49_獮充 象 η 5 9 9 3 t fl.doc/002 8 9 1 1 4 4 2 2諕說明軎修TF本 A7 B7 修正日期90/11/9 五、發明說明（ί ) 本發明是有關於一種電測超微孔對準度之機構，且 特別是有關於一種具有超微孔之印刷電路板的對準度之測 試機構。 (請先閱讀背面之注意事項再填寫本頁) 近年來，爲因應電子產品日益輕、薄、短、小之趨 勢，印刷電路板（Printed Circuit Board，PCB)上之佈線 設計及製作亦須加以改良。爲增加線路佈線密度（Layout Density)，除了使線路細微化之外，還可以將印刷電路板 之貫穿孔（Through Via)的孔徑縮小化，使線路之運作更 加快速、更有效率。 以往係以機械鑽孔（Mechanic Drill Through Hole) 方式，於印刷電路板上製作貫穿孔，其孔徑最小爲0.2毫 米（mm)。因受限於機械加工的精密度，所以無法將貫穿孔 之孔徑進一步縮小，故未能達成線路細微化之目的。若改 以高功率之雷射（Laser)對印刷電路板進行鑽孔時，其所 形成之貫穿孔的孔徑則可小於0.2毫米。 但是也由於電子元件產品的積集度（Integration) 高，功能也越來越強，用以裝設電子元件的印刷電路板也 由單面開始越作越多層，由1層、2層而變爲6層、8層， 修煩 ^ 經濟部智慧財產局員工消費合作社印製 甚至到10層以上，以便使電子元件可以更密集的裝設於 ί| 印刷電路板上，使電子產品所佔的空間能更小。因此，隨 m ^ 一 |… 著多層印刷電路板的層數越來越多，連接到各層間之高密 奠年葵度內連線（High Density Interconnection ’ HDI)所應用 fgf雷射鑽孔（Laser* Drill)產生之孔徑會越來越小，若孔位 稍有偏移而影響電性導通，導致印刷電路板之可靠度降 修所 正提 〇之 3 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） ;箱免 J3鷗 5993twfl. doc/002 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（>) 低，製作成本也因不良率增加而大幅提昇。 7 以往係利用電路板板內已有之超微孔（Micro Via)製 作切片，來檢測超微孔之對準度及品質，此抽樣型破壞檢 測不但會造成檢測過的電路板報廢，卻無法正確及有效的 了解品質狀況。 因此本發明就是在提供一種電測超微孔對準度之機 構，以檢測超微孔之對準度，確保高密度內連線產品之品 質。 根據本發明之上述及其他目的，提出一種電測超微 孔對準度之機構，應用於一電路基板之超微孔作對準度測 試，其中電路基板至少包括一絕緣層、數層圖案化線路層、 數個外層銲墊、數個內層銲墊、以及數個超微孔。其中絕 緣層與數層圖案化線路層彼此交替疊合，而外層銲墊與內 層銲墊位於不同之圖案化線路層。超微孔位於外層銲墊與 內層銲墊間的絕緣層中，且分別對應於外層銲墊與內層銲 墊。而部分內層銲墊的中央分別具有開口，且此開口對應 不同內層銲墊，具有不同之直徑。 依照本發明之較佳實施例，本發明之電測超微孔對 、 準度之機構，可以利用簡易的電性導通檢測，以獲得雷射 1' 鑽孔所產生之孔位的偏移量，以監控產品之可靠度及良 f 率，並可即時調整製程參數，提高生產效能。而利用印刷 i, i 〔I電路板之折斷邊作檢測，不但免於損壞欲測試之印刷電路 1 ； 板，而且正確及有效的了解品質狀況，使高密度內連線產 1/品可靠度提昇。 —十，ί 4 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） —j------------------訂---------^ —Awl (請先閱讀背面之注意事項再填寫本頁) 耦尤 5 9 9 3 t rf 1 . d( :/002 A7 B7 五、發明說明（，） 爲讓本發明之上述和其他目的、特徵、和優點能更 明顯易懂，下文特舉較佳實施例，並配合所附圖式，作詳 細說明如下： 圖式之簡單說明： 第1A圖與第1B圖繪示依照本發明之較佳實施例電 測超微孔對準度之機構之平面位置示意圖。 第2A圖至第2E圖繪示依照本發明之較佳實施例電 測超微孔對準度之機構之剖面及各層平面示意圖。 第3A圖繪示依照本發明之較佳實施例電測超微孔對 準度之機構的位置對應圖。 第3B圖與第3C圖繪示依照本發明之較佳實施例電 測超微孔對準度之機構的剖面及透視示意圖。 圖式之標記說明： 100、200 電路基板 102 :折斷邊 104 :線路區 120 :部分電路基板 202a、202b、202c、302 :外層銲墊 204、304 :超微孔 206a、206b、206c、306 ··內層銲墊 220a、220b、220c :圖案化線路層 260 :絕緣層 240 :銲罩層 300 :孔位組合 (請先閱讀背面之注意事項再填寫本頁) > n α ί I ϋ— 一 0, I emae i^i ϋ— It n ¢/ , i Μ請委員明示 年 月 日所提之 釦正私f無變吏If質内容是否准予修正。 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） A7 B7 η 5 9 9 3|twf 1. doc /002 五、發明說明（f) 306a :導通銲墊 308 :開口 308a〜308g ··開口大小 310 :電路接線 312 :節距 314 :全長 320 :偏差量 324 :外層銲墊大小 322 :內層銲墊大小 350 ·•電測超微孔對準度之機構 實施例 請參照第1A圖及第1B圖’其繪示的是依照本發明 之較佳實施例電測超微孔對準度之機構之平面位置示意 圖。 如第1A圖所示，繪示的是電路基板100，例如是印 刷電路板，爲具有高密度內連線（High Density Interconnection，HDI)之產品。此電路基板100之絕緣 芯層可使用樹脂片（Prepreg)製作，例如是以玻璃環氧基 ’U. 樹脂爲材質之FR-4基板、以雙順丁烯二酸醯亞胺 (Bi smal eimide-Tr i azine , BT)樹脂爲材質之BT基板等。 I :: 而絕緣芯層表面還可以積層（bu i 1 d up)多層絕緣層及圖案 化線路層，其中絕緣層之材質包括環氧樹脂（epoxy)、聚 内：， | ,：.亞醯胺（polyiimde)等，而圖案化線路層係由銅箔層經過 t 微影蝕刻而形成。電路基板100在線路區104係用以形成 ;一，，.5-4 〜二 〇 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） —；------------------訂---------^ —Awl (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 經濟部中央標準局員工消費合作社印製 493g^pj 5993t^fl.doc/002 ^ —————Γ4422號說明書修TF苜 B7 修7FR崩91门/?ι 五、發明説明（t) 所需之線路佈局，而線路區104以外之區域爲折斷邊102。 爲了避免作超微孔對準度之測試時損傷線路，故檢測時將 超微孔對準度之測試機構置於折斷邊102，待確定電路板 品質無虞後，可選擇性地裁切掉折斷邊102，而不會影響 電路基板之正常功能。 如第1B圖所示，係爲電測超微孔對準度之機構350 位於折斷邊102內的部分電路板120位置放大圖。 請參照第2A圖至第2E圖，其中第2A圖繪示的是依 照本發明之較佳實施例電測超微孔對準度之機構的俯視 圖；第2B圖繪示對應第2A圖I-Ι剖面的剖面圖；而第2C 圖至第2E圖則繪示各層圖案的平面示意圖。 如第2A圖與第2B圖所示，電測超微孔對準度之機 構建構於電路基板200。其中電路基板200至少包括絕緣 層260、數層圖案化線路層220a、220b、220c、數個外層 銲墊 202a、202b、202c、數個內層銲墊 206a、206b、206c、 以及數個超微孔204，其中絕緣層260與數層圖案化線路 層220a、220b、220c彼此交替疊合，而外層銲墊202a、 202b、202c與內層銲墊206a、206b、206c位於不同之圖 案化線路層220a、220b、220c，且超微孔204分別對應於 外層銲墊 202a、202b、202c 與內層銲墊 206a、206b、206c 之間。