係液晶層之實效光軸與偏光穿透 軸所形成之角度。本實施例中爲液晶分子之旋轉角a之液 晶層厚度方向之實效值,亦即可當做假設相同之旋轉時之 平均值處理之虛值。 d e f f爲具有複折射性之實效液晶層之厚度, △ η爲折射率各向異性,λ爲光線之波長。 (1)式中,施加電場Ex時,a e f f之數值配 合其強度增大,在4 5度時成爲最大。 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -13 - 494261 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明説明(η ) 在本實施例之模擬中,將液晶 on ) Δ η · d eff選定爲光線 現複折射零次模態,而將介電係數 第4 2 A圖爲將可產生接近最 施加於I TO電極時之等電位線之 示液晶層之厚度(厚度4 · 0//m 對位置關係。圖中之數值表示規格 第42B、42C圖表示施加 成之橫電場成分E X時之液晶層內 及傾斜(上昇)角。 如第4 2 C圖所示,即使施加 分子幾乎不上昇。本實施例中,在 之傾斜角爲8度以下。如第4 2 B 分子在液晶層之中央附近大約旋轉 爲了說明之方便,第42C圖 以右方上昇爲正,左方上昇爲負。 ,即使在電極上液晶分子之旋轉角 穿透率。 與該動作最有關係者爲液晶之 扭轉彈性係數K 2愈小愈佳。該彈 液晶分子愈容易受到電極間之液晶 近電極間之液晶分子之旋轉角α。 第41D圖爲扭轉彈性係數ΚThe differences between the structures of the liquid crystal display elements described in Proceedings of the IEEE, December, 1974, PP-1710-1711 (hereinafter referred to as Document 1) are as follows. In Reference 1, the comb-shaped electrode corresponding to the pixel electrode and the counter electrode is made of a transparent conductive film. However, when the initial alignment state of the liquid crystal molecules is formed, Si 0 is vaporized obliquely at an angle of 85 degrees, and a high pretilt angle is intentionally formed at the interface between each electrode and the liquid crystal layer at the liquid crystal molecules. Therefore, as shown in Figure 1 (b) in Reference 1, by applying a voltage between the comb electrodes, a uniform orientation of 90 degrees is reversed from the initial orientation state printed in the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Between the electrodes is a uniform alignment state that is substantially parallel to the substrate surface, and a homeotropic alignment state on the electrodes that is perpendicular to the substrate surface, as the re-alignment state. However, according to this structure, as the electric field increases, 2 This kind of realignment of liquid crystal molecules can complement each other, and can display more brightly, but because the tilt angle of liquid crystal molecules must be increased evenly, its viewing angle characteristic becomes narrow. This paper size applies the Chinese National Standard (CNS) A4 specification (210X 297 mm) -11-494261 Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 ___B7_ V. Description of the invention (9) According to the horizontal electric field method of the present invention In a liquid crystal display device, even if a voltage is applied between the pixel electrode and the counter electrode in order to generate a wide viewing angle characteristic and a good aperture ratio, the realigned portion of the liquid crystal molecules that affect the display image is kept as parallel as possible to the substrate surface. The uniform orientation state of the transparent conductive film electrode corresponds to the angle of rotation α from the initial alignment direction. The penetration rate on the electrode and the penetration rate between the electrodes complement each other, which can substantially increase the aperture ratio. In this specification, the uniformly aligned state refers to a state in which the liquid crystal molecules in the liquid crystal layer have an inclination (rise) angle as parallel to the substrate surface or the interface of the liquid crystal layer as possible. Specifically, the inclination angle from the substrate surface or the interface of the liquid crystal layer is less than 45 degrees. Therefore, the so-called vertical alignment state refers to a state where the inclination angle from the substrate surface or the interface of the liquid crystal layer exceeds 45 degrees. Fig. 41A shows a potential distribution diagram in a liquid crystal layer in an electrode structure that generates an electric field in a parallel direction on a substrate surface. The solid line in the figure indicates the equipotential line, and the electric field vector is oriented perpendicular to the equipotential line. The electric field vector E generates only a component Ey in the direction perpendicular to the substrate surface at the center of the electrode, but it can generate a component E X horizontal to the substrate surface outside the center portion. As shown in Figures 4 1 B and 4 1 C, the liquid crystal molecules between the electrodes rotate only by the rotation angle α from the initial alignment direction RDR toward the horizontal electric field EX in the area where the horizontal component, that is, the horizontal electric field component EX, is generated. The liquid crystal molecules on it rotate with the rotation of the liquid crystal molecules between the electrodes due to the elastic field in the liquid crystal. Therefore, the paper size of the liquid crystal molecule I at the center of the electrode applies the Chinese National Standard (CNS) A4 specification (210 × 297 mm) -12-494261 A7 B7 V. Description of the invention (10) No transverse electric field is applied, but it is oriented due to the elastic field Rotate in the same direction as the liquid crystal molecules around it. In other words, the rotation angle α is large between the electrodes, decreases at the electrodes, and becomes minimum at the center portion of the electrodes. Figures 4 2 Α ~ C show the results of simulating the state. The simulation in this embodiment uses the initial twist angle of the liquid crystal layer to be substantially zero, the initial alignment direction RDR formed by the initial alignment direction RDR and the applied electric field EX, LC = 75 degrees, and the liquid crystal molecules near the upper and lower interfaces of the liquid crystal layer are formed. The initial pretilt angle is set to zero degrees as the initial uniform alignment state of the liquid crystal molecules, and the transmission axis of one side of the polarizing plate is consistent with the initial alignment direction RD R, and becomes a right angle with the transmission axis of the other polarizing plate. Intersect and implement the structure example shown in the birefringence mode. The light transmittance T / T at this time. It can be expressed by the following formula. T / T〇 = si η2 (2α eff) · si η 2 (π deff · Δη / λ) ...... (1) Printed by the Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs in the above formula, aeff is a liquid crystal layer The angle formed by the effective optical axis and the polarized light transmission axis. In this embodiment, the effective value of the liquid crystal layer thickness direction of the rotation angle a of the liquid crystal molecules can also be regarded as an imaginary value of the average value processing when assuming the same rotation. d e f f is the thickness of the effective liquid crystal layer with birefringence, Δ η is the refractive index anisotropy, and λ is the wavelength of light. In the formula (1), when the electric field Ex is applied, the numerical value of a e f f increases in intensity, and becomes maximum at 45 degrees. This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -13-494261 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (η) In the simulation of this embodiment, the liquid crystal on) Δ η · d eff is selected as the zero-order mode of light birefringence, and the dielectric coefficient No. 4 2 A is the thickness of the liquid crystal layer that will produce an isoelectric line close to the most applied to the I TO electrode (Thickness 4 · 0 // m vs. positional relationship. The values in the figure represent the specifications. Figures 42B and 42C show the liquid crystal layer and the tilt (rise) angle when the applied transverse electric field component EX is applied. As shown in Figure 4 2C In the present embodiment, the inclination angle is less than 8 degrees. For example, the 4 2 B molecule is rotated around the center of the liquid crystal layer. For convenience of explanation, the 42C diagram is ascended to the right as Positive, left rises to negative. Even the rotation angle transmittance of liquid crystal molecules on the electrode. The most relevant to this action is that the smaller the torsional elasticity coefficient K 2 of the liquid crystal is, the better. The more easily the liquid crystal molecules are affected by the electrode Jianjian LCD The liquid crystal molecules between the rotation angle α. 41D graph of the torsional spring constant Κ

層之阻尼(Retardati- 波長λ之二分之一而實 各向異性Δε設定爲正 大值之明亮顯示之電壓 狀態之特性圖,縱軸表 ),橫軸表示電極之相 化之電位強度。 從該等電位線之狀態形 之液晶分子之旋轉角α 電壓時,電極上之液晶 液晶層之全部厚度方向 圖所示,電極上之液晶 1 5〜3 5度。 所示之傾斜角之符號係 因此,本發明之方式中 α亦發生變化,可改變 扭轉彈性係數Κ2。該 性係數愈小,電極上之 分子之影響而旋轉,接 2大約爲1 0 X 請 先 閲 讀 背 之 注 意 事 項 再 填赢I 頁 訂 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -14 494261 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明(I2 ) 1 0 -1 2 N 〔N e w ton) 時之電極上及電極間之穿透率之分 布 〇 若 電 極 爲 透 明 時 , 由 於 上 述 電 極 上 之 液 晶 分 子 之 再 配 向 動 作 電 極 間 之 A 部 分 之 穿 透 率 之 平 均 穿 透 率 之 5 3 0 % 成 爲 電 極 上 之 B 部 分 之 穿 透 率 之 平 均 值 穿 透 率 〇 如 後 文 中 所 述 若 將 扭 轉 彈 性 係 數 K 2 設 定 爲 2 • 0 X 1 0 -1 2 N以下 則可使電極間之A部分之穿透係數之 平 均 穿 透 率 之 5 0 % 以 上 成 爲 電 極 上 之 B 部 分 之 穿 透 率 之 平 均 值 穿 透 率 〇 因 此 全 部 分 之 平 均 穿 透 率 成 爲 A + B 部 分 之 穿 透 率 之 平 均 值 穿 透 率 可 提 局 其 數 值 0 亦 即 與 習 用 之 由 完 全 不 透 光 之 金 屬 層 所 構 成 之 裝 置 比 較 可 實 質 上 提 局 每 一 mri 圖 素 之 孔 徑 率 〇 本 實 施 例 之 模 擬 時 y 係 將 初 期 傾 斜 角 設 定 爲 0 而 設 計 〇 但 實 際 上 > 必 須 利 用 研 磨 處 理 將 液 晶 層 與 配 向 膜 之 界 面 附 近 之 初 期 預 傾 斜 角 設 定 爲 大 約 1 0 度 以 下 > 最 好 爲 6 度 以 下 〇 在 後 述 之 實 施 例 中 係 設 定 爲 大 約 5 度 〇 將 初 期 預 傾 斜 角 設 定 在 上 述 範 圍 內 > 即 可 將 液 晶 層 界 面 之 液 晶 分 子 之 方 向 限 制 於 基 板 面 內 方 向 > 即 使 在 施 加 電 場 時 電 極 上 之 液 晶 層 之 平 均 傾 斜 角 仍 可 維 持 小 於 4 5 度 〇 亦 即 > 施 加 電 場 時 9 仍 可 防 止 電 極 上 之 液 晶 成 爲 垂 直 定 向 〇 第 4 4 圖 表 示 橫 電 場 方 式 之 液 晶 顯 示 裝 置 中 表 示 液 晶 層 內 之 液 晶 分 子 之 傾 斜 角 與 對 比 在 全 方 位 成 爲 1 0 以 上 之 視 野 角 範 圍 之 模 擬 結 果 之 特 性 圖 之 一 實 施 例 〇 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) -15 - 494261 A7 ___B7_ 五、發明説明(13 ) 亦即,若傾斜角爲3 0度左右,則對比在與垂直於顯 示面之方向成爲4 0度角度傾斜之視野角範圍內之全方位 成爲1 0以上,可產生大致上與習用之縱電場方式之液晶 顯示裝置相等之特性。尤其傾斜角愈小,視野角範圍愈擴 大’若爲1 0度左右,則可擴大至大約傾斜8 0度之視野 角範圍內,若爲5度以下,則可擴大至全部領域,可產生 寬視野角特性。 本實施例中,爲了經常減小未施加電場時及施加電場 時之電極間及透明電極上之液晶層內之液晶分子之平均傾 斜角,後述之配向膜OR I 1、OR I 2之研磨方向係設 定初期配向狀態,使2片基板SUB1、SUB2側之液 晶層之界面之液晶分子之初期預傾斜角成爲射流(spray )狀態,使液晶層之中央部附近之液晶分子儘可能的平行 於界面。 本發明之其他目的,特徵及動作狀態可由以下參照圖 式之說明成爲更明確。 以下參照圖式說明本發明之實施例。 經濟部智慧財產局員工消費合作社印製 (實施例1 ) 〔主動矩陣液晶顯示裝置〕 以下說明將本發明應用於主動矩陣方式之彩色液晶顯 示裝置之實施例。圖中具有相同功能之構件以相同記號表 示,省略重覆說明。 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -16 - 494261 A7 ___B7 五、發明説明(Η ) 〔矩陣部(圖素部)之平面結構〕 第1圖爲本發明之主動矩陣方式彩色液晶顯示裝置之 一圖素及其周邊之平面圖(圖中斜線部分表示透明導電膜 g 2 ) 〇 第1圖中,各圖素係配置在掃描信號(閘極信號線或 水平信號線)G L,對向電極信號線(對向電極配線) C L,與2條影像信號線(吸極信號線或垂直信號線) DL之交叉領域內(由4條領域線包圍之領域內)。各圖 素包括薄膜電晶體TFT,儲存電容器C s t g,圖素電 極PX,及對向電極CT。圖中,掃描信號線GL,對向 電壓信號線C L延伸至左右方向,而且在上下方向配置許 多條。影像信號線D L延伸至上下方向,並且在左右方向 配置許多條。圖素電極PX經由源極SD1連接於薄膜電 晶體TFT,而對向電極CT與對向電壓信號線CL成爲 一體。 經濟部智慧財產局員工消費合作社印製 沿著影像信號線D L上下鄰接之2個圖素在將第1圖 於A線彎折時,其平面結構成爲重疊。其理由爲,以沿著 影像信號線D L上下的鄰接之2個圖素將對向電壓信號線 C L共通化,擴大對向電壓信號線C L之電極寬度而減小 對向電壓信號線C L之電阻。如此,較容易從外部電路將The damping of the layer (Retardati-half of the wavelength λ and the anisotropy Δε is set to a positive value of the bright display of the voltage state characteristic chart, the vertical axis table), the horizontal axis represents the potential strength of the electrode phase. When the voltage of the rotation angle α of the liquid crystal molecules from the state of the equipotential lines is shown in the thickness direction of the liquid crystal liquid crystal layer on the electrode, the liquid crystal on the electrode is 15 to 35 degrees. The sign of the tilt angle is shown. Therefore, in the mode of the present invention, α is also changed, and the torsional elastic coefficient K2 can be changed. The smaller the coefficient of this property, the effect of the molecules on the electrode rotates. The value of 2 is about 10 X. Please read the precautions on the back before filling in page I. The paper size applies to the Chinese National Standard (CNS) A4 specification (210X297). (%) -14 494261 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Disclosure of Invention (I2) 1 0 -1 2 N (N ew ton). When the electrode is transparent, due to the realignment of the liquid crystal molecules on the above electrode, the average transmittance of part A between the electrodes is 5 30%, which becomes the average value of the transmittance of part B on the electrode. Rate 〇 As described later, if the torsional elastic coefficient K 2 is set to 2 • 0 X 1 0 -1 2 N or less, 50% or more of the average penetration of the penetration coefficient of the part A between the electrodes becomes The average transmittance of part B on the electrode The average transmission rate becomes the average transmission rate of the A + B part. The transmission rate can be improved. Its value is 0, which means that compared with the conventional device composed of a completely opaque metal layer, it can substantially improve The aperture ratio of one mri pixel. In the simulation of this embodiment, y was designed by setting the initial tilt angle to 0. However, in practice, it is necessary to set the initial pre-tilt angle near the interface between the liquid crystal layer and the alignment film by polishing. 10 ° or less > 6 ° or less is preferred. In the embodiment described later, it is set to about 5 °. By setting the initial pretilt angle within the above range, the liquid crystal molecules at the interface of the liquid crystal layer can be changed. The direction is limited to the in-plane direction of the substrate > The average tilt angle of the liquid crystal layer on the electrode can be maintained less than 45 degrees even when an electric field is applied, that is, when an electric field is applied 9 It is still possible to prevent the liquid crystal on the electrode from becoming vertically oriented. Figure 4 4 shows the simulation of the tilt angle and contrast of the liquid crystal molecules in the liquid crystal layer in the liquid crystal display device of the transverse electric field method in a viewing angle range of 10 or more in all directions. An example of the characteristic chart of the result. 0 This paper size applies the Chinese National Standard (CNS) A4 specification (210X 297 mm) -15-494261 A7 ___B7_ V. Description of the invention (13) That is, if the inclination angle is 30 degrees Left and right, the contrast will be more than 10 in all directions within a viewing angle range that is 40 degrees oblique to the direction perpendicular to the display surface, and can produce characteristics that are roughly equivalent to the conventional liquid crystal display device of the vertical electric field method. In particular, the smaller the angle of inclination, the wider the range of the viewing angle. 'If it is about 10 degrees, it can be expanded to a range of about 80 degrees of inclination. If it is less than 5 degrees, it can be expanded to all areas, resulting in a wide range. Viewing angle characteristics. In this embodiment, in order to often reduce the average tilt angle of the liquid crystal molecules between the electrodes when the electric field is not applied and between the electrodes and the liquid crystal layer on the transparent electrode, the polishing directions of the alignment films OR I 1 and OR I 2 described later The initial alignment state is set so that the initial pretilt angle of the liquid crystal molecules at the interface of the liquid crystal layer on the two substrates SUB1 and SUB2 sides becomes a spray state, so that the liquid crystal molecules near the center of the liquid crystal layer are as parallel to the interface as possible. . Other objects, features, and operating states of the present invention will become clearer from the following description with reference to the drawings. Hereinafter, embodiments of the present invention will be described with reference to the drawings. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs (Embodiment 1) [Active Matrix Liquid Crystal Display Device] The following describes an embodiment in which the present invention is applied to an active matrix color liquid crystal display device. Components with the same functions in the figure are indicated by the same symbols, and repeated explanations are omitted. This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -16-494261 A7 ___B7 V. Description of the invention (Η) [Plane structure of the matrix section (pixel section)] Figure 1 is the initiative of the invention A plan view of one pixel and its surroundings of a matrix-type color liquid crystal display device (the oblique line in the figure indicates the transparent conductive film g 2). In the first figure, each pixel is arranged on a scanning signal (gate signal line or horizontal signal line) ) GL, counter electrode signal line (counter electrode wiring) CL, and 2 video signal lines (suction electrode line or vertical signal line) DL (in the area surrounded by 4 field lines). Each pixel includes a thin film transistor TFT, a storage capacitor C s t g, a pixel electrode PX, and a counter electrode CT. In the figure, the scanning signal lines GL extend opposite to the voltage signal lines C L in the left-right direction, and a plurality of them are arranged in the up-down direction. The video signal line D L extends to the up-down direction, and many lines are arranged in the left-right direction. The pixel electrode PX is connected to the thin-film transistor TFT via the source SD1, and the counter electrode CT and the counter voltage signal line CL are integrated. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. The two pixels adjacent to each other along the image signal line D L are folded in the plane structure when the first image is bent on line A. The reason is that the opposing voltage signal line CL is made common by the two adjacent pixels along the video signal line DL, the electrode width of the opposing voltage signal line CL is enlarged, and the resistance of the opposing voltage signal line CL is reduced. . In this way, it is easier to transfer

