TW461059B - Package structure and method of chips - Google Patents

Abstract

The present invention provides a package structure and a method of chips for image sensor comprising plural metal foils arranged with the first surface and the second surface, a chip electrically connected with the first surface of said metal foils, a transparent colloid to cover said metal foils and chips, which can receive a light signal to form a signal output of the chip to connect with the circuit board by exposing the transparent colloid through the second surface of said metal foils.

Description

46 1 0 S9

V. Description of the invention α) The present invention is a method, especially referring to the wafer as a load bearing. The pins are sealed with the pins. The lower surface material cannot be produced as a magnetic material. The packaging structure and packaging method of the integrated image sensing chip are as follows. The transparent colloid is used as the light transmission of the image sensor, which can be integrated with the substrate to form a package, which can reduce the production layer and the cost. Generally, ceramics are used to connect the chip with each other to complete the image sensor crystal. It must be made. If the ceramics cannot be used for the board, the substrate and the electric form C, which is not easy to transfer. In addition, Yiying and another type of transparent colloid image sensing material are used as the C type to connect the substrate material to the image sensing wafer. The substrate is made of ceramic magnetic material. Attention should be paid to the selection of ceramic or magnetically controlled substrate knots. Because of this, the The electrical shape of the pin board is relatively flat, the 响 -shaped ring chip is placed, and the light-sensing base wafer that reaches the scattered piece is placed, and then installed, if it is a pin and an image sensing component, Will cause cutting, so that the connection of its raw surface is relatively flat. However, on the base substrate, the feet, and the shadow heat and high density, on this base substrate, the transparent glass can be used to make the circuit board shape 'ψ · wafer. The basic selection and the addition of the base material result in a manufacturing cost phase system that uses the contact surface to understand the lower surface of the pin to the image pin to form a longer signal transmission distance, and the signal transmission of the base material. When testing the chip, it must be sealed with a light-transmissive slope glass. The periphery of the material is formed, and then the wire is electrically connected to the wafer, and the shadow of the package is electrically connected. The material's processing to shape or crack β of the working temperature must then be processed individually. It is electrically connected to the circuit so as not to affect it.

Page 5 461059 Makes the wafer inconvenient for inventor portrait sensing, and provides the purpose method. One purpose method is to transfer the above-mentioned metal sheet wafer and the chip for transmitting the signal. The signal belongs to the effective contraction of the film.

The light signal reveals the spirit of B 精神 through the transparent glass. The method is to seal the wafer to reduce the distance of the seal, including multi-surface and electrical connection, and the transparent gel of the wafer and the circuit board. The distance between the metal sheet and the colloid has a light-transmitting cover because it has the purpose of the purpose, the short wafer formed by the output of each of the gold and the metal. The other way is to receive the light of the film and the first end of the film. The second connection circuit is used to transmit a large number of signals. Fifth, the description of the invention (2) is covered on the wafer, and its manufacturing is more in view of this. The development of the invention can reduce the production cost. The main assembly of the invention Structure and packaging for low production cost The additional structure and packaging of the present invention to achieve a better signal is to achieve a number of mutually aligned second surfaces; one connection; a transparent colloid can receive an optical signal to expose In order to form a crystal, if this is the case, the gold electrical connection 'and a better chip can be obtained', so that it can transmit light and make the process of crystal so as to reduce the quality of your trial and make breakthroughs. The package structure and the transmission of the signal of the south chip. It is to provide an image sensor which has the effect of mass production, to provide an image sensor to shorten the signal transmission of the chip. The invention is characterized in that a metal sheet is provided with a first surface-shaped crystal. The sheet covers the two surfaces and can be flattened by dots. The floor signal is transmitted through gelatin, sealed, and transparent, which can simplify the sealing progress. Learn about the creative purpose and characteristics of the present invention.