銲罩層240覆蓋電路基板200之表面，並暴露出外 層銲墊 202a、202c。 v 形成銲罩層240之材質爲絕緣材料，包括紫外線型 ^ 綠漆及熱硬化型綠漆等，而塗佈綠漆形成焊罩之方法則包 7 I------------#-I (請先閱讀背面之注意事項再填寫本頁) 訂 本紙張尺度適用中國國家標隼（CNS ) A4規格（210X 297公釐） Α7 Β7 修正日期91/3/9Ί 5993t|^fl . doc/〇〇2 ΐΐϋΐ4422號說明書修正苜 五、發明説明（厶） (請先閲讀背面之注意事項再填寫本頁) 括滾筒塗佈法（Roller Coatmg)、簾幕塗佈法（Curtam Coating)、網版印刷法（screerl Printing)、浸染法（Dip) 以及乾膜（Dry Film)形成方法等。例如使用紫外線型綠漆 形成銲罩層240,是先將綠漆塗佈於電路基板2〇〇表面上， 經第一次烤乾、曝光、顯影及第二次烤乾等步驟後，形成 所需之銲罩層240。又例如使用熱硬化型綠漆形成銲罩層 240 ’則是按照所需之銲罩層圖案將綠漆塗佈於電路基板 200表面上’經烤乾使其硬化，即可形成所需之銲罩層24〇。 如第2C圖至第2E圖所示，在第2C圖中圖案化線路 層220a具有之外層銲墊202a與202c分別對應第2B圖中 圖案化線路層220b之內層銲墊206a與圖案化線路層220c 之內層銲墊206c。同理，在第2D圖中圖案化線路層220b 具有之外層銲墊202b亦分別對應第2E圖中圖案化線路層 220c之內層銲墊206b，但在完成定義圖案化線路層22〇b 之同時，必須電測外層銲墊202b與內層銲墊206b間之超 微孔之對準度，其電測原理將於後續說明。若超過三層以 上，其外層銲墊與內層銲墊的對應方式可依此類推。 請參照第3A圖，其所繪示的是依照本發明之較佳實 施例電測超微孔對準度之機構的位置對應圖。 艮消 ，費 i, 容杜: |書: 参日 修所 提 〇之 如第3A圖所示，電測超微孔對準度之機構之全長314 內具有數個外層銲墊302並對應位於另一圖案化線路層之 內層銲墊306。內層銲墊306彼此之間用數個電路接線310 相互串接並電性導通。外層銲墊大小324可以小於或等於 內層銲墊大小322。而部分內層銲墊306中心具有開口 308 本紙張尺度適用中國國家標準（CNS ) A4規格（21〇X297公釐） 4Wi4 搞尤廖孤處 η 5 9 93 rfl.doc/002 A7 B7 經濟部智慧財產局員工消費合作社印製 -.. ^ , si Γ. 煩請委員明示 年 月 日所提之 修正本有無變更實質内容是否准予修i ο 發明說明（q) 並與之互爲同心圓。其中，開口 308之大小可以由右至左 依序遞減，其大小排序比如爲3〇8a > 308b > 308c > 308d > 308e > 308f > 308g 。 而在電測超微孔對準度之機構中至少有兩個內層銲 墊306並無開口以作爲導通銲墊306a。設置導通銲墊306a 目的純粹是爲了了解用雷射形成之超微孔是否有貫穿絕緣 層至內層銲墊306。因爲在製作超微孔時，有可能因雷射 鑽孔機所使用之能量不足，而無法貫穿超微孔，或其他因 素造成超微孔不爲通孔，而影響檢測的正確性。若電測時 導通則可確定其上方具有超微孔，即可往右移動節距312， 繼續進行電測另一孔位組合300以判別超微孔之對準度。 請參照第3B圖與第3C圖，其所繪示的是依照本發 明之較佳實施例電測超微孔對準度之機構的剖面及透視示 意圖。 如第3B圖與第3C圖所示，孔位組合300至少包括： 外層銲墊302、超微孔304、以及內層銲墊306。外層銲墊 302之材質爲導電性材料，比如是銅，並與超微孔304互 爲同心圓。而對應外層銲墊302與超微孔304的是內層銲 墊306。內層銲墊306間藉由電路接線310彼此電性連接， 比如爲共陰極可藉由電路接線310串接後接地。而超微孔 304爲高密度內連線產品中以雷射鑽孔方式形成之穿孔， 丨並鍍有一導電金屬。內層銲墊306更具有開口 308，當超 :微孔304未與內層銲墊306形成電性接觸時，表示超微孔 之位準落於開口 308的範圍內。相反的，當開口 308之邊 9 本紙張尺度適用中國國家標準（CNS)A4規格（21〇 X 297公釐） •--^------------------訂---------線 (請先閱讀背面之注意事項再填寫本頁) 90.ψίί 籀先 η I 9 9 3 rf 1 . doc/ 002 A7 B7 經濟部智慧財產局員工消費合作社印製 嚷ν!ζ!ι;ι:.ι-;:-~4Γν’ι·>κιη·':·'..1:>;ι·ι· :-k>DS40l^;-i^^l]£ 五、發明說明（Ϊ) 緣的內層銲墊306因未對準而與超微孔304接觸時，可電 測出爲導通狀態，此時則可由開口 308之大小推測超微孔 的偏移量，比如開口 308之邊緣至超微孔304之偏差量 320，可作爲判定超微孔304對準度之依據，即爲內層銲 墊306所位於之圖案化線路層與外層銲墊302所位於之圖 案化線路層偏移之差値。 如上所述，其中超微孔304進行鑽孔時，所使用之 雷射包括氣體雷射、固體雷射等，例如二氧化碳雷射（C02 Laser)、i乙銘石榴石雷射（Yttri um-A1 umi num-Garne t Las er, YAG Laser)等，而二氧化碳雷射之波長約爲10.6微米 (Micron)，光束直徑（Beam Size)約爲0.1毫米；釔鋁石 榴石雷射之波長則約爲1,064微米，光束直徑約爲0.05 毫米。 以超微孔之孔徑約0.2毫米、深度約0.2毫米爲例， 於樹脂材料中，形成此種尺寸之超微孔，其所需使用之雷 射脈衝（Pulse)次數約爲8至10個雷射脈衝；而於一般基 板之玻璃纖維材料中，形成上述尺寸之超微孔，其所需使 用之雷射脈衝次數則高達26至30個雷射脈衝。 另外，可用各式量錶或儀器，比如是三用電錶（Electric Meter)、嗡鳴器（Buzzer)，檢測出超微孔是否導通，即可 判定超微孔是否偏移，以獲得對應之對準度，即對應之偏 移量。而在檢測過程中，須特別注意除了在印刷電路板中 的圖案化線路層能有線路外，其餘各層於相同位置處不可 設置任何銅面或線路，及將銲罩層打開。因爲在檢測過程 10 本紙張尺度適用中國國家標準（CNS)A4規格（210 * 297公爱y —,------------------訂---------線 (請先閱讀背面之注意事項再填寫本頁)49_ 狝 像 η 5 9 9 3 t fl.doc / 002 8 9 1 1 4 4 2 2 Description of repair TF this A7 B7 Date of amendment 90/11/9 V. Description of the invention (ί) The invention has The invention relates to a mechanism for electrically measuring the alignment of ultra-micro holes, and more particularly to a testing mechanism for the alignment of printed circuit boards with ultra-micro holes. (Please read the precautions on the back before filling this page) In recent years, in order to respond to the trend of electronic products becoming lighter, thinner, shorter, and smaller, the design and production of wiring on printed circuit boards (PCBs) must also be carried out. Improvement. In order to increase the layout density of the circuit, in