對向電壓充分的供給於左右方向之各圖素之對向電極C T 〇 圖素電極PX與對向電極CT互相對向,由各圖素電 極P X與對向電極c T間之電場控制液晶L C之光學狀態 ^紙張尺度適用中國國家標準(〇~5)八4規格(210/ 297公釐) 一 17 - 494261 A7 _ B7_ 五、發明説明(15 ) ,以便控制顯示。圖素電極P X及對向電極c T成各梳齒 狀,分別在圖之上下方向形成細長電極。 1個圖素內之對向電極CT之數量0 (梳齒之數量) 必須與圖素電極PX之數量(梳齒之數量)P保持0 = P + 1之關係(本實施例中爲0=3 ,p = 2。其理由爲將 對向電極C T與圖素電極P X交替的配置,而且使對向電 極C T必定鄰接於影像信號線D L。如此,可用對向電極 C 丁屏蔽從影像信號線D L產生之電力線,避免對向電極 C T與圖素電極P X間之電場受到從影像信號線D L產生 之電場之影響。因爲對向電極C T經常從外部經由後述之 對向電壓信號線D L供給電位,故其電位非常穩定。因此 ,即使鄰接影像信號線DL,其電位幾乎不變動。因此, 圖素電極P X與影像信號線D L間之幾何學位置變成較遠 ,故圖素電極P X與影像信號線D L間之寄生電容量大幅 度的減少,又可抑制圖素電極電位V s之影像信號電壓所 造成之變動。因此,可抑制產生於上下方向之串音(被稱 爲縱向污點之畫質不良。 經濟部智慧財產局員工消費合作社印製 圖素電極P X及對向電極C T之電極寬度分別爲6 //m。爲了對液晶層之厚度方向在全部液晶層施加充分之 電場,將寬度設定爲充分大於後述之液晶層之厚度3 . 9 //m,而爲了儘量增大孔徑率,儘可能的形成爲較細。又 爲了防止斷線,將影像信號線D L之電極寬度形成爲較圖 素電極P X及對向電極CT稍寬之8 μ m。此時,將影像 信號線D L之電極寬度設定成爲鄰接之對向電極C T之電 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 一 一 18 - 494261 經濟部智慧財產局員工消費合作社印製 A7 B7__五、發明説明(16 ) 極寬度之2倍以下。若影像信號線0 L之電極寬度根據良 品率之生產性而已確定時,則將鄰接於影像信號線0 L之 對向電極c τ之電極寬度設定爲影像信號線D ^之電極寬 度之二分之一以上。其理由爲以兩旁之對向電極C T吸收 從影像信號線D L產生之電力線。爲了吸收從某一電極寬 度產生之電力線,需要具有大於其寬度之電極寬度之電極 。因此,只要兩旁之對向電極C T分別吸收從影像信號線 D L之電極之一半(4 vm)產生之電力線即可,故將鄰 接於影像信號線D L之對向電極C T之電極寬度設定爲二 分之一以上。如此,可利用影像信號之影響防止串音所產 生之尤其是上下方向(縱方向之串音)。 掃描信號線G L將電極寬度設定以便滿足使掃描電壓 可充分施加於終端之圖素(後述之掃描電極端子GTM之 相反側)之閘極G T所需之電阻值。對向電壓信號線C L 亦設定電極寬度以便滿足使對向電壓可施加於終端之圖素 (後述之共同匯流排線C B之相反側)之對向電極C T所 需之電阻值。 圖素電極P X與對向電極C T間之電極間隔依照使用 之液晶材料更換。其理由爲,因爲達成最大穿透率之電場 強度依照液晶材料而不同,故配合液晶材料設定電極間隔 ’以便可在由使用之影像信號驅動電路(信號側驅動器) 之耐壓設定之信號電壓之最大振幅範圍內產生最大穿透率 。若使用後述之液晶材料時,電極間隔爲1 6 /zm。 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 494261 經濟部智慧財產局員工消費合作社印製 A7 B7五、發明説明(17 ) 〔矩陣部(圖素部)之斷面結構〕 第2圖爲第1圖中沿3—3線之斷面圖。第3圖爲第 1圖中沿4 一 4線之薄膜電晶體TF T之斷面圖。第4圖 爲第1圖中沿5 — 5線之儲存電容器C s t g之斷面圖。 如第2〜4圖所示,以液晶層L C爲基準在下部透明玻璃 基板SUB 1側形成有薄膜電晶體TFT,儲存電容器 Cs tg,及電極群,而在上部透明玻璃基板SUB2側 形成有彩色濾光器F I L,遮光用黑色矩陣圖型BM。 在各透明玻璃基板S U B 1 ,S U B 2之內側(液晶 L C側)表面設有控制液晶之初期配向之配向膜0 R I 1 、〇RI 2,而在各透明玻璃基板SUB1 、SUB2之 外側表面設有與偏光軸成爲垂直相交之偏光板。 〔T F T基板〕 首先詳細說明下側透明玻璃基板S U B 1側(T F T 基板)之結構。 〔薄膜電晶體T F T〕 薄膜電晶體TFT在閘極GT上施加正偏壓後,使源 極與吸極間之通道電阻減小,若偏壓變成0時,使通道電 阻增大。 如第3圖所示,薄膜電晶體T F T具有閘極G T,閘 極絕緣膜GI ,由i型(直性,intrinsic,未摻雜導電 型決定用不純物)非晶質矽(S i )所構成之i型半導體 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) — -20 - 494261 A7 B7 五、發明説明(18 ) 層AS,一對源極SD1 ,吸極SD2。源極,吸極本來 係依照其間之偏壓極性決定,在該液晶顯示裝置之電路中 其極性在動作當中反轉,故源極、吸極在動作當中會更換 。在以下之說明中,爲了說明之方便將一方設定爲源極, 另一方設定爲吸極。 〔閘極G T〕 閘極G T與掃描信號線G L成爲連續,而使掃描信號 線G L之一部分領域成爲閘極G T。閘極G T係超過薄膜 電晶體T F T之主動領域之部分,而且形成比其形狀更大 ,以便完全披覆(從下方觀察時)i型半導體層AS。如 此,除了產生閘極G T之作用以外,又防止外部光線及背 光照射到i型半導體層A S。本實施例中,閘極G T係由 單層導電膜g 1形成。導電膜g 1係使用以例如濺射形成 之鋁膜,在其上面設有鋁之陽極氧化膜AOF。 〔掃描信號線G L〕 經濟部智慧財產局員工消費合作社印製 掃描信號線G L係由導電膜g 1構成。該掃描信號線 GL之導電膜g1係在與閘極GT之導電膜g1相同之製 程中形成,而且成爲一體。外部電路之閘極電壓V g經由 該掃描信號線GL供給於閘極GT。在掃描信號線GL上 亦設有鋁之陽極氧化膜AOF。與影像信號線DL交叉之 部分爲了減少與影像信號線D L發生短路之或然率而形成 爲細小,而且形成爲雙叉狀,以便萬一發生短路時’可利 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -21 494261 A7 B7 五、發明説明(l9 ) 用雷射修正將短路分離 〔對向電極c 對向電極 層之導電膜g 氧化膜A〇F 本實施例中, 號線D L之最 驅動電壓V d 體元件T F 丁 gh )電壓△ V 使用之積體電 交流電壓即可 T〕 c T係由與閘極G 1構成。在對向電 。對向電極C T上 對向電壓V C O m 小位準之驅動電壓 m a X之中間直流 成爲斷路狀態時產 s之電位。但若希 路之電源電壓減小 T及掃描信 極C T上亦 施加對向電 係設定在較 V d m i η 電位低相當 生之場通( 望將影像信 爲大約一半 號線G L同一* 設有鋁之陽極 壓 V c 〇 m 〇 施加於影像信 與最大位準之 於使薄膜電晶 Field Throu-號驅動電路所 時,只要施加 請 先 閱 讀 背 面 之 注 意 事 項 再 填 訂 經濟部智慧財產局員工消費合作社印製 〔對向電壓信號線C L〕 對向電壓信號線C L係由導電膜g 1構成。該對向電 壓信號線C L之導電膜g 1係在與閘極G T,掃描信號線 GL,及對向電極CT之導電膜g 1相同之製程中形成, 而且與對向電極C T成爲一體。外部電路將對向電壓 Vc om經由對向電壓信號線CL供給於對向電極CT。 在對向電壓信號線CL上亦設有鋁之陽極氧化膜AOF。 與影像信號線D L交叉之部分與掃描信號線G L相同的, 爲了減小其與影像信號線D L發生短路之或然率而形成爲 細小,而且形成爲雙叉狀,以便萬一發生短路時,可利用 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -22 - 494261 A7 B7 五、發明説明(20 雷射修正分離 〔絕緣膜G I〕 絕緣膜GI在薄膜電晶體TFT中與閘極GT—起用 來做爲供給電場於半導體層A S之閘極絕緣膜。絕緣膜 GI係形成在閘極GT及掃描信號線GL之上層。絕緣膜 G I係選用例如由電漿CVD形成之氮化矽膜,而且形成 爲1 200〜2700A之厚度(本實施例中爲24〇〇 A左右)。閘極絕緣膜G I包圍全部矩陣部AR,周邊部 被去除以便露出外部連接端子DTM,GTM。絕緣膜 G I又可絕緣掃描信號線G L及對向電壓信號線C L與影 像信號線D L。 〔i型半導體層A S〕 i型半導體層A S係由非晶質矽形成爲2 0 0〜 2200A之厚度(本實施例中爲2000A之膜厚)。 d〇層係將歐姆接觸用之磷(P)摻雜之N ( + )型非晶 質矽半導體層,只殘留在下側有i型半導體層AS,上側 有導電層dl (d2)之處。 i型半導體層A S又設在掃描信號線G L及對向電壓 信號線C L與影像信號線D L之交叉部之兩者之間。該交 叉部之i型半導體層A S可減少交叉部之掃描信號線G L 及對向電壓信號線C L與影像信號線D L發生短路。 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 請 先 閲 讀 背 之 注 意 事 項 頁 經濟部智慧財產局員工消費合作社印製 -23 - 494261 A7 ---_ _B7 五、發明説明(21 ) 〔源極SD1 ,吸極SD2〕 源極SD1 、吸極SD2分別由接觸N ( + )型半導 胃靥d 〇之導電膜d 1及形成於其上之導電膜d 2所構成 〇 導電膜d 1係使用以濺射法形成之C r膜,並形成 5 〇 0〜1 Ο Ο 0A之厚度(本實施例爲6 Ο 0A左右。 r膜之厚度太厚,則其應力增大,故不可超過 2 〇 〇 0A左右之膜厚。C r膜可改善與N ( + )型半導 體層d 〇之黏接性,並爲了防止導電膜d 2之Aj?擴散至 N ( + )型半導體層d 0 (亦即阻擋層)而使用。導電膜 d 1除了 C r膜之外亦可使用高融點金屬(Mo ,T i , Ta ,w)膜,高融點金屬矽化物(MoSi2, TiSi2,TaSi2,WSi2)膜。 導電膜d 2係利用Aj?之濺射形成爲3 0 0 0〜 5〇〇〇A之厚度(本實施例中爲4000A左右)。 經濟部智慧財產局員工消費合作社印製 A义膜之應力比C r膜小,可形成爲較厚之膜厚,而且可 減小源極S D 1 ,吸極S D 2,及影像信號線D L之電阻 值,或確實發生起因於閘極GT或i型半導體層A S而造 成之段落差之超過(可改善階距有效區域)。 以相同之掩罩圖型形成導電膜d 1 ,導電膜d 2之圖 型後,使用同一掩罩,或使用導電膜dl ,導電膜d2去 除N ( + )型半導體層dO。亦即以自行對準(seif Align)去除殘留於i型半導體層AS上之N ( + )型半 導體層d〇之導電膜dl ,d2以外之部分。此時,N + 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 一 24 - 494261 A7 B7 五、發明説明(22 ) 型半導體層d 0之厚度全部被蝕刻,故i型半導體層A S 之若千表面部分亦被蝕刻,但只要控制蝕刻時間即可解決 請 先 閲 讀 背 之 注 意 事 項 再 填 馬 本 頁 〔影像信號線D L〕 影像信號線DL係由與源極SD1 ,吸極SD2同一 層之第2導電膜d2,第3導電膜d3所構成。影像信號 線D L與吸極S D 2成爲一體。 由透明導電層g 2形成。該透明導電 形成之透明導電膜(Indium-Tin-並形成爲 100 〜 2000A 之厚 400A左右之膜厚)。 經濟部智慧財產局員工消費合作社印製 〔圖素電極P X〕 圖素電極P X係 膜g 2係由以濺射法 Oxide: ITO)所構成 1 度(本實施例中爲1 如本實施例中因 穿透光可提高進行白 素電極爲不透明時比 後述,因爲未施加電 且配置偏光板以便在 常黑色模態),故雖 該部分,可顯示良質 而且可達成充分之對 〔儲存電容量C s t 爲圖素電極爲透明,故穿透該部分之 色顯示時之最大穿透率,因此,與圖 較,可進行更明亮之顯示。此時,如 壓時液晶分子保持初期配向狀態,而 該狀態下進行黑色顯示(使其成爲正 然圖素電極爲透明,光線亦不會通過 之黑色。因此,可提高最大穿透率, 比0 g 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ297公釐) 25 - 494261 經濟部智慧財產局員工消費合作社印製 A7 B7五、發明説明(23 ) 圖素電極P X係形成在與連接於薄膜電晶體T F T之 端部相反之端部,重疊於對向電壓信號線C L。由第4圖 可知,該重疊形成以圖素電極P X做爲一電極P L 2,以 對向電壓信號線C L做爲另一電極P L 1之儲存電容器( 靜電電容元件)Cstg。該儲存電容器Cstg之介電 質膜係由做爲薄膜電晶體T F T之閘極絕緣膜使用之絕緣 膜GI及陽極氧化膜AOF所構成。 如第1圖所示,在平面上,儲存電容器Cs tg係形 成於對向電壓信號線CL之導電膜g1之寬度擴大之部分 〇 〔保護膜P S V 1〕 在薄膜電晶體TFT上設有保護膜PSV1。保護膜 P SV 1主要是爲了保護薄膜電晶體TFT不受到濕氣而 形成。一般係使用透明度高,耐顯性佳之物質。保護膜 P SV 1係以例如利用電漿CVD裝置製成之氧化矽膜或 氮化砂膜所構成,其膜厚爲1 //m左右。 保護膜P SV 1包圍全部矩陣部AR,其周邊部被去 除以便露出外部連接端子DTM、GTM。保護膜 P SV 1與閘極絕緣膜G I之厚度關係爲,前者考慮保護 效果而形成較厚,後者考慮電晶體之互導gm而形成較薄 。保護效果高之保護膜P SV 1形成爲大於閘極絕緣膜 GI ,以便保護周邊部之廣大範圍。 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -26 - 494261 A7 B7 五、發明説明(24 ) [彩色濾光器基板〕 以下參照第1 、2圖說明上側透明玻璃基板SUB 2 側(彩色濾光器基板)之結構。 〔遮光膜B Μ〕 上部透明玻璃基板SUB 2側形成有遮光膜ΒΜ (所 謂之黑色矩陣)以防止從不需要之間隙(圖素電極PX與 對向電極CT間以外之間隙)射出之穿透光射出於顯示面 而降低對比等。遮光膜BM又有防止背光射入i型半導體 層A S之功能。亦即,薄膜電晶體T F T之i型半導體層 A S被位於上下之遮光膜BM與較大之閘極G T挾持,故 外部之自然光及背光不會照到。 第1圖所示之遮光膜BM之閉合之多角形輪廓線之內 側表示不形成遮光膜BM之開口。該輪廓線之圖型只爲一 實施例。若需要加大開口部分時,亦可形成爲第1圖中虛 線所示之遮光膜BM1。第1圖中放大之領域內之電場方 向不整齊,但該部分之顯示以1對1對應於圖素內之影像 資訊,若在黑色時變黑,在白色時變白,故可做爲顯示之 一部分利用。圖中上下方向之分界線根據上下基板之對正 精確度決定,若對正精確度高於鄰接影像信號線D L之對 向電極C T之電極寬度時,設定在對向電極之寬度之間, 即可更擴大開口部。 遮光膜BM具有遮光性,而且由絕緣性高之膜形成以 防止影響圖素電極P X與對向電極C T間之電場。本實施 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) (請先閲讀背面之注意事項再填寫本頁) 訂 經濟部智慧財產局員工消費合作社印製 -27 - 494261 A7 B7 經濟部智慧財產局員工消費合作社印製 五、 發明説明(25 ) 例 中 係 在 抗 蝕 材 料 中 混 入 黑 色 顏 料 , 形 成 爲 1 • 2 β m 左 右 之 厚 度 〇 遮 光 膜 B Μ 係 在 各 圖 素 周 圍 形 成 爲 格 子 狀 » 以 該 格 子 劃 分 1 個 圖 素 之 有 效 顯 示 領 域 〇 因 此 遮 光 膜 Β Μ 可 使 各 圖 素 之 輪 廓 成 爲 極 明 顯 〇 亦 即 y 遮 光 膜 B Μ 具 有 黑 色 矩 陣 及 對 i 型 半 導 體 層 A S 之 遮 光 等 2 種 功 能 〇 遮 光 膜 B Μ 又 在 周 邊 部 形 成 爲 圖 框 狀 贅 其 圖 型 連 續 於 3TU 55C 有 點 狀 之 許 多 開 □ 之 第 1 rg| 圖 所 示 矩 陣 部 之 圖 部 〇 遮 光 部 之 遮 光 膜 B Μ 延 伸 至 封 閉 部 S L 之 外 側 以 便 防 止 因 個 人 電 腦 等 實 際 機 器 所 造 成 之 反 射 光 之 洩 漏 光 進 入 矩 陣 部 〇 另 一 方 面 該 遮 光 膜 B Μ 係 設 在 較 基 板 S U Β 2 之 邊 緣 大 約 0 • 3 1 • 0 m m 左 右 之 內 側 > 避 開 基 板 S U Β 2 之 切 me. 斷 領 域 〇 [ 彩 色 濾 光 器 F I L ] 彩 色 濾 光 器 F I L 係 在 對 向 於 圖 素 之 位 置 形 成 爲 反 復 紅 綠 、 藍 色 之 條 紋 狀 0 彩 色 濾 光 器 F I L 重 疊 於 遮 光 膜 B Μ 之 邊 緣 部 分 〇 彩 色 濾 光 器 F I L 可 如 下 所 述 的 形 成 〇 首 先 在 上 部 透 明 玻 璃 基 板 S U B 2 表 面 形 成 丙 烯 系 樹 脂 等 染 色 基 材 後 利 用 光 學 石 版 印 刷 技 術 去 除 紅 色 濾 光 器 形 成 領 域 以 外 之 染 色 基 材 〇 然 後 ϊ 以 紅 色 染 料 將 染 色 基 材 染 色 9 實 施 固 定 處 理 形 成 紅 色 Μ 光 器 R 〇 然 後 實 施 相 同 之 作 業 依 次 形 成 綠 色 濾 光 器 G 藍 色 濾 光 器 B 〇 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 一 28 -The counter electrode CT, which supplies the pixels in the left and right directions with sufficient counter voltages, 〇 The pixel electrode PX and the counter electrode CT face each other, and the liquid crystal LC is controlled by the electric field between each pixel electrode PX and the counter electrode c T. The optical state ^ paper size is applicable to the Chinese national standard (0 ~ 5), 8 specifications (210/297 mm)-17-494261 A7 _ B7_ V. Description of the invention (15) in order to control the display. The pixel electrode P X and the counter electrode c T are formed in comb-like shapes, and elongated electrodes are formed in the upper and lower directions of the figure, respectively. The number of counter electrodes CT in one pixel 0 (the number of comb teeth) must be maintained in a relationship of 0 = P + 1 with the number of pixel electrodes PX (the number of comb teeth) (in this embodiment, 0 = 3, p = 2. The reason is that the counter electrode CT and the pixel electrode PX are alternately arranged, and the counter electrode CT must be adjacent to the video signal line DL. In this way, the counter electrode C can be used to shield the video signal line The power lines generated by DL avoid the influence of the electric field between the counter electrode CT and the pixel electrode PX from the electric field generated from the image signal line DL. Because the counter electrode CT is often supplied with a potential from the outside through the counter voltage signal line DL described later, Therefore, its potential is very stable. Therefore, even if it is adjacent to the image signal line DL, its potential does not change. Therefore, the geometric position between the pixel electrode PX and the image signal line DL becomes far away, so the pixel electrode PX and the image signal line The parasitic capacitance between DL is greatly reduced, and the variation caused by the image signal voltage of the pixel electrode potential V s can be suppressed. Therefore, crosstalk (called a picture of vertical stains) generated in the vertical direction can be suppressed. The electrode width of the pixel electrode PX and the counter electrode CT printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs is 6 // m. In order to apply a sufficient electric field to the liquid crystal layer in the thickness direction, the width is set. In order to be sufficiently larger than the thickness of the liquid crystal layer described later, 3.9 // m, and in order to increase the aperture ratio as much as possible, it is formed as thin as possible. In order to prevent disconnection, the electrode signal width of the image signal line DL is formed as shown in the figure. The element electrode PX and the counter electrode CT are slightly wider than 8 μm. At this time, the electrode width of the image signal line DL is set to the adjacent counter electrode CT. The paper size applies the Chinese National Standard (CNS) A4 specification (210X297). (Mm) 111-494261 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7__V. Description of the invention (16) Less than twice the width of the electrode. If the width of the electrode of the image signal line 0 L is based on the yield When it is determined, the electrode width of the counter electrode c τ adjacent to the video signal line 0 L is set to be more than one-half of the electrode width of the video signal line D ^. The reason is to use two pairs of opposite sides. The electrode CT absorbs the power lines generated from the image signal line DL. In order to absorb the power lines generated from a certain electrode width, an electrode having an electrode width larger than its width is required. Therefore, as long as the opposite electrodes CT on both sides absorb the image signal lines DL separately The power line generated by one half of the electrode (4 vm) is sufficient, so the electrode width of the counter electrode CT adjacent to the image signal line DL is set to more than half. In this way, the influence of the image signal can be used to prevent crosstalk. Especially generated in the up-down direction (cross-talk in the vertical direction). The scanning signal line GL sets the electrode width so as to satisfy the gate GT that allows the scanning voltage to be fully applied to the terminal pixels (the opposite side of the scanning electrode terminal GTM described later). The required resistance value. The counter voltage signal line C L also sets the electrode width so as to satisfy the resistance value required for the counter electrode C T of the pixel (the opposite side of the common bus line C B to be described later) that the counter voltage can be applied to the terminal. The electrode interval between the pixel electrode P X and the counter electrode C T is changed according to the liquid crystal material used. The reason is that because the electric field strength that achieves the maximum transmittance varies according to the liquid crystal material, the electrode interval is set in accordance with the liquid crystal material so that the signal voltage can be set at the withstand voltage of the video signal driving circuit (signal driver) used. The maximum transmittance is produced in the maximum amplitude range. When a liquid crystal material described later is used, the electrode interval is 16 / zm. This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) 494261 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (17) [Sectional structure of the matrix department (pixel unit)] Figure 2 is a cross-sectional view taken along line 3-3 in Figure 1. Fig. 3 is a sectional view of the thin film transistor TF T taken along line 4 to 4 in Fig. 1. Fig. 4 is a sectional view of the storage capacitor C s t g along line 5-5 in Fig. 1. As shown in Figs. 2 to 4, a thin film transistor TFT, a storage capacitor Cs tg, and an electrode group are formed on the lower transparent glass substrate SUB 1 side with the liquid crystal layer LC as a reference, and a color is formed on the upper transparent glass substrate SUB 2 side. Filter FIL, black matrix pattern BM for shading. Alignment films 0 RI 1 and 0RI 2 that control the initial alignment of the liquid crystal are provided on the inner (liquid crystal LC side) surface of each transparent glass substrate SUB 1 and SUB 2, and on the outer surface of each transparent glass substrate SUB 1 and SUB 2 A polarizing plate that intersects the polarizing axis perpendicularly. [T F T substrate] First, the structure of the lower transparent glass substrate S U B 1 side (T F T substrate) will be described in detail. [Thin Film Transistor T F T] After applying a positive bias to the gate electrode GT of the thin film transistor TFT, the channel resistance between the source and the sink decreases. If the bias voltage becomes zero, the channel resistance increases. As shown in Figure 3, the thin-film transistor TFT has a gate GT and a gate insulating film GI. It is composed of i-type (straight, intrinsic, impurity doped with non-conductive type) amorphous silicon (S i). The paper size of the i-type semiconductor is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) — -20-494261 A7 B7 V. Description of the invention (18) Layer AS, a pair of source SD1, sink SD2. The source and the sink are originally determined according to the polarity of the bias therebetween. In the circuit of the liquid crystal display device, the polarity is reversed during the operation, so the source and the sink are replaced during the operation. In the following description, for convenience of explanation, one side is set as a source, and the other is set as an sink. [Gate G T] The gate G T and the scanning signal line G L are continuous, and a part of the scanning signal line G L is a gate G T. The gate G T is a part that exceeds the active area of the thin film transistor T F T and is formed larger than its shape so as to completely cover (when viewed from below) the i-type semiconductor layer AS. In this way, in addition to the effect of generating the gate G T, the i-type semiconductor layer A S is prevented from being irradiated with external light and backlight. In this embodiment, the gate G T is formed of a single-layer conductive film g 1. The conductive film g 1 is an aluminum film formed by, for example, sputtering, and an anodized aluminum film AOF is provided on the aluminum film. [Scanning Signal Line G L] Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economy The scanning signal line G L is composed of a conductive film g 1. The conductive film g1 of the scanning signal line GL is formed in the same process as the conductive film g1 of the gate GT and is integrated. The gate voltage V g of the external circuit is supplied to the gate GT via the scanning signal line GL. An anodic oxide film AOF of aluminum is also provided on the scanning signal line GL. The part crossing the image signal line DL is formed to be small and double-forked in order to reduce the probability of a short circuit with the image signal line DL, so that in the event of a short circuit, the paper standard of China can be adapted to the Chinese National Standard (CNS) A4 specifications (210X297 mm) -21 494261 A7 B7 V. Description of the invention (l9) Use laser correction to separate the short circuit [opposite electrode c conductive film of the counter electrode layer g oxide film A0F In this embodiment, No. The maximum driving voltage of the line DL is V d, the body element TF d gh), and the voltage Δ V can be used as the integrated electric AC voltage T] c T is composed of the gate G 1. Opposite electricity. The intermediate DC of the driving voltage m a X of the counter voltage V C O m on the counter electrode C T becomes a potential of s when the circuit is in an open state. However, if the power supply voltage of Hillow is reduced by T and the scanning signal CT is also applied, the opposing electrical system is set to a field voltage that is relatively lower than the potential of V dmi η (I hope the image signal is about half the line GL is the same. * Set The anode voltage of aluminum V c 〇m 〇 is applied to the image signal and the maximum level is to make the thin film transistor Field Throu- drive circuit, as long as it is applied, please read the precautions on the back before filling in the Intellectual Property Bureau staff of the Ministry of Economic Affairs Printed by a consumer cooperative [opposite voltage signal line CL] The opposing voltage signal line CL is composed of a conductive film g1. The conductive film g1 of the opposing voltage signal line CL is connected to the gate GT and the scanning signal line GL, It is formed in the same process as the conductive film g 1 of the counter electrode CT, and is integrated with the counter electrode CT. An external circuit supplies the counter voltage Vc om to the counter electrode CT via the counter voltage signal line CL. The voltage signal line CL is also provided with an aluminum anodized film AOF. The portion crossing the image signal line DL is the same as the scanning signal line GL, and is formed to reduce the probability of a short circuit with the image signal line DL. It is small and double-forked, so that in case of a short circuit, the paper size can be used in accordance with Chinese National Standard (CNS) A4 (210X297 mm) -22-494261 A7 B7 V. Description of the invention (20 laser correction [Insulation film GI] The insulation film GI is used as a gate insulation film for supplying electric field to the semiconductor layer AS in the thin film transistor TFT. The insulation film GI is formed on the gate GT and the scanning signal line GL. Upper layer. The insulating film GI is made of, for example, a silicon nitride film formed by plasma CVD, and is formed to a thickness of about 1 200 to 2700 A (about 2400 A in this embodiment). The gate insulating film GI surrounds the entire matrix The part AR and the peripheral part are removed so as to expose the external connection terminals DTM and GTM. The insulating film GI can insulate the scanning signal line GL, the opposing voltage signal line CL and the image signal line DL. [I-type semiconductor layer AS] i-type semiconductor layer The AS system is formed of amorphous silicon to a thickness of 2000 to 2200 A (a film thickness of 2000 A in this embodiment). The d0 layer is an N (+) type non-doped phosphorous (P) doped for ohmic contact. Crystalline silicon semiconductor layer, only remaining below There is an i-type semiconductor layer AS, and a conductive layer dl (d2) is provided on the upper side. The i-type semiconductor layer AS is provided between the scanning signal line GL and the intersection of the opposing voltage signal line CL and the image signal line DL. The i-type semiconductor layer AS of the cross section can reduce the short circuit between the scanning signal line GL and the opposing voltage signal line CL and the image signal line DL of the cross section. This paper size applies to the Chinese National Standard (CNS) A4 specification (210X297 mm) ) Please read the note on the back page printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs -23-494261 A7 ---_ _B7 V. Description of the invention (21) [Source SD1, sink SD2] Source SD1, sink The pole SD2 is composed of a conductive film d 1 which contacts the N (+) -type semiconducting gastric cavity d 〇 and a conductive film d 2 formed thereon. The conductive film d 1 is a C r film formed by a sputtering method. And a thickness of 5 0 to 1 0 0 A is formed (about 6 0 0 A in this embodiment. If the thickness of the r film is too thick, the stress increases, so it cannot exceed a film thickness of about 2000A. The C r film can improve the adhesion with the N (+) type semiconductor layer d 0, and is used in order to prevent the Aj? Of the conductive film d 2 from diffusing into the N (+) type semiconductor layer d 0 (that is, the barrier layer). In addition to the Cr film, the conductive film d1 may be a high-melting-point metal (Mo, Ti, Ta, w) film, or a high-melting-point metal silicide (MoSi2, TiSi2, TaSi2, WSi2) film. The conductive film d 2 is formed to a thickness of 3,000 to 5,000 A (about 4000 A in this embodiment) by sputtering of Aj ?. The stress of the printed A film by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs is smaller than that of the C r film, which can be formed into a thicker film thickness, and can reduce the source SD 1, the sink SD 2, and the image signal line DL. The resistance value may actually exceed the step difference caused by the gate GT or the i-type semiconductor layer AS (the step effective area can be improved). The conductive film d 1 is formed with the same mask pattern. After the conductive film d 2 is patterned, the same mask is used, or the conductive film d1 is used, and the conductive film d2 is used to remove the N (+) type semiconductor layer dO. That is, the portions other than the conductive films d1 and d2 of the N (+)-type semiconductor layer do on the i-type semiconductor layer AS are removed by self-alignment. At this time, the N + paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) 24-494261 A7 B7 V. Description of the invention (22) The thickness of the semiconductor layer d 0 is all etched, so i-type semiconductors The surface part of layer AS is also etched, but it can be solved as long as the etching time is controlled. Please read the precautions on the back and fill in this page. [Image signal line DL] The image signal line DL is connected to the source SD1 and the sink electrode. SD2 is composed of a second conductive film d2 and a third conductive film d3 in the same layer. The image signal line D L is integrated with the sink electrode S D 2. It is formed of a transparent conductive layer g 2. This transparent conductive transparent conductive film (Indium-Tin- is formed to a thickness of about 100A to 2000A and a thickness of about 400A). Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs [Pixel electrode PX] The pixel electrode PX film g 2 is formed by 1 degree (spray method Oxide: ITO) (1 in this embodiment, as in this embodiment) Because penetrating light can improve the whiteness of the electrode when it is opaque than described later, because no electricity is applied and the polarizer is configured so as to be in the normally black mode), although this part can show good quality and can achieve a sufficient pair [storage capacity C st is the maximum transmittance of the pixel electrode when it is transparent, so the color that penetrates this part is displayed. Therefore, compared with the figure, a brighter display can be performed. At this time, when pressed, the liquid crystal molecules maintain the initial alignment state, and a black display is performed in this state (making it a normal pixel electrode is transparent, and light will not pass through the black. Therefore, the maximum transmittance can be increased, and the ratio 0 g This paper size applies the Chinese National Standard (CNS) A4 specification (210 × 297 mm) 25-494261 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (23) The pixel electrode PX is formed and connected At the opposite end of the thin film transistor TFT, it overlaps with the opposing voltage signal line CL. As can be seen from FIG. 4, the overlap is formed by using the pixel electrode PX as an electrode PL 2 and the opposing voltage signal line CL. As a storage capacitor (capacitive element) Cstg of the other electrode PL 1. The dielectric film of the storage capacitor Cstg is composed of the insulating film GI and the anodic oxide film AOF used as the gate insulating film of the thin film transistor TFT. As shown in Fig. 1, on a plane, the storage capacitor Cs tg is formed on a portion where the width of the conductive film g1 of the opposing voltage signal line CL is enlarged. [Protective film PSV 1] The crystal TFT is provided with a protective film PSV1. The protective film P SV 1 is mainly formed to protect the thin film transistor TFT from moisture. Generally, a material with high transparency and excellent resistance is used. The protective film P SV 1 is for example used It consists of a silicon oxide film or a nitrided sand film made of a plasma CVD device, and its film thickness is about 1 // m. The protective film P SV 1 surrounds all the matrix portions AR, and its peripheral portion is removed to expose the external connection terminal DTM. GTM. The relationship between the thickness of the protective film P SV 1 and the gate insulating film GI is that the former is formed thicker considering the protective effect, and the latter is formed thinner considering the transconductance gm of the transistor. The protective film P SV 1 with high protective effect It is formed to be larger than the gate insulating film GI in order to protect a wide range of peripheral parts. This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -26-494261 A7 B7 V. Description of the invention (24) [Color filter Optical device substrate] The structure of the upper transparent glass substrate SUB 2 side (color filter substrate) will be described below with reference to FIGS. 1 and 2. [Light-shielding film B M] A light-shielding film B M is formed on the upper transparent glass substrate SUB 2 side (the so-called Color matrix) to prevent the penetrating light emitted from the unnecessary gap (the gap between the pixel electrode PX and the counter electrode CT) from entering the display surface to reduce the contrast. The light-shielding film BM prevents the backlight from entering the i-type. The function of the semiconductor layer AS. That is, the i-type semiconductor layer AS of the thin-film transistor TFT is held by a light-shielding film BM located on the upper and lower sides and a larger gate GT, so natural light and backlight from the outside will not be illuminated. The inside of the closed polygonal contour line of the light-shielding film BM shown is an opening where no light-shielding film BM is formed. The outline pattern is only one example. If it is necessary to enlarge the opening portion, it may be formed as a light-shielding film BM1 shown by a dotted line in the first figure. The direction of the electric field in the enlarged area in Figure 1 is not uniform, but the display of this part corresponds to the image information in the pixel on a 1: 1 basis. If it becomes black when it is black, it becomes white when it is white, so it can be used as a display. Partial use. The dividing line in the vertical direction in the figure is determined according to the alignment accuracy of the upper and lower substrates. If the alignment accuracy is higher than the electrode width of the opposite electrode CT adjacent to the image signal line DL, it is set between the widths of the opposite electrodes, that is, The opening can be enlarged. The light-shielding film BM has a light-shielding property and is formed of a highly insulating film to prevent the electric field between the pixel electrode P X and the counter electrode C T from being affected. This implementation of this paper size applies Chinese National Standard (CNS) A4 specifications (210X297 mm) (Please read the precautions on the back before filling this page) Order printed by the Intellectual Property Bureau of the Ministry of Economic Affairs Consumer Cooperatives -27-494261 A7 B7 Economy Printed by the Consumer Cooperative of the Ministry of Intellectual Property Bureau. 5. Description of the Invention (25) In the example, a black pigment is mixed in a resist material to form a thickness of about 1 • 2 β m. The light-shielding film B M is formed around each pixel. It is grid-like »Dividing an effective display area of one pixel with this grid. Therefore, the light-shielding film BM can make the outline of each pixel extremely obvious. That is, the light-shielding film BM has a black matrix and an i-type semiconductor layer AS. There are 2 functions such as light shielding. The light shielding film BM is formed as a frame on the peripheral part, and its pattern is continuous at 3TU 55C. It has many dots. The first rg |The light-shielding film B Μ extends to the outside of the closed portion SL in order to prevent leakage light of reflected light caused by an actual device such as a personal computer from entering the matrix portion. On the other hand, the light-shielding film B Μ is provided on the edge of the substrate SU Β 2 About 0 • 3 1 • 0 mm or so inside> Avoid cutting the substrate SU Β 2 me. Breaking area 〇 [Color filter FIL] The color filter FIL is repeated at the position facing the pixel Red, green, and blue stripes 0 The color filter FIL overlaps the edge portion of the light-shielding film B M. The color filter FIL can be formed as described below. First, an acrylic resin is formed on the surface of the upper transparent glass substrate SUB 2. After dyeing the substrate, the optical lithography technology is used to remove the dyeing substrate outside the red filter formation area. Then, the red dye is used. Dye the dyeing base material 9 and perform a fixed treatment to form a red M light filter R 〇 Then perform the same operation in turn to form a green filter G blue filter B 〇 This paper size applies Chinese National Standard (CNS) A4 specifications (210X297) Cents) a 28-

494261 A7 B7 五、發明説明(26 ) 〔外部塗敷膜0 C ) 請 先 閱 讀 背 面 之 注 意 事 項 再 填 % 本 頁 外部塗敷膜0C係爲了防止彩色濾光器F丨L之染料 洩漏至液晶L C,及將彩色濾光器F I L,遮光膜BM所 造成之段落差平坦化而設置。外部塗敷膜〇 C係由例如丙 烯樹脂,環氧樹脂等透明樹脂材料所形成。 〔液晶層及偏向板〕 以下說明液晶層、配向膜、及偏光板。 〔液晶層〕 液晶材料L C係使用介電係數各向異性爲正,其 數值爲13 · 2,折射率各向異性An爲〇 · 081 ( 5 8 9 n m,2 0 °C )之向列液晶。液晶層之厚度(間隙 )爲3 · 9/zm,阻尼Δη · d爲〇 · 316。這種阻尼 經濟部智慧財產局員工消費合作社印製 △ η · d之數值可使後述之配向膜與偏光板組合,當液晶 分子從研磨方向朝電場方向旋轉4 5度角度時產生最大穿 透率。可在可視光之範圍內產生幾乎無波長依存性之穿透 光。液晶層之厚度(間隙)係利用聚合物珠控制。 液晶材料L C無特別限制,其介電係數各向異性△ ε 亦可爲負值。介電係數各向異性△ ε之數值愈大,愈可降 低驅動電壓。折射率各向異性△ η愈小,液晶層之厚度( 間隙)可愈厚,可縮短液晶之封入時間,而且可減少間隙 之不均勻。 表紙張尺度適用中國國家標準(CNS ) Α4規格(210X29*7公釐) -29 - 494261 Α7 Β7 五、發明説明(27 ) (請先閲讀背面之注意事項再填寫本頁) 沏1 ^ '液晶材料之材料物性與透明導電膜之對向電極部 分或Η素電;極部分之穿透光強度後得知強烈的依存液晶材 料之扭轉彈性係數Κ 2。其理由爲,在電極間之開口部因 發I光線穿過之橫電場所造成之面內扭轉變形在透明導電 膜之電極上部發生之衰減,以配合該液晶材料之扭轉彈性 係數Κ 2之固有曲率發生。因此,爲了希望更增加光線在 透明導電膜之電極部分之穿透量而提高包括該透明導電膜 之電極之全部開口部之亮度,只要使用扭轉彈性係數Κ 2 小之液晶材料而減小該衰減曲率。關於扭轉彈性係數Κ 2 之效果將於實施例1 1中說明。 本實施例1中,扭轉彈性係數Κ 2係使用在室溫下 5.1x10-12Ν〇 扭轉彈性係數Κ 2之測定方法在岡野光治,小林駿介 共編’液晶基礎篇ΡΡ216〜220 (培風館, 1 9 8 5年)中有記載,可利用扭轉之液晶晶胞之閾值電 壓測定算出。 經濟部智慧財產局員工消費合作社印製 〔配向膜〕 配向膜0 R I係使用聚醯亞胺。研磨方向係在上下基 板互相成爲平行,與切期配向方向RDR與施加電場方向 EDR(Ex)所形成之初期配向角炎LC爲75度。第 .1 9圖表示其關係。 若液晶材料之介電係數各向異性△ ε爲正,則初期配 向方向R D R與施加電場方向E R R所形成之初期配向角 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ 297公釐1 一 30 - 494261 A7 B7 五、發明説明(28 ) 0 L C必須爲4 5度以上9 0度以下,若介電係數各向異 性△ ε爲負,則必須大於0度小於4 5度。 本實施例中,將研磨方向在配向膜〇RI 1 、 〇R I 2上形成爲互相平行,使得對電極間及電極上之顯 示有影響之液晶層之上下界面之液晶分子之初期預傾斜角 成爲射流狀態,液晶分子產生互相補償光學特性之功效, 可產生寬大之視野角特性。 將研磨方向在配向膜ORI 1 、ORI 2上形成爲互 相反平行之狀態,則液晶層之上下界面之液晶分子之預傾 斜角成爲平行狀態,液晶層內之平均傾斜角可更加大,但 將預傾斜角設定爲1 0度以下,即產生與本發明相同之效 果。 〔偏光板〕 偏光板P 0 L係使用日東電工公司製之 G 1 2 2 ODU,使下側之偏光板POL 1之偏光板穿透 軸MAX 1之方向與研磨方向RDR成爲一致,並使上側 偏向板P 0 L 2之偏光穿透軸MAX 2與其成爲垂直相交 。第1 9圖表示其關係。如此,可產生隨著施加於本發明 之圖素之電電(圖素電極PX與對向電極CT間之電壓) 之上昇,穿透率亦上昇之正常閉合特性。未施加電壓時, 可實現良質之黑色顯示。 在偏光板P 0 L本身之一面的形成透明導電膜,以便 爲了防止來自外部之靜電之影響而減小其電阻係數值。該 本紙張尺度適用中國國家標準(CNS ) A4規格(210'〆297公釐) ' -31 - (請先閲讀背面之注意事項再填寫本頁) Ί1Τ494261 A7 B7 V. Description of the invention (26) [External coating film 0 C) Please read the precautions on the back before filling%. The external coating film 0C on this page is to prevent the dye of the color filter F 丨 L from leaking to the liquid crystal. LC and flattening the step difference caused by the color filter FIL and the light-shielding film BM are provided. The outer coating film C is formed of a transparent resin material such as acrylic resin and epoxy resin. [Liquid Crystal Layer and Polarizing Plate] A liquid crystal layer, an alignment film, and a polarizing plate will be described below. [Liquid Crystal Layer] The liquid crystal material LC is a nematic liquid crystal with a dielectric constant anisotropy of 13 · 2 and a refractive index anisotropy of An. 0 · 081 (5 89 nm, 20 ° C). . The thickness (gap) of the liquid crystal layer was 3 · 9 / zm, and the damping Δη · d was 0 · 316. The value of △ η · d, which is printed by the employee's consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, can make the alignment film and polarizing plate described later combine to produce the maximum transmittance when the liquid crystal molecules rotate from the grinding direction to the electric field direction by 45 degrees. . It is possible to generate transmitted light with almost no wavelength dependence in the visible light range. The thickness (gap) of the liquid crystal layer is controlled using polymer beads. The liquid crystal material LC is not particularly limited, and its dielectric anisotropy Δε may also be negative. The larger the value of the dielectric anisotropy Δε, the lower the driving voltage can be. The smaller the refractive index anisotropy △ η, the thicker the thickness (gap) of the liquid crystal layer can be, which can shorten the sealing time of the liquid crystal and reduce the unevenness of the gap. The paper size of the table applies to the Chinese National Standard (CNS) Α4 specification (210X29 * 7 mm) -29-494261 Α7 Β7 V. Description of the invention (27) (Please read the precautions on the back before filling this page) Make 1 ^ 'LCD The material physical properties of the material are opposite to that of the transparent conductive film or the electrode element; after the light intensity of the pole portion is transmitted, it is known that the torsional elasticity coefficient K 2 of the liquid crystal material is strongly dependent. The reason is that the in-plane torsional deformation in the openings between the electrodes caused by the transverse electric field through which the I-rays pass passes through the attenuation of the upper portion of the transparent conductive film electrode to match the inherent torsional elasticity of the liquid crystal material K 2 Curvature occurs. Therefore, in order to increase the penetration of light through the electrode portion of the transparent conductive film and increase the brightness of all the openings of the electrode including the transparent conductive film, as long as a liquid crystal material having a small torsional elastic coefficient K 2 is used to reduce the attenuation Curvature. The effect of the torsional elasticity coefficient K 2 will be described in Example 11. In this Example 1, the torsional modulus of elasticity K 2 was measured at room temperature by 5.1 × 10-12 NO. The torsional modulus of elasticity K 2 was measured by Koji, Okano and Kosuke Kobayashi. It is described in 5 years) that it can be calculated by measuring the threshold voltage of a twisted liquid crystal cell. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs [Alignment film] The alignment film 0 R I is made of polyimide. The polishing direction is that the upper and lower substrates are parallel to each other, and the initial alignment angle inflammation LC formed by the tangential alignment direction RDR and the applied electric field direction EDR (Ex) is 75 degrees. Figure .19 shows the relationship. If the dielectric constant anisotropy Δ ε of the liquid crystal material is positive, the initial alignment angle formed by the initial alignment direction RDR and the applied electric field direction ERR This paper size applies the Chinese National Standard (CNS) A4 specification (210 × 297 mm 1 1 30-494261 A7 B7 V. Description of the invention (28) 0 LC must be above 45 degrees and below 90 degrees. If the dielectric anisotropy Δ ε is negative, it must be greater than 0 degrees and less than 45 degrees. In the process, the polishing directions are formed on the alignment films ORI 1 and ORI 2 so as to be parallel to each other, so that the initial pretilt angle of the liquid crystal molecules at the upper and lower interfaces of the liquid crystal layer that affects the display between the electrodes and the electrodes becomes a jet state. The liquid crystal molecules have the effect of compensating optical characteristics with each other, and can produce wide viewing angle characteristics. When the polishing direction is formed on the alignment films ORI 1 and ORI 2 in an anti-parallel state, the liquid crystal molecules at the upper and lower interfaces of the liquid crystal layer are pretilted. The angles are parallel, and the average tilt angle in the liquid crystal layer can be larger. However, setting the pre-tilt angle to 10 degrees or less will produce the same effect as the present invention. ] The polarizing plate P 0 L is a G 1 2 2 ODU manufactured by Nitto Denko Corporation. The direction of the polarizing plate penetration axis MAX 1 of the polarizing plate POL 1 on the lower side is aligned with the grinding direction RDR, and the upper polarizing plate P is aligned. The polarized light transmission axis MAX 2 of 0 L 2 intersects it perpendicularly. Fig. 19 shows its relationship. In this way, electricity can be generated as the pixel applied to the present invention (between the pixel electrode PX and the counter electrode CT). Voltage), the normal closing characteristic that the transmittance also increases. When no voltage is applied, a good black display can be achieved. A transparent conductive film is formed on one side of the polarizing plate P 0 L itself in order to prevent static electricity from the outside. Influence and reduce its resistivity value. The size of this paper applies the Chinese National Standard (CNS) A4 specification (210'〆297mm) '-31-(Please read the precautions on the back before filling this page) Ί1Τ

