JP2002368949A - Stacked package structure for image sensor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a stacked package structure for an image sensor. SOLUTION: The stacked package structure for the image sensor to be electrically connected to a printed circuit board has a printed circuit board, an integrated circuit and an image sensing chip. The board has a 1st side on which a signal input terminal is formed and a 2nd side on which a signal input terminal and a signal output terminal are formed, and is connected electrically to the printed circuit board. The image sensing chip is electrically connected to the signal input terminal that is placed on the integrated circuit and formed on the board. The integrated circuit is electrically connected to the signal output terminal placed on the 2nd side of the board and formed on the 2nd side of the board. Then a transparent layer covers the image sensing chip, which receives an image signal via the transparent layer and converts the signal into an electric signal transmitted to the board.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a stack package structure of an image sensor, and more particularly, an integrated circuit having different functions and an image sensing chip are packaged in a package body to reduce the number of package substrates. The present invention relates to a structure in which an integrated circuit having different functions and an image sensing chip are integrally packaged.

[0002]

2. Description of the Related Art Generally, a sensor is used for detecting a signal.
It can be an optical or audio signal. The sensor of the present invention receives an image signal and converts the image signal into an electrical signal for transmission to a printed circuit board.

Generally, an image sensor receives an image signal and converts the image signal into an electric signal to be transmitted to a printed circuit board. The image sensor is then electrically connected to another integrated circuit to perform the required functions. For example, the image sensor is electrically connected to a digital signal processor that processes signals generated by the image sensor. In addition, the image sensor also includes a microcontroller,
It is connected to a central processing unit or other circuits and has necessary functions.

However, a traditional image sensor is packaged, and an integrated circuit corresponding to the image sensor needs to be packaged separately from the image sensor. The packaged image sensor and various signal processing units are electrically connected to the printed circuit board. Then, the image sensor is electrically connected to the signal processing unit by a plurality of wires. Therefore, in order to individually package each signal processing unit and the image sensor, it is necessary to use a plurality of substrates and package bodies, thereby increasing the manufacturing cost. Furthermore, the required area of the printed circuit board must be larger than the signal processing unit when each signal processing unit is mounted on the printed circuit board, so that the product cannot be reduced in size, thickness, and weight.

In order to solve the above-mentioned problems, the present invention provides a stack package structure of an image sensor to solve the drawbacks caused by the conventional image sensor.

[0006]

SUMMARY OF THE INVENTION Accordingly, it is a primary object of the present invention to provide a stack package structure of an image sensor, and reduce the number of package elements and the package cost.

Another object of the present invention is to provide a stack package structure of an image sensor to simplify and facilitate a manufacturing process.

It is yet another object of the present invention to provide a stack package structure of an image sensor and reduce the area of an image sensing product.

It is still another object of the present invention to provide a stack package structure of an image sensor, and reduce the package cost and test cost of an image sensing product.

[0010]

According to a first aspect of the present invention, in a stack package structure for electrically connecting an image sensor to a printed circuit board, a first surface on which signal input terminals are formed, a signal input terminal and the printed circuit board. A substrate having a signal output terminal electrically connected to the substrate, and an image sensing chip disposed on the first surface of the substrate and electrically connected to the signal input terminal on the first surface of the substrate. An integrated circuit disposed on a second surface of the substrate and electrically connected to a signal input terminal on the second surface of the substrate, the integrated circuit being a transparent layer, covering the image sensing chip; An image sensing chip receives an image signal through the transparent layer and converts the image signal into an electric signal transmitted to a substrate.
A stack package structure of an image sensor, comprising: the transparent layer. According to a second aspect of the present invention, in the image sensor according to the first aspect, the integrated circuit is a signal processing unit. The invention according to claim 3 is characterized in that the integrated circuit is electrically connected to a signal input terminal on a second surface of the substrate in a flip-chip manner as the stack package structure of the image sensor according to claim 1. I have. The invention according to claim 4 is characterized in that a projection structure is formed on the first surface of the substrate, and a transparent layer is arranged on the projection structure. I have.

[0011]

According to the present invention, a stack package structure of an image sensor for electrically connecting to a