V. Description of the invention (3) " ------------- Characters are described below with the illustrations; = One is a sectional view of the package structure of the image sensing chip of the present invention. ^ ^ ^ A first schematic diagram of a packaging method for an image sensing chip invented. == ^ ^ The second schematic diagram of the packaging method of the image sensing chip of the invention. ^ The third schematic diagram of the packaging method of the image sensing chip invented. ^ ^ See Figure 1. This is a cross-sectional view of the packaging structure of the image sensor of the present invention. Ϊ́ Right ΐ includes a plurality of metal sheets 10 arranged each other, each of the metal sheet 10: the face of the number 1-12: η input. The end and the second surface 14 act as a bearing π9η. A wafer 18 having a plurality of pads 16 is disposed on an electric 22 ^ f 'is electrically connected to each of the metal pieces 10 through a wire 22, The Γ plane = two: wire, d) is connected to the metal sheet 丄. On the first day of the 10th day * 8 on the welding pad 16, the signal of the wafer 18 can be transmitted to the metal L). Support a Λ plane 12 're. Passed from the second surface 14 to the circuit board (not shown in the figure, and the preparation 20 is made of metal' is integrated with the metal sheet 10 I #) The gap 24 between the gold and the metal sheet 10 and The carrier 20 is left between each metal sheet 10 to form an electrically isolated state, and the wafer is placed on the carrier 20. 'And transparent: the colloid 26 is used to cover the mother-metal sheet 10 and the wafer 18, and 20 phases 56 are filled in the gap 24, so that each metal sheet 10 and the support 26 are exposed, and each metal is exposed. The second surface 14 is covered by a transparent colloid 26 and strikes 1 to form a wafer 18. If it's a transparent colloid; the light can receive a light signal with the chip 18, and the signal is transmitted from the output terminal formed by the metal J surface 1 14. Please refer to FIG. 2, which is a schematic diagram of a packaging method for an image sensing chip according to the present invention.

461059 V. Description of the invention (4) A schematic diagram 'First, a plurality of metal sheets 10 and a carrier 20 are arranged on a tape 28 in a mutually aligned manner, and the tape 28 has a chip 18 for accommodating the wafer 18 The valley setting area 30 containing area 30 is used to place the holder 20 at a position Γ, and then the adhesive tape 28 is placed in a hollowed-out fixture 32 :. Please refer to FIG. 3 ′, which is a second schematic diagram of the packaging method of the image sensing chip of the present invention. The wafer I8 provided with a plurality of bonding pads 16 (bonding pads) is placed on the carrier of the accommodating area 30 of 7 ″ 28 (Carrier) 20, and then wire 22 is connected to the pad i 6 of the chip 18 and the metal sheet 10 by wire bonding, so that the signal of the chip 18 can be transmitted to the first surface 12 of the metal sheet. 'Then pass the second surface 14 of the metal sheet 10 to the circuit board (not shown). I—Please refer to FIG. 4. This is the second intent of the method for packaging an image sensing wafer according to the present invention. The wafer 18 is wire-finished so that the wafer i8 and the metal sheet} are electrically connected, and then the transparent colloid 26 is poured. In the fixture 32, the metal sheet, the wires 22 and the wafer 18 are covered, because the transparent colloid "allows the light to be transmitted to the wafer 18, so that the wafer 18 can receive the first sentence_ belongs to the piece 18. Finally The tape 28 is torn off: into a bluff, go to & "Take out the inside, that is to complete the whole 20% of the video discussion 1 = ΐ i ^ The invention has the following points, a shorter transmission distance, and better Pass :: plate 'can get' metal sheet 1. Has a flat second surface 14; Electrical contact effect. The circuit board formed a better soil journal Ran was cut into a single piece of Feng Jun

3.Can mold multiple substrates at the same time 461059

The body 'therefore has a high manufacturing speed and can reduce production costs. 4. Packaging materials made of plastic material have lower raw material cost than ceramic magnetic material, which greatly reduces the packaging cost. Take: transparent sound excitation 26 to take my transparent glass, can be simplified: cover, cover transparent and fill the gap 'and fill the transparent colloid 26, can be made into a substrate at the same time, so that the production cost is reduce. In summary, He Zaosheng made it clear that the above can clearly meet the requirements of his creative goals. We ask for the right of interest, and the real sense will explain the image and effect of the image sensor of the present invention. The early and early package structure and method of the smart and progressive special metal sheet of the present invention 10 first surface 1 2 second surface 1 4 pad 16 wafer 18 carrier 20 wire 2 2 gap 2 4 Transparent gel 2 6 Tape '28 Receiving area 30 'Fixture 3 2

No. 9

Claims (1)

461059 461059 VI. Application for patent scope d. Fill transparent jelly into the jig, and package the metal sheet, chip and a plurality of wires to form the package of the light sensor; e. Complete the package Take out the photo sensor holder, and remove the tape, and the metal pieces are exposed by the transparent colloid: 7. The packaging method of the image sensing chip as described in item 6 of the patent application scope, The metal wires are electrically connected to a bonding pad and a metal piece of a chip in a wireb οnding manner. 8. The method for packaging an image-sensing chip as described in item 6 of the scope of the patent application, wherein a carrier can be placed in the accommodating area of the tape, and then the wafer is placed on the carrier. . ··· 9. The method for packaging an image sensing chip as described in item 8 of the scope of the patent application, wherein the plurality of metal sheets are made in a single body with the carrier. Page 12