經濟部智慧財產局員工消費合作社印製 494261 經濟部智慧財產局員工消費合作社印製Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 494261 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs

A7 B7五、發明説明(29 ) 透明導電膜亦可形成在上基板s U B 2與上偏光板 P〇L 2之間。 〔矩陣周邊之結構〕 第5圖爲表示包括上下玻璃基板SUB1、SUB2 之顯示面板PNL之矩陣(AR)周邊之要部平面圖。第 6圖爲左側應連接掃描電路之外部連接端子G TM附近之 斷面,右側無外部連接端子之封閉部附近之斷面圖。 在製造該面板時,若面板之尺寸小,則爲了提高生產 量,以一片玻璃基板同時加工許多個裝置後將之分割,若 尺寸大時,則爲了共用製造設備而加工任何品種皆標準化 之大小之玻璃基板後,減小爲配合各品種之尺寸,而且皆 在經過全部作業後切斷玻璃。第5、6圖表示後者之例。 第5、6圖中皆表示切斷上下基板SUB 1 、SUB 2後 之狀態。L N表示切斷兩基板前之邊緣。無論任何情況下 ,在完成狀態時皆有外部連接端子群Tg、Td及端子 COT之存在(圖中之上邊及左邊)之部分將上側基板 S B U 2之大小限制於下側基板S U B 1之內側,以便使 其露出。端子群T g、T d係以許多個爲一批以後述之掃 描電路連接用端子GTM,影像信號電路連接用端子 D TM,及積體電路晶粒C Η I上裝載之引出線部之帶載 體包裝TCP (第1 6、1 7圖)之單位命名者。從各群 之矩陣部至外部連接端子部之引出配線愈接近兩端愈傾斜 。其理由係爲了將顯示面板PNL之端子DTM、GTM (請先閲讀背面之注意事項再填寫本頁) 1.· 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) -32 - 494261 A7 ___ B7 五、發明説明(30 ) 對正包裝T C P之排列間距及各包裝T C P之連接子間距 。對向電極端子C TM爲從外部電路供給對向電壓於對向 電極C T之端子。矩陣部之對向電壓信號線c L係拉出至 掃描電路用端子GTM之相反側(圖中之右側),以共同 匯流排線C B集中各對向電壓信號線而連接於對向電極端 子 C 丁 Μ。 在透明玻璃基板SUB 1、SUB 2之間沿著其邊緣 形成有封閉除了液晶封入口 I N J以外之液晶L C之封閉 圖型S L。封閉材料係由例如環氧樹脂製成。 配向膜OR I 1 、OR I 2之層係形成在封閉圖型 SL之內側。偏光板P0L1、P0L2分別形成於下部 透明玻璃基板SUB 1 ,上部透明玻璃基板SUB 2之外 側表面。液晶L C係封閉在設定液晶分子之方向之下部配 向膜OR I 1與上部配向膜OR I 2之間,由對閉圖型 S L劃分之領域內。下部配向膜〇R I 1係形成在下部透 明玻璃基板S U B 1側之保護膜P S V 1之上部。 經濟部智慧財產局員工消費合作社印製 該液晶顯示裝置係在下部透明玻璃基板S U B 1側, 上部透明玻璃基板S U B 2側分別重疊各種層,在基板 S U B 2側形成封閉圖型S L,重疊下部透明玻璃基板 SUB1 ,及上部透明玻璃基板SUB2,從封閉材料 S L之開口部I N J注入液晶L C,以環氧樹脂等封閉注 入口INJ ,切斷上下基板而組成。 〔閘極端子部〕 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 一 33 - 經濟部智慧財產局員工消費合作社印製 五、發明説明(31 ) 第7 A圖爲從連接矩陣之掃描信號線G L至其外部連 接端子G TM之連接構造之平面圖。第7 B圖爲第7A圖 中沿B — B線之斷面圖。圖中,對應於第5圖右中央附近 以一直線表示傾斜配線部分。 A 0抗光劑直接描繪之分界線,亦即選擇性陽極氧化 之抗光劑圖型。因此,該抗光劑在陽極氧化後去除,圖中 之圖型A〇不會成爲完成品留下,但因爲如斷面圖中所示 ,在閘極配線GL上選擇性的形成氧化膜AOF,故其軌 跡會留下來。平面圖中,以抗光劑之分異線A 0爲基準之 左側係以抗光劑披覆,而不發生陽極氧化之領域,亦即右 側爲從抗光劑中露出之發生陽極氧化之領域。在被陽極氧 化之Aj?層gl表面形成基氧化物六520 3膜入0?,下 方之導電部之體積減小。當然必須設定適當之時間及電壓 等進行陽極氧化,使其導電部留下。 爲了說明之方便,圖中之Aj?層g 1以斜線表示,但 不被陽極氧化之領域則形成梳狀圖型。其目的爲,因爲著 A j?層之寬度大則在表面產生雜物,故將每一支之寬度減 小,將許多支並聯的集中在一起,以便防止雜質之發生, 並且將斷線之或然率及導電係數之犧牲抑制爲最低限度。 閘極端子GTM係由AP層gl ,及保護其表面,而 且提高與T C P (Tape Cai^iei· Package)之連接可靠性 之透明導電層g 2構成。該透明導電膜g 2係使用與圖素 電極PX在同一過程中製成之透明導電膜I TO。形成於 A又層gl上及其側面部之導電層dl、d2係爲了補償 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公羡) -34 - 494261 A7 B7 經濟部智慧財產局員工消費合作社印製 五、 發明説明(32 ) 1 I A 層 與 透 明 導 電 層 g 2 之 連 接 不 良 在 A 層 與 透 明 導 1 ! I 電 層 g 2 上 連 接 連 接 性 佳 之 C r 層 d 1 > 降 低 連 接 電 阻 而 1 1 設 導 電 層 d 2 因 爲 利 用 與 導 電 層 d 1 相 同 之 掩 罩 形 成 而 I 請 1 | 殘 留 下 來 〇 先 閲 1 讀 1 I 平 面 圖 中 掃 描 絕 緣 膜 G I 係 形 成 在 較 其 分 界 線 更 右 背 1 | 側 保 護 膜 P S V 1 亦 形 成 較 其 分 界 線 更 右 側 j 位 於 左 端 之 注 意 1 I 事 1 之 端 子 部 G T Μ 可 與 從 其 露 出 之 外 部 電 路 接 觸 〇 圖 中 只 表 項 再 1 示 閘 極 線 G L 與 閘 極 端 子 之 — 對 , 但 實 際 上 y 如 此 之 一 對 填j 寫< 本 1 如 第 7 A B 圖 所 示 的 上 下 的 排 列 許 多 個 而 構 成 端 子 群 頁 1 1 T g ( 第 5 圖 ) , 閘 極 端 子 之 左 端 在 製 造 •ίΙΗ. 過 程 中 越 過 基 板 1 之 切 斷 領 域 延 長 而 由 配 線 S Η g ( 未 圖 示 ) 短 路 〇 製 造 過 程 中 , 該 短 路 線 S Η g 可 在 陽 極 氧 化 時 供 電 及 防 止 配 向 訂 膜 〇 R I 1 之 研 磨 時 防 止 發 生 靜 電 破 壞 〇 1 1 I C 吸 極 端 子 D Τ Μ ] 4 1 1 1 第 8 A 圖 表 示 從 影 像 信 號 線 D L 至 其 外 部 連 接 端 子 % 1 D T Μ 爲 止 之 連 接 平 面 圖 0 第 8 B 圖 爲 第 8 A 圖 中 沿 B — 1 1 B 線 之 斷 面 圖 〇 該 圖 對 應 於 第 5 圖 右 上 附 近 j tjJ 圖 式 之 方 向 1 1 稍 有 變 更 其 右 端 方 向 相 當 於 基 板 S U B 1 之 上 端 部 〇 1 Τ S T d 爲 檢 查 端 子 0 外 部 電 路 不 連 接 於 該 端 子 但 1 1 I 其 寬 度 大 於 配 線 部 以 便 使 探 針 接 hmx 觸 〇 同 樣 的 ϊ 吸 極 端 子 1 丨 I D T Μ 亦 寬 度 大 於 配 線 部 , 以 便 與 外 部 電 路 連 接 〇 外 部 連 1 1 I 接 吸 極 端 子 部 D Τ Μ 排 列 於 上 下 方 向 吸 極 端 子 D T Μ 如 1 1 第 5 圖 所 示 的 構 成 端 子 群 T d 並 且 越 m 基 板 S U B 1 之 1 1 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) 一 35 - 494261 A7 B7____ 五、發明説明(33 ) 切斷線更加延長,在製造過程中,爲了防止靜電破壞’全 部由配線SHd (未圖示)短路。如第8A圖所示’檢查 端子T S T d係形成在相隔1條之影像信號線D L上。 吸極連接端子DTM係由2個單層之透明導電層2 2 形成,並且在去除閘極絕緣膜G I之部分連接於影像信號 線DL。該透明導電膜g2與閘極端子GTM同樣的使用 在與圖素電極PX同一過程中形成之透明導電膜I TO。 形成在閘極絕緣膜G I端部上之半導體層A S將閘極絕緣 膜G I之邊緣蝕刻成傾斜狀。爲了與外部電路連接’吸極 端子DTM上之保護膜P SV1被去除。 從矩陣部至吸極端子部DTM之引出配線中,位於影 像信號線DL同一水平之層dl、d2形成至保護膜 P SV 1之中途,而在保護膜P SV 1中與透明導電膜 g 2連接。其目的爲儘量以保護膜P S V 1吸封閉圖型 SL保護容易腐蝕之Aj?層d2。 〔對向電極端子CTM〕 第9 A圖表示從對向電壓信號線C L至其外部連接端 子C TM之連接平面圖。第9 B圖爲第9 A圖中沿B — B 線之斷面圖。該圖對應於第5圖之左上附近。 各對向電壓信號線C L由共同匯流排線C B集中後, 引出至對向電極端子C TM。共同匯流排線C B係在導電 層g 1上堆疊導電層d 1、d2而形成。其目的爲減小共 同匯流排線C B之電阻,以便將對向電壓從外部電路充分 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐)~一 -36 - (請先閲讀背面之注意事項再填寫本頁) .A7 B7 5. Description of the invention (29) A transparent conductive film may also be formed between the upper substrate s U B 2 and the upper polarizing plate POL 2. [Structure of Matrix Peripheral] FIG. 5 is a plan view showing a main part of a matrix (AR) around a display panel PNL including upper and lower glass substrates SUB1 and SUB2. Fig. 6 is a section near the external connection terminal G TM to which the scanning circuit should be connected on the left side, and a section near the closed portion without the external connection terminal on the right side. When manufacturing the panel, if the size of the panel is small, in order to increase the production volume, a glass substrate is used to process many devices at the same time and then divided. If the size is large, the size of any variety is standardized in order to share manufacturing equipment. After reducing the glass substrate, it is reduced to the size of each type, and the glass is cut after all operations. Figures 5 and 6 show examples of the latter. Figures 5 and 6 show the state after cutting the upper and lower substrates SUB 1 and SUB 2. L N represents the edge before cutting the two substrates. In any case, there are external connection terminal groups Tg, Td and terminal COT (upper and left sides in the figure) in the completed state. The size of the upper substrate SBU 2 is limited to the inside of the lower substrate SUB 1, So that it is exposed. The terminal groups T g and T d consist of a plurality of terminals GTM for scanning circuit connection, D TM for video signal circuit connection, and lead wires of integrated circuit chips C Η I as described later. The unit name of the carrier package TCP (Figures 16 and 17). The lead wires from the matrix section of each group to the external connection terminal section are inclined closer as they approach the ends. The reason is to connect the DTM and GTM terminals of the display panel PNL (please read the precautions on the back before filling this page) 1. · This paper size applies the Chinese National Standard (CNS) A4 specification (210X 297 mm) -32- 494261 A7 ___ B7 V. Description of the invention (30) Alignment pitch of packaged TCP and connection sub-spacing of each packaged TCP. The counter electrode terminal C TM is a terminal for supplying a counter voltage to the counter electrode C T from an external circuit. The opposing voltage signal line c L of the matrix part is drawn to the opposite side (right side in the figure) of the scanning circuit terminal GTM, and the opposing voltage signal lines are concentrated by a common bus line CB and connected to the opposite electrode terminal C. Ding M. Between the transparent glass substrates SUB1 and SUB2, a closed pattern SL is formed along the edges of the transparent glass substrates to seal the liquid crystal LC except for the liquid crystal sealing inlet I N J. The sealing material is made of, for example, epoxy resin. The layers of the alignment films OR I 1 and OR I 2 are formed inside the closed pattern SL. The polarizing plates P0L1 and P0L2 are respectively formed on the lower transparent glass substrate SUB1 and the upper transparent glass substrate SUB2 on the outer side surfaces. The liquid crystal LC is enclosed between the lower alignment film OR I 1 and the upper alignment film OR I 2 in the direction in which the liquid crystal molecules are set, and the area is divided by the closed pattern S L. The lower alignment film OR I 1 is formed on the upper portion of the protective film P S V 1 on the lower transparent glass substrate S U B 1 side. The liquid crystal display device is printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. The liquid crystal display device is on the lower transparent glass substrate SUB 1 side, and the upper transparent glass substrate SUB 2 side is superimposed with various layers. A closed pattern SL is formed on the substrate SUB 2 side, and the lower transparent part is overlapped. The glass substrate SUB1 and the upper transparent glass substrate SUB2 are formed by injecting liquid crystal LC from the opening INJ of the sealing material SL, closing the injection port INJ with epoxy resin, etc., and cutting off the upper and lower substrates. [Ministry of Gates] This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) 33-Printed by the Consumer Consumption Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (31) Figure 7 A is from the connection A plan view of the connection structure of the scanning signal line GL of the matrix to its external connection terminal G TM. Figure 7B is a sectional view taken along line B-B in Figure 7A. In the figure, the inclined wiring portion is indicated by a straight line corresponding to the vicinity of the right center in FIG. 5. The dividing line drawn directly by A 0 photoresist, that is, the photoresist pattern of selective anodizing. Therefore, the photoresist is removed after anodizing, and the pattern A0 in the figure will not remain as a finished product, but because the oxide film AOF is selectively formed on the gate wiring GL as shown in the cross-sectional view. , So its trajectory will stay. In the plan view, the left side, which is based on the differentiation line A 0 of the light-resistant agent, is covered with the light-resistant agent, and the area where the anodization does not occur, that is, the right side is the area where the anodization is exposed from the light-resistant agent. On the surface of the anodized Aj? Layer gl, a base oxide six 520 3 film is formed into 0 ?, and the volume of the conductive part below is reduced. Of course, it is necessary to set an appropriate time, voltage, etc. to perform anodization so that the conductive parts remain. For the convenience of explanation, the Aj? Layer g 1 in the figure is indicated by diagonal lines, but the areas not anodized form a comb pattern. The purpose is that, because the width of the Aj? Layer is large, debris is generated on the surface. Therefore, the width of each branch is reduced, and many branches are concentrated in parallel to prevent the occurrence of impurities and to disconnect the broken wires. Sacrifice suppression of probability and conductivity is minimized. The gate terminal GTM is composed of an AP layer gl and a transparent conductive layer g 2 which protects the surface thereof and improves connection reliability with T C P (Tape Cai ^ Package). The transparent conductive film g 2 is a transparent conductive film I TO made in the same process as the pixel electrode PX. The conductive layers dl and d2 formed on the A layer and the side of the gl are applied to compensate for the size of this paper. Chinese National Standard (CNS) A4 specifications (210X297 public envy) -34-494261 A7 B7 Employees ’Intellectual Property Bureau Cooperative printed 5. Description of the invention (32) 1 Poor connection between IA layer and transparent conductive layer g 2 Connect C layer d 1 with good connectivity on layer A and transparent conductive 1! I electrical layer g 2 > Reduce connection resistance And 1 1 is provided with the conductive layer d 2 because it is formed using the same mask as the conductive layer d 1. I 1 | Remaining. 0 Read 1 Read 1 I Scan the insulating film GI in the plan view. 1 | The side protective film PSV 1 is also formed to be more to the right than its dividing line. J is located at the left end. Note 1 I. The terminal GT of event 1 can be in contact with the external circuit exposed from it. 1 Shows that the gate line GL and the gate terminal pair are right, but in fact, y is such a pair. Fill in j < Ben 1 as shown in Figure 7 AB above and below to form a terminal group page 1 1 T g (figure 5), the left end of the gate electrode is extended across the cutting area of the substrate 1 during the manufacturing process and is shorted by the wiring S Η g (not shown). During the manufacturing process, the short-circuit line S Η g It can supply power during anodizing and prevent the alignment film. RI 1 prevents electrostatic damage during grinding. 1 1 IC suction terminal D T M] 4 1 1 1 Figure 8 A shows the connection from the image signal line DL to its external The plan view of the connection up to terminal% 1 DT Μ 0 The 8 B figure is a sectional view taken along line B — 1 1 B in the 8 A figure. The figure corresponds to the direction of the j tjJ diagram near the upper right of the 5th figure 1 1 slightly There is a change in the direction of the right end equivalent to the substrate SUB 1 The end 〇1 Τ ST d is the inspection terminal. 0 The external circuit is not connected to this terminal but 1 1 I is wider than the wiring section so that the probe is connected to hmx. The same suction terminal 1 丨 IDT Μ is also wider than the wiring section. In order to be connected to an external circuit, the external connection 1 1 I suction terminal D DT is arranged in the up and down suction terminal DT Μ as shown in FIG. 1 1 and constitutes a terminal group T d as shown in FIG. 1 1 This paper size applies the Chinese National Standard (CNS) A4 specification (210X 297 mm) 35-494261 A7 B7____ V. Description of the invention (33) The cutting line is further extended. In the manufacturing process, in order to prevent electrostatic damage 'all Shorted by wiring SHd (not shown). As shown in FIG. 8A, the 'inspection terminal T S T d is formed on the video signal line D L spaced apart. The attracting terminal DTM is formed of two single-layer transparent conductive layers 2 2 and is connected to the image signal line DL in a portion where the gate insulating film G I is removed. This transparent conductive film g2 is used in the same way as the gate electrode GTM. A transparent conductive film I TO formed in the same process as the pixel electrode PX. The semiconductor layer AS formed on the end of the gate insulating film G I etches an edge of the gate insulating film G I into an inclined shape. In order to connect to an external circuit, the protective film PSV1 on the suction terminal DTM is removed. In the lead-out wiring from the matrix portion to the suction terminal portion DTM, the layers d1 and d2 located at the same level as the image signal line DL are formed halfway to the protective film P SV 1, and the protective film P SV 1 and the transparent conductive film g 2 connection. The purpose is to protect the Aj? Layer d2, which is easily corroded, with the protective film P S V 1 as a suction seal pattern SL. [Counter electrode terminal CTM] FIG. 9A shows a plan view of the connection from the counter voltage signal line C L to its external connection terminal C TM. Figure 9B is a sectional view taken along line B-B in Figure 9A. This figure corresponds to the vicinity of the upper left of FIG. 5. Each of the opposing voltage signal lines C L is concentrated by the common bus line C B and then led out to the opposing electrode terminal C TM. The common bus line C B is formed by stacking conductive layers d 1 and d 2 on the conductive layer g 1. The purpose is to reduce the resistance of the common busbar CB, so that the opposing voltage is sufficient from the external circuit. This paper size applies the Chinese National Standard (CNS) A4 specification (210X 297 mm) ~ one -36-(Please read the back first (Please fill in this page again).

