TW473949B - Solid-state image sensing device and method of manufacturing the same - Google Patents

Solid-state image sensing device and method of manufacturing the same Download PDF

Info

Publication number
TW473949B
TW473949B TW089115032A TW89115032A TW473949B TW 473949 B TW473949 B TW 473949B TW 089115032 A TW089115032 A TW 089115032A TW 89115032 A TW89115032 A TW 89115032A TW 473949 B TW473949 B TW 473949B
Authority
TW
Taiwan
Prior art keywords
solid
state image
image sensing
transparent substrate
wiring pattern
Prior art date
Application number
TW089115032A
Other languages
English (en)
Chinese (zh)
Inventor
Keiji Sasano
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Application granted granted Critical
Publication of TW473949B publication Critical patent/TW473949B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Wire Bonding (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
TW089115032A 1999-08-03 2000-07-27 Solid-state image sensing device and method of manufacturing the same TW473949B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11219440A JP2001044245A (ja) 1999-08-03 1999-08-03 固体撮像装置及びその製造方法

Publications (1)

Publication Number Publication Date
TW473949B true TW473949B (en) 2002-01-21

Family

ID=16735451

Family Applications (1)

Application Number Title Priority Date Filing Date
TW089115032A TW473949B (en) 1999-08-03 2000-07-27 Solid-state image sensing device and method of manufacturing the same

Country Status (2)

Country Link
JP (1) JP2001044245A (ja)
TW (1) TW473949B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003060114A (ja) * 2001-08-17 2003-02-28 Sony Corp 半導体装置及び固体撮像装置

Also Published As

Publication number Publication date
JP2001044245A (ja) 2001-02-16

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Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees