TW461059B - Package structure and method of chips - Google Patents
Package structure and method of chips Download PDFInfo
- Publication number
- TW461059B TW461059B TW089124335A TW89124335A TW461059B TW 461059 B TW461059 B TW 461059B TW 089124335 A TW089124335 A TW 089124335A TW 89124335 A TW89124335 A TW 89124335A TW 461059 B TW461059 B TW 461059B
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- chip
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- carrier
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Solid State Image Pick-Up Elements (AREA)
Abstract
Description
46 1 0 S946 1 0 S9
五、發明說明α) 本發明為一種 法,特別係指 晶片為 承載.晶 腳,將 之接腳 片之封 下表面 料作為 磁材料 制不當 構無法 生產, 基材下 必須具 連接。 以作為 整之接 影像感測晶片之封裝結構及其封裝方 利用透明膠體作為影像感測器之透光 可與基材一體封裝成形,而可降低生產 層,且該 成本者。 一般 係以陶磁 相互導通 接晶片與 以完成影 像感測晶 此種 型時,必 制,若其 者,該陶 造,無法 再者 板,因此 基材與電 式形成C 其不易得 號傳遞。 另外 以,亦影 再者 種 透明膠體 影像感測 材料作為 之C型接 該基材材 像感測晶 片以基材 以陶磁材 須注意陶 選擇或控 磁基材結 進行大量 ,由於該 ,該接腳 路板之電 字形狀, 到較為平 ,該匚型 響晶片至 ,該光感 了達到散 片之基材 晶片置於 ,而後以 裝,如是 之接腳與 影像感測 成份之選 ,將造成 切割,以 以致其生 表面之接 有較平整 然而,習 基材上、 腳_,而影 熱及高密 ,於該基 基材上, 透光玻璃 ’即可將 電路板形 'ψ· 晶片之基 擇以及_加 該基材變 致於製造 產成本相 腳係'用以 之接觸面 知之接腳 下表面之 響到影像 接腳所形成之電訊號傳遞距離較長,y 基材之訊號傳遞。 測晶片在封裝時’必須以一透光坡璃封 封性之需求, 材周緣形成有 再以導線電連 盖於晶.片上, 封裝完成之影 成電連接。 材’其加工成 工溫度的控 形或龜裂β再 時必須單顆製 當的尚。 電連接於電路 ,方不致影響 係以沖壓之方 接腳,是以, 感測晶片之訊V. Description of the invention α) The present invention is a method, especially referring to the wafer as a load bearing. The pins are sealed with the pins. The lower surface material cannot be produced as a magnetic material. The packaging structure and packaging method of the integrated image sensing chip are as follows. The transparent colloid is used as the light transmission of the image sensor, which can be integrated with the substrate to form a package, which can reduce the production layer and the cost. Generally, ceramics are used to connect the chip with each other to complete the image sensor crystal. It must be made. If the ceramics cannot be used for the board, the substrate and the electric form C, which is not easy to transfer. In addition, Yiying and another type of transparent colloid image sensing material are used as the C type to connect the substrate material to the image sensing wafer. The substrate is made of ceramic magnetic material. Attention should be paid to the selection of ceramic or magnetically controlled substrate knots. Because of this, the The electrical shape of the pin board is relatively flat, the 响 -shaped ring chip is placed, and the light-sensing base wafer that reaches the scattered piece is placed, and then installed, if it is a pin and an image sensing component, Will cause cutting, so that the connection of its raw surface is relatively flat. However, on the base substrate, the feet, and the shadow heat and high density, on this base substrate, the transparent glass can be used to make the circuit board shape 'ψ · wafer. The basic selection and the addition of the base material result in a manufacturing cost phase system that uses the contact surface to understand the lower surface of the pin to the image pin to form a longer signal transmission distance, and the signal transmission of the base material. When testing the chip, it must be sealed with a light-transmissive slope glass. The periphery of the material is formed, and then the wire is electrically connected to the wafer, and the shadow of the package is electrically connected. The material's processing to shape or crack β of the working temperature must then be processed individually. It is electrically connected to the circuit so as not to affect it.