經濟部智慧財產局員工消費合作社印製 ^4261 A7 ---------B7_ _ 五、發明説明(34 ) 的供給於各對向電壓信號線C L。依照該構造,不必另外 附加導電層即可降低共同匯流排線之電阻。共同匯流排線 CB之導電21並未爲了連接於導電層dl ,導電層d2 而陽極氧化,而且又從閘極絕緣膜G I露出。 對向電極端子CTM係在導電層g1上堆疊透明導電 靥g 2而構成。該透明導電膜g 2與其他端子相同的,使 用在與圖素電極PX同一過程中形成之透明導電膜I丁0 。爲了保護其表面,及防止腐蝕,以耐久性高之透明導電 層g2披覆導電層gl。 〔顯示裝置之全部等效電路〕 第1 0圖表示顯示矩陣部之等效電路及其周邊電路之 接線圖。該圖爲電路圖,但對應於實際上之幾何學配置畫 出。AR爲將許多圖素排列成二次元狀之矩陣陣列。 圖中,X爲影像信號線DL,以.G、B、及R分別表 示綠、藍及紅色圖素。1、2、3……end係依照掃描 時序之順序附加。 經濟部智慧財產局員工消費合作社印製 掃描信號線Y連接於垂直掃描電路V,影像信號線X 連接於影像信號驅動電路Η。 S U Ρ爲包括從1個電壓源產生許多分壓而且穩定之 電壓源之電源電路,及將從主要裝置(上位運算處理裝置 )產生之CRT (陰極射線管)用資訊變換成TFT液晶 顯示裝置用資訊之電路之電路。 本紙張尺度適用中國國家標準職⑺㈣域) 494261 A7 B7 五、發明説明(35 ) 〔驅動方法〕 第1 1圖表 實施例1中 阻金屬之導電膜 波形變形減少。 低信號線電壓。 亦即,將對 矩型波,而且與 )、v g ( i ) V g 1 h 與 V h 擇電壓之振幅值 加於液晶層之電 示本發明之液晶顯示裝置之驅動波形。 ,因爲對向電壓信號線c L係由鋁等低電 g 1所構成,故負載阻抗小,對向電壓之 因此,可將對向電壓變成交流電壓,可降 向電壓形成爲Vch與Vc1之二元交流 其成爲同步的,將掃描信號Vg (i - 1 之非選擇電壓於每一掃描期間改變成 1 1之二元值。對向電壓之振幅值與非選 則設定爲相同。影像信號電壓係從希望施 壓減去對向電壓之振幅之二分之一之電壓 請 先 閲 讀 背 之 注 意 事 項 再 填 寫 本 頁 經濟部智慧財產局員工消費合作社印製 對向電壓亦可爲直流,但若爲交流時,可減小影像信 號電壓之最大振幅,可使用耐壓低之影像信號驅動電路( 信號側驅動器)。實施例2、3中,因爲對向電壓信號線 C L係由透明導電膜g 2形成,故電阻較高’其對向電壓 使用直流方式較佳。 〔儲存電容器C s t g之功能〕 儲存電容器C s t g係爲了將寫入圖素中(薄膜電晶 體T F T成爲斷路後)之影像資訊長時間儲存而設置者。 本發明之將電場平行於基板面施加之方式與將電;場 加於基板面之方式不同,因爲幾乎無由圖素電極與對@電 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 一 38 - 494261 A7 B7 五、發明説明(36 ) (請先閲讀背面之注意事項再填寫本頁) 極構成之電容量(所謂之液晶電容量),故儲存電容器 c S t g不能將影像資訊儲存於圖素中。因此,將電場平 行於基板面施加之方式中,儲存電容器C s t g爲必要之 構件。 儲存電容器C s t g在薄膜電晶體TFT轉換時,可 減小閘極電位變化Δν g對圖素電極電位v s之影響。以 數式表示如下。 △ Vs={Cgs / (Cgs+Cstg + Cpix) } X Δ V g 經濟部智慧財產局員工消費合作社印製 上式中,Cg s爲形成於薄膜電晶體TFT之閛極 GT與源極SD1之間之寄生電容器,Cp i X爲形成於 圖素電極PX與對向電極CT之間之電容器,AV s爲由 △ V g造成之圖素電極電位之變化量之所謂場通(Field Through)電壓。該變化量Z\V s成爲施加於液晶L C之 直流成分之原因,但保持電容器C s t g愈大時,其數值 變成愈小。施加於液晶L C之直流成分之減少可提高液晶 L C之壽命,可減少液晶顯示晝面切換時,以前之畫像殘 留之所謂膠著之現象。 如上所述,閘極GT增大至可完全披覆i型半導體層 As之程度,但其與源極SD1 ,吸極SD2重疊之面積 增加,因此寄生電容器C g s增大,發生圖素電極電位 V S容易接受閘極(掃描)信號Vg之影響之反效果。然 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -39 - 494261 A7 B7 五、發明説明(37 ) 而設置儲存電容器C s t g即可消除此缺點。 〔製造方法〕 以下參照第1 2〜1 4圖說明上述液晶顯示裝置之基 板SUB 1側之製造方法。圖中,中央之文字係過程名稱 之簡稱,左側爲第3圖所示薄膜電晶體T F T部分,右側 爲以第7圖所示閘極端子附近之斷面形狀加工時之過程。 除了過程B、D以外,過程A〜過程I係對應於各照相處 理區分之過程,各過程中之任一斷面圖皆表示照相處理後 之加工終了而去除抗光劑之階段。所謂照相處理在本發明 中係指從塗敷抗光劑至經過使用掩罩之選擇曝光而將之顯 像爲止之一連串之作業。不再重複說明。以下依照區分之 過程加以說明。 過程A,第1 2圖 利用濺射法在AN6 3 5玻璃(商品名)所構成之下 部透明玻璃基板SUB 1上形成由膜厚爲3 Ο Ο 0A之 Aj? — Pd ,Aj? — Si ,Ai — Ta ,Aj?-Ti — Ta等所構成之導電膜gl。在照相處理後,以磷酸、硝 酸及冰醋酸之混合酸液選擇性的蝕刻導電膜g1。如此形 成閘極GT,掃描信號線GL,對向電極CT,對向電壓 信號線C L,電極P L 1 ,閘極端子G T Μ,共同匯流排 線C Β之第1導電層,對向電極端子CTM之第1導電層 ,連接閘極端子GTM之陽極氧化匯流排線SHg (未圖 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 一 40—— (請先閲讀背面之注意事項再填寫本頁) 訂 經濟部智慧財產局員工消費合作社印製 494261 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明(38 ) 示),及連接於陽極氧化匯流排線sHg之陽極氧化墊片 (未圖示)。 過程B,第1 2圖 利用直接描繪形成陽極氧化掩罩A 0後,在以乙烯甘 醇液將以氨調整3%酒石酸使其成爲PH6 · 2 5 土 〇 . 05之溶液稀釋成1 : 9之液體所構成之陽極氧化液 中浸漬基板S U B 1 ,調整其化成電流密度使其成爲 〇 . 5mA/cm2 (定電流化成)。然後進行陽極氧化 一直到達到形成一定之A j? 203膜厚所需之化成電壓 1 2 5爲止。然後,最好保持該狀態數十分鐘(定電壓化 成)。此步驟在形成均勻之Α $20 3膜時非常重要。因此 ,可形成導電膜g 1被陽極氧化,在閘極GT,掃描信號 線GL,對向電極CT,對向電壓信號線CL及電極 P L 1上形成膜厚爲1 8 0 0A之陽極氧化膜AOF。 過程C,第1 2圖 在電漿CVD裝置中導入氨氣,矽烷氣,氮氣,形成 膜厚爲2 2 5 0A之氮化矽膜,在電漿CVD裝置中導入 矽烷氣體,氫氣,形成膜厚爲2 0 0 0A之i型非晶質矽 膜後,在電漿CVD裝置中導入氫氣,膦氣體,形成膜厚 爲3 0 0 A之N ( + )型非晶質矽膜。 過程D,第1 3圖 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 一 41 一 (請先閱讀背面之注意事項再填寫本頁) 494261 A7 B7 五、發明説明(39 ) (請先閲讀背面之注意事項再填寫本頁) 經過照相處理後,使用s F6、C c 做爲乾式蝕刻 氣體,選擇性的蝕刻N ( + )型非晶質矽膜,i型非晶質 矽膜而形成島狀之i型半導體層AS。 過程E,第1 3圖 經過照相處理後,使用S F 6做爲乾式蝕刻氣體,選 擇性的蝕刻氮化矽膜。 過程F,第1 3圖 利用濺射法形成膜厚爲1 4 0 0A之I TO膜所構成 之透明導電膜g 2。經過照相處理後,以鹽酸及硝酸之混 合酸液做爲蝕刻液選擇性的蝕刻透明導電膜g 2,形成閘 極端子G TM之最上層,吸極端子D TM及對向電極端子 CTM之第2導電層。 過程G,第1 4圖 經濟部智慧財產局員工消費合作社印製 利用濺射法形成膜厚爲6 0 0A之C I*所構成之導電 膜dl ,又利用濺射法形成膜厚爲4000A之A又一 Pd ,Aj? — Si ,Aj? — Ta ,A 义一Ti— Ta 等所 構成之導電膜d 2。經過照相處理後,以與過程B相同之 溶液蝕刻導電膜d 2,以與過程A相同之溶液蝕刻導電膜 dl ,形成將影像信號線DL,源極SD1 ,吸極SD2 ,圖素電極PX,電極PL2,共同匯流排線CB之第2 導電層,第3導電層及吸極端子DTM短路之匯流排線 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) "" 一 42 - 494261 A7 _ B7 五、發明説明(4〇 ) 請 先 閱 讀 背 面 I 事 項 再 填 寫 本 頁 SHd (未圖示)。然後,在乾式蝕刻裝置中導入 CCp4,Sf6,蝕刻N ( + )型非晶質矽膜,選擇性的 去除源極與吸極間之N( + )型半導體層d〇。 過程Η,第1 4圖 在電漿CVD裝置中導入氨氣,矽烷氣,氮氣,形成 膜厚爲1 /zm之氮化矽膜。經過照相處理後,以使用 S F 6做爲乾式蝕刻氣體之照相蝕刻技術選擇性的蝕刻氮 化矽膜而形成保護膜PSV1。 P C Β 1〕 顯示面板Ρ Ν 路V之狀態之 之驅動I C晶 C晶粒,左邊 C晶粒)。Τ 接合法(T A 裝,P C Β 1 基板,被分割 電路基板。F 殼S H D上之 P C Β 1與左 平狀電纜係使 醇層挾持許多 L上連接 上面圖。 粒(下側 之各1 0 C Ρ爲如 Β )安裝 爲安裝上 成影像信 G Ρ爲框 彈簧狀破 側驅動電 用如圖中 引出線( 一 43 - 經濟部智慧財產局員工消費合作社印製 〔顯示面板P N L及驅動電路基板 第1 5圖爲在第5圖中所示之 影像信號驅動電路Η及垂直掃描電 CHI爲驅動顯示面板PNL 之5個爲垂直掃描電路側之驅動I 個爲影像信號驅動電路側之驅動I 第1 6、1 7圖所示,利用帶自動 驅動用I C晶粒C Η I之帶載體包 述T C Ρ及電容器等之驅動電路用 號驅動電路用基板及掃描信號驅動 架接地墊片’上面焊接設在屏蔽外 片。F C爲連接下側驅動電路基板 路基板P C Β 1之扁平狀電纜。扁 所示’以條紋狀聚乙烯層及聚乙烯 本紙張尺度適用中國國家標準(CNS ) Α4規格(210X297公釐) 494261 A7 B7__ 五、發明説明(4!) 在磷青銅原材料上實施錫鍍金之線)而支持之電纜。 〔TCP之連接構造〕 第1 6圖爲表示構成掃描信號驅動電路V及影像信號 驅動電路Η之在可撓性配線基板上裝載積體電路晶粒 CH I之帶載體包裝置TC Ρ之斷面構造圖。第1 7圖爲 將之連接於液晶顯示面板上,本實施例中爲連接於掃描信 號電路用端子G ΤΜ之狀態之要部斷面圖。 圖中,ΤΤΒ爲積體電路CH I之輸入端子·配線部 。ΤΤΜ爲積體電路CH I之輸出端子•配線部。各配線 部係由例如銅所製成,在各內側前端部(一般稱爲內部引 出線)利用面向下接合法連接積體電路CHI之接合墊片 PAD。端子ΤΤΒ、ΤΤΜ外側之前端部(一般稱外部 引出線)分別對應於半導體積體電路晶粒C Η I之輸入端 及輸出端,利用焊接連接於CRT/TFT變換電路•電 源電路SUP,經由各向異性導電膜ACF連接於液晶顯 示面板PNL。包裝TCP之前端部連接於面板上,並包 覆使面板P N L側之連接端子G TM露出之保護膜 PSV1 。因此,外部連接端子CTM(DTM)至少由 保護膜P SV 1或包裝TC P中之一方包覆,故對於腐蝕 之耐性強。 BF1係由聚醯亞胺等構成之基部薄膜,SRS爲防 止焊接時焊錫附著於不必要之部分之抗焊劑。封閉圖型 S L之外側之上下側玻璃基板之間隙在洗淨後由環氧樹脂 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) (請先閲讀背面之注意事項再填寫本頁) 春. 經濟部智慧財產局員工消費合作社印製 -44 - 494261 經濟部智慧財產局員工消費合作社印製 A7 B7五、發明説明(42 ) E P X等保護,在包裝TC P與上側基板S UB 2之間又 填充矽樹脂S I L而形成多重保護。 〔驅動電路基板PCB2〕 驅動電路基板PCB2上裝載I C,電容器,電阻等 電子零件。該驅動電路基板P C B 2上裝載從一個電壓源 產生分壓而且穩定之許多電壓源之電源電路,及包括將主 要裝置(上位運算處理裝置)產生之CRT (陰極射線管 )用資訊變換成TFT液晶顯示裝置用資訊之電路之電路 S U P。C T爲與連接於外部之未圖示連接器連接之連接 器連接部。 驅動電路基板P C B 1與驅動電路基板P C B 2經由 扁平型電纜F C連接。 〔液晶顯示模組之全部結構〕 第18圖表示液晶顯示模組MDL之各構件之分解透 視圖。 SHD爲金屬板製之框狀屏蔽盒(金屬框架)。 CLW爲其顯示窗。PNL爲液晶顯示面板。SPB爲光 擴散板。LCB爲導光體。PM爲反射板。BL爲背光螢 光管。L C A爲背光盒。各構件以如圖所示之上下配置關 係重疊而組立模組M D L。 模組MD L由設在屏蔽盒SHD之爪及鈎固定全部。 背光盒LCA之形狀成爲可收納背光螢光管BL,光 本紙張尺度適用中國國家標準(CNS ) Α4規格(210X297公釐) (請先閲讀背面之注意事項再填寫本頁) 訂Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs ^ 4261 A7 --------- B7_ _ V. The invention description (34) is supplied to the opposite voltage signal lines C L. According to this structure, the resistance of the common bus bar can be reduced without adding an additional conductive layer. The conductive 21 of the common bus bar CB is not anodized in order to be connected to the conductive layer d1 and the conductive layer d2, and is exposed from the gate insulating film G1. The counter electrode terminal CTM is formed by stacking a transparent conductive 靥 g 2 on the conductive layer g1. This transparent conductive film g 2 is the same as the other terminals, and is used as the transparent conductive film I D0 formed in the same process as the pixel electrode PX. In order to protect the surface and prevent corrosion, the conductive layer gl is coated with a transparent conductive layer g2 having high durability. [All Equivalent Circuits of Display Device] Figure 10 shows the wiring diagram of the equivalent circuit of the display matrix and its peripheral circuits. The diagram is a circuit diagram, but it corresponds to the actual geometric configuration. AR is a matrix array in which many pixels are arranged into a quadratic element. In the figure, X is the image signal line DL, and .G, B, and R represent green, blue, and red pixels, respectively. 1, 2, 3 ... end are added in the order of the scan timing. Printed by the Employees' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. The scanning signal line Y is connected to the vertical scanning circuit V, and the image signal line X is connected to the image signal driving circuit Η. SU P is a power supply circuit including a plurality of divided and stable voltage sources generated from one voltage source, and information for converting CRT (cathode ray tube) information generated from a main device (high-level arithmetic processing device) into a TFT liquid crystal display device. Circuit of information. The dimensions of this paper are applicable to the national standard of China.) 494261 A7 B7 V. Description of the invention (35) [Driving method] No. 11 Chart The conductive film of the resistive metal in Example 1 has reduced waveform distortion. Low signal line voltage. That is, the driving waveforms of the liquid crystal display device of the present invention are shown by applying an amplitude value of a selected voltage to), v g (i) V g 1 h and V h to the rectangular wave. Because the counter voltage signal line c L is composed of low current g 1 such as aluminum, the load impedance is small. Therefore, the counter voltage can be changed to an AC voltage, and the down voltage can be formed as Vch and Vc1. The binary exchange becomes synchronized, and the non-selected voltage of the scanning signal Vg (i-1 is changed to a binary value of 1 1 during each scanning period. The amplitude value of the opposite voltage is set to the same as the non-selected. Video signal The voltage is the voltage from the desired pressure minus one-half of the amplitude of the opposite voltage. Please read the precautions before filling out this page. The counter voltage printed by the employee consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs can also be DC, but In the case of AC, the maximum amplitude of the video signal voltage can be reduced, and a video signal drive circuit (signal driver) with a low withstand voltage can be used. In Examples 2 and 3, because the opposing voltage signal line CL is made of a transparent conductive film g 2 is formed, so the resistance is high, and it is better to use the DC method for the opposite voltage. [Function of the storage capacitor C stg] The storage capacitor C stg is for writing into pixels (thin-film transistor TFT It is set up for long-term storage of image information after the circuit is broken. The method of applying an electric field parallel to the substrate surface and the method of applying an electric field to the substrate surface of the present invention are different, because there is almost no way for the pixel electrode and the counter @ 电This paper size applies to Chinese National Standard (CNS) A4 (210X297 mm) 38-494261 A7 B7 V. Description of the invention (36) (Please read the precautions on the back before filling this page) Storage capacitor c S tg), so the storage capacitor c S tg cannot store the image information in the pixels. Therefore, the storage capacitor C stg is a necessary component when the electric field is applied parallel to the substrate surface. The storage capacitor C stg is in a thin film When the transistor TFT is switched, the influence of the gate potential change Δν g on the pixel electrode potential vs can be reduced. It is expressed as follows: △ Vs = {Cgs / (Cgs + Cstg + Cpix)} X Δ V g Ministry of Economy In the above formula printed by the Intellectual Property Bureau's Consumer Cooperative, Cg s is a parasitic capacitor formed between the thin-film transistor TFT's GT GT and the source SD1, and Cp i X is formed between the pixel electrode PX and the counter electrode CT Of Between capacitors, AV s is the so-called field through voltage of the pixel electrode potential change caused by △ V g. This change amount Z \ V s becomes the cause of the DC component applied to the liquid crystal LC, but keeps The larger the capacitor C stg, the smaller its value becomes. The reduction of the DC component applied to the liquid crystal LC can increase the life of the liquid crystal LC, and can reduce the so-called sticking phenomenon of the previous image remaining when the liquid crystal display is switched between day and day. It is stated that the gate GT increases to the extent that it can completely cover the i-type semiconductor layer As, but the area where it overlaps with the source SD1 and the sink SD2 increases, so the parasitic capacitor C gs increases and the pixel electrode potential VS is easy to occur. The opposite effect of receiving the influence of the gate (scan) signal Vg. However, this paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -39-494261 A7 B7 V. Description of the invention (37) The storage capacitor C s t g can be used to eliminate this disadvantage. [Manufacturing method] The manufacturing method of the substrate SUB 1 side of the liquid crystal display device will be described below with reference to Figs. 12 to 14. In the figure, the letter in the center is the abbreviation of the process name. The left side is the thin film transistor T F T part shown in Fig. 3, and the right side is the process during processing in the shape of the section near the gate terminal shown in Fig. 7. Except for Processes B and D, Processes A to I correspond to the processes that are distinguished for each photographic process. Any cross-sectional view in each process indicates the stage where the photoresist is removed and the photoresist is removed. In the present invention, the term "photographic treatment" refers to a series of operations from application of a light-resistant agent to development by selective exposure using a mask. The description will not be repeated. The following is a description of the process of differentiation. Process A, FIG. 12 uses the sputtering method to form Aj? — Pd, Aj? — Si on the lower transparent glass substrate SUB 1 composed of AN6 3 5 glass (trade name), with a film thickness of 3 〇 0 Ai-Ta, Aj? -Ti-Ta and other conductive films gl. After the photographic treatment, the conductive film g1 is selectively etched with a mixed acid solution of phosphoric acid, nitric acid and glacial acetic acid. The gate GT, the scanning signal line GL, the counter electrode CT, the counter voltage signal line CL, the electrode PL 1, the gate terminal GT M, the first conductive layer of the common bus line C Β, and the counter electrode terminal CTM are formed. The first conductive layer is connected to the gate electrode GTM anodized busbar SHg (not shown in the paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm)) 40-(Please read the precautions on the back first Please fill in this page again) Order printed by the Intellectual Property Bureau Employee Consumer Cooperatives of the Ministry of Economic Affairs 494261 A7 B7 Printed by the Intellectual Property Bureau Employee Consumer Cooperatives of the Ministry of Economic Affairs printed by the Consumer Cooperatives 5. Illustration of Invention (38)), and the anode connected to the anodizing bus bar sHg Oxidation gasket (not shown). Process B, Fig. 12 uses direct drawing to form an anodizing mask A 0, and then dilutes 3% tartaric acid with ammonia to pH 6 · 2 5 soil 0.05 to a 1: 9 solution with ethylene glycol solution. The substrate SUB 1 was immersed in an anodic oxidation solution composed of a liquid, and its formation current density was adjusted to be 0.5 mA / cm 2 (constant current formation). Then, anodization is performed until the formation voltage 1 2 5 required to form a certain A j? 203 film thickness is reached. Then, it is preferable to keep this state for several tens of minutes (constant voltage formation). This step is very important when forming a uniform A $ 20 3 film. Therefore, the conductive film g 1 can be formed by anodizing, and an anodic oxide film having a thickness of 180 0A can be formed on the gate GT, the scanning signal line GL, the counter electrode CT, the counter voltage signal line CL, and the electrode PL 1. AOF. Process C, Fig. 12 Introduce ammonia, silane, and nitrogen into the plasma CVD device to form a silicon nitride film with a thickness of 2 250 A, and introduce silane gas and hydrogen into the plasma CVD device to form a film After an i-type amorphous silicon film having a thickness of 20000 A, hydrogen gas and a phosphine gas were introduced into a plasma CVD apparatus to form an N (+) type amorphous silicon film having a film thickness of 300 A. Process D, Fig. 1 3 This paper size is in accordance with Chinese National Standard (CNS) A4 specification (210X297mm) 41 41 (Please read the precautions on the back before filling this page) 494261 A7 B7 V. Description of the invention (39) (Please read the precautions on the back before filling in this page) After photographic processing, use s F6, C c as dry etching gas to selectively etch N (+) type amorphous silicon film, i type amorphous The silicon film forms an island-shaped i-type semiconductor layer AS. Process E, Fig. 13 After photographic processing, S F 6 is used as a dry etching gas to selectively etch the silicon nitride film. Process F, FIG. 13 A transparent conductive film g 2 composed of an I TO film having a film thickness of 14 00 A is formed by a sputtering method. After the photographic treatment, the transparent conductive film g 2 is selectively etched by using a mixed acid solution of hydrochloric acid and nitric acid as an etching solution to form the uppermost layer of the gate electrode G TM, the suction electrode D TM and the counter electrode terminal CTM. 2 conductive layer. Process G, Figure 14: The Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs prints a conductive film dl made of CI * with a film thickness of 600 A by sputtering method, and forms A with a film thickness of 4000 A by sputtering method. Another conductive film d 2 is composed of Pd, Aj? — Si, Aj? — Ta, A meaning Ti—Ta, and so on. After photographic processing, the conductive film d 2 is etched with the same solution as in process B, and the conductive film dl is etched with the same solution as in process A to form the image signal line DL, the source SD1, the sink SD2, and the pixel electrode PX, The electrode PL2, the second conductive layer of the common busbar CB, the third conductive layer, and the short-circuited DTM busbar. This paper applies the Chinese national standard (CNS) A4 specification (210X297 mm) " " a 42-494261 A7 _ B7 V. Description of the Invention (4〇) Please read the item I on the back before filling in SHd (not shown) on this page. Then, CCp4 and Sf6 are introduced into the dry etching device, and an N (+) type amorphous silicon film is etched to selectively remove the N (+) type semiconductor layer do between the source and the sink. Process Η, Fig. 14 Introducing ammonia gas, silane gas, and nitrogen gas into a plasma CVD apparatus to form a silicon nitride film with a thickness of 1 / zm. After the photographic treatment, the silicon nitride film is selectively etched by a photoetching technique using S F 6 as a dry etching gas to form a protective film PSV1. P C Β 1] shows the driving state of the state of the panel PN path V (IC grain (C grain, left C grain)). T-bonding method (TA mounting, PC Β1 substrate, divided circuit substrate. The PC Β1 on the F shell SHD and the left flat cable system make the alcohol layer hold a lot of L and connect to the top picture. Grain (1 0 on each lower side) C P is such as B) Installation is installed as an image letter G P is a frame spring-shaped broken-side driving power is drawn as shown in the figure (a 43-printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs [display panel PNL and driving circuit Fig. 15 of the substrate is the image signal driving circuit shown in Fig. 5 and the vertical scanning circuit CHI is used to drive the display panel PNL. 5 are driven by the vertical scanning circuit side I are driven by the image signal driving circuit side I As shown in Figures 16 and 17, using a carrier with IC chips C Η I for automatic driving to describe the drive circuit board for the drive circuit and drive signal board and the ground pad of the scanning signal drive frame. Soldering is provided on the shielded outer sheet. FC is a flat cable connected to the lower driver circuit board PC substrate 1. The flat cable is shown in the form of a stripe polyethylene layer and polyethylene. This paper applies the Chinese National Standard (CNS) A4 specification. (2 10X297 mm) 494261 A7 B7__ V. Description of the invention (4!) A cable supported by the implementation of tin-plated wires on phosphor bronze raw materials. [TCP connection structure] Figure 16 shows the drive circuit V and Image signal driving circuit: A cross-sectional structure view of a carrier package device TC P with integrated circuit chip CH I mounted on a flexible wiring substrate. Figure 17 shows the connection to a liquid crystal display panel. In the example, it is a cross-sectional view of the main part connected to the terminal G TM of the scanning signal circuit. In the figure, TTB is the input terminal and wiring section of the integrated circuit CH I. TTM is the output terminal and wiring of the integrated circuit CH I Each wiring part is made of, for example, copper, and each inner front end portion (commonly referred to as an internal lead) is connected to a bonding pad PAD of the integrated circuit CHI by a face-down bonding method. Terminals TTB, TMT outer front end (Generally referred to as the external lead) corresponding to the input terminal and output terminal of the semiconductor integrated circuit die C Η I, which are connected to the CRT / TFT conversion circuit and power supply circuit SUP by welding, and through the anisotropic conductive film ACF It is connected to the liquid crystal display panel PNL. The front end of the package TCP is connected to the panel and is covered with a protective film PSV1 that exposes the connection terminal G TM on the panel PNL side. Therefore, the external connection terminal CTM (DTM) is at least protected by the protective film P SV 1 or one of the packaging TC P, so it has strong resistance to corrosion. BF1 is a base film made of polyimide, etc. SRS is a solder resist that prevents solder from adhering to unnecessary parts during soldering. Closed pattern The gap between the upper and lower glass substrates on the outer side of the SL is washed by epoxy resin. The paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) (please read the precautions on the back before filling this page). Spring. Printed by the Consumers 'Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs -44-494261 Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the Invention (42) EPX and other protections, between the packaging TP P and the upper substrate S UB 2 Filled with silicone SIL for multiple protection. [Drive circuit board PCB2] Electronic parts such as IC, capacitors and resistors are mounted on the drive circuit board PCB2. The driving circuit substrate PCB 2 is provided with a power supply circuit that generates a plurality of voltage sources from a voltage source and is stable, and includes a CRT (cathode ray tube) generated by a main device (high-level arithmetic processing device) for converting information into a TFT liquid crystal. A circuit SUP for a circuit for displaying information for a device. C T is a connector connecting portion connected to a connector (not shown) connected to the outside. The driving circuit board P C B 1 and the driving circuit board P C B 2 are connected via a flat cable F C. [All Structure of Liquid Crystal Display Module] Fig. 18 shows an exploded perspective view of each component of the liquid crystal display module MDL. SHD is a frame-shaped shielding box (metal frame) made of metal plate. CLW is its display window. PNL is a liquid crystal display panel. SPB is a light diffusion plate. LCB is a light guide. PM is a reflecting plate. BL is a backlight fluorescent tube. L C A is the backlight box. Each component overlaps with the arrangement relationship shown in the figure to form a module M D L. The module MD L is fixed by the claws and hooks provided in the shielding box SHD. The shape of the backlight box LCA can be used to store the backlight fluorescent tube BL. The paper size applies the Chinese National Standard (CNS) Α4 specification (210X297 mm) (Please read the precautions on the back before filling this page). Order

-45 - 494261 A7 B7 _ 五、發明説明(43 ) (請先閲讀背面之注意事項再填寫本頁) 擴散板SPB,導光體LCB,及反射板PM之形狀,將 設在導光體L C B側面之背光螢光管B L之光線以導光體 LCB,反射板RM,光擴散板SPB變成在顯示面成爲 均勻之背光,並將之射出於液晶顯示面板P N L。 背光螢光管B L連接於倒相器基板P C B 3,成爲背 光螢光管B L之電源。 依照上述之本實施例,將圖素電極形成爲透明,即可 將進行白色顯示時之最大穿透率提高大約3 0% (本實施 例中爲3 1 · 8 % )。 具體言之,本實施例可將穿透率從採用不透明圖素電 極時之大約3 · 8%提高至採用透明圖素電極時之大約 5.0%。 此外,又可同時形成提高端子之可靠性用之I TO膜 ,可同時實現可靠性及生產性。-45-494261 A7 B7 _ V. Description of the invention (43) (Please read the precautions on the back before filling this page) The shape of the diffuser SPB, light guide LCB, and reflector PM will be set on the light guide LCB The light of the side-backlit fluorescent tube BL is converted into a uniform backlight on the display surface by the light guide LCB, the reflection plate RM, and the light diffusion plate SPB, and is projected out of the liquid crystal display panel PNL. The backlight fluorescent tube BL is connected to the inverter substrate P C B 3 and becomes the power source of the backlight fluorescent tube BL. According to the embodiment described above, by forming the pixel electrode to be transparent, the maximum transmittance during white display can be increased by about 30% (in this embodiment, 3 1 · 8%). Specifically, this embodiment can increase the transmittance from about 3.8% when an opaque pixel electrode is used to about 5.0% when a transparent pixel electrode is used. In addition, an I TO film for improving the reliability of the terminal can be formed at the same time, which can achieve both reliability and productivity.

〔實施例2〕 經濟部智慧財產局員工消費合作社印製 本實施例除了以下之要件以外,其他皆與實施例1相 同。第2 0圖表示圖素之平面圖。圖中之斜線部分表示透 明導電膜g 2。 〔圖素電極P X〕 本實施例中,圖素電極PX係由源極SD 1 ,吸極 SD2,及同一層之第2導電膜d2,第3導電膜(13所 構成。圖素電極P X與源極S D 1形成一體。 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) ' ' -- -46 ~ 494261 A7 B7 五、發明説明(44 ) 〔對向電極C T〕 (請先閱讀背面之注意事項再填寫本頁) 本實施例中,對向電極C T係由透明導電膜g 2所構 成。該透明導電膜g 2與實施例1相同,係由利用濺射形 成之透明導電膜(I TO)所構成,其厚度爲1 00〜 2〇〇〇A(本實施例中爲1400A左右之厚度)。 〔對向電壓信號線C L〕 對向電壓信號線C L係由透明導電膜g 2所構成,而 且與對向電極C T形成爲一體。 〔閘極端子部〕[Embodiment 2] Printed by the Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs This embodiment is the same as Embodiment 1 except for the following requirements. Figure 20 shows a plan view of a pixel. The hatched part in the figure shows the transparent conductive film g 2. [Pixel electrode PX] In this embodiment, the pixel electrode PX is composed of a source electrode SD 1, an sink electrode SD 2, and a second conductive film d 2 and a third conductive film (13 in the same layer. The pixel electrode P X and The source SD 1 is integrated. This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) ''---46 ~ 494261 A7 B7 V. Description of the invention (44) [Counter electrode CT] (please first Read the notes on the back side and fill in this page again.) In this embodiment, the counter electrode CT is composed of a transparent conductive film g 2. This transparent conductive film g 2 is the same as in Example 1 and is formed of transparent conductive film formed by sputtering. It is composed of a film (I TO), and its thickness is 100 to 2000 A (a thickness of about 1400 A in this embodiment). [Opposite Voltage Signal Line CL] The opposing voltage signal line CL is made of a transparent conductive film. It is composed of g 2 and is integrated with the counter electrode CT. [Gate terminal part]