addition to miniaturizing the circuit, the hole diameter of the Through Via of the printed circuit board can be reduced to make the operation of the circuit faster and more efficient. In the past, mechanical drilling through holes were used to make through holes on printed circuit boards with a minimum hole diameter of 0.2 millimeters (mm). Due to the limited precision of machining, the hole diameter of the through hole cannot be further reduced, so the purpose of miniaturizing the circuit cannot be achieved. If a high-power laser is used to drill a printed circuit board, the hole diameter of the formed through-hole can be less than 0.2 mm. However, due to the high integration level of electronic component products, the functions are also getting stronger and stronger. The printed circuit boards used to install electronic components have also become more multi-layered from one side and changed from one layer to two layers. For the 6th and 8th floors, repair trouble ^ The Intellectual Property Bureau of the Ministry of Economic Affairs's employee cooperatives printed even more than 10 floors so that electronic components can be more densely mounted on the printed circuit board, so that electronic products occupy Space can be smaller. Therefore, as m ^ I | ... As the number of layers of the multilayer printed circuit board increases, the fgf laser drilling (Laser) applied to the High Density Interconnection 'HDI connected to each layer * Drill) will produce smaller and smaller apertures. If the positions of the holes are slightly shifted, which will affect electrical continuity, the reliability of printed circuit boards will be reduced. 3 of this paper applies to Chinese National Standards (CNS) A4 specifications (210 X 297 mm); Box free J3 gull 5993twfl.doc / 002 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (>) is low, and the production cost is also greatly increased due to the increase of the defective rate Promotion. 7 In the past, microvias (micro vias) already in the circuit board were used to make slices to test the alignment and quality of the ultra microvias. This sampling-type damage detection not only caused the circuit board to be scrapped, but it could not be used. Correct and effective understanding of quality status. Therefore, the present invention is to provide a mechanism for electrically measuring the alignment of ultra-micro holes to detect the alignment of ultra-micro holes and ensure the quality of high-density interconnect products. According to the above and other objectives of the present invention, a mechanism for electrically measuring the alignment of ultra-micro holes is proposed and applied to the alignment test of the ultra-micro holes of a circuit substrate. The circuit substrate includes at least an insulating layer and several layers of patterned circuits. Layer, several outer layer pads, several inner layer pads, and several microvias. The insulation layer and several patterned circuit layers are alternately superposed on each other, and the outer layer pads and the inner layer pads are located in different patterned circuit layers. The ultra-micro holes are located in the insulating layer between the outer pad and the inner pad, and correspond to the outer pad and the inner pad, respectively. There are openings in the center of some inner pads, and the openings correspond to different inner pads and have different diameters. According to a preferred embodiment of the present invention, the mechanism for electrically