第5頁 461059 使晶片 為不便 發明人 像感測. ,並提 要目的 方法, 的。 一目的 方法, 傳遞之 上述之 金屬片 晶片與 用以將 號,該 片訊號 屬片所 有效縮 號傳遞 以灌模 片得以 生產成 查委員Page 5 461059 Makes the wafer inconvenient for inventor portrait sensing, and provides the purpose method. One purpose method is to transfer the above-mentioned metal sheet wafer and the chip for transmitting the signal. The signal belongs to the effective contraction of the film.
之光訊號由該透光玻璃透 出 B 疋 之精神, 方.法,其 晶片之封 以達到降 晶片之封 之距離, 包括有多 —表面及 成電性連 ,而晶片 透明膠體 與電路板 之距離, 金屬片及 膠體具有 蓋透光居 ’在於 其具有 目.的 目的, ,該每 該等金 該等金. 等金屬 之輸出 形成之 短晶片 。再者 之方式 接收光 屬片之 屬片及 片‘之第 端。 第二接 與電路 ,以透 大量製 訊號, 五、發明說明(2) 盖於晶片.之上, 以’其製造上較 有鑑於此, 研發出本發明影 可降低生產成本 本發明之主 裝結構及其封裝 低生產成本之目 本發明之另 裝結構及其封裝 以達到較佳訊號 是以,為達 數個相互排列之 一第二表面;一 接;一透明膠體 得以接收一光訊 露出,以形成晶 如是,該金 電連接’且亦可 以得到較佳之訊 晶片’是以,可 透光效果,使晶 之製程,以降低 為使 貴審 本於精盈求精、創新突破 ^片之封裝結構及其封褒 南晶片訊號之傳遞。 ,在於提供一種影像感測 其具有大量生產之功效, 提供一種影像感測 縮短晶片訊號傳遞 本發明之特徵在於 一金屬片設有一第 第一表面形 晶.片覆蓋住 二表面則由 點可平整地 板訊號傳遞 明膠體封密 造,且透明 而可簡化封 本 進 步瞭解本發明之創作目的與特The light signal reveals the spirit of B 精神 through the transparent glass. The method is to seal the wafer to reduce the distance of the seal, including multi-surface and electrical connection, and the transparent gel of the wafer and the circuit board. The distance between the metal sheet and the colloid has a light-transmitting cover because it has the purpose of the purpose, the short wafer formed by the output of each of the gold and the metal. The other way is to receive the light of the film and the first end of the film. The second connection circuit is used to transmit a large number of signals. Fifth, the description of the invention (2) is covered on the wafer, and its manufacturing is more in view of this. The development of the invention can reduce the production cost. The main assembly of the invention Structure and packaging for low production cost The additional structure and packaging of the present invention to achieve a better signal is to achieve a number of mutually aligned second surfaces; one connection; a transparent colloid can receive an optical signal to expose In order to form a crystal, if this is the case, the gold electrical connection 'and a better chip can be obtained', so that it can transmit light and make the process of crystal so as to reduce the quality of your trial and make breakthroughs. The package structure and the transmission of the signal of the south chip. It is to provide an image sensor which has the effect of mass production, to provide an image sensor to shorten the signal transmission of the chip. The invention is characterized in that a metal sheet is provided with a first surface-shaped crystal. The sheet covers the two surfaces and can be flattened by dots. The floor signal is transmitted through gelatin, sealed, and transparent, which can simplify the sealing progress. Learn about the creative purpose and characteristics of the present invention.