本實施例中,在與對向電極C T之同一過程中形成保 護閘極端子GTM之Aj?層g 1之表面,而且提高與 T C P (Tape Carrier Package)之連接之可靠性之透明 導電膜g2。其結構與實施例並無不同,與第7A、7B 圖所示相同。 經濟部智慧財產局員工消費合作社印製 〔吸極端子D T Μ〕 本實施例中,吸極連接端子DTM之透明導電層g 2 係使用與閘極端子G TM相同之在與對向電極C T同一過 程中形成之透明導電膜I TO。其結構中,層之上下關係 與實施例1稍有不同(圖中未示)。 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -47 - 494261 A7 B7 五、發明説明(45 ) 〔對向電極端子CTM〕 對向電極端子C TM之導電膜g 1上之透明導電層 g 2係使用與其他端子相同,在與對向電極CT同一過程 時形成之透明導電膜I TO。其結構與實施例1並無不同 ,與第9A,9B圖所示相同。 〔製造方法〕 本實施例中,在實施例1之過程B與過程C之間插入 過程F。其過程之順序爲,從第1 2圖至第1 5圖之過程 順序爲A — B — F — C — D — E — G — Η。掩罩圖型爲掃 描信號線GL,掃描電極GT,與對向電壓信號線CL分 離’各端子之透明導電層g 2與對向電壓信號線C l之圖 型以同一掩罩形成。 如此,將對向電極形成爲透明,即可將最大穿透率提 高大約16% (本實施例中爲15 .9%),液晶顯示面 板PNL之穿透率成爲大約4.4%。 (實施例3 ) 本實施例除了以下要件以外,其他皆與實施例丨,實 施例2相同。第2 1圖表示圖素之平面圖。圖中斜線部分 表示透明導電膜g 2。 〔對向電極C T〕 本實施例中,對向電極CT係以透明導電膜g 2構成 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) "^ 一 48 — (請先閲讀背面之注意事項再填寫本頁) 訂 經濟部智慧財產局員工消費合作社印製 494261 A7 B7___ 五、發明説明(46 ) (請先閱讀背面之注意事項再填寫本頁) 。該透明導電膜g 2與實施例1相同係由利用濺射法形成 之透明導電膜(I TO)所構成,其厚度爲1 〇 〇〜 2〇〇OA(本實施例中爲i4〇〇A左右)° 〔對向電壓信號線CL〕 對向電壓信號線c L係由透明導電膜g 2所構成’而 且與對向電極C T形成一體。 〔製造方法〕 本實施例中’在實施例1之過程B與過程C之間插入 過程F。過程之順序係從第1 2圖至第1 5圖之過程順序 爲A — B — F-^C — D — E-^F-^G — H。掩罩圖型係掃 描信號線GL,掃描電極GT,及對向電壓信號線CL之 圖型係由獨立之掩罩形成。 經濟部智慧財產局員工消費合作社印製 本實施例中,因爲將圖素電極及對向電極形成爲透明 ,故與實施例1及實施例2比較,可更提高進行白色顯示 時之最大穿透率大約5 0% (本實施例中爲4 7 . 7%) ,液晶顯示面板PNL之穿透率爲大約5·6%。 (實施例4 ) 本實施例除了以下要件以外,其他皆與實施例1及實 施例3相同。第2 2圖表示圖素之平面圖。圖中斜線部分 爲透明導電膜g 2。 本紙張尺度適用中國國家標準rCNS ) A4規格(210X297公釐) -49 - 494261 A7 B7 五、發明説明(47 ) 〔對向電壓信號線c L〕 對向電壓信號線C L係以導電膜g 1構成。本實施例 中,導電膜g 1係使用C r 。而且不爲了連接對向電壓信 號線C L與對向電極C T而進行陽極化成。在閘極絕緣膜 G I上形成穿孔PH。導電膜g 1除了可由C r形成以外 ,亦可由Ta ,Ti ,Mo ,W,A$或其合金,或將之 層疊之包層構造形成。 〔製造方法〕 本實施例中,減少實施例1之過程B。又在過程E時 形成穿孔P Η,在過程F時以同一掩罩同時形成圖素電極 Ρ X及對向電極C Τ。 本實施例中,除了可產生實施例1及實施例3之功效 以外,又可藉著降低對向電壓信號線C L之電阻而使電壓 可在對向電極間順利的傳送,又藉著減少電壓之失真而減 少在水平方向產生之串音(橫向污點)。 又因爲以同一掩罩同時形成圖素電極Ρ X及對向電極 CT,故在實施例4中實施2次之過程F只要1次即可, 又可提高生產性。 (實施例5 ) 本實施例除了以下要件以外,其他皆與實施例1及實 施例4相同。第2 3圖表示圖素之平面圖。圖中之斜線部 分表示透明導電膜g 2。 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公 (請先閱讀背面之注意事項再填寫本頁) 訂 經濟部智慧財產局員工消費合作社印製 -50 - 494261 經濟部智慧財產局員工消費合作社印製 A7 B7五、發明説明(48 ) 〔對向電極c T〕 本實施例中,只將中央之對向電極C T以透明導電膜 g 2構成。鄰接於影像信號線之對向電極係以金屬膜與對 向信號線形成爲一體。 本實施例除了可產生與第1實施例及第4實施例之功 效以外,又因爲將鄰接於影像信號線之對向電極形成爲不 透明,故可抑制隨著影像信號而發生之串音。其理由已在 上述說明中記述。 (實施例6 ) 上述實施例2及3皆爲對向電極C T與對向電極信號 線C L係由透明導電層g 2構成之例。 此時,本實施例係利用第2 4A〜C圖所示之結構大 幅度的降低該對向電極信號線C L之電阻值之例。 第2 4 A圖爲表示第2 0圖中之對向電極信號線C L 之一部分之平面圖。第2 4 B圖爲第2 4 A圖中沿b — b 線之斷面圖。 該圖中與第2 0圖不同之處爲對向電極信號線C L係 由雙層構造所構成,而且形成電阻值小之A j?層1 0做爲 其下層,在Aj層1 〇之上面形成完全披覆AP層1 0之 I TO膜1 1 。對向電極CT係由延長該I TO膜1 1之 一部分之延伸部構成。 如此,可降低對向電極信號線C L之電阻,而且可防 本纸張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) (請先閲讀背面之注意事項再填寫本頁) -51 - 494261 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明(49 ) 止在A $層發生之因鬚狀突起所造之經由層間絕緣膜與其 他導電層(例如影像信號線DL)之短路。 亦即AP層1〇之上層在形成影像信號線DL之層間 絕緣膜時形成鬚狀突起而產生上述弊害。但形成完全披覆 該AP層之I TO膜即可防止形成該鬚狀突起。 第2 4 C圖表示由雙層配線形成之對向電極。本實施 例中,在Aj?層1 〇之配線上披覆I TO膜1 1之配線。 因爲配線之中心線附近即使在電極間施加電壓時仍爲低穿 透率,故即使如本實施例中設置不透明之金屬配線,仍幾 乎無開口率之減小。 因爲對向電極或圖素電極係雙層配線構造,故可形成 爲大畫面而顯著的減小電極之斷線等問題。 (實施例7 ) 〔主動矩陣液晶顯示裝置〕 以下說明將本發明應用於主動矩陣方式之彩色液晶顯 示裝置之實施例。圖中具有相同功能之構件以相同記號表 示,不再重複說明。 〔矩陣部(圖素部)之平面結構〕 第2 5圖爲本發明之主動矩陣方式彩色液晶顯示裝置 之一圖素及其周邊之平面圖(圖中之斜線部分表示透明導 電膜i 1 )。 如第2 5圖所示,各圖素係配置在掃描信號線(閘極 (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS )A4規格(2i〇x297公釐) -52 - 494261 A7 B7 經濟部智慧財產局員工消費合作社印製 五、 發明説明 ) 1 I 信 號 線 或 水 平 信 號 線 ) G L , 對 向 電 壓 信 號 線 ( 對 向 電 極 1 1 I 配 線 ) C L > 與 鄰 接 之 2 條 影 像 信 號 線 ( 吸 極 信 號 線 或 垂 I 1 I 直 信 號 線 ) D L 之 交 叉 領 域 內 ( 由 4 條 信 號 線 包 圍 之 領 域 -V I 請 1 I 內 ) 〇 各 圖 素 包 括 薄 膜 電 晶 體 T F T 贅 儲 存 電 容 器 先 閲 1 讀 1 C S t g I prj 圖 素 電 極 P X 及 對 向 電 極 C T 〇 掃 描 信 號 線 背 面 -V 1 1 G L 對 向 電 壓 信 號 線 C L 在 圖 中 延 伸 至 左 右 方 向 而 且 i 1 I 在 上 下 方 向 配 設 許 多 條 〇 影 像 信 號 線 D L 延 伸 至 上 下 方 向 ψ 項 再 1 1 I , 而 且 在 左 右 方 向 配 設 許 多 條 〇 圖 素 電 極 P X 係 由 透 明 導 填 寫 本 1 難 | 電 膜 i 1 形 成 並 經 由 源 極 S D 1 與 薄 膜 電 晶 體 T F T 連 頁 1 1 接 〇 對 向 電 極 C T 亦 由 透 明 導 電 膜 i 1 形 成 而 且 與 對 向 電 壓 信 號 線 C L 連 接 〇 圖 素 電 極 P X 與 對 向 電 極 C T 互 相 對 向 以 各 问 圖 素 電 訂 極 P X 與 對 向 電 極 C T 間 之 電 場 控 制 液 晶 L C 之 光 學 狀 態 Ί I 並 控 制 其 顯 示 〇 圖 素 電 極 P X 與 對 向 電 極 C T 成 爲 梳 齒 1 1 I 狀 分 別 成 爲 朝 向 圖 中 之 上 下 方 向 之 細 長 電 極 〇 1 個 圖 素 內 之 對 向 電 極 C T 之 數 量 ( 梳 齒 之 數 量 ) 與 ( 圖 素 電 極 P X 數 量 ( 梳 齒 之 數 量 ) P 具 有 〇 — P + 1 之 關 1 1 係 ( 本 實 施 例 中 〇 3 P = 2 ) 〇 其 理 由 係 爲 了 將 對 1 1 向 電 極 C T 與 回 圖 素 電 極 P X 交 替 的 配 置 而 使 對 向 電 極 1 C T 必 定 鄰 接 於 影 像 信 號 線 D L 〇 如 此 可 利 用 對 向 電 極 1 I C T 屏 蔽 影 像 信 號 線 D L 所 產 生 之 電 力 線 以 防 止 對 向 電 1 I 極 C T 與 圖 素 電 極 P X 間 之 電 場 不 受 從 影 像 信 號 線 D L 產 1 1 I 生 之 電 場 之 影 響 〇 因 爲 對 向 電 極 C T 由 後 述 之 對 向 電 壓 信 1 1 號 線 C L 經 常 從 外 部 供 給 電 位 故 電 位 成 爲 穩 定 0 因 此 1 1 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 一 53 _ 494261 經濟部智慧財產局員工消費合作社印製 A7 B7五、發明説明(51 ) 即使鄰接影像信號線D L,其電位幾乎不發生變動。如此 ’圖素電極P X離開影像信號線D L之幾何學位置變成更 遠,故圖素電極P X與影像信號線D L間之寄生電容量大 幅度的減小,又可抑制圖素電極電位V s因影像信號電壓 而發生變動。如此,可抑制在上下方向發生之串音(稱爲 縱向污點之畫質不良)。 圖素電極P X與對向電極C T之電極寬度分別爲6 /zm。其理由爲,爲了在液晶層之厚度方向施加充分之電 場於全部液晶層而形成爲充分大於後述之液晶層厚度 3 · 9//m,而且爲了加大孔徑率而儘量形成爲細小。此 外,爲了防止斷線,影像信號線D L之電極寬度與圖素電 極PX及對向電極CT比較,形成爲稍寬之8 。此時 ,將影像信號線D L之電極寬度形成爲鄰接之對向電極 C T之電極寬度之2倍以下。若影像信號線D L之電極寬 度根據良品之生產性而已確定時,則將鄰接於影像信號線 D L之對向電極C T之電極寬度形成爲影像信號線D L之 電極寬度二分之一以上。其理由爲,分別以兩旁之對向電 極C T吸收從影像信號線D L產生之電力線。爲了吸收從 某一電極寬度產生之電力線,必須具有與其同一寬度以上 之電極寬度。因此,只要分別由兩旁之對向電極C T吸收 從影像信號線DL之電極之一半(每4 Mm)產生之電力 線即可,因此將鄰接於影像信號線D L之對向電極C T之 電極寬度形成爲二分之一以上。如此,可防止因影像信號 之影響而發生串音之尤其是上下方向(縱方向)之串音。 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) (請先閲讀背面之注意事項再填寫本頁) 訂 -54 - 494261 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明(52 ) 掃描信號線G L設定電極寬度,以便滿足可在終端側 之圖素(後述之掃描電極端子GTM之相反側)之閘極 G 丁施加充分之掃描電壓之電阻值。對向電壓信號線C L 亦設定電極寬度,以便滿足可在終端側之圖素(後述之離 開共同匯流排線CB 1及CB 2最遠之圖素,亦即CB 1 與C B 2之中間之圖素)之對向電極Ct上施加充分之對 向電壓之電阻值。 圖素電極P X與對向電極C T間之電極間隔依照使用 之液晶材料改變。其理由爲,達成最大穿透率之電場強度 因液晶材料而不同,故配合液晶材料設定電極間隔,以便 在由使用之影像信號驅動電路(信號側驅動器)之耐壓設 定之信號電壓之最大振幅範圍內產生最大穿透率。若使用 後述之液晶材料,則電極間隔成爲1 6 // m。 〔矩陣部(圖素部)之斷面結構〕 第2 6圖爲第2 5圖中沿6 — 6線之斷面圖。第2 7 圖爲第2 5圖中沿7 — 7線之薄膜電晶體TF 丁之斷面圖 。第2 8圖爲第2 5圖中沿8 — 8線之儲存電容器 C s t g之斷面圖。 如第2 6〜2 8圖所示,以液晶層L C爲基準在下部 透明玻璃基板SUB 1側形成薄膜電晶體TFT,儲存電 容器Ss tg,及電極群,在上部透明玻璃基板SUB2 側形成彩色濾光器F I L,遮光用黑色矩陣圖型BM。 在透明玻璃基板S U B 1 、S U B 2之各內側(液晶 (請先閲讀背面之注意事項再填寫本頁) Γ 、τIn this embodiment, the surface of the Aj? Layer g1, which protects the gate electrode GTM, is formed in the same process as the counter electrode C T, and the transparent conductive film g2 which improves the reliability of connection with the T C P (Tape Carrier Package) is formed. Its structure is not different from the embodiment, and is the same as that shown in Figs. 7A and 7B. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs [Suction Terminal DT M] In this embodiment, the transparent conductive layer g 2 of the suction terminal DTM is the same as the gate electrode G TM and the same as the counter electrode CT. The transparent conductive film I TO formed in the process. In the structure, the relationship between the upper and lower layers is slightly different from that in the first embodiment (not shown). This paper size applies to the Chinese National Standard (CNS) A4 specification (210X297 mm) -47-494261 A7 B7 V. Description of the invention (45) [Counter electrode terminal CTM] The conductive film g 1 of the counter electrode terminal C TM The transparent conductive layer g 2 uses the same transparent conductive film I TO that is formed in the same process as the counter electrode CT, as in the other terminals. Its structure is not different from that of the first embodiment, and is the same as that shown in Figs. 9A and 9B. [Manufacturing method] In this embodiment, a process F is inserted between the process B and the process C of the first embodiment. The sequence of the process is from Figure 12 to Figure 15. The sequence is A — B — F — C — D — E — G — Η. The mask pattern is a pattern of the scanning signal line GL, the scan electrode GT, and the transparent conductive layer g 2 of each terminal separated from the opposing voltage signal line CL, and the opposing voltage signal line C l are formed with the same mask. In this way, by forming the counter electrode transparent, the maximum transmittance can be increased by about 16% (15.9% in this embodiment), and the transmittance of the PNL of the liquid crystal display panel becomes about 4.4%. (Embodiment 3) This embodiment is the same as Embodiment 丨 except for the following requirements, and Embodiment 2 is the same. Figure 21 shows a plan view of the pixels. The oblique line in the figure indicates the transparent conductive film g 2. [Counter Electrode CT] In this embodiment, the counter electrode CT is made of transparent conductive film g2. The paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) " ^ 一 48 — (Please read first Note on the back, please fill out this page) Order printed by the Intellectual Property Bureau of the Ministry of Economic Affairs's Consumer Cooperatives to print 494261 A7 B7___ V. Invention Description (46) (Please read the note on the back before filling out this page). The transparent conductive film g 2 is composed of a transparent conductive film (I TO) formed by a sputtering method in the same manner as in Example 1. The thickness of the transparent conductive film g 2 is 100 to 200 OA (i400A in this embodiment). (Left and right) ° [Counter voltage signal line CL] The counter voltage signal line c L is made of a transparent conductive film g 2, and is formed integrally with the counter electrode CT. [Manufacturing method] In this embodiment, a process F is inserted between the process B and the process C of the first embodiment. The sequence of the processes is from A to B to F- ^ C to D to E to ^ F to ^ G to H. The mask pattern is a pattern formed by the scanning signal line GL, the scan electrode GT, and the counter voltage signal line CL by a separate mask. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs in this embodiment, since the pixel electrode and the counter electrode are formed to be transparent, compared with Embodiment 1 and Embodiment 2, the maximum penetration during white display can be further improved. The rate is about 50% (47.7% in this embodiment), and the transmissivity of the PNL of the liquid crystal display panel is about 5.6%. (Embodiment 4) This embodiment is the same as Embodiment 1 and Embodiment 3 except for the following requirements. Figure 22 shows a plan view of the pixels. The oblique line in the figure is the transparent conductive film g 2. This paper size applies the Chinese national standard rCNS) A4 specification (210X297 mm) -49-494261 A7 B7 V. Description of the invention (47) [opposing voltage signal line c L] Opposing voltage signal line CL is made of conductive film g 1 Make up. In this embodiment, C r is used as the conductive film g 1. Furthermore, anodization is not performed to connect the counter voltage signal line C L and the counter electrode C T. A through-hole PH is formed on the gate insulating film G I. In addition to being formed of C r, the conductive film g 1 may be formed of Ta, Ti, Mo, W, A $ or an alloy thereof, or a clad structure in which the conductive film g 1 is laminated. [Manufacturing Method] In this embodiment, the process B of Embodiment 1 is reduced. In the process E, a perforation PΗ is formed, and in the process F, a pixel electrode PX and a counter electrode CT are simultaneously formed with the same mask. In this embodiment, in addition to the effects of Embodiments 1 and 3, the voltage can be smoothly transmitted between the opposing electrodes by reducing the resistance of the opposing voltage signal line CL, and by reducing the voltage. This reduces distortion and reduces crosstalk (horizontal stains) in the horizontal direction. Since the pixel electrode P X and the counter electrode CT are simultaneously formed with the same mask, the process F performed twice in Example 4 can be performed only once, and productivity can be improved. (Embodiment 5) This embodiment is the same as Embodiment 1 and Embodiment 4 except for the following requirements. Figure 23 shows a plan view of the pixels. The hatched portion in the figure represents the transparent conductive film g 2. This paper size applies to China National Standard (CNS) A4 specifications (210X 297 male (please read the precautions on the back before filling this page). Order printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs-50-494261 Printed by the consumer cooperative A7 B7 V. Description of the invention (48) [Counter electrode c T] In this embodiment, only the central counter electrode CT is made of transparent conductive film g 2. The counter electrode adjacent to the image signal line The metal film is formed integrally with the opposite signal line. In addition to the effects of the first embodiment and the fourth embodiment, the opposite electrode adjacent to the image signal line is made opaque, so it can be used. The crosstalk caused by the video signal is suppressed. The reason has been described in the above description. (Embodiment 6) The above embodiments 2 and 3 are the counter electrode CT and the counter electrode signal line CL are made of the transparent conductive layer g. Example of structure 2. At this time, this embodiment is an example in which the resistance value of the counter electrode signal line CL is greatly reduced by using the structure shown in Figures 2A to 4C. Figure 2A shows the second 0 Pair in picture A plan view of a part of the electrode signal line CL. Fig. 2 4B is a cross-sectional view taken along line b-b in Fig. 2 A. The difference between this figure and Fig. 20 is the counter electrode signal line CL system. It is composed of a two-layer structure, and an Aj? Layer 10 with a small resistance value is formed as its lower layer, and an I TO film 1 1 which completely covers the AP layer 10 is formed on the Aj layer 10. The counter electrode CT It consists of an extension that extends a part of the I TO film 11. In this way, the resistance of the counter electrode signal line CL can be reduced, and the paper size can be prevented from applying the Chinese National Standard (CNS) A4 specification (210X297 mm). (Please read the precautions on the back before filling this page) -51-494261 A7 B7 Printed by the Consumers' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs V. Invention Description (49) Caused by whisker-like protrusions that occur only on the A $ level The shortcoming is caused by the short-circuit between the interlayer insulating film and other conductive layers (such as the video signal line DL). That is, the above layer of AP layer 10 forms a whisker-like protrusion when forming the interlayer insulating film of the video signal line DL. The I TO film covering the AP layer can prevent the formation of the whisker-like protrusions. Figure 2 4C shows the counter electrode formed by the double-layer wiring. In this embodiment, the wiring of the I TO film 11 is coated on the wiring of the Aj? Layer 10, because the center line of the wiring is applied even between the electrodes. When the voltage is still low, even if opaque metal wiring is provided as in this embodiment, there is almost no reduction in aperture ratio. Because the counter electrode or pixel electrode has a double-layer wiring structure, it can be formed as a large one. The screen significantly reduces problems such as electrode disconnection. (Embodiment 7) [Active matrix liquid crystal display device] An embodiment in which the present invention is applied to an active matrix color liquid crystal display device will be described below. Components with the same functions in the figure are indicated by the same symbols, and will not be repeated. [Plane Structure of Matrix Section (Pixel Section)] Figures 25 are plan views of one pixel and its surroundings of an active matrix color liquid crystal display device of the present invention (the shaded part in the figure represents the transparent conductive film i 1). As shown in Figure 25, each pixel is arranged on the scanning signal line (gate (please read the precautions on the back before filling out this page). This paper size is applicable to the Chinese National Standard (CNS) A4 specification (2i × 297mm). (%) -52-494261 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention) 1 I signal line or horizontal signal line) GL, opposite voltage signal line (opposing electrode 1 1 I wiring) CL > 2 adjacent video signal lines (supplying signal line or vertical I 1 I straight signal line) in the intersection of DL (area surrounded by 4 signal lines-VI please within 1 I) 〇 Each pixel includes film Transistor TFT Cell Storage Capacitor Read 1 Read 1 CS tg I prj Pixel electrode PX and counter electrode CT 〇 Scan signal line back -V 1 1 GL Opposite voltage signal line CL extends to left and right in the figure and i 1 I have many bars in the up and down direction 〇 The image signal line DL extends to the ψ term in the up and down direction and then 1 1 I, and a number of pixel electrodes PX are arranged in the left and right directions. 1 Difficulty | the electric film i 1 is formed and passes through the source SD 1 and Thin-film transistor TFT Connecting page 1 1 Connection. The counter electrode CT is also formed of a transparent conductive film i 1 and is connected to the counter voltage signal line CL. The pixel electrode PX and the counter electrode CT are opposed to each other and each pixel is electrically charged. The electric field between the pole PX and the counter electrode CT controls the optical state of the liquid crystal LC Ί I and controls its display. The pixel electrode PX and the counter electrode CT become comb teeth 1 1 I shape and become slender toward the upper and lower directions in the figure. The number of counter electrodes CT (the number of comb teeth) and (the number of pixel electrodes PX (the number of comb teeth) P in 1 pixel) have a relationship of 1 to 0 + P + 1 (this embodiment 〇3 P = 2) 〇 The reason is that the counter electrode 1 CT must be adjacent to the video signal line DL in order to arrange the counter electrode 1 CT and the pixel electrode PX alternately. 〇The counter electrode 1 can be used in this way. ICT shields the power lines generated by the image signal line DL to prevent the electric field between the counter electrode 1 I pole CT and the pixel electrode PX from being affected by the electric field generated from the image signal line DL 1 1 I. Opposite voltage letter 1 Line CL, which will be described later, often supplies potential from the outside, so the potential becomes stable. Therefore, 1 1 This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm). 53_ 494261 Intellectual Property Bureau, Ministry of Economic Affairs Printed by employee consumer cooperative A7 B7 V. Invention description (51) Even if it is adjacent to the image signal line DL, its potential does not change. In this way, the geometric position of the pixel electrode PX from the image signal line DL becomes farther, so the parasitic capacitance between the pixel electrode PX and the image signal line DL is greatly reduced, and the pixel electrode potential V s can be suppressed. The video signal voltage varies. In this way, crosstalk (bad image quality called vertical stain) that occurs in the vertical direction can be suppressed. The pixel widths of the pixel electrode P X and the counter electrode C T are 6 / zm, respectively. The reason is that it is formed to be sufficiently larger than the thickness of the liquid crystal layer to be described later, 3 · 9 // m, in order to apply a sufficient electric field to the entire liquid crystal layer in the thickness direction of the liquid crystal layer, and to be as small as possible in order to increase the porosity. In addition, in order to prevent disconnection, the electrode width of the video signal line D L is formed to be slightly wider than the pixel electrode PX and the counter electrode CT 8. At this time, the electrode width of the image signal line D L is formed to be less than twice the electrode width of the adjacent opposing electrode C T. If the electrode width of the image signal line D L has been determined according to the productivity of a good product, the electrode width of the counter electrode C T adjacent to the image signal line D L is formed to be more than a half of the electrode width of the image signal line D L. The reason is that power lines generated from the video signal line D L are absorbed by the opposing electrodes C T on both sides. In order to absorb power lines generated from a certain electrode width, it is necessary to have an electrode width that is equal to or greater than the width of the electrode. Therefore, as long as the opposing electrodes CT on both sides absorb the power lines generated from one and a half (every 4 Mm) of the electrodes of the image signal line DL, the electrode width of the opposing electrode CT adjacent to the image signal line DL is formed as More than half. In this way, crosstalk can be prevented from occurring due to the influence of the video signal, especially crosstalk in the vertical direction (vertical direction). This paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling this page) Order -54-494261 A7 B7 Printed by the Consumers' Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs Explanation (52) The scanning signal line GL sets the electrode width so as to meet the resistance value that can apply a sufficient scanning voltage to the gate electrode G of the terminal pixel (the opposite side of the scanning electrode terminal GTM described later). The opposite voltage signal line CL also sets the electrode width in order to meet the pixels that can be on the terminal side (the pixels that are farthest away from the common bus lines CB 1 and CB 2 described later, that is, the map between CB 1 and CB 2 Element), a sufficient resistance value is applied to the counter electrode Ct. The electrode interval between the pixel electrode P X and the counter electrode C T changes according to the liquid crystal material used. The reason is that the electric field strength that achieves the maximum transmittance varies with the liquid crystal material, so the electrode interval is set in accordance with the liquid crystal material so that the maximum amplitude of the signal voltage is set by the withstand voltage of the video signal driving circuit (signal driver) used. The maximum penetration is produced within the range. If a liquid crystal material described later is used, the electrode interval becomes 16 6 m. [Sectional Structure of Matrix Section (Pixel Section)] Figure 26 is a sectional view taken along line 6-6 in Figure 25. Fig. 27 is a sectional view of the thin film transistor TF D along line 7-7 in Fig. 25. Fig. 28 is a sectional view of the storage capacitor C s t g along line 8-8 in Fig. 25. As shown in Figures 26 to 28, a thin film transistor TFT, a storage capacitor Ss tg, and an electrode group are formed on the lower transparent glass substrate SUB 1 side with the liquid crystal layer LC as a reference, and a color filter is formed on the upper transparent glass substrate SUB 2 side Light device FIL, black matrix pattern BM for shading. Inside each of the transparent glass substrates S U B 1 and S U B 2 (Liquid crystal (please read the precautions on the back before filling this page) Γ, τ

本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -55 - 494261 經濟部智慧財產局員工消費合作社印製 A7 B7五、發明説明(53 ) L C側)表面設有控制液晶之初期配向之配向膜OR I 、 〇RI 2 ,在透明玻璃基板SUB1 、SUB2之各外側 表面設有偏光軸互相垂直相交而配量之偏光板。 〔T F T基板〕 首先詳細說明下側透明玻璃基板S U B 1側(T F T 基板)之結構。 〔薄膜電晶體T F T〕 薄膜電晶體TFT在其閘極GT上施加正偏壓後,源 極與吸極間之通常電阻減小,若偏壓爲〇時,通道電阻變 大。 如第2 7圖所示,薄膜電晶體TFT包括閘極GT, 絕緣膜GI ,由i型(真性,instrinsic,未摻雜導電型 決定不純物)非晶質矽所構成之i型半導體層A S,一對 源極SD1 ,及吸極SD2。源極,吸極本來係由其間之 偏壓極性所決定,本液晶顯示裝置之電路中,其極性在動 作當中反轉,故源極,吸極在動作當中會更換。但爲了說 明之方便,在以下說明中將一方固定爲源極,另一方固定 爲源極。 〔閘極G T〕 閘極G T與掃描信號線G L成爲連續,掃描信號線 G L之一部分領域成爲閘極GT。閘極GT係超過薄膜電 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐)~~ 一 56 - (請先閲讀背面之注意事項再填寫本頁) •^^1 494261 A7 B7 五、發明説明(54 ) 晶體T F T之主動領域之部分。本例中,閘極G T係由單 層之導電膜g 3形成。導電膜g 3係使用例如利用濺射法 形成之C r 一 Mo合金膜,但本發明不受其限制。 〔掃描信號線G L〕 掃描信號線G L係由導電膜g 3形成。該掃描信號線 G L之導電膜g 3係在與閘極GT之導電膜g 3同一過程 中形成,而且形成爲一體。利用該掃描信號線G L將閘極 電壓V g從外部電路供給於閘極GT。本實施例中,導電 膜g 3係使用例如利用測射法形成之C r 一 Μ 〇合金膜。 掃描信號線GL及閘極GT不限定於C r 一 Mo合金,亦 可爲了降低電阻而以C r 一 Mo包覆鋁,或鋁合金之雙層 構造。與影像信號線D L交叉之部分爲了減小與影像信號 線D L發生短路之或然率而形成爲細小,或形成爲雙叉狀 以便即使發生短路時,仍可利用雷射修整切離。 〔對向電壓信號線C L〕 對向電壓信號線C L係由導電膜g 3構成。該對向電 壓信號線C L之導電膜g 3係在與閘極GT,掃描信號線 G L,及對向電極CT之導電膜g 3同一製程中形成,而 且可連接於對向電極C T。由於該對向電壓信號線C l, 可將對向電壓V c om從外部電路供給於對向電極CT。 對向電壓信號線CL不限定於由c r - Mo合金所製 成,亦可爲了降低電阻而以C r - Mo包覆鋁或鋁合金之 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) (請先閲讀背面之注意事項再填寫本頁) 、-贷 經濟部智慧財產局員工消費合作社印製 -57 - 494261 A7 B7 五、發明説明(55 ) 雙層構造。 與影像信號線D L交叉之部分亦可爲了減小其與影像 信號線D L發生短路之或然率而形成爲細小,亦可形成爲 雙叉狀,以便部使發生短路時,仍可利用雷射整條切離。 〔絕緣膜G I〕 絕緣膜G I係用來做爲在薄膜電晶體TF T中,供給 電場於閘極G T及半導體層A S之閘極絕緣膜使用。絕緣 膜GI係形成在閘極GT及掃描信號線GL之上層。絕緣 膜G I係選用例如利用電漿C V D法形成之氮化矽膜,其 膜厚爲2500〜4500A(本實施例中爲3500A )。絕緣膜GI又具有掃描信號線GL及對向電壓信號線 C L與影像信號線D L之層間絕緣膜之作用,又構成其絕 緣膜。絕緣膜G I係利用與後述之保護膜P SV 1相同之 光學掩罩形成其圖型,而且整批的加工製作。 〔i型半導體層A S〕 i型半導體層A S係由非晶質矽形成爲2 0 0〜 2500A之厚度(本實施例中爲1200A)。 d0層係摻雜歐姆接觸用磷(P)之N ( + )型非晶 質矽半導體層,其下側有i型半導體層AS,而在上側只 殘留導電層d 3。 i型半導體層A S及d 0層亦設在掃描信號線G L及 對向電壓信號線C L與影像信號線D L之交叉部之兩者之 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) 一 58 - (請先閲讀背面之注意事項再填寫本頁)This paper size is in accordance with Chinese National Standard (CNS) A4 (210X297 mm) -55-494261 Printed by the Consumers' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (53) LC side) The initial stage is equipped with liquid crystal control The alignment films OR I and RI 2 of the alignment are provided on each outer surface of the transparent glass substrates SUB1 and SUB2 with polarizers whose polarizing axes intersect each other perpendicularly and are aligned. [T F T substrate] First, the structure of the lower transparent glass substrate S U B 1 side (T F T substrate) will be described in detail. [Thin Film Transistor T F T] After a thin film transistor TFT applies a positive bias to its gate GT, the normal resistance between the source and the sink decreases. If the bias is zero, the channel resistance increases. As shown in FIG. 27, the thin film transistor TFT includes a gate GT, an insulating film GI, and an i-type semiconductor layer AS composed of i-type (true, instrinsic, undoped conductive type to determine impurities) amorphous silicon, A pair of source SD1 and sink SD2. The source and the sink are originally determined by the bias polarity between them. In the circuit of the liquid crystal display device, the polarity is reversed during the operation, so the source and the sink are replaced during the operation. However, for convenience of explanation, in the following description, one side is fixed as the source and the other is fixed as the source. [Gate G T] The gate G T and the scanning signal line G L become continuous, and a part of the scanning signal line G L becomes a gate GT. Gate GT exceeds the standard of thin-film electrical paper. Applicable to China National Standard (CNS) A4 specification (210X297 mm) ~~ 56-(Please read the precautions on the back before filling this page) • ^^ 1 494261 A7 B7 5 2. Description of the invention (54) Part of the active field of crystalline TFT. In this example, the gate G T is formed of a single-layered conductive film g 3. The conductive film g 3 is, for example, a C r -Mo alloy film formed by a sputtering method, but the present invention is not limited thereto. [Scanning Signal Line G L] The scanning signal line G L is formed of a conductive film g 3. The conductive film g 3 of the scanning signal line G L is formed in the same process as the conductive film g 3 of the gate GT, and is integrally formed. The scan signal line G L is used to supply the gate voltage V g from an external circuit to the gate GT. In this embodiment, the conductive film g 3 is, for example, a C r -Mo alloy film formed by a radiographic method. The scanning signal line GL and the gate GT are not limited to the Cr-Mo alloy, and may also be coated with Cr-Mo aluminum or a double-layer structure of aluminum alloy in order to reduce the resistance. The portion that intersects the image signal line D L is formed to be small or double-forked in order to reduce the probability of a short circuit with the image signal line D L so that laser trimming can be used to cut off even when a short circuit occurs. [Opposite Voltage Signal Line C L] The opposing voltage signal line C L is composed of a conductive film g 3. The conductive film g 3 of the counter voltage signal line C L is formed in the same process as the gate electrode GT, the scanning signal line G L, and the conductive film g 3 of the counter electrode CT, and can be connected to the counter electrode CT. Due to the counter voltage signal line C 1, the counter voltage V com can be supplied to the counter electrode CT from an external circuit. The counter voltage signal line CL is not limited to being made of cr-Mo alloy, and can also be coated with Cr-Mo aluminum or aluminum alloy in order to reduce the resistance. The paper size of this paper applies the Chinese National Standard (CNS) A4 specification (210X297 (Mm) (Please read the notes on the back before filling out this page),-Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Finance and Economics -57-494261 A7 B7 V. Description of the invention (55) Double-layer structure. The part that intersects the image signal line DL can also be formed to be small in order to reduce the probability of a short circuit with the image signal line DL, or it can be formed into a double fork, so that when the short circuit occurs, the entire laser can still be used. Cut off. [Insulating film G I] The insulating film G I is used as a gate insulating film for supplying an electric field to the gate G T and the semiconductor layer AS in a thin film transistor TF T. The insulating film GI is formed on the gate GT and the scanning signal line GL. The insulating film G I is a silicon nitride film formed by, for example, a plasma C V D method, and has a film thickness of 2500 to 4500 A (in this embodiment, 3500 A). The insulating film GI also functions as an interlayer insulating film of the scanning signal line GL and the opposing voltage signal line C L and the image signal line D L, and also constitutes its insulating film. The insulating film G I is patterned using the same optical mask as the protective film P SV 1 described later, and is manufactured in a batch. [I-type semiconductor layer A S] The i-type semiconductor layer A S is formed of amorphous silicon to a thickness of 200 to 2500 A (1200 A in this embodiment). The d0 layer is an N (+)-type amorphous silicon semiconductor layer doped with phosphorus (P) for ohmic contact. The i-type semiconductor layer AS is located on the lower side, and only the conductive layer d 3 remains on the upper side. The i-type semiconductor layers AS and d 0 layers are also provided on both the scanning signal line GL and the intersection of the opposing voltage signal line CL and the image signal line DL. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X 297 Mm) 58-(Please read the notes on the back before filling this page)