measuring ultra-micro hole pairs and accuracy of the present invention can use a simple electrical continuity test to obtain the deviation of the hole position generated by the laser 1 'drilling. To monitor the reliability and yield of the product, and to adjust the process parameters in real time to improve production efficiency. And the use of printed i, i [I circuit board broken edges for testing, not only avoids damage to the printed circuit 1 to be tested; board, but also accurately and effectively understand the quality status, so that high-density interconnect production 1 / product reliability Promotion. —Ten, ί 4 This paper size applies to China National Standard (CNS) A4 specification (210 X 297 mm) —j ------------------ Order ----- ---- ^ —Awl (Please read the notes on the back before filling this page) Coupling 5 9 9 3 t rf 1. D (: / 002 A7 B7 V. Description of the invention (,) And other purposes, features, and advantages can be more clearly understood. The following is a detailed description of the preferred embodiments and the accompanying drawings as follows: Brief description of the drawings: Figures 1A and 1B show Schematic plan view of a mechanism for electrically measuring the alignment of ultramicroholes according to a preferred embodiment of the present invention. Figures 2A to 2E show a mechanism for electrically measuring the alignment of ultramicroholes according to a preferred embodiment of the present invention. Section and schematic plan view of each layer. Fig. 3A shows a positional correspondence diagram of a mechanism for electrically measuring the alignment of an ultramicropore according to a preferred embodiment of the present invention. Figs. 3B and 3C show a preferred implementation according to the present invention. Exemplary cross-section and perspective schematic diagram of the mechanism for measuring the alignment of ultra-micro holes by electrical examples. Symbols of the drawings: 100, 200 Circuit board 102: Broken edge 104: Circuit area 120: Department Circuit boards 202a, 202b, 202c, 302: outer pads 204, 304: ultra-micro holes 206a, 206b, 206c, 306. inner pads 220a, 220b, 220c: patterned circuit layer 260: insulating layer 240: solder Cover layer 300: hole combination (please read the precautions on the back before filling in this page) > n α ί I ϋ— 一 0, I emae i ^ i ϋ— It n ¢ /, i Μ, please members to indicate the year and month The deductions made in Japan are not changed. Whether the content is allowed to be revised. Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, Consumer Cooperatives. This paper is printed in accordance with China National Standard (CNS) A4 (210 X 297 mm) A7 B7 η 5 9 9 3 | twf 1. doc / 002 V. Description of the invention (f) 306a: Conduction pad 308: Opening 308a ~ 308g. · Opening size 310: Circuit wiring 312: Pitch 314: Full length 320: Deviation 324: Outer layer pad size 322: Inner layer pad size 350 · • For the embodiment of the mechanism for measuring the alignment of the ultra-micro holes, please refer to FIG. 1A and FIG. 1B ′, which shows a circuit according to a preferred embodiment of the present invention. Schematic diagram of the plane position of the mechanism for measuring the alignment of ultra-micro holes. As shown in FIG. 1A, the circuit substrate 100 is shown. If it is a printed circuit board, it is a product with high density interconnects (High Density Interconnection, HDI). The insulating core layer of this circuit board 100 can be made using a resin sheet (Prepreg), for