五、發明說明(3) " ------------- 徵,茲配合圖示說明如下; =一為本發明影像感測晶片之封裝結構的剖示圖。 ^ ^ ^發明影像感測晶片之封裝方法的第一示意圖。 ==^ ^發明影像感測晶片之封裝方法的第二示意圖。 ^ 發明影像感測晶片之封裝方法的第三示意圖。 ^ ^閱圖一,為本發明影像感測器之封裝結構的剖視 ί右ΐ ί括有多數個相互排列之金屬片10,每—金屬片10 :號之面1一2: η之輸入端及-第二表面14作為 承® π9η出為,一汉有稷數個焊墊16之晶片18係設置於一 電22 ^以f ’藉由導線22與每—金屬片10形成電連接,導 Γ面=二:;wire,d)之方式連接於金屬片丄。之第- 片1 〇之第日日* 8之焊塾16上,使晶片18之訊號得傳入金屬 L )。承一Λ面12 ’再.由第二表面14傳遞至電路板(圖未 成,而备20為金屬材質’係與金屬片10 一體I#)笔 當之間隙24金之間及金屬片10與承載器20間留 使每一金屬片10形成電性隔離狀態,而晶片 則係置放於承載器20上。 ' 且透明:膠體26用以將母一金屬片10及晶片18覆蓋住, 20相5 6填充於間隙24内,使每一金屬片1 〇與承戴哭 26露出二乂而每一金屬之第二表面14則由透明膠體 26覆罢付1形成晶片1 8之訊说輪出端。如是’被透明膠體 ;以住=片18得以接收一光訊號,而將訊號由金屬J 弟一表面1 4所形成之輸出端傳遞出。 請參閱圖二,為本發明影像感測晶片之封裝方法的第V. Description of the invention (3) " ------------- Characters are described below with the illustrations; = One is a sectional view of the package structure of the image sensing chip of the present invention. ^ ^ ^ A first schematic diagram of a packaging method for an image sensing chip invented. == ^ ^ The second schematic diagram of the packaging method of the image sensing chip of the invention. ^ The third schematic diagram of the packaging method of the image sensing chip invented. ^ ^ See Figure 1. This is a cross-sectional view of the packaging structure of the image sensor of the present invention. Ϊ́ Right ΐ includes a plurality of metal sheets 10 arranged each other, each of the metal sheet 10: the face of the number 1-12: η input. The end and the second surface 14 act as a bearing π9η. A wafer 18 having a plurality of pads 16 is disposed on an electric 22 ^ f 'is electrically connected to each of the metal pieces 10 through a wire 22, The Γ plane = two: wire, d) is connected to the metal sheet 丄. On the first day of the 10th day * 8 on the welding pad 16, the signal of the wafer 18 can be transmitted to the metal L). Support a Λ plane 12 're. Passed from the second surface 14 to the circuit board (not shown in the figure, and the preparation 20 is made of metal' is integrated with the metal sheet 10 I #) The gap 24 between the gold and the metal sheet 10 and The carrier 20 is left between each metal sheet 10 to form an electrically isolated state, and the wafer is placed on the carrier 20. 'And transparent: the colloid 26 is used to cover the mother-metal sheet 10 and the wafer 18, and 20 phases 56 are filled in the gap 24, so that each metal sheet 10 and the support 26 are exposed, and each metal is exposed. The second surface 14 is covered by a transparent colloid 26 and strikes 1 to form a wafer 18. If it's a transparent colloid; the light can receive a light signal with the chip 18, and the signal is transmitted from the output terminal formed by the metal J surface 1 14. Please refer to FIG. 2, which is a schematic diagram of a packaging method for an image sensing chip according to the present invention.