I 經濟部智慧財產局員工消費合作社印製 494261 A7 B7 經濟部智慧財產局員工消費合作社印製 五、 發明説明(56 ) 1 1 間 〇 該 交 叉 部 之 i 型 半 導 體 層 A S 可 減 少 掃 描 信 號 線 G L 1 I 及 對 向 電 壓 信 號 線 C L 與 影 像 信 OjL·· 線 D L 之 短 路 〇 1 1 請 1 I C 源 極 S D 1 吸 極 S D 2 ] 无 閲 1 讀 -|K 1 1 源 極 S D 1 吸 極 S D 2 分 別 由 接 觸 N ( + ) 型 半 導 背 面 1 I 之 1 I 體 層 d 0 之 導 電 膜 d 3 所 構 成 〇 注 意 1 1 事 1 I 導 電 膜 d 3 係 使 用 利 用 濺 射 法 形 成 之 C r — Μ 0 合 金 項 再 1 1 填 1 膜 其 厚 度 爲 5 0 0 3 0 0 0 A ( 本 實 施 例 中 爲 寫 本 m 頁 1 2 5 0 0 A 左 右 ) 〇 因 爲 C r — Μ 0 膜 之 應 力 小 故 可 形 1 成 較 厚 之 膜 對 降 低 配 線 之 電 阻 有 效 〇 C r 一 Μ 0 膜 與 N 1 I ( + ) 型 半 導 體 層 d 0 之 黏 接 性 亦 佳 〇 導 電 膜 d 3 除 了 使 « I J 用 C r 一 Μ 0 膜 之 外 亦 可 使 用 其 他 局 融 點 金 屬 ( Μ 0 訂 T i T a > W ) 膜 ί 高 融 點 金 屬 矽 化 物 ( Μ 0 S i 〇 2 Ί 1 T i S i 2, T a S i ^ 2 W S i 2膜, ,亦可形成爲與鋁 I I 等 之 層 疊 構 造 ο ▲ 以 掩 罩 形 成 導 電 膜 d 3 之 園 圖 型 後 > 以 導 電 膜 d 3 爲 掩 % 1 罩 去 除 N ( + ) 型 半 導 體 層 d 0 0 亦 即 殘 留 於 i 型 半 導 1 1 體 層 A S 上 之 Ν ( + ) 型 半 導 體 層 d 0 除 了 導 電 膜 d 1 1 1 導 電 膜 d 2 以 外 之 部 分 皆 以 白 動 對 準 被 去 除 〇 此 時 y N ( 1 + ) 型 半 導 體 層 d 0 之 厚 度 全 部 被 蝕 刻 故 i 型 半 導 體 層 1 I A S 之 若 干 表 面 部 分 亦 被 蝕 刻 其 蝕 刻 程 度 可 利 用 蝕 刻 時 1 I 間 控 制 〇 1 1 1 1 C 影 像 信 號 線 D L 〕 1 1 1 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 一 59 - 6 42 49 A7 B7 五、發明説明(57 ) (請先閱讀背面之注意事項再填寫本頁) 影像信號線DL係由與源極SD1 ’吸極SD2同一 層之導電膜d 3所構成。影像信號線D L與吸極S D 2成 爲一體。本實施例中,導電膜4 3係使用利用濺射法形成 之Cr 一 Mo合金膜,其厚度爲500〜3000A (本 實施例爲2500A左右)。因爲Cr—Mo膜之應力小 ,故可形成較厚之膜厚,對降低配線之電阻有利。c r 一 Mo膜與N (十)型半導體層d〇之黏接性亦佳。導電膜 d 3除了可使用C r 一 Mo膜之外’亦可使用高融點金屬 (Mo,Ti ,Ta ,W)膜,高融點金屬矽化物(I Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs 'employee consumer cooperative 494261 A7 B7 Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs' employee consumer cooperative. V. Invention description (56) 1 1 〇 The i-type semiconductor layer AS at the intersection can reduce the scanning signal line GL 1 Short circuit between I and counter voltage signal line CL and video signal OjL · · line DL 〇 1 1 Please 1 IC source SD 1 sink SD 2] No read 1 read- | K 1 1 source SD 1 sink SD 2 Consists of a conductive film d 3 in contact with the N (+) -type semiconducting back surface 1 I 1 I body layer d 0. Note 1 1 Matter 1 I The conductive film d 3 is C r — Μ formed by sputtering. 0 alloy item and then 1 1 fill 1 film with a thickness of 5 0 0 3 0 0 0 A (in this example, the book m page 1 2 5 0 0 A) 〇 Because C r — Μ 0 of the film The stress is small, so it can be formed. A thicker film is effective to reduce the resistance of the wiring. The adhesion between the C r -M 0 film and the N 1 I (+) -type semiconductor layer d 0 is also good. The conductive film d 3 is used in addition to « In addition to the Cr-M0 film for IJ, other local melting point metals (M0 order T i T a > W) film ί high melting point metal silicide (M 0 S i 〇 2 Ί 1 T i S i 2, T a S i ^ 2 WS i 2 film can also be formed as a layered structure with aluminum II, etc. ▲ After masking the pattern of the conductive film d 3 > with the conductive film d 3 as a mask The% 1 cover removes the N (+) -type semiconductor layer d 0 0, that is, the N (+) -type semiconductor layer d 0 remaining on the i-type semiconductor 1 1 bulk layer AS except the conductive film d 1 1 1 and the conductive film d 2 Parts are removed in white alignment. At this time, the thickness of the y N (1 +) -type semiconductor layer d 0 is all etched, so some surface portions of the i-type semiconductor layer 1 IAS are also The degree of etching can be controlled by 1 time during etching. 0 1 1 1 1 C Video signal line DL】 1 1 1 This paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm)-59-6 42 49 A7 B7 V. Description of the invention (57) (Please read the precautions on the back before filling this page) The image signal line DL is composed of the conductive film d 3 on the same layer as the source SD1 and the sink SD2. The image signal line D L is integrated with the suction electrode S D 2. In this embodiment, the conductive film 43 is a Cr-Mo alloy film formed by a sputtering method, and has a thickness of 500 to 3000 A (about 2500 A in this embodiment). Because the stress of the Cr-Mo film is small, a thicker film thickness can be formed, which is beneficial for reducing the resistance of the wiring. The adhesion between the c r -Mo film and the N (ten) type semiconductor layer do is also good. In addition to the Cr-Mo film, the conductive film d 3 can also be a high-melting-point metal (Mo, Ti, Ta, W) film, and a high-melting-point metal silicide (

Mo S i2,T i S i2,Ta S i2,WS i2)膜,亦可 形成爲與鋁等之層疊構造。 〔儲存電容器C s t g〕 導電膜d 3在薄膜電晶體TFT之源極SD 2部分與 對向電壓信號線C L重疊。如第2 8圖所示,該重疊構成 以源極SD2 (d3)做爲一電極’以對向電壓信號CL 做爲另一方之電極之儲存電容器(靜電電容器元件) 經濟部智慧財產局員工消費合作社印製 C s t g。該儲存電容器C s t g之介電質膜係由做爲薄 膜電晶體T F T之閘極絕緣膜使用之絕緣膜G I所構成。 如第2 5圖所示,在平面上,儲存電容器C s t g係 形成在對向電壓信號線C L之一部分。 〔保護膜P S V 1〕 在薄膜電晶體TFT上設有保護膜PSV1。保護膜 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐1 ' ' -60 - 494261 經濟部智慧財產局員工消費合作社印製 A7 B7五、發明説明(58 ) P S V 1主要係爲了保護薄膜電晶體T F T以免其受到濕 氣而設置。使用透明性高而耐濕性佳之保護膜。保護膜 P SV 1係由例如利用電漿CVD裝置形成之氧化矽膜及 氮化矽膜製成,其厚度大約爲〇 · 3〜lvm左右。 保護膜P SV 1之一部分被去除,以便露出外部連接 端子DTM、GTM。保護膜PSV1與絕緣膜GI之厚 度關係爲,前者係考慮其保護效果而形成爲較厚’係者爲 將電晶體之互導gm形成較薄。保護膜P S V 1係以與絕 緣膜G I相同之光學掩罩形成圖型,並以整批加工。在其 圖素部爲了對向電壓信號線C L與後述之對向電極C T之 連接,及源極SD2與圖素電極PX之連接而設置穿孔 TH2及TH2。因爲在穿孔TH2中,將保護膜 P SV 1與絕緣膜G I整批的加工,故可形成深達g 3層 之孔,而在穿孔ΤΗ 1中因爲由d 3阻擋,故可形成深達 d 3層之孔。 〔圖素電極P X〕 圖素電極PX係由透明導電層i1形成。該透明導電 膜i 1係由利用濺射形成之透明導電膜(I T 0 )所構成 ,其厚度爲100〜2000A(本實施例中爲1400 A左右)。圖素電極PX經由穿孔TH1連接於源極 S D 2。 本實施例中因爲圖素電極爲透明。故穿透該部分之光 線使得進行白色顯示時之最大穿透率提高。因此與圖素電 (請先閲讀背面之注意事項再填寫本頁) 訂 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) ~ 61 - 494261 A7 B7 五、發明説明(59 ) 極爲不透明者比較,可進行更明亮之顯示。此時,如後文 中所述,偏光板係配置成未施加電壓時,液晶分子保持初 期之配向狀態,在該狀態下進行黑色顯示之狀態(使其成 爲正常黑色模態),故即使圖素電極爲透明,光線亦不會 穿過該部分,可進行良質之黑色顯示。如此,可提高最大 穿透率,而且可達成充分之對比。 〔對向電極c T〕 對向電極CT係由透明導電層i1形成。該透明導電 膜i 1係由利用濺射形成之透明導電膜(I T 0 )所構成 ,其厚度爲10 0〜2 Ο Ο 0A (本實施例中爲1 4 0 0 A之厚度)。對向電極CT經由穿孔TH2連接於對向電 壓信號線C L。 對向電極CT上施加對向電壓Vc om。本實施例中 ,對向電壓V c ◦ m係設定在低於施加在影像信號線D L 之最小位準之驅動電壓V dm i η與最大位準之驅動電壓 V dm a X之中間直流電位相當於薄膜電晶體元件TF Τ 成爲斷路狀態時產生之場通電壓△ V S之電位。若需要將 影像信號驅動電路所使用之積體電路之電源降低至大約一 半時,只要施加交流電壓即可。 〔彩色濾光基板〕 以下參照第2 5、2 6圖詳細說明上側透明玻璃基板 SUB 2側(彩色濾光器基板)之結構。 ^紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 一 62 - (請先閲讀背面之注意事項再填寫本頁) 訂 經濟部智慧財產局員工消費合作社印製 494261 A7 __B7 五、發明説明(6〇 ) 〔遮光膜B Μ〕 在上部透明玻璃基板S U Β 2側形成有遮光膜ΒΜ ( 所謂之黑色矩陣),以防止穿透不需要之間隙部(圖素電 極ΡΧ與對向電極CT間以外之間隙)之穿透光線射出至 顯示面而降低對比。遮光膜Β Μ又具有防止外部光或背光 射入i型半體導層A S之功能。亦即,薄膜電晶體TF Τ 之i型半導體層A S被位於上下之遮光膜BM與較大之閘 極G T挾持,外部之自然光及背光皆照不到。 第2 5圖所示之遮光膜BM係在薄膜電晶體元件 T F T上部朝向左右方向延伸成線狀、之結構。該圖型僅爲 一實施例,亦可形成爲開口部爲孔狀之矩陣狀。在梳齒電 極端部等之電場方向成爲混亂之部分,該部分之顯示以1 對1之狀態對應於圖素內之影像資訊,而在黑色時成爲黑 ,在白色時成爲白,故可做爲顯示之一部分利用。圖中上 下方向之對向電極C T與影像信號線D L間之間隙部係以 在與閘極GT同一過程中形成之遮光層SH遮光。因此, 左右方向之上下方向之遮光可利用T F T過程中之對準精 確度極精確的遮光,故可在鄰接於影像信號線D L之對向 電極C T之電極間設定遮光層S Η之分界,比依存上下基 板之對正精確度之遮光膜ΒΜ之遮光更可擴大開口部。 遮光膜ΒΜ具有遮光性,而且係由絕緣性高之絕緣膜 形成以防止對圖素電極Ρ X與對向電極C T之間之電場發 生影響。本實施例中係在抗蝕材料中混合黑色顏料而形成 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ297公釐) (請先閱讀背面之注意事項再填寫本頁) 訂 經濟部智慧財產局員工消費合作社印製 -63 - 494261 經濟部智慧財產局員工消費合作社印製 A7 _____ B7五、發明説明(6l ) 大約1 · 2//m之厚度。 遮光膜B Μ係成爲朝向左右方向之線狀形成於各行之 圖素上,以該線劃分各行之有效顯示領域β因此,遮光膜 ΒΜ可使各行之圖素之輪廓成爲極明確。亦即,遮光膜 ΒΜ具有對黑色矩陣及i型半導體層A S之遮光之2種功 會b 。 遮光膜BM又在周邊部形成爲相框狀,其圖型與第 2 6圖所示之矩陣部之圖型成爲連續。周邊部之遮光膜 BM延伸至封閉部s L之外側,以便防止個人電腦等機器 所產生之反射光等洩漏光進入矩陣部,而且防止背光等洩 漏至顯示區域之外。另一方面,遮光膜BM形成至離開基 板SUB2之邊絕大約0 · 3〜1 · Omm左右以內,而 且避開基板S U B 2之切斷領域形成。 〔彩色濾光器F I L〕 與實施例1相同。 〔外部塗敷膜0 C〕 與實施例1相同。 〔液晶層,配向膜及偏向板〕 與實施例1相同。 〔矩陣周邊之結構〕 本纸張尺度適用中國國家標準(CNS ) A4規格(210X29*7公釐) ~ ' 一 一 64 一 (請先閲讀背面之注意事項再填寫本頁)Mo S i2, Ti S i2, Ta S i2, WS i2) films may be formed in a laminated structure with aluminum or the like. [Storage capacitor C s t g] The conductive film d 3 overlaps the opposing voltage signal line C L at the source SD 2 portion of the thin film transistor TFT. As shown in Fig. 28, the superposition constitutes a storage capacitor (electrostatic capacitor element) with the source SD2 (d3) as an electrode and the opposite voltage signal CL as the other electrode. The employee ’s intellectual property bureau consumes Cooperative printed C stg. The dielectric film of the storage capacitor C s t g is composed of an insulating film G I used as a gate insulating film of a thin film transistor T F T. As shown in FIG. 25, on a plane, the storage capacitor Cstg is formed on a part of the opposing voltage signal line CL. [Protective Film P S V 1] A protective film PSV1 is provided on the thin film transistor TFT. Protective film The size of this paper applies the Chinese National Standard (CNS) A4 specification (210X297 mm 1 '' -60-494261 printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (58) PSV 1 is mainly for protection The thin film transistor TFT is provided to protect it from moisture. Use a protective film with high transparency and excellent moisture resistance. The protective film P SV 1 is made of, for example, a silicon oxide film and a silicon nitride film formed by a plasma CVD device. Its thickness is about 0.3 to lvm. Part of the protective film PSV 1 is removed to expose the external connection terminals DTM and GTM. The thickness relationship between the protective film PSV1 and the insulating film GI is that the former is formed by considering its protective effect For thicker ones, it is necessary to make the transconductance gm of the transistor thinner. The protective film PSV 1 is patterned with the same optical mask as the insulating film GI and processed in a batch. The through voltage signal line CL is connected to a counter electrode CT described later, and the source SD2 is connected to the pixel electrode PX to provide through holes TH2 and TH2. Because the through hole TH2, the protective film PSV1 and the insulating film GI are integrated. Batch plus Therefore, holes with a depth of up to g 3 layers can be formed, and in the perforation T1, because of d 3 blocking, holes with a depth of up to d 3 layers can be formed. [Pixel electrode PX] The pixel electrode PX is made of a transparent conductive layer i1 is formed. The transparent conductive film i 1 is composed of a transparent conductive film (IT 0) formed by sputtering, and has a thickness of 100 to 2000 A (about 1400 A in this embodiment). The pixel electrode PX is perforated through TH1 Connected to the source SD 2. In this embodiment, the pixel electrode is transparent. Therefore, the light that penetrates this part increases the maximum transmittance when displaying in white. Therefore, please contact with the pixel (please read the precautions on the back first) (Fill in this page again) The size of the paper used for this edition is in accordance with the Chinese National Standard (CNS) A4 (210X297 mm) ~ 61-494261 A7 B7. 5. Description of the invention (59) Compared with extremely opaque, a brighter display is possible. At this time As described later, when the polarizing plate is configured without voltage applied, the liquid crystal molecules maintain an initial alignment state, and a black display state is made in this state (making it a normal black mode), so even if the pixel electrode is Transparent, light It will not pass through this part, and it can display good quality black. In this way, the maximum transmittance can be improved and sufficient contrast can be achieved. [Counter electrode c T] The counter electrode CT is formed of a transparent conductive layer i1. The transparent conductive film i 1 is composed of a transparent conductive film (IT 0) formed by sputtering, and has a thickness of 10 0 to 2 0 0 0A (a thickness of 1 400 A in this embodiment). The electrode CT is connected to the opposing voltage signal line CL via the through hole TH2. A counter voltage Vc om is applied to the counter electrode CT. In this embodiment, the counter voltage V c ◦ m is set at a driving voltage V dm i η lower than the minimum level applied to the image signal line DL and equal to the intermediate DC potential of the maximum level driving voltage V dm a X The potential of the field-on voltage ΔVS generated when the thin-film transistor element TF VT is turned off. If it is necessary to reduce the power of the integrated circuit used in the image signal driving circuit to about half, it is only necessary to apply an AC voltage. [Color filter substrate] The structure of the upper transparent glass substrate SUB 2 side (color filter substrate) will be described in detail below with reference to FIGS. 25 and 26. ^ The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) 62-(Please read the notes on the back before filling this page) Order printed by the Intellectual Property Bureau Employee Consumer Cooperative of the Ministry of Economic Affairs 494261 A7 __B7 V. Invention Explanation (60) [Light-shielding film BM] A light-shielding film BM (so-called black matrix) is formed on the upper transparent glass substrate SU Β 2 side to prevent penetration of unnecessary gaps (pixel electrode Pix and counter electrode) The penetrating light from the gaps other than the CTs is emitted to the display surface to reduce the contrast. The light-shielding film BM has the function of preventing external light or backlight from entering the i-type half-body guide layer A S. That is, the i-type semiconductor layer AS of the thin film transistor TF is held by the light-shielding film BM located on the upper and lower sides and the larger gate G T, and neither the external natural light nor the backlight can be illuminated. The light-shielding film BM shown in FIG. 25 is a structure in which a thin film transistor element T F T extends in a linear shape toward the left and right directions. This pattern is only an example, and it may be formed in a matrix shape with openings in a hole shape. The direction of the electric field at the end of the comb electrode becomes chaotic. The display of this part corresponds to the image information in the pixels in a 1: 1 state, and becomes black when black, and white when white, so it can be done. Use for part of the display. The gap between the counter electrode C T and the video signal line D L in the upper and lower directions in the figure is shielded by a light shielding layer SH formed in the same process as the gate GT. Therefore, the shading in the left-right direction and the up-down direction can use the extremely accurate shading of the alignment accuracy in the TFT process. Therefore, the boundary of the light-shielding layer S Η can be set between the electrodes adjacent to the opposing electrode CT of the image signal line DL. The light-shielding film BM, which relies on the alignment accuracy of the upper and lower substrates, can further expand the opening. The light-shielding film BM has a light-shielding property and is formed of an insulating film having a high insulation property to prevent an influence on an electric field between the pixel electrode px and the counter electrode C T. In this example, a black pigment is mixed in a resist material to form the paper. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 × 297 mm) (Please read the precautions on the back before filling this page) Order the intellectual property of the Ministry of Economic Affairs Printed by the Bureau's Consumer Cooperatives -63-494261 Printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 _____ B7 V. Description of the Invention (6l) Approximately 1 · 2 // m thickness. The light-shielding film BM is formed on the pixels of each line in a line shape facing the left and right directions, and the effective display area β of each line is divided by the line. Therefore, the light-shielding film BM can make the outline of the pixels of each line extremely clear. That is, the light-shielding film BM has two functions b to shield the black matrix and the i-type semiconductor layer AS. The light-shielding film BM is formed into a frame shape at the peripheral portion, and its pattern is continuous with that of the matrix portion shown in FIG. 26. The light-shielding film BM in the peripheral portion extends beyond the closed portion s L to prevent leakage light such as reflected light from a personal computer or the like from entering the matrix portion, and prevent leakage of the backlight or the like from outside the display area. On the other hand, the light-shielding film BM is formed to be within about 0.3 mm to 1 mm from the edge of the substrate SUB2, and is formed while avoiding the cutting area of the substrate S U B 2. [Color filter F I L] The same as in the first embodiment. [External Coating Film 0 C] The same as in Example 1. [Liquid crystal layer, alignment film, and polarizing plate] The same as in Example 1. [Structure around the matrix] This paper size applies Chinese National Standard (CNS) A4 specification (210X29 * 7mm) ~ 'one one 64 one (Please read the precautions on the back before filling this page)

494261 A7 B7____ 五、發明説明(Μ ) 與實施例1相同。 (請先閲讀背面之注意事項再填寫本頁) 〔閘極端子部〕 第2 9圖爲表示從顯示矩陣之掃描信號線G L至其外 部連接端子G ΤΜ之連接構造之平面圖。第2 9 Β圖爲第 2 9 Α圖中沿Β〜Β線之斷面圖。該圖對應於第5圖之中 央附近,斜配線之部分爲了方便以一直線表示。 爲了容易了解,圖中之C r 一 Mo層g 3以斜線表示 〇 閘極端子GTM係由C r — Mo層g 3,及保護其表 面,而且可提高T C P (Tape Carrier Package)之連接 可靠性之透明導電層i1所構成。該透明導電層i1係使 用在與圖素電極PX同一過程中形成之透明導電膜IT〇 〇 經濟部智慧財產局員工消費合作社印製 平面圖中,絕緣膜G I及保護膜P SV 1係形成在較 其分界線更右側之位置,位於左端之端子部G ΤΜ從該膜 中露出,以便與外部電路連接。圖中,只表示一對閘極線 G L及閘極端子,但實際上,如第2 9圖所示,這種成對 之閘極線及閘極端子在上下位置排列許多個而形成端子群 Tg (第5圖),閘極端子之左端在製造過程中越過基板 之切斷領域延長而由配線S G g (未圖示)短路,並且可 防止在製造過程中,配向膜OR I 1在研磨時發生靜電破 壞。 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐y -65 - 6 42 49 經濟部智慧財產局員工消費合作社印製 A7 B7五、發明説明(63 ) 〔吸極端子D T Μ〕 第3 Ο Α圖表示從影像信號線D L至其外部連接部子 D TM之連接狀態之平面圖。第3 Ο B圖表示第3 Ο A圖 中沿B—B線之斷面圖。該圖對應於第5圖之右上部附近 ,爲了方便將圖中之方向改變,其右端方向相當於基板 SUB 1之上端部。 T S T d爲檢查端子。外部電路未連接於該端子,但 其寬度大於配線部,以便接觸探針等。同樣的,吸極端子 D TM之寬度亦大於配線部,以便與外部電路連妾。外部 連接吸極端子D TM排列在上下方向,而吸極端子D 丁 Μ 係如第5圖所示的構成端子群Td而越過基板SUB 1之 切斷線更延伸,在製造過程中,爲了防止靜止破壞其全部 經由配線SHd (未圖示)短路。如第8圖所示,檢查端 子T S T d係形成在相隔一條之影像信號線D L上。 吸極連接端子DTM係由透明導電層i1形成,而在 去除保護膜PSV1之部分連接於影像信號線DL。該透 明導電膜i 1與閘極端子GTM時相同的,使用在與圖素 電極PX同一過程中形成之透明導電膜I T〇。 從矩陣部至吸極端子部D ΤΜ之引出配線係由與影像 信號線D L同一水平之層d 3所構成。 〔對向電極端子CTM〕 第3 1 A圖爲從對向電壓信號線C L至其外部連接端 子CTM之連接之平面圖。第31B圖爲第31A圖中沿 (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 一 66 _ 494261 A7 B7 五、發明説明(64 ) B - B線之斷面圖。該圖對應於第5圖之左上部附近。 各對向電壓信號線C L在共同匯流排線C B 1整批的 引出至對向電極端子C TM。共同匯流排C B係在導電層 S3上層疊導電層3,並以透明導電層i 1連接而構成。 其理由爲可將對向電壓從外部電路充分的供給於各對向電 壓信號線C L。依照該構造,可不必另外設置導電層即可 降低共同匯流排線之電阻。 對向電極端子CTM係在導電層g 3上層疊透明導電 層i1而構成。該透明導電膜i1係與其他端時相同的使 用在與圖素電極PX同一過程中形成之透明導電膜I TO 。爲了利用透明導電層i 1保護其表面並防止腐蝕,以耐 久性強之透明導電層i 1包覆導電層g 3。透明導電層 i1與導電層g3及導電層d3係由形成在保護膜 P SV 1及絕緣膜G I上之穿孔連接。 第3 2 A圖爲從對向電壓信號線C L之另一端至其外 部連接端子C TM2之連接狀態之平面圖。第3 2 B圖爲 第3 2A圖中沿B — B線之斷面圖。該圖對應於第5圖之 右上部附近。共同匯流排線C B 2在各對向電壓信號線 C L之另一端(閘極端子CTM側)整集中引出至對向電 極端子CTM2。與共同匯流排線CB1不同之處爲以導 電層d3及透明導電層i1形成以便與掃描信號線GL絕 緣。與掃描信號線GL係以絕緣膜GI絕緣。 〔全部顯示裝置之等效電路〕 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) (請先閲讀背面之注意事項再填寫本頁) 、τ 經濟部智慧財產局員工消費合作社印製 -67 - 494261 A7 B7 五、發明説明(65 ) (請先閲讀背面之注意事項再填寫本頁) 第3 3圖表示顯示矩陣部之等效電路及其周邊電路之 胃線圖。該圖爲電路圖,但實際上係對應於幾何學配置表 $ ° A R爲將許多圖素排列成二次元狀之矩陣陣列。 圖中,X表示影像信號線DL,G,B及R分別對應 於綠、藍、及紅色圖素。Y爲掃描信號線GL,1 ,2, 3 ...... e n d係依照掃描時序附加。 掃描信號線Y連接於垂直掃描電路V,而影像信號線 X連接於影像信號驅動電路Η。 S U Ρ係包括從1個電壓源產生分壓而穩定之許多電 壓源之電源電路,及將主要裝置(上位運算處理裝置)所 產生之CRT (陰極射線管)用資訊變換成TFT液晶顯 示裝置用資訊之電路之電路。 〔驅動方法〕 經濟部智慧財產局員工消費合作社印製 第3 4圖表示本實施例之液晶顯示裝置之驅動波形。 對向電壓V c爲一定電壓。掃描信號Vg在每一次掃描期 間時成爲導通位準,其他時成爲斷路位準。影像信號電壓 係以需要施加於液晶層之電壓之2倍振幅將正極及負極於 每一幀反轉而傳送至1個圖素。此時,影像信號電壓V d 於每一列將極性反轉,又於每一行將極性反轉。如此,成 爲極性反轉之圖素變成上下左右鄰接之結構,較不容易發 生閃爍及串音(污點)。將對向電壓Vc設定爲從影像信 號電壓之極性反轉之中央電壓降低一定量之電壓。如此, 可修正薄膜電晶體元件從導通變成斷路時產生之場通電壓 i紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐) " ~~ 一 68 - 494261 A7 B7 五、發明説明(66 ) ,係爲了在液晶上施加直流成分少之交流電壓而實施。其 理由爲當直流施加於液晶上後,殘像及劣化更爲嚴重。 除此之外,將對向電壓交流化即可降低影像信號電壓 之最大振幅,又可使用耐壓低之影像信號驅動電路(信號 側驅動器)。 〔儲存電容器C s t g之功能〕 與實施例1相同。 〔製造方法〕 以下參照第3 5〜3 7圖說明上述液晶顯示裝置之基 板SUB 1側之製造方法。圖中,中央之文字爲過程之簡 稱,左側爲第2 7圖所示薄膜電晶體T F T部分,右側爲 第2 9圖所示閘極端子附近之斷面形狀之加工流程。除了 過程B、D以外,過程A〜I爲對應於各照相處理區分者 。各過程之任一斷面圖皆表示照相處理後之加工已完成而 去除抗光劑之階段。所謂照相處理係指本發明中,從塗敷 抗光劑經過以掩罩進行之選擇曝光而至顯像爲止之一連串 作業,不再重複。以下依照區分之過程加以說明。 過程A,第3 5圖 利用濺射法在由AN6 3 5玻璃(商品名)所構成之 下部透明玻璃基板SUB 1上形成膜厚爲2 Ο Ο 0A之 C r 一 M0所構成之導電膜g 3。經過照相處理後,以硝 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) (請先閱讀背面之注意事項再填寫本頁) 、τ Γ 經濟部智慧財產局員工消費合作社印製 ~ 69 - 494261 經濟部智慧財產局員工消費合作社印製 A7 B7五、發明説明(67 ) 酸第2鈽胺選擇性的蝕刻導電膜g 3。如此,形成連接閘 極GT,掃描信號線GL,對向電壓信號線CL,閘極端 子GTM,共同匯流排線CB 1之第1導電層,對向電極 端子CTM1之第1導電層,閘極端子GTM之匯流排線 S H g (未圖示)。 過程B ’第3 5圖 在電漿CVD裝置中導入氨氣、矽烷氣、氮氣而形成 膜厚爲3 5 Ο 0A之氮化矽膜,在電漿CVD裝置中導入 矽烷氣,氫氣’形成膜厚爲1 2 Ο 0A之i型非晶質S i 膜後,在電漿CVD裝置中導入氫氣,膦氣,形成膜厚爲 300A之N ( + )型非晶質矽膜。 過程C,第3 5圖 經過照相處理後,使用S F β,C C P 4做爲乾式蝕刻 氣體選擇性的蝕刻Ν ( + )型非晶質S i膜,i型非晶質 矽膜而形成島狀i型半導體層AS。 過程D,第3 6圖 以濺射法形成膜厚爲3 Ο 0A之C r所構成之導電膜 d 3。經過照相處理後,以與過程A時相同之溶液蝕刻導 電膜d3,形成將影像信號線DL,源極SD1 ,吸極 SD 2,共同匯流排線CB 2之第1導電層,及吸極端子 DTM短路之匯流排線SHd (未圖示)。然後,在乾式 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) (請先閲讀背面之注意事項再填寫本頁) —-訂 一 70 - 經濟部智慧財產局員工消費合作社印製 494261 A7 __B7 五、發明説明(68 ) 蝕刻裝置中導入ccp4,SF6,蝕刻N ( + )型非晶質 砂膜而選擇性的去除源極與吸極間之N ( + )型半導體層 d 〇 〇 過程E,第3 6圖 在電漿CVD裝置中導入氨氣,矽烷氣,氮氣而形成 膜厚爲0 · 4 //m之氮化矽膜。經過照相處理後,使用 S F 6做爲乾式蝕刻氣體選擇性的蝕刻氮化矽,形成保護 膜PSV1及絕緣膜GI之圖型。 過程F,第3 7圖 以濺射法形成由膜厚爲1 4 Ο 0A之I TO膜所構成 之透明導電膜i 1。經過照相處理後,以鹽酸及硝酸之混 合酸液做爲蝕刻液選擇性的蝕刻透明導電膜i 1 ,形成閘 極端子G Τ Μ之最上層,吸極端子D TM及對向電極端子 CTM1及CTM2之第2導電層。 〔顯示面板PNL及驅動電路基板PCB 1〕 與實施例1相同。 〔TCP之連接構造〕 與實施例1相同。 〔驅動電路基板PCB2〕 i紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) (請先閲讀背面之注意事項再填寫本頁)494261 A7 B7____ 5. Description of the Invention (M) Same as Example 1. (Please read the precautions on the back before filling in this page) [Gate terminal section] Figure 29 is a plan view showing the connection structure from the scanning signal line G L of the display matrix to its external connection terminal G TM. Fig. 29B is a sectional view taken along line B-B in Fig. 29A. This figure corresponds to the vicinity of the center of Figure 5. The diagonally-lined portions are shown as straight lines for convenience. For easy understanding, the C r -Mo layer g 3 in the figure is indicated by oblique lines. The gate terminal GTM is composed of C r-Mo layer g 3 and protects its surface, and it can improve the connection reliability of TCP (Tape Carrier Package). It is made of transparent conductive layer i1. The transparent conductive layer i1 is printed with a transparent conductive film IT OO formed in the same process as the pixel electrode PX. The printed plan of the employee consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs prints the insulating film GI and the protective film P SV 1 in a relatively flat shape. The boundary line is further to the right, and the terminal portion G TM at the left end is exposed from the film for connection with an external circuit. In the figure, only a pair of gate lines GL and gate terminals are shown. In fact, as shown in FIG. 29, a plurality of such pairs of gate lines and gate terminals are arranged in the upper and lower positions to form a terminal group. Tg (figure 5), the left end of the gate electrode is extended across the cutting area of the substrate during the manufacturing process and is shorted by the wiring SG g (not shown), and can prevent the alignment film OR I 1 from being polished during the manufacturing process Electrostatic damage occurred. This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm y -65-6 42 49. Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (63) [Sucking terminal DT Μ] Section Fig. 3 〇 A shows a plan view of the connection state from the image signal line DL to its external connection part D TM. Fig. 3 〇 B shows a sectional view along line B-B in Fig. 3 A. This figure corresponds to Near the upper right of Figure 5, for the convenience of changing the direction in the figure, the direction of the right end is equivalent to the upper end of the substrate SUB 1. TST d is the inspection terminal. The external circuit is not connected to this terminal, but its width is larger than the wiring section. In order to contact the probe, etc. Similarly, the width of the suction terminal D TM is larger than that of the wiring part so as to be connected to an external circuit. The external connection suction terminal D TM is arranged in the up-down direction, and the suction terminal D D M is as described above. The terminal group Td shown in Fig. 5 extends beyond the cutting line of the substrate SUB 1. In the manufacturing process, in order to prevent static damage, all of them are shorted through the wiring SHd (not shown). As shown in Fig. 8, check The terminal TST d is formed at The image signal line DL is separated from each other. The suction terminal DTM is formed by a transparent conductive layer i1, and the portion where the protective film PSV1 is removed is connected to the image signal line DL. The transparent conductive film i 1 is the same as the gate terminal GTM. The transparent conductive film IT0 formed in the same process as the pixel electrode PX is used. The lead-out wiring from the matrix portion to the suction terminal portion D Tm is composed of a layer d 3 at the same level as the image signal line DL. Counter electrode terminal CTM] Figure 3 1A is a plan view of the connection from the counter voltage signal line CL to its external connection terminal CTM. Figure 31B is the edge in Figure 31A (please read the precautions on the back before filling in this (Page) This paper size is in accordance with Chinese National Standard (CNS) A4 (210X297 mm) 66_494261 A7 B7 V. Description of the invention (64) Sectional drawing of line B-B. This figure corresponds to the upper left of Figure 5. Each counter voltage signal line CL is led out in a batch to the common electrode terminal C TM at the common bus line CB. The common bus CB is a conductive layer 3 laminated on the conductive layer S3 and a transparent conductive layer i 1 connection. The counter voltage can be sufficiently supplied from the external circuit to each counter voltage signal line CL. According to this structure, the resistance of the common bus bar can be reduced without separately providing a conductive layer. The counter electrode terminal CTM is on the conductive layer g 3 is formed by laminating a transparent conductive layer i1. The transparent conductive film i1 is the same as that used at the other end, and the transparent conductive film I TO formed in the same process as the pixel electrode PX is used. In order to protect the surface with the transparent conductive layer i 1 It also prevents corrosion and covers the conductive layer g 3 with a durable transparent conductive layer i 1. The transparent conductive layer i1, the conductive layer g3, and the conductive layer d3 are connected by perforations formed on the protective film PSV1 and the insulating film GI. Fig. 3 2A is a plan view of the connection state from the other end of the opposing voltage signal line C L to its external connection terminal C TM2. Figure 3 2 B is a sectional view taken along line B-B in Figure 3 2A. This figure corresponds to the vicinity of the upper right of Figure 5. The common bus line C B 2 is led to the opposite terminal CTM2 at the other end of the opposite voltage signal line C L (gate terminal CTM side). The difference from the common bus line CB1 is that it is formed with a conductive layer d3 and a transparent conductive layer i1 so as to be insulated from the scanning signal line GL. It is insulated from the scanning signal line GL by an insulating film GI. [Equivalent circuits of all display devices] This paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling this page), τ Printed by the Intellectual Property Bureau Employees Consumer Cooperatives System -67-494261 A7 B7 V. Description of the Invention (65) (Please read the precautions on the back before filling out this page) Figure 3 3 shows the stomach diagram of the equivalent circuit of the display matrix and its peripheral circuits. The diagram is a circuit diagram, but it actually corresponds to the geometric configuration table $ ° A R is a matrix array in which many pixels are arranged in a quadratic element shape. In the figure, X indicates that the image signal lines DL, G, B, and R correspond to green, blue, and red pixels, respectively. Y is the scanning signal line GL, 1,2, 3 ... e n d is added in accordance with the scanning timing. The scanning signal line Y is connected to the vertical scanning circuit V, and the image signal line X is connected to the image signal driving circuit Η. SU P is a power supply circuit that includes a number of voltage sources that are stabilized by generating a divided voltage from one voltage source, and that converts information for CRT (cathode ray tube) generated by a main device (high-level arithmetic processing device) into a TFT liquid crystal display device. Circuit of information. [Driving method] Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Fig. 34 shows the driving waveforms of the liquid crystal display device of this embodiment. The opposing voltage V c is a certain voltage. The scanning signal Vg becomes the ON level during each scanning period, and becomes the OFF level during other scanning periods. The image signal voltage is transmitted to one pixel by inverting the positive electrode and the negative electrode every frame with an amplitude twice the voltage to be applied to the liquid crystal layer. At this time, the video signal voltage V d reverses the polarity in each column and reverses the polarity in each row. In this way, pixels with reversed polarities become adjacent to each other up and down, making flicker and crosstalk (stains) less likely to occur. The counter voltage Vc is set to a voltage lowered by a certain amount from the central voltage in which the polarity of the video signal voltage is reversed. In this way, the field-on voltage generated when the thin-film transistor element is turned from on to off can be corrected. The paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) " ~~ 68-494261 A7 B7 V. Description of the invention ( 66) is implemented in order to apply an AC voltage with a small DC component to the liquid crystal. The reason is that after DC is applied to the liquid crystal, the afterimage and deterioration are more serious. In addition, by alternating the counter voltage, the maximum amplitude of the video signal voltage can be reduced, and a video signal drive circuit (signal driver) with a low withstand voltage can be used. [Function of Storage Capacitor C s t g] The same as in the first embodiment. [Manufacturing method] The manufacturing method of the substrate SUB 1 side of the liquid crystal display device will be described below with reference to Figs. 3 5 to 37. In the figure, the text in the center is the abbreviation of the process, the left side is the thin film transistor T F T part shown in Figure 27, and the right side is the processing flow of the shape of the section near the gate terminal shown in Figure 29. Except for processes B and D, processes A to I are those corresponding to each photographic process. Each cross-sectional view of each process indicates that the processing after the photographic processing has been completed and the photoresist is removed. The term "photographic treatment" refers to a series of operations in the present invention from the application of a light-resistant agent to selective development through masking to development, and will not be repeated. The following describes the process according to the distinction. Process A, FIG. 3-5 A conductive film g made of C r -M0 with a film thickness of 2 0 0 0A is formed on the lower transparent glass substrate SUB 1 made of AN6 3 5 glass (trade name) by sputtering. 3. After photographic processing, the paper size of this paper applies Chinese National Standard (CNS) A4 specifications (210X297 mm) (please read the precautions on the back before filling this page), τ Γ Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs ~ 69-494261 A7 B7 printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention (67) The acid 2nd amine selectively etches the conductive film g3. In this way, the first conductive layer connected to the gate GT, the scanning signal line GL, the counter voltage signal line CL, the gate terminal GTM, the common bus line CB 1 and the first conductive layer of the counter electrode terminal CTM1, and the gate terminal are formed. The busbar SH g (not shown) of the sub-GTM. Process B 'Fig. 3 5 Introducing ammonia gas, silane gas, and nitrogen gas into the plasma CVD device to form a silicon nitride film with a thickness of 3 5 0 0A, and introducing silane gas into the plasma CVD device to form a hydrogen film. After an i-type amorphous Si film having a thickness of 120 Å, a hydrogen gas and a phosphine gas were introduced into a plasma CVD apparatus to form an N (+)-type amorphous silicon film having a thickness of 300 A. Process C, Figures 3 and 5 After photographic processing, SF β and CCP 4 are used as dry etching gases to selectively etch N (+) -type amorphous Si films and i-type amorphous silicon films to form islands. i-type semiconductor layer AS. Process D, FIG. 36 A conductive film d 3 made of C r with a film thickness of 3 0 0A is formed by a sputtering method. After photographic processing, the conductive film d3 is etched with the same solution as in process A to form the first conductive layer of the image signal line DL, the source SD1, the sink SD2, the common bus bar CB2, and the sink terminal DTM shorted bus bar SHd (not shown). Then, apply the Chinese National Standard (CNS) A4 specification (210X297 mm) to the paper size of the dry-type paper (please read the precautions on the back before filling out this page) —-Book 1 70-Printed by the Consumer Cooperative of Intellectual Property Bureau, Ministry of Economic Affairs 494261 A7 __B7 V. Description of the invention (68) Introducing ccp4, SF6 into the etching device, and etching the N (+) type amorphous sand film to selectively remove the N (+) type semiconductor layer d between the source and the sink. 〇 Process E, Fig. 36. Ammonia gas, silane gas, and nitrogen gas are introduced into the plasma CVD apparatus to form a silicon nitride film having a film thickness of 0 · 4 // m. After photographic processing, S F 6 was used as a dry etching gas to selectively etch silicon nitride to form a pattern of a protective film PSV1 and an insulating film GI. Process F, Fig. 37. A transparent conductive film i 1 composed of an I TO film having a film thickness of 1 4 0 0 A is formed by a sputtering method. After photographic treatment, the transparent conductive film i 1 is selectively etched by using a mixed acid solution of hydrochloric acid and nitric acid as an etching solution to form the uppermost layer of the gate electrode G T M, the suction electrode D TM and the counter electrode terminal CTM1 and The second conductive layer of CTM2. [Display Panel PNL and Drive Circuit Board PCB 1] The same as in the first embodiment. [TCP connection structure] The same as in the first embodiment. 〔Drive circuit board PCB2〕 i Paper size applies to Chinese National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling this page)