example, glass epoxy 'U. resin It is made of FR-4 substrate, and BT substrate made of Bismal eimide-Trazine (BT) resin. I :: And the surface of the insulating core layer can also be laminated (bu i 1 d up) with multiple insulating layers and patterned circuit layers, where the material of the insulating layer includes epoxy, poly :, |,:. Amine (polyiimde) and the like, and the patterned circuit layer is formed by copper foil layer through t-lithography etching. The circuit board 100 is used to form the circuit area 104; one ,, .5-4 ~ 20 This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) —; ------- ----------- Order --------- ^ --Awl (Please read the precautions on the back before filling out this page) Intellectual Property Bureau of the Ministry of Economic Affairs Consumer Cooperatives Printed by the Ministry of Economic Affairs Central Printed by the Consumer Bureau of Standards Bureau 493g ^ pj 5993t ^ fl.doc / 002 ^ ————— Γ4422 Specification repair TF alfal B7 Repair 7FR collapse 91 doors /? V. Description of the invention (t) Required circuit layout The area outside the line area 104 is the broken edge 102. In order to avoid damage to the circuit during the test of the alignment of the ultra-micro holes, the test mechanism of the alignment of the ultra-micro holes is placed on the break edge 102. After the quality of the circuit board is determined, the break can be selectively cut off. Side 102 without affecting the normal function of the circuit substrate. As shown in FIG. 1B, it is an enlarged view of a part of the circuit board 120 located in the broken edge 102 of the mechanism 350 for electrically measuring the alignment of the ultramicrohole. Please refer to FIG. 2A to FIG. 2E, wherein FIG. 2A shows a top view of a mechanism for electrically measuring the alignment of an ultramicropore according to a preferred embodiment of the present invention; FIG. 2B shows a corresponding figure 2A of FIG. A cross-sectional view of the section I; and FIGS. 2C to 2E are schematic plan views of each layer pattern. As shown in FIG. 2A and FIG. 2B, a mechanism for electrically measuring the alignment of an ultramicrohole is constructed on a circuit substrate 200. The circuit substrate 200 includes at least an insulating layer 260, a plurality of patterned circuit layers 220a, 220b, and 220c, a plurality of outer pads 202a, 202b, and 202c, a plurality of inner pads 206a, 206b, and 206c, and a plurality of supermicros. Hole 204, in which insulating layer 260 and several patterned circuit layers 220a, 220b, and 220c alternately overlap each other, and outer layer pads 202a, 202b, 202c and inner layer pads 206a, 206b, and 206c are located in different patterned circuit layers 220a, 220b, 220c, and the ultra-micro holes 204 respectively correspond to the outer layer pads 202a, 202b, 202c and the inner layer pads 206a, 206b, 206c. The solder mask layer 240 covers the surface of the circuit substrate 200 and exposes the outer pads 202a, 202c. v The material for forming the solder mask layer 240 is an insulating material, including ultraviolet-type ^ green paint and heat-hardening green paint, etc., and the method of applying a green paint to form a solder mask includes 7 I ---------- -#-I (Please read the notes on the back before filling out this page) The size of the paper used for this edition applies to the Chinese National Standard (CNS) A4 (210X 297 mm) Α7 Β7 Revision date 91/3 / 9Ί 5993t | ^ fl. doc / 〇〇2 ΐΐϋΐ4422 amendments to the alfalfa 5. Description