461059 五、發明說明(4) 一示意圖’首先將複數個金屬片1 〇及承载器2 〇相互排列地 黏設於一膠帶(tape)28上,而膠帶28上具有一用以容置晶 片18之谷置區域3〇 容置區域3〇係用以置放承器2〇之位· Γ置,.而後將膠帶28置放於一鏤空之治具32内:。 請參閱圖三’為本發明影像感測晶片之封裝方法的第 二示意圖,將設有複數個焊墊16(bonding pad)之晶片I8 置於膝》7^28之容置區域30的承載器(carrier) 20上,而後 以打線之方式,將導線22連接於晶片1 8之焊墊i 6及金屬片 1 〇上’使晶片1 8之訊號得以傳輸至金屬片丨〇之第一表面 12 ’再藉金屬片10之第二表面14傳辱至電路板(圖未顯 示)。 一—請參閱圖四,為本發明影像感測晶片之封裝方法的第 二不意圖,將晶片1 8完成打線,使晶片i 8與金屬片} 〇形成 電連,之後,將透明膠體26灌注於治具32内,而將金屬片 、導線22及晶片18包覆住,由於透明膠體“可使光傳遞 至晶片 1 8,使.晶片1 8得以接收先句缺 _ 屬片1 8。最後將膠帶28予以撕除‘成:唬傳、至& “卿内取出,即完成整二成之影像議 1 = ΐ i ^ 發明具有如下之件點 ,較短之傳遞距離,而具有較佳遞::板’可獲 '金屬片1。具有平整之第二表面14,;電路。 之電接觸效果。 ,、電路板形成較佳 土刊 冉予以裁切成單 顆之封骏461059 V. Description of the invention (4) A schematic diagram 'First, a plurality of metal sheets 10 and a carrier 20 are arranged on a tape 28 in a mutually aligned manner, and the tape 28 has a chip 18 for accommodating the wafer 18 The valley setting area 30 containing area 30 is used to place the holder 20 at a position Γ, and then the adhesive tape 28 is placed in a hollowed-out fixture 32 :. Please refer to FIG. 3 ′, which is a second schematic diagram of the packaging method of the image sensing chip of the present invention. The wafer I8 provided with a plurality of bonding pads 16 (bonding pads) is placed on the carrier of the accommodating area 30 of 7 ″ 28 (Carrier) 20, and then wire 22 is connected to the pad i 6 of the chip 18 and the metal sheet 10 by wire bonding, so that the signal of the chip 18 can be transmitted to the first surface 12 of the metal sheet. 'Then pass the second surface 14 of the metal sheet 10 to the circuit board (not shown). I—Please refer to FIG. 4. This is the second intent of the method for packaging an image sensing wafer according to the present invention. The wafer 18 is wire-finished so that the wafer i8 and the metal sheet} are electrically connected, and then the transparent colloid 26 is poured. In the fixture 32, the metal sheet, the wires 22 and the wafer 18 are covered, because the transparent colloid "allows the light to be transmitted to the wafer 18, so that the wafer 18 can receive the first sentence_ belongs to the piece 18. Finally The tape 28 is torn off: into a bluff, go to & "Take out the inside, that is to complete the whole 20% of the video discussion 1 = ΐ i ^ The invention has the following points, a shorter transmission distance, and better Pass :: plate 'can get' metal sheet 1. Has a flat second surface 14; Electrical contact effect. The circuit board formed a better soil journal Ran was cut into a single piece of Feng Jun
3.可同時灌模製造多數個基材 4610593.Can mold multiple substrates at the same time 461059
體’因此,其製造速度快,可降低生產成本。 4·塑膠材質製成之封裝體’其原料成本較陶磁材料低, 使封裝成本大為降低。 以:透明聲激26取我透光玻璃,可簡:化覆、蓋透光破填之 成’且灌注透明膠體26時,可同時製成基材,使其,、生I 產成本大為降低。 何 、版造生 综觀以上說明 確可達到其創作目 利係要件,懇請 利性權,實感德便 圖號說明 ’本發明影像感測器 的及功效,而異有新 鈞局惠予審查,並早 〇 之封裝結構及方法 穎性及進步性之專 曰核予本發明之專 金屬片10 第一表面1 2 第二表面1 4 焊墊 16 晶片 18 承載器20 導線 2 2 間隙 2 4 透明膠體2 6 膠帶 '28 容置區域30 '治具 3 2The body 'therefore has a high manufacturing speed and can reduce production costs. 4. Packaging materials made of plastic material have lower raw material cost than ceramic magnetic material, which greatly reduces the packaging cost. Take: transparent sound excitation 26 to take my transparent glass, can be simplified: cover, cover transparent and fill the gap 'and fill the transparent colloid 26, can be made into a substrate at the same time, so that the production cost is reduce. In summary, He Zaosheng made it clear that the above can clearly meet the requirements of his creative goals. We ask for the right of interest, and the real sense will explain the image and effect of the image sensor of the present invention. The early and early package structure and method of the smart and progressive special metal sheet of the present invention 10 first surface 1 2 second surface 1 4 pad 16 wafer 18 carrier 20 wire 2 2 gap 2 4 Transparent gel 2 6 Tape '28 Receiving area 30 'Fixture 3 2
第9賓No. 9
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TW089124335A TW461059B (en) | 2000-11-16 | 2000-11-16 | Package structure and method of chips |
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