-71 - 494261 A7 B7 五、發明説明(69 ) 與實施例1相同。 (請先閲讀背面之注意事項再填寫本頁) 〔液晶顯示模組之全部結構〕 與實施例1相同。 如上所述,本實施例中因爲與實施例3相同的將梳齒 電極形成爲透明,故可將進行白色顯示時之最大穿透率提 高大約5 0%,可使液晶顯示面板PNL之穿透率成爲大 約 5 . 7 %。 此外,又可同時形成可提高端子之可靠性之I TO膜 ,可同時產生可靠性及生產性。 本實施例與實施例1〜6不同,因爲使用將I TO形 成於保護膜P S V之上層之製程,故可將對向電極設在最 上層,影像信號線之洩漏電場之屏蔽效率亦高,可降低串 音。 經濟部智慧財產局員工消費合作社印製 又因爲在驅動電極間之液晶之電力線通路中無保護膜 p SV,故電壓不會在保護膜p SV降低,可將驅動液晶 之最大驅動電壓值從實施例1之7·5V降低至本實施例 之 5 · 0 V。 本方式之施加平行於基板面之電場而驅動液晶之方式 因爲在電極間之電力線通路中有2個保護膜,故又可簡化 製程,並提高生產性。 (實施例8 ) 本實施例除了以下之要件以外,其他與實施例7相同 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -72 - 494261 經濟部智慧財產局員工消費合作社印製 A7 B7五、發明説明(7G ) 。第3 8圖表不圖不之平面圖。圖中之斜線部分表示透明 導電膜i 1。 〔圖素電極P X〕 本實施例中,圖素電極PX係由與源極SD 1 ,吸極 SD2同一層之導電膜d 3所構成。圖素電極PX與源極 S D 1成爲一體。 本實施例中,除了具有與實施例1相同之功效以外, 雖然穿透率稍受影響,但可避免圖電極P X與源極 s D 1發生接觸不良。又因爲電極之一方被絕緣膜(保護 膜P S V 1 )披覆,故發生配向膜缺陷時直流電流通過液 晶之可能性降低,不會發生液晶劣化,可提高可靠性。 (實施例9 ) 本實施例除了以下要件以外,其他與實施例7相同。 第3 9圖表示圖素之平面圖。圖中斜線部分表示透明導電 膜i 1 〇 〔對向電極C 丁〕 本實施例中,以導電膜g 3將對向電極C T與對向電 壓信號線C L形成一體。 本實施例中,除了可產生如第1實施例之效果之外, 雖然穿透率稍受影響,但可避免對向電極C T與對向電壓 信號線C L發生接觸不良。又因爲電極之一方被絕緣膜( (請先閲讀背面之注意事項再填寫本頁) 本纸張尺度適用中國國家標準(CNS ) A4規格(210X29*7公釐) -73 - 494261 A7 B7 五、發明説明(71 ) 保護膜P S V 1 )披覆,故發生配向膜缺陷時直流通過液 晶之可能性降低,不會發生液晶劣化,可提高可靠性。 (請先閲讀背面之注意事項再填寫本頁) (實施例1 0 ) 本實施例除了以下要件之外,其他與實施例7相同, 第4 0圖表示圖素之平面圖。圖中之斜線部分表示透明導 電膜i 1。 〔遮光膜B Μ〕 在上部透明玻璃基板SUB 2側形成遮光膜ΒΜ (亦 黑色矩陣),以防止穿透不需要之間隙部(圖素電極PX 與對向電極CT間以外之間隙)之穿透光射出至顯示面而 降低對比。遮光膜BM又具有防止外部光及背光射入i型 半導體層A S之功能。亦即,薄膜電晶體T F T之i型半 導體層A S由位於上下方之遮光膜BM及較大之閘極G 丁 挾持,故外部之自然光及背光不會照到。 經濟部智慧財產局員工消費合作社印製 第4 0圖所示遮光膜BM在薄膜電晶體TF T元件上 部朝向上下左右方向延伸,其形狀爲在開口部設有孔之矩 陣狀。在梳齒電極端部等電場方向混亂之部分之顯示以1 對1對應於圖素內之影像資訊,而在黑色時變黑,白色時 變白,故可做爲顯示之一部分利用。 本實施例與實施例7不同,遮光膜BM具有遮光性, 而且由導電性高之膜形成以防止從影像信號線D L產生之 電場影響圖素電極P X與對向電極C T間之電場。本實施 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -74 - 494261 Α7 Β7 五、發明説明(72 ) (請先閲讀背面之注意事項再填寫本頁) 例中,從對向基板SUB 1面形成厚度大約〇 · 2 //m左 右之鉻氧化物(CrOx),鉻氮化物(CrNx),鉻 (C r )之3層構造。此時,鉻氧化物係爲了抑制顯示面 之反射而使用。鉻係設在遮光層BM之最上層,以便從外 部供給電壓於遮光膜BM。 遮光膜B Μ在各行之圖素上形成爲朝向左右方向之線 狀’而由該線劃分各彳了之有效顯7Κ領域。因此,遮光膜 ΒΜ使各行之圖素之輪廓成爲更明確。亦即遮光膜ΒΜ具 有對黑色矩陣及i型半導體層A S之遮光等2種功能。 遮光膜BM又在周邊部形成爲畫框狀,其圖型與第 2 5圖所示之矩陣部之圖型成爲連續。周邊部之遮光膜 B Μ延伸至封閉部S L之外側,防止個人電腦等機器所造 成之反射光等洩漏光進入矩陣部,而且又防止背光等光線 洩漏至顯示區域以外。另一方面,該遮光膜ΒΜ只形成至 離開基板SUB2之邊緣大約0·3〜1.0之內側,避 開基板S U Β 2之切斷領域形成。 經濟部智慧財產局員工消費合作社印製 〔外部塗敷膜0 C〕 與實施例1相同。但亦可形成穿孔以便將電位供給於 遮光膜ΒΜ。電位最好連接於對向電壓V c。 本實施例,除了可產生實施例7之效果以外,又因爲 遮光膜Β Μ可屏蔽從影像信號線D L產生之電場之影響, 故圖素電極Ρ X與對向電極C Τ之電場不會受到影響。因 此,與影像信號線D L之間不會發生串音,可消除畫面上 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ297公釐) ~ 75 - 494261 A7 __ B7 五、發明説明(73 ) 出現直線紋之畫質不良(污點)。此外,將設在影像信號 線D L兩旁之透明對向電極C T以遮光層S Η遮光之領域 亦縮小,可實現更高之穿透率。 (實施例1 1 ) 第4 3圖爲本實施例之提高主動矩陣型彩色液晶顯示 裝置之孔徑率之原理圖。第4 3 Α圖爲在電極上施加電壓 時之液晶顯示層內之電位分布特性圖。第4 3 B圖爲液晶 層之中央部附近之液晶分子之再配向狀態之平面圖。第 4 3 C圖爲第4 3 B圖所示液晶分子之旋轉角α之特性圖 。第4 3 D圖爲穿透上下偏光板,上下基板,電極上及電 極間之液晶層之光線之穿透率分布之特性圖之一例。 本實施例除了以下要件以外,其他與實施例7相同。 本實施例中,液晶層之扭轉彈性係數Κ 2係使用大約 2 X 1 0 -12 Ν。 若扭轉彈性係數Κ 2係使用例如大約1 Ο X 1 Ο—12Ν之較大數值時,如第4 1 Β圖所示,電極上中 央部之液晶分子之旋轉角α幾乎等於0,因此,電極上中 央部之穿透率大致上成爲黑暗顯示之數值。 本實施例中,連電極上中央部之液晶分子亦旋轉,電 極間之Α部分之穿透率之平均穿透率之5 0%以上成爲電 極上之B部分之穿透率之平均值穿透率。 因此,全部平均穿透率成爲A + B部分之穿透率之平 均值穿透率,可大幅度的提高。 I紙張尺度適用中國國家標準( CNS ) A4規格(210X297公釐) ~ -76 - (請先閲讀背面之注意事項再填寫本頁) 訂 經濟部智慧財產局員工消費合作社印製 494261 經濟部智慧財產局員工消費合作社印製 A7 B7五、發明説明(74 ) 本發明可如上述的應用於液晶等,在液晶製造業中有 實用性。 ρ. 第1圖爲本發明實施例1之主動矩陣型彩色液晶顯示 裝置之液晶顯示部之一圖素及其周邊之要部平面圖; 第2圖爲第1圖中沿3 — 3線之圖素之斷面圖; 第3圖爲第1圖中沿4 一 4線之薄膜電晶體元件 T F T之斷面圖; 第4圖爲第1圖中沿5 — 5線之儲存電容器C s t g 之斷面圖; 第5圖爲用來說明顯示面板之矩陣周邊部之結構之平 面圖; 第6圖爲左側無掃描信號端子,右側無外部連接端子 之面板邊緣部分之斷面圖; 第7 A圖爲閘極端子G TM及閘極配線G L之連接部 附近之平面圖,第7 B圖爲其斷面圖; 第8 A圖爲吸極端子D TM及影像信號線D L之連接 部附近之平面圖,第8 B圖爲其斷面圖; 第9A圖爲共同電極端子CTM,共同匯流排線CB ,及共同電壓信號線C L之連接部附近之平面圖,第9 B 圖爲其斷面圖; 第1 0圖爲本發明之主動矩陣型彩色液晶顯示裝置之 包括矩陣部及周邊部之電路圖; ^紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) ""~ -77 - (請先閱讀背面之注意事項再填寫本頁) 494261 A7 B7 五、發明説明(?5 ) 胃11圖爲本發明之主動矩陣型彩色液晶顯示裝置之 驅動波型之圖; (請先閱讀背面之注意事項再填寫本頁) 第1 2圖爲基板SUB 1側之過程A〜C之製造過程 之Η素部及閘極端子部之斷面之流程圖; 第1 3圖爲基板SUB 1側之過程D〜F之製造過程 之圖素部及閘極端子部之斷面之流程圖; 第1 4圖爲基板SUB 1側之過程G〜Η之製造過程 之圖素部及閘極端子部之斷面之流程圖; 第1 5圖爲液晶顯示面板上安裝周邊之驅動電路之狀 態之上面圖; 第1 6圖爲在可撓性配線基板上裝載構成驅動電路之 積體電路晶粒CH I之帶載體包裝TC Ρ之斷面構造圖; 第17圖爲將帶載體包裝TCP連接於液晶顯示面板 P N L之掃描信號電路用端子G TM之狀態之要部斷面圖 第1 8圖爲液晶顯示模組之分解透視圖; 經濟部智慧財產局員工消費合作社印製 第1 9圖爲施加電場方向,研磨方向,偏光板穿透軸 之關係圖; 第2 0圖爲本發明實施例2之主動矩陣型彩色液晶顯 示裝置之液晶顯示部之一圖素及其周邊之要部平面圖; 第21圖爲本發明實施例3之主動矩陣型彩色液晶顯 示裝置之液晶顯不部之· 一*圖素及其周邊之要部平面圖, 第2 2圖爲本發明實施例4之主動矩陣型彩色液晶顯 示裝置之液晶顯示部之一圖素及其周邊之要部平面圖; 中國國家標準(CNS ) A4規格(210X297公釐1 ~:; _ 494261 經濟部智慧財產局員工消費合作社印製 A7 B7五、發明説明(76 ) 第2 3圖爲本發明實施例5之主動矩陣型彩色液晶顯 示裝置之液晶顯示部之一圖素及其周邊之要部平:面圖; 第2 4 A〜C圖爲本發明實施例6之主動矩陣型彩色 液晶顯示裝置之液晶顯$部之及其周邊之要部平1面 圖及斷面圖; 第2 5圖爲本發明實施例7之$動矩陣型彩色'液晶顯 示裝置之液晶顯示部之一圖素及其周邊之要部平面圖; 第2 6圖第2 5圖中沿6 — 6線之斷面圖; 第2 7圖爲第2 5圖中沿7〜7線之薄膜電晶體元件 T F T之斷面圖; 第2 8圖爲第2 5圖中沿8〜8線之儲存電容器 C s t g之斷面圖; 第2 9 A圖爲閘極端子G T Μ,閘極配線G L之連接 部附近之平面圖,第2 9 Β圖爲其斷面圖; 第3 0Α圖爲吸極端子DTM與影像信號線DL之連 接部附近之平面圖,第3 Ο Β圖爲其斷面圖; 第3 1 Α圖爲共同電極端子CTM1 ,共同匯流排線 C Β 1 ,及共同電壓信號線D L之連接部附近之平面圖, 第3 1 B圖爲其斷面圖; 第3 2A圖爲共同電極端子CTM2,共同匯流排線 C B 2,及共同電壓信號線C L之連接部附近之平面圖, 第3 2圖爲其斷面圖; 第3 3圖爲本發明之主動矩陣型彩色液晶顯示裝置之 包括矩陣部及其周邊之電路圖; 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) — _ -79 - (請先閲讀背面之注意事項再填寫本頁) 494261 A7 B7 五、發明説明(77 ) 胃3 4圖爲本發明之主動矩陣型彩色液晶顯示裝置之 驅動波動之圖; 第3 5圖爲基板SUB 1側之過程A〜C之製造過程 之圖素部及閘極端子部之斷面之流程圖; 第3 6圖爲基板SUB 1側之過程D〜E之製造過程 之圖素部及閘極端子部之斷面之流程圖; 第3 7圖爲基板SUB 1側之過程F之製造過程之圖 素部及閘極端子部之斷面之流程圖; 第3 8圖爲本發明實施例8之主動矩陣型彩色液晶顯 示裝置之液晶顯示部之一圖素及其周邊之要部平面圖; 第3 9圖爲本發明實施例9之主動矩陣型彩色液晶顯 示裝置之液晶顯示部之一圖素及其周邊之要部平面圖; 第4 0圖爲本發明實施例1 〇之主動矩陣型彩色液晶 顯示裝置之液晶顯示部之一圖素及其周邊之要部平面圖; 第4 1 A〜D圖爲本發明之原理圖,第4 1 A圖爲在 電極上施加電壓時之液晶層內之電位分布之特性圖,第 4 1 B圖爲液晶層之中央部附近之液晶分子之再配向狀態 之平面圖,第4 1 C圖爲第4 1 B圖所示液晶分子之旋轉 角α之特性圖,第4 1 D圖爲穿透上下偏光板,上下基板 ,電極上及電極間之液晶層之光線之穿透率分有之特性圖 > 第4 2圖爲本發明之原理圖,第4 2Α圖爲在透明電 極上施加電壓時之等電位線之狀態之特性圖,第4 2 Β, 4 2 C圖爲施加電場時之液晶層內之液晶分子之旋轉角α 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ 297公釐) (請先閱讀背面之注意事項再填寫本頁) 、τ 經濟部智慧財產局員工消費合作社印製 -80 - 494261 A7 _____B7 五、發明説明(78 ) 及傾斜角(上昇)之圖之一例; 第4 3圖爲提高本發明實施例1 1之主動矩陣型彩色 液晶顯示裝置之孔徑率之原理圖,第4 3 A圖爲在電極上 經濟部智慧財產局員工消費合作社印製 施 加 電 壓 時 之 液 晶 層 內 之 電 位 分 布 之 特 性 [S3 圖 > 第 4 3 B 圖 爲 液 晶 層 之 中 央 部 附 近 之 液 晶 分 子 之 再 配 向 狀 態 之 平 面 |cjfl 圖 第 4 3 C rwr 圖 爲 第 4 3 Β 圖 所 示 液 晶 分 子 之 旋 轉 角 a 之 特 性 圖 第 4 3 D 圖 爲 穿 透 上 下 偏 光 板 > 上 下 基 板 電 極 上 及 電 極 間 之 液 晶 層 之 光 線 之 穿 透 率 分 布 之 特 性 圖 之 一 例 > 第 4 4 固 圖 爲 在 橫 電 場 方 式 之 液 晶 顯 示 裝 置 中 與 液 晶 層 內 之 液 晶 分 子 之 傾 斜 角 在 全 方 位 之 對 比 成 爲 1 0 以 上 之 視 野 角 範 圍 之 模 擬 結 果 之 特 性 圖 之 1 例 〇 C 符 號 說 明 ) R D R 初 期 配 向 方 向 G T 閘 極 A S i 型 半 導 體 層 A 〇 F 陽 極 氧 化 膜 g 1 導 電 膜 d 〇 N ( + ) 型 半 導 體 層 d 1 , d 2 導 電 膜 P S V 1 保 護 膜 D T Μ G T Μ 外 部 連 接 端 子 G I 閘 極 絕 緣 膜 T g > T d 外 部 連 接 端 子 群 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) _ 81 494261 A7 B7 五、發明説明(79 ) 經濟部智慧財產局員工消費合作社印製 L N 邊 緣 D T M 汲 極 端 子 T S T d 檢 查 端 子 C T M 對 向 電 極 端 子 E 電 場 向 量 E X 橫 電 場 E y 基 板 面 方 向 φ L C 初 期 配 向 角 a 旋 轉 角 〇 R I 1 2 配 向 膜 S U B 1 > 2 基 板 G L 掃 描 信 號 C L 對 向 電 極 信 號 T F T 薄 膜 電 晶 體 C s t g 儲 存 電 容 器 P X 圖 素 電 極 C T 對 向 電 極 D L 影 像 信 號 線 S D 1 源 極 C B 共 通 匯 流 排 L C 液 晶 層 F I L 彩 色 光 器 B M 遮 光 膜 P N L 顯 示 面 板 (請先閲讀背面之注意事項再填寫本頁) 、11 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -82 - 494261 A7 B7 五、發明説明(8〇 )PCB1 驅動電路基板 經濟部智慧財產局員工消費合作社印製 本纸張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -83 --71-494261 A7 B7 V. Description of Invention (69) Same as the first embodiment. (Please read the precautions on the back before filling in this page) [All the structure of the liquid crystal display module] The same as the first embodiment. As described above, in this embodiment, since the comb-shaped electrode is formed as transparent as in Embodiment 3, the maximum transmittance during white display can be increased by about 50%, and the PNL of the liquid crystal display panel can be penetrated. The rate becomes approximately 5.7%. In addition, an I TO film that can improve the reliability of the terminal can be formed at the same time, which can simultaneously produce reliability and productivity. This embodiment is different from Embodiments 1 to 6, because the process of forming I TO on the protective film PSV is used, so the counter electrode can be set at the uppermost layer, and the shielding efficiency of the leakage electric field of the image signal line is also high. Reduce crosstalk. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, because there is no protective film p SV in the power line path of the liquid crystal between the driving electrodes, the voltage will not decrease in the protective film p SV, and the maximum driving voltage value for driving the liquid crystal can be changed from implementation. The 7 · 5V of Example 1 was reduced to 5.0 · V of this embodiment. This method uses an electric field parallel to the substrate surface to drive the liquid crystal. Since there are two protective films in the power line path between the electrodes, the process can be simplified and productivity can be improved. (Embodiment 8) Except for the following requirements, this embodiment is the same as the embodiment 7. The paper size is the same as the Chinese National Standard (CNS) A4 specification (210X297 mm) -72-494261 Printed by the Intellectual Property Bureau Staff Consumer Cooperatives System A7 B7 V. Description of Invention (7G). Figure 38 is not a plan view. The hatched portion in the figure indicates the transparent conductive film i 1. [Pixel Electrode P X] In this embodiment, the pixel electrode PX is composed of a conductive film d 3 on the same layer as the source SD 1 and the sink SD 2. The pixel electrode PX is integrated with the source S D 1. In this embodiment, in addition to having the same effects as in Embodiment 1, although the transmittance is slightly affected, it is possible to avoid poor contact between the pattern electrode P X and the source s D 1. Since one of the electrodes is covered with an insulating film (protective film P S V 1), the possibility of a direct current passing through the liquid crystal is reduced when an alignment film defect occurs, and liquid crystal degradation does not occur, which improves reliability. (Embodiment 9) This embodiment is the same as Embodiment 7 except for the following requirements. Figures 3 to 9 show plan views of the pixels. The oblique line in the figure indicates the transparent conductive film i 1 〇 [counter electrode C D] In this embodiment, the counter electrode C T and the counter voltage signal line C L are integrated with the conductive film g 3. In this embodiment, in addition to the effects as in the first embodiment, although the transmittance is slightly affected, the poor contact between the counter electrode C T and the counter voltage signal line C L can be avoided. Because one of the electrodes is covered by an insulating film ((Please read the precautions on the back before filling this page) This paper size is applicable to China National Standard (CNS) A4 (210X29 * 7 mm) -73-494261 A7 B7 V. Description of the invention (71) The protective film PSV 1) is covered, so the possibility of direct current passing through the liquid crystal when the alignment film defect occurs is reduced, the liquid crystal is not deteriorated, and the reliability can be improved. (Please read the precautions on the back before filling in this page) (Embodiment 10) This embodiment is the same as Embodiment 7 except for the following requirements. Figure 40 shows a plan view of the pixels. The hatched part in the figure indicates the transparent conductive film i 1. [Light-shielding film BM] A light-shielding film BM (also a black matrix) is formed on the upper transparent glass substrate SUB 2 side to prevent penetration of unnecessary gaps (the gaps between the pixel electrode PX and the counter electrode CT). Light is emitted to the display surface to reduce contrast. The light-shielding film BM also has a function of preventing external light and the backlight from entering the i-type semiconductor layer AS. That is, the thin-film transistor T F T's i-type semiconductor layer A S is held by a light-shielding film BM and a larger gate G D which are located above and below, so that the external natural light and backlight will not be illuminated. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. The light-shielding film BM shown in Fig. 40 extends from the top of the thin-film transistor TF T element in the vertical, horizontal, and leftward direction. The display of the electric field in the direction of the comb electrode is chaotic, which corresponds to the image information in the pixel on a one-to-one basis, and becomes black when it is black and white when it is white, so it can be used as part of the display. This embodiment is different from Embodiment 7 in that the light-shielding film BM has a light-shielding property and is formed of a highly conductive film to prevent an electric field generated from the image signal line D L from affecting the electric field between the pixel electrode P X and the counter electrode C T. In this implementation, the paper size applies to the Chinese National Standard (CNS) A4 (210X297 mm) -74-494261 Α7 Β7 V. Description of the invention (72) (Please read the precautions on the back before filling this page) For example, from A three-layer structure of chromium oxide (CrOx), chromium nitride (CrNx), and chromium (C r) is formed on the substrate SUB 1 surface to a thickness of about 0.2 mm // m. In this case, chromium oxide is used to suppress reflection on the display surface. Chromium is provided on the uppermost layer of the light-shielding layer BM to supply a voltage to the light-shielding film BM from the outside. The light-shielding film BM is formed on the pixels of each row in a line shape toward the left and right directions', and the effective 7K area is divided by the line. Therefore, the light-shielding film BM makes the outline of the pixels in each row more clear. That is, the light-shielding film BM has two functions, such as shielding the black matrix and the i-type semiconductor layer AS. The light-shielding film BM is formed into a picture frame shape at the peripheral portion, and its pattern is continuous with that of the matrix portion shown in FIG. 25. The light shielding film BM at the peripheral portion extends beyond the closed portion SL to prevent leakage light such as reflected light from a personal computer or the like from entering the matrix portion, and prevent light such as backlight from leaking out of the display area. On the other hand, the light-shielding film BM is formed only to the inside of about 0.3 to 1.0 from the edge of the substrate SUB2, and is formed so as to avoid the cutting area of the substrate SUB2. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs [External Coating Film 0 C] The same as in Example 1. However, a perforation may be formed to supply a potential to the light-shielding film BM. The potential is preferably connected to the counter voltage V c. In this embodiment, in addition to the effect of Embodiment 7, and because the light shielding film BM can shield the influence of the electric field generated from the image signal line DL, the electric field of the pixel electrode P X and the counter electrode C T will not be affected. influences. Therefore, crosstalk does not occur with the image signal line DL, and the paper size on the screen can be eliminated according to the Chinese National Standard (CNS) A4 specification (210 × 297 mm) ~ 75-494261 A7 __ B7 V. Description of the invention (73) Poor quality (smear) with straight lines. In addition, the area where the transparent counter electrodes C T provided on both sides of the image signal line D L are shielded by the light-shielding layer S Η is also reduced, and a higher transmittance can be achieved. (Embodiment 1 1) Figures 4 and 3 are principle diagrams of improving the aperture ratio of an active matrix color liquid crystal display device of this embodiment. Figure 4 3A is a graph showing the potential distribution characteristics of the liquid crystal display layer when a voltage is applied to the electrodes. Figure 4 3B is a plan view of the realignment state of liquid crystal molecules near the central portion of the liquid crystal layer. Figure 4 3C is a characteristic diagram of the rotation angle α of the liquid crystal molecules shown in Figure 4 3B. Fig. 4 3D is an example of a characteristic diagram of the light transmittance distribution of light passing through the upper and lower polarizing plates, the upper and lower substrates, the liquid crystal layer on the electrodes and between the electrodes. This embodiment is the same as Embodiment 7 except for the following requirements. In this embodiment, the torsional elasticity coefficient K 2 of the liquid crystal layer is about 2 X 1 0 -12 N. If the torsional modulus of elasticity K 2 uses a large value, for example, about 1 0 X 1 0-12N, as shown in FIG. 4B, the rotation angle α of the liquid crystal molecules at the center of the electrode is almost equal to 0. Therefore, the electrode The transmittance of the upper central portion is roughly the value of the dark display. In this embodiment, even the liquid crystal molecules at the central part of the electrodes are also rotated, and the average transmittance of the transmittance of the A part between the electrodes is more than 50%, which becomes the mean transmittance of the B part on the electrode. rate. Therefore, the entire average transmittance becomes the average transmittance of the transmittance of the A + B portion, which can be greatly improved. I Paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) ~ -76-(Please read the precautions on the back before filling out this page) Ordered by the Intellectual Property Bureau of the Ministry of Economic Affairs and printed by the Consumer Cooperatives 494261 Intellectual Property of the Ministry of Economic Affairs Printed by the Consumer Cooperative of the Bureau A7 B7 V. Description of the Invention (74) The invention can be applied to liquid crystal and the like as described above, and has practicality in the liquid crystal manufacturing industry. ρ. FIG. 1 is a plan view of a pixel of a liquid crystal display portion of an active matrix color liquid crystal display device and its surroundings in Embodiment 1 of the present invention; FIG. 2 is a view taken along line 3-3 in FIG. 1 Sectional view of the element; Figure 3 is a sectional view of the thin film transistor TFT along line 4-4 in Figure 1; Figure 4 is a breakdown of the storage capacitor C stg along line 5-5 in Figure 1 Figure 5 is a plan view for explaining the structure of the matrix peripheral portion of the display panel; Figure 6 is a sectional view of the edge portion of the panel without scanning signal terminals on the left and external connection terminals on the right; Figure 7 A is A plan view near the connection part of the gate terminal G TM and the gate wiring GL, FIG. 7B is a sectional view; FIG. 8 A is a plan view near the connection part of the suction terminal D TM and the image signal line DL. Fig. 8B is a cross-sectional view; Fig. 9A is a plan view near the connection part of the common electrode terminal CTM, the common bus line CB, and the common voltage signal line CL, and Fig. 9B is a cross-sectional view thereof; The figure shows an active matrix color liquid crystal display device of the present invention including a matrix portion and a peripheral portion. Road map; ^ Paper size applies Chinese National Standard (CNS) A4 specification (210X 297 mm) " " ~ -77-(Please read the notes on the back before filling this page) 494261 A7 B7 V. Description of the invention ( 5) Stomach 11 is the driving waveform of the active matrix color liquid crystal display device of the present invention; (Please read the precautions on the back before filling this page) Figure 12 shows the process A on the substrate SUB 1 side ~ The flow chart of the cross section of the element and gate terminals of the manufacturing process of C; Figure 13 shows the cross sections of the pixel and gate terminals of the manufacturing process of D to F on the substrate SUB 1 side. Flow chart; Figure 14 is a flowchart of the cross section of the pixel part and the gate terminal part of the manufacturing process G ~ Η on the substrate SUB 1 side; Figure 15 is a peripheral driving circuit mounted on the LCD panel The top view of the state; FIG. 16 is a cross-sectional structure view of a carrier package TC P on which the integrated circuit chip CH I constituting the driving circuit is mounted on a flexible wiring substrate; FIG. 17 is a package with a carrier Status of TCP connected to the scanning signal circuit terminal G TM of the liquid crystal display panel PNL Figure 18 of the cross-section of the main part is an exploded perspective view of the liquid crystal display module; printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs; Figure 19 is the relationship between the direction of the applied electric field, the grinding direction, and the axis of the polarizing plate penetration; FIG. 20 is a plan view of a pixel of a liquid crystal display part of an active matrix type color liquid crystal display device according to Embodiment 2 of the present invention and its surroundings; FIG. 21 is an active matrix color liquid crystal display of Embodiment 3 of the present invention The LCD display part of the device is a plan view of the main part of the pixel and its surroundings, and FIG. 22 is a pixel and its peripheral part of the liquid crystal display of the active matrix type color liquid crystal display device according to Embodiment 4 of the present invention. Plan view of main parts; Chinese National Standard (CNS) A4 specifications (210X297 mm 1 ~ :; _ 494261 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (76) Figures 2 and 3 are examples of the present invention One pixel of the liquid crystal display part of the active matrix type color liquid crystal display device of FIG. 5 and the main parts around it are flat: a surface view; and FIGS. 2A to C are the active matrix color liquid crystal display devices of Embodiment 6 of the present invention. liquid crystal $ 1 of the main part and its surroundings are a plan view and a sectional view; Figures 2 and 5 are a picture of a liquid crystal display part of a $ moving matrix type color 'liquid crystal display device according to Embodiment 7 of the present invention and its surroundings. The plan view of the main part; Fig. 26, Fig. 25 is a sectional view taken along line 6-6 in Fig. 25; Fig. 27 is a sectional view of the thin film transistor TFT taken along line 7-7 in Fig. 25; Fig. 28 is a sectional view of the storage capacitor C stg along lines 8 to 8 in Fig. 25; Fig. 2 A is a plan view near the gate terminal GT Μ and the connection portion of the gate wiring GL, Fig. 2 9 Figure B is a sectional view; Figure 30A is a plan view near the connection between the suction terminal DTM and the image signal line DL; Figure 30B is a sectional view; Figure 3A is a common electrode terminal CTM1 , The common bus line C Β 1 and the common voltage signal line DL near the connection portion of the plan view, Figure 3 1 B is a sectional view; Figure 3 2A is the common electrode terminal CTM2, the common bus line CB 2, And the common voltage signal line CL near the connection portion, FIG. 32 is a sectional view; FIG. 33 is an active matrix color liquid crystal of the present invention The circuit diagram of the display device includes the matrix part and its surroundings; This paper size applies to the Chinese National Standard (CNS) A4 specification (210X297 mm) — _ -79-(Please read the precautions on the back before filling this page) 494261 A7 B7 V. Description of the invention (77) Stomach 3 4 is the driving fluctuation of the active matrix color liquid crystal display device of the present invention; Figure 3 5 is the pixel portion of the manufacturing process A to C of the substrate SUB 1 side and Sectional flow chart of the gate electrode terminal section; Figure 36 shows the flow chart of the pixel section and the gate electrode terminal section of the manufacturing process from D to E on the substrate SUB 1 side; Figure 37 shows the substrate A flowchart of the cross section of the pixel part and the gate electrode terminal part of the manufacturing process of the process F on the SUB 1 side; FIG. 38 is a diagram of a liquid crystal display part of an active matrix color liquid crystal display device according to Embodiment 8 of the present invention A plan view of the main part of the pixel and its surroundings; FIGS. 39 and 9 are plan views of one of the pixels of the liquid crystal display part of the active matrix color liquid crystal display device according to Embodiment 9 of the present invention and the main part of its periphery; and FIG. 40 is the present invention Example 1 〇 Active Matrix Color LCD A plan view of a pixel of the liquid crystal display part of the device and the surrounding parts; Figures 4 1 to D are schematic diagrams of the present invention, and Figure 4 1 A is the potential distribution in the liquid crystal layer when a voltage is applied to the electrodes. Fig. 4 1B is a plan view of the realignment state of the liquid crystal molecules near the central portion of the liquid crystal layer, and Fig. 4 1C is a characteristic diagram of the rotation angle α of the liquid crystal molecules shown in Fig. 4 1B. Figure 4 1D is a characteristic diagram of the transmittance of light penetrating through the upper and lower polarizing plates, the upper and lower substrates, the liquid crystal layer on and between the electrodes, and Figure 4 2 is a schematic diagram of the present invention, and Figure 4 2A It is a characteristic diagram of the state of the equipotential line when a voltage is applied to the transparent electrode. Figures 4 2 Β and 4 2 C are the rotation angles of the liquid crystal molecules in the liquid crystal layer when an electric field is applied. CNS) A4 specification (210 × 297 mm) (Please read the precautions on the back before filling out this page), τ Printed by the Consumer Consumption Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs -80-494261 A7 _____B7 V. Description of the invention (78) and tilt An example of the angle (rising) diagram; The principle diagram of the aperture ratio of the active matrix color liquid crystal display device in Example 11 of the present invention, and Figure 4 A is the potential distribution in the liquid crystal layer when the voltage is printed on the electrodes by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Characteristics [S3 map> Figure 4 3B is the plane of the realignment state of the liquid crystal molecules near the central portion of the liquid crystal layer | cjfl Figure 4 3 C rwr is the rotation angle of the liquid crystal molecules shown in Figure 4 3 Β Characteristic diagram of a. Figure 4 3D is an example of the characteristic diagram of the transmittance distribution of light transmitted through the upper and lower substrate electrodes and the liquid crystal layer between the electrodes. Figure 4 4 is a diagram showing the transverse electric field. In the liquid crystal display device of the present invention, the comparison of the inclination angle of the liquid crystal molecules in the liquid crystal layer in all directions becomes 1 in the characteristic diagram of the simulation result of the viewing angle range of 10 or more. 1 Example of OC symbol description) RDR initial orientation direction GT gate AS i-type semiconductor layer A 〇F anodized oxide film g 1 conductive film d 〇N (+) type semiconductor layer d 1, d 2 conductive film PSV 1 protective film DT MG GT Μ external connection terminal GI gate insulation film T g > T d External connection terminal group The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) _ 81 494261 A7 B7 V. Description of the invention (79) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Edge DTM Drain terminal TST d Inspection terminal CTM Counter electrode terminal E Electric field vector EX Horizontal electric field E y Substrate plane direction φ LC Initial alignment angle a Rotation angle 〇 1 1 Alignment film SUB 1 > 2 GL scan signal CL pair To the electrode signal TFT thin film transistor C st g Storage capacitor PX pixel electrode CT counter electrode DL image signal line SD 1 source CB common bus LC liquid crystal layer FIL color light BM light-shielding film PNL display panel (please read the precautions on the back before filling this page), 11 This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -82-494261 A7 B7 V. Description of the invention (80) PCB1 Drive circuit substrate Intellectual property bureau staff of the Ministry of Economic Affairs Consumer Cooperatives printed this paper size Applicable to China National Standard (CNS) A4 specification (210X297 mm) -83-