of the invention (厶) (Please read the precautions on the back before filling in this page) Roller Coatmg, Curtain Coating (Curtam Coating) ), Screen printing (screerl printing), dip (Dip), and dry film (Dry Film) forming methods. For example, a UV-type green paint is used to form the solder mask layer 240. The green paint is first coated on the surface of the circuit board 2000. After the first baking, exposure, development, and second baking, etc. Required solder mask layer 240. Another example is to use a thermosetting green paint to form the solder mask layer 240 '. The green paint is applied on the surface of the circuit substrate 200 according to the desired solder mask layer pattern. Cover layer 24. As shown in FIGS. 2C to 2E, the patterned circuit layer 220a in FIG. 2C has outer pads 202a and 202c corresponding to the inner pads 206a and the patterned lines of the patterned circuit layer 220b in FIG. 2B The inner pad 206c of the layer 220c. Similarly, the patterned circuit layer 220b in FIG. 2D has outer pads 202b respectively corresponding to the inner pads 206b of the patterned circuit layer 220c in FIG. 2E, but after completing the definition of the patterned circuit layer 22b, At the same time, the alignment of the ultra-micro holes between the outer pad 202b and the inner pad 206b must be measured electrically. The principle of the electrical measurement will be described later. If there are more than three layers, the correspondence between the outer pads and the inner pads can be deduced by analogy. Please refer to FIG. 3A, which shows a position correspondence diagram of a mechanism for electrically measuring the alignment of an ultramicrohole according to a preferred embodiment of the present invention. Eliminate, Fei, Jun Du: | Book: As shown in Figure 3A, the total length 314 of the mechanism for measuring the alignment of the ultra-micropores has several outer pads 302 and correspondingly located in An inner pad 306 of another patterned circuit layer. The inner pads 306 are connected in series with each other by a plurality of circuit wirings 310 and are electrically conducted. The outer pad size 324 may be less than or equal to the inner pad size 322. And some inner layer pads 306 have openings in the center of 308. This paper size is applicable to Chinese National Standard (CNS) A4 specification (21 × 297 mm) 4Wi4. You Lonely Place η 5 9 93 rfl.doc / 002 A7 B7 Wisdom of the Ministry of Economic Affairs Printed by the Consumer Cooperative of the Property Bureau-.. ^, si Γ. Members are kindly requested to indicate whether there are any changes in the amendments proposed in the year, month, and day. Whether the substance of the amendment is allowed to be repaired i ο Description of invention (q) and concentric circles with each other. Among them, the size of the opening 308 can be sequentially decreased from right to left, and the order of the size is, for example, 308a > 308b > 308c > 308d > 308e > 308f > 308g. In the mechanism for electrically measuring the alignment of the ultra-micro holes, at least two inner layer pads 306 have no openings as the conduction pads 306a. The purpose of providing the conductive pads 306a is purely to understand whether the ultra-micro holes formed by the laser have penetrated the insulating layer to the inner pads 306. Because when making ultra-micro holes, the energy used by laser drilling machines may not be enough to penetrate the ultra-micro holes, or other factors may cause the ultra-micro holes not to