Claims (1)

494261 經濟部智慧財產局員工消費合作社印製 A 8 r B8Ο , D8六、申請專利範圍 丨丨 1.一種具有高開口率之橫電場方式液晶顯示裝置, 主要爲具有圖素電極及對向電極,利用大致上平行於該圖 素電極與該對向電極間之基板面之電場成分控制可扭轉之 液晶層之液晶分子而進行顯示之主動矩陣型液晶顯示裝置 ,其特徵爲:至少圖素電極或對向電極中之一方爲透明電 極,該可扭轉之液晶之初期配向狀態,及偏光板之偏光軸 構成爲隨著該電場成分之增加,該顯示裝置之光穿透率亦 增加之狀態,未施加電場時,該可扭轉之液晶層之初期定 向狀態成爲均勻配向狀態,施加電場時之圖素電極與對向 電極間及該透明電極上之液晶分子主動的平行於基板面旋 轉,該光穿透率之最大值爲大於4 · 0%,對比1 0對1 以上之視野角範圍在與顯示面成爲垂直方向成爲4 0度以 上傾斜之全方位範圍內。 2 . —種具有高開口率之橫電場方式液晶顯示裝置, 主要爲具有圖素電極及對向電極,利用大致上平行於該圖 素電極與該對向電極間之基板面之電場成分控制可扭轉之 液晶層之液晶分子而進行顯示之主動矩陣型液晶顯示裝置 ,其特徵爲:至少圖素電極或對向電極中之一方爲透明電 極,該可扭轉之液晶之初期配向狀態,偏光板之偏光軸構 成爲隨著該電場成分之增加,該顯示裝置之光穿透率亦增 加之狀態,未施加電場時該可扭轉之液晶層之初期配向狀 態成爲均勻狀態,其扭轉彈性係數爲1 0 X 1 0 —1 2 Ν ( Newton)以下。 3·—種具有高開口率之橫電場方式液晶顯示裝置, 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 辦丨 (請先閲讀背面之注意事項再填寫本頁) 訂 -84 - 494261 A8 B8 C8 D8 六、申請專利範圍 (請先閲讀背面之注意事項再填寫本頁) 主要爲具有圖素電極及對向電極,利用大致上平行於該圖 素電極及該對向電極間之基板面之電場成分控制可扭轉之 液晶層之液晶分子而進行顯示之主動矩陣型液晶顯示裝置 ,其特徵爲:至少圖素電極或對向電極中之一方爲透明電 極,該可扭轉之液晶之初期配向狀態,偏光板之偏光軸構 成爲隨著該電場成分之增加,該顯示裝置之光穿透率亦增 加之狀態,未施加電場時之該可扭轉之液晶層之初期配向 狀態爲均勻配向狀態,液晶層之上下界面之液晶分子之初 期預傾斜角度爲1 0度以下,而液晶層內之液晶分子之初 期傾斜狀態爲擴散狀態,代表於其上形成有該圖素電極之 基板的研磨(rubbing)方向與於其上未形成該圖素電極之 基板的研磨方向是相同的。 4 . 一種具有高開口率之橫電場方式液晶顯示裝置’ 主要爲具有圖素電極及對向電極,利用大致上平行於該圖 素電極與該對向電極間之基板面之電場成分控制可扭轉之 液晶層之液晶分子而進行顯示之主動矩陣型液晶顯示裝置 經濟部智慧財產局員工消費合作社印製 ,其特徵爲:至少圖素電極或對向電極中之一方爲透明電 極,該可扭轉之液晶之初期配向狀態,偏光板之偏光軸構 成爲隨著電場成分之增加,該顯示裝置之光穿透率亦增加 之狀態,未施加電場時之該可扭轉之液晶層之初期配向狀 態成爲均勻配向狀態,透明電極上之液晶層之液晶分子之 平均傾斜角在未施加電場時仍爲小於4 5度。 5 .如申請專利範圍第2項之裝置,其中該液晶之扭 轉彈性係數爲5 · 1 X 1 0 —12 N以下。 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) " ' -85 - 494261 經濟部智慧財產局員工消費合作社印製 A8 B8 C8 D8六、申請專利範圍 6.如申請專利範圍第2項之裝置’其中該液晶之扭 轉彈性係數爲2 X 1 0_12N以下。 7 ·如申請專利範圍第3項之裝置,其中該可扭轉之 液晶層之上下界面之液晶分子之初期預傾斜角爲6度以下 〇 8 ·如申請專利範圍第4項之裝置,其中該可扭轉之 液晶層之透明電極上之液晶分子之平均傾斜角在施加電場 時仍爲3 0度以下。 9 .如申請專利範圍第4項之裝置,其中該可扭轉之 液晶層之透明電極上之液晶分子之平均傾斜角在施加電場 時仍爲10度以下。 1 0 ·如申請專利範圍第1至4項中之任一項之裝置 ,其中圖素電極或對向電極係由透明電極及不透明金屬電 極所構成之雙層構造。 1 1 .如申請專利範圍第1至4項中之任一項之裝置 ,其中該主動矩陣型液晶顯示裝置又具有連接各對向電極 間之對向電壓信號線,鄰接且具有一條閘信號線介於其間 之2條對向電壓信號線以對向電極經由穿孔而相互連接。 1 2 .如申請專利範圍第1至4項中之任一項之裝置 ,其中該主動矩陣型液晶顯示裝置又具有披覆主動矩陣元 件以及影像信號線之保護膜,至少該圖素電極或該對向電 極中之一方形成於該保護膜上,並且經由形成於該保護膜 之穿孔連接於主動矩陣元件或對向電壓信號線。 1 3 ·如申請專利範圍第1至4項中之任一項之裝置 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 一 86 _ (請先閲讀背面之注意事項再填寫本頁) 訂 494261 經濟部智慧財產局員工消費合作社印製 A8 B8 C8 D8六、申請專利範圍 ’其中對向電極係由透明電極所構成,又在對向電極與影 像信號線之間具有遮光圖型,且遮光圖型被形成於相同基 板上,此相同基板上形成有對向電極。 14·如申請專利範圍第1至4項中之任一項之裝置 ,其中該主動矩陣型液晶顯示裝置又具有連接各對向電極 間之對向電壓信號,而該對向電壓信號線係由金屬形成。 1 5 ·如申請專利範圍第1 1項之裝置,其中該對向 電壓信號線係由金屬形成。 1 6 .如申請專利範圍第1至4項中之任一項之裝置 ,其中該主動矩陣型液晶顯示裝置又具有影像信號線,在 1個圖素內具有包括鄰接於影像信號線之2條對向電極之 3支以上之對向電極,鄰接於該影像信號線之對向電極爲 不透明。 1 7 .如申請專利範圍第1至4項中之任一項之裝置 ,其中透明電極之透明導電膜爲I TO。 1 8 .如申請專利範圍第1 4項之裝置,其中對向電 壓信號線係由Cr ,Ta ,Ti ,Mo ,W,Af ,或其 合金,或將之層疊之包層構造形成。 19 .如申請專利範圍第14項之裝置,其中對向電 壓信號線係由在Cr ,Ta ,Ti ,Mo ,W,Aj?,或 其合金上層疊I T 0等之透明導電膜之包層構造所形成。 2 0 .如申請專利範圍第1 5項之裝置,其中對向電 壓信號線係由在C r ,T a ,T i ,Μ 〇 ,W,A又,或 其合金上層疊I T 0等之透明導電膜之包層構造所形成。 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 一 87 - .* 4, (請先閱讀背面之注意事項再填寫本頁) 、aT 494261 Α8 Β8 C8 D8 六、申請專利範圍 2 1 ·如申請專利範圍第1至4項中之任一項之裝置 ’其中在未施加電場時,該液晶層之初期扭轉角大致上爲 0 ’而介於初期配向方向與一電場施加方向之間的角度若 液晶材料之介電係數各向異性Δε爲正時爲4 5度以上 9 0以下,若介電係數各向異性Λε爲負時,爲〇度以上 4 5度以下。 2 2 · —種具有高開口率之橫電場方式液晶顯示裝置 之製造方法,主要爲具有圖素電極及對向電極,利用大致 上平行於該圖素電極與該對向電極間之基板面之電場成分 控制液晶層之液晶分子而進行顯示之主動矩陣型液晶顯示 裝置之製造方法,其特徵爲:將至少掃描信號線端子部的 最上層導電層,影像信號線端子部,或對向電極端子部中 之任一種形成爲第一透明導電層,及將至少圖素電極或對 向電極中之一形成爲第2透明導電層,並且在同一過程中 形成。 (請先閲讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS ) Α4規格(210X297公釐) -88 -494261 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A 8 r B 80, D 8 VI. Patent application range 丨 1. A transverse electric field mode liquid crystal display device with a high aperture ratio, mainly with pixel electrodes and counter electrodes, An active matrix type liquid crystal display device that performs display by using an electric field component substantially parallel to a substrate surface between the pixel electrode and the counter electrode to control liquid crystal molecules of a reversible liquid crystal layer, which is characterized in that at least the pixel electrode or One of the counter electrodes is a transparent electrode, and the initial alignment state of the reversible liquid crystal and the polarization axis of the polarizing plate are configured such that as the electric field component increases, the light transmittance of the display device also increases. When an electric field is applied, the initial orientation state of the reversible liquid crystal layer becomes a uniform alignment state. When an electric field is applied, the liquid crystal molecules between the pixel electrode and the counter electrode and on the transparent electrode actively rotate parallel to the substrate surface, and the light passes through. The maximum value of the transmittance is greater than 4.0%, and the range of the viewing angle from 10 to 1 contrast is more than 40 degrees in a direction perpendicular to the display surface. A full-range of tilt. 2. A transverse electric field type liquid crystal display device with a high aperture ratio, which mainly includes a pixel electrode and a counter electrode, and uses an electric field component control substantially parallel to a substrate surface between the pixel electrode and the counter electrode. An active matrix type liquid crystal display device that displays liquid crystal molecules of a twisted liquid crystal layer is characterized in that at least one of a pixel electrode or a counter electrode is a transparent electrode, and the initial alignment state of the reversible liquid crystal is that of a polarizing plate. The polarization axis is configured as a state where the light transmittance of the display device increases as the electric field component increases. The initial alignment state of the torsionable liquid crystal layer becomes uniform when the electric field is not applied, and its torsional elasticity coefficient is 10 X 1 0 —1 2 N (Newton) or less. 3 · —A horizontal electric field type liquid crystal display device with a high aperture ratio. This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm). 丨 (Please read the precautions on the back before filling this page) Order- 84-494261 A8 B8 C8 D8 6. Scope of patent application (please read the precautions on the back before filling this page) Mainly have a pixel electrode and a counter electrode, using the pixel electrode and the counter electrode which are approximately parallel to the pixel electrode An active matrix type liquid crystal display device that controls the liquid crystal molecules of a liquid crystal layer that can be twisted to control the electric field component on the substrate surface is characterized in that at least one of the pixel electrode or the counter electrode is a transparent electrode. The initial alignment state of the liquid crystal. The polarization axis of the polarizing plate is configured as a state where the light transmittance of the display device increases as the electric field component increases. The initial alignment state of the reversible liquid crystal layer when no electric field is applied is In the uniform alignment state, the initial pretilt angle of the liquid crystal molecules at the upper and lower interfaces of the liquid crystal layer is 10 degrees or less, and the initial stage of the liquid crystal molecules in the liquid crystal layer State diffusion inclined state, the substrate is formed thereon representative of the picture element electrodes polishing (Rubbing) is not formed thereon in a direction of a substrate to the rubbing direction of the picture element electrodes are the same. 4. A transverse electric field type liquid crystal display device with a high aperture ratio is mainly provided with a pixel electrode and a counter electrode, which can be reversed by using an electric field component control substantially parallel to the substrate surface between the pixel electrode and the counter electrode. The active matrix type liquid crystal display device for displaying liquid crystal molecules of the liquid crystal layer is printed by the consumer cooperative of employees of the Intellectual Property Bureau of the Ministry of Economic Affairs. It is characterized in that at least one of the pixel electrode or the counter electrode is a transparent electrode, which can be reversed. The initial alignment state of the liquid crystal, and the polarizing axis of the polarizing plate is configured as a state in which the light transmittance of the display device increases as the electric field component increases. The initial orientation state of the reversible liquid crystal layer when the electric field is not applied becomes uniform. In the aligned state, the average tilt angle of the liquid crystal molecules of the liquid crystal layer on the transparent electrode is still less than 45 degrees when no electric field is applied. 5. The device according to item 2 of the patent application scope, wherein the twisting elastic coefficient of the liquid crystal is 5 · 1 X 1 0-12 N or less. This paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) " '-85-494261 Printed by A8 B8 C8 D8 of the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 6. Scope of patent application 6. The device of item 2 wherein the torsional elastic coefficient of the liquid crystal is 2 X 1 0-12N or less. 7 · If the device in the scope of patent application item 3, wherein the initial pretilt angle of the liquid crystal molecules on the upper and lower interfaces of the reversible liquid crystal layer is 6 degrees or less. 0 · If the device in the scope of patent application item 4, the The average tilt angle of the liquid crystal molecules on the transparent electrodes of the twisted liquid crystal layer is still less than 30 degrees when an electric field is applied. 9. The device according to item 4 of the scope of patent application, wherein the average tilt angle of the liquid crystal molecules on the transparent electrode of the reversible liquid crystal layer is still below 10 degrees when an electric field is applied. 10 · The device according to any one of claims 1 to 4, wherein the pixel electrode or the counter electrode has a double-layer structure composed of a transparent electrode and an opaque metal electrode. 1 1. The device according to any one of claims 1 to 4, wherein the active matrix type liquid crystal display device further has an opposite voltage signal line connected between the opposite electrodes, and is adjacent to and has a gate signal line. The two opposing voltage signal lines are connected to each other through the through holes through the opposing electrodes. 1 2. The device according to any one of claims 1 to 4, wherein the active matrix liquid crystal display device further has a protective film covering the active matrix element and the image signal line, at least the pixel electrode or the One of the counter electrodes is formed on the protective film, and is connected to an active matrix element or a counter voltage signal line through a through hole formed in the protective film. 1 3 · If you apply for any of the items 1 to 4 in the scope of patent application, the paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm)-86 _ (Please read the precautions on the back before filling in this Page) Order 494261 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A8 B8 C8 D8 6. The scope of patent application 'The counter electrode is composed of a transparent electrode, and there is a light-shielding pattern between the counter electrode and the image signal line The light-shielding pattern is formed on the same substrate, and a counter electrode is formed on the same substrate. 14. The device according to any one of the claims 1 to 4, wherein the active matrix liquid crystal display device further has a voltage signal connected between opposite electrodes, and the voltage signal line is formed by Metal formation. 1 5 · The device according to item 11 of the scope of patent application, wherein the opposite voltage signal line is formed of metal. 16. The device according to any one of items 1 to 4 of the scope of patent application, wherein the active matrix type liquid crystal display device further has an image signal line, and includes 2 pixels adjacent to the image signal line in one pixel. The three or more opposing electrodes of the opposing electrodes are opaque to the opposing electrodes adjacent to the image signal line. 17. The device according to any one of claims 1 to 4, wherein the transparent conductive film of the transparent electrode is I TO. 18. The device according to item 14 of the scope of patent application, wherein the opposing voltage signal line is formed by Cr, Ta, Ti, Mo, W, Af, or an alloy thereof, or a cladding structure in which the same is laminated. 19. The device according to item 14 of the scope of patent application, wherein the opposing voltage signal line is made of a cladding structure of a transparent conductive film such as IT 0 on Cr, Ta, Ti, Mo, W, Aj ?, or an alloy thereof. Formed. 2 0. The device according to item 15 of the scope of patent application, wherein the counter voltage signal line is transparent by stacking IT 0 and the like on C r, Ta, Ti, Mo, W, A, or an alloy thereof. The cladding structure of the conductive film is formed. This paper size applies to Chinese National Standard (CNS) A4 specification (210X297 mm) 87-. * 4, (please read the precautions on the back before filling this page), aT 494261 Α8 Β8 C8 D8 六 、 Scope of patent application 2 1 · The device according to any one of claims 1 to 4 of the scope of patent application 'wherein when no electric field is applied, the initial twist angle of the liquid crystal layer is substantially 0', which lies between the initial alignment direction and an electric field application direction If the dielectric anisotropy Δε of the liquid crystal material is positive, the angle is 45 ° to 90 °, and if the dielectric anisotropy Δε is negative, the angle is 0 ° to 45 °. 2 2 · —A method for manufacturing a liquid crystal display device with a transverse electric field method having a high aperture ratio, which mainly includes a pixel electrode and a counter electrode, and uses a substrate surface substantially parallel to the pixel electrode and the counter electrode. A method for manufacturing an active matrix liquid crystal display device in which an electric field component controls liquid crystal molecules of a liquid crystal layer to perform display, is characterized by scanning at least the uppermost conductive layer of a signal line terminal portion, an image signal line terminal portion, or a counter electrode terminal. Any one of the parts is formed as the first transparent conductive layer, and at least one of the pixel electrode or the counter electrode is formed as the second transparent conductive layer, and is formed in the same process. (Please read the precautions on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs This paper applies the Chinese National Standard (CNS) Α4 specification (210X297 mm) -88-
TW085115891A 1996-12-18 1996-12-23 Liquid crystal display device using in plane switching with high opening ratio TW494261B (en)

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KR100293806B1 (en) * 1997-06-25 2001-10-24 박종섭 Liquid crystal display
US6287899B1 (en) * 1998-12-31 2001-09-11 Samsung Electronics Co., Ltd. Thin film transistor array panels for a liquid crystal display and a method for manufacturing the same
JP2002062544A (en) 2000-08-22 2002-02-28 Nec Corp Active matrix type liquid crystal display device
JP4176487B2 (en) * 2003-01-15 2008-11-05 株式会社 日立ディスプレイズ Liquid crystal display
KR101002347B1 (en) 2004-06-24 2010-12-21 엘지디스플레이 주식회사 Thin film transistor substrate of horizontal electronic field applying type and fabricating method thereof
KR101085136B1 (en) 2004-12-04 2011-11-18 엘지디스플레이 주식회사 Thin film transistor substrate of horizontal electric field and fabricating method thereof
JP4537929B2 (en) * 2005-10-04 2010-09-08 エルジー ディスプレイ カンパニー リミテッド Liquid crystal display device and method of manufacturing liquid crystal display device
JP5315136B2 (en) * 2009-06-05 2013-10-16 株式会社ジャパンディスプレイ Liquid crystal display
KR20200039671A (en) 2017-08-10 2020-04-16 제이엔씨 주식회사 Liquid crystal aligning agent, liquid crystal aligning film and liquid crystal display device using same

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