be through holes, which will affect the accuracy of detection. If the electrical test is conducted, it can be determined that there is an ultramicro hole above it, and then the pitch 312 can be moved to the right, and another electrical position combination 300 is continued to determine the alignment of the ultramicro hole. Please refer to FIG. 3B and FIG. 3C, which show the cross-section and perspective views of a mechanism for electrically measuring the alignment of ultra-micropores according to a preferred embodiment of the present invention. As shown in FIG. 3B and FIG. 3C, the hole combination 300 includes at least: an outer layer pad 302, an ultra-micro hole 304, and an inner layer pad 306. The material of the outer pad 302 is a conductive material, such as copper, and is concentric with the ultra-micro holes 304. Corresponding to the outer pad 302 and the ultra-micro hole 304 is the inner pad 306. The inner pads 306 are electrically connected to each other through a circuit wiring 310. For example, a common cathode can be grounded after being connected in series through the circuit wiring 310. The ultra-micro hole 304 is a perforation formed by laser drilling in a high-density interconnecting product, and is plated with a conductive metal. The inner pad 306 further has an opening 308. When the ultra-micro holes 304 do not make electrical contact with the inner pad 306, it means that the position of the ultra-micro holes falls within the range of the opening 308. In contrast, when the side of the opening 308 is 9 paper sizes, the Chinese National Standard (CNS) A4 specification (21〇X 297 mm) is applicable. -Order --------- line (please read the precautions on the back before filling in this page) 90.ψίί 籀 先 η 9 9 3 rf 1 .doc / 002 A7 B7 Staff Consumption of Intellectual Property Bureau, Ministry of Economic Affairs Cooperative print 嚷 ν! Ζ! Ι; ι: .ι-;:-~ 4Γν'ι · > κιη · ': ·' .. 1: >; ι · ι ·: -k > DS40l ^;- i ^^ l] £ V. Description of the Invention (Ϊ) When the inner pad 306 of the edge is in contact with the ultra-micro hole 304 due to misalignment, it can be electrically measured to be in a conductive state, and the size of the opening 308 can be inferred The offset of the ultramicro hole, such as the deviation 320 of the edge of the opening 308 to the ultramicro hole 304, can be used as a basis for determining the alignment of the ultramicro hole 304, that is, the patterned circuit layer where the inner pad 306 is located. Offset from the patterned circuit layer where the outer pad 302 is located. As mentioned above, when the ultra-micro holes 304 are drilled, the lasers used include gas lasers, solid lasers, and the like, such as carbon dioxide lasers (C02 Laser), i-tit garnet lasers (Yttri um-A1 umi num-Garne t Laser, YAG Laser), etc., and the wavelength of carbon dioxide laser is about 10.6 microns (Micron), the beam diameter (Beam Size) is about 0.1 mm; the wavelength of yttrium aluminum garnet laser is about 1,064 Micrometer, beam diameter is about 0.05 mm. Taking an ultra-micro hole with an aperture diameter of about 0.2 mm and a depth of about 0.2 mm as an example, the formation of ultra-micro holes of this size in a resin material requires about 8 to 10 laser pulses. The number of laser pulses required to form ultra-micropores of the above size in the glass fiber material of a general substrate is as high as 26 to 30 laser pulses. In addition, you can use various types of gauges or instruments, such as an electric meter and a buzzer, to detect whether the ultra-micro holes are conducting, and then determine whether the ultra-micro holes are shifted to obtain corresponding pairs. Accuracy, which is the corresponding offset. During the inspection process, special attention must be paid to the patterned circuit layer in the printed circuit board. Except that the patterned circuit layer can have circuits, the other layers should not be provided with any copper surface or circuit at the same location, and the solder mask layer should be opened. Because in the testing process, the paper size of this paper applies the Chinese National Standard (CNS) A4 specification (210 * 297 public love y-, ------------------ order ------ ---- Line (Please read the notes on the back before filling in this page)
五 經濟部智慧財產局員工消費合作社印製 修煩 丟請 奎委 事員 無明 f示 j年: 内干: 容 f月 古 ( 准 予日 修所 正提 之 發明說明（1) 中不可以有防銲油墨，以免影響到量測的準確性。 綜上所述，本發明之電測超微孔對準度之機構至少具 有下列優點： 1 .應用本發明可以量測多層印刷電路板（Mul t i -layer Printed Board)，或者是其他具有超微孔之封裝基 板之超微孔對準度。而利用印刷電路板之折斷邊作檢測， 不但免於損壞欲測試之印刷電路板，而且正確及有效的了 解品質狀況，使高密度內連線產品可靠度提昇。 2.本發明係用以量測高密度內連線（Hi gh Dens i ty Interconnection, HDI)產品之超微孔的對準度，可以在 製程中即時監測各層圖案化線路層間的對準度，並即時調 整調整製程參數，以提高製程良率。 3·可用各式量錶或儀器，比如是三用電錶（Eiect ric Meter)、嗡鳴器（Buzzer)，檢測出超微孔是否導通，即可 判定超微孔是否偏移，十分簡易和便利。 雖然本發明已以較佳實施例揭露如上，然其並非用以 限定本發明，任何熟習此技藝者，在不脫離本發明之精神 和範圍內，當可作各種之更動與潤飾，因此本發明之保護 範圍當視後附之申請專利範圍所界定者爲準。 11 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） --»------------------訂---------線 (請先閱讀背面之注意事項再填寫本頁)Five employees of the Intellectual Property Bureau of the Ministry of Economic Affairs, printed the repairs of the consumer cooperative, and asked Kui to appoint the clerk, Wu Ming, to show the year j: Internal cadres: Rong f Yuegu (The invention description granted to the Japanese Repair Institute (1) must not be protected. In order to avoid affecting the accuracy of the measurement, in summary, the mechanism for electrically measuring the alignment of ultra-micropores of the present invention has at least the following advantages: 1. The present invention can measure multi-layer printed circuit boards (Mul ti -layer Printed Board), or the alignment of the ultra-micro holes of other packaging substrates with ultra-micro holes. The use of the broken edge of the printed circuit board for detection will not only avoid damage to the printed circuit board to be tested, but also correct and effective Understanding the quality status improves the reliability of high-density interconnects. 2. The present invention is used to measure the alignment of ultra-micro holes in high-density interconnects (HDI) products. You can monitor the alignment between the layers of the patterned circuits in real time during the manufacturing process, and adjust and adjust the process parameters in real time to improve the yield rate of the process. 3. Various types of meters or instruments can be used, such as a three-purpose meter (Eiect ric Meter) The buzzer can detect whether the ultra-micro holes are conductive or not, which is very simple and convenient. Although the present invention has been disclosed above in a preferred embodiment, it is not intended to limit the present invention. Anyone skilled in this art can make various modifications and retouching without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be defined by the scope of the attached patent application. 11 This paper Standards apply to China National Standard (CNS) A4 specifications (210 X 297 mm)-»------------------ Order --------- line ( (Please read the notes on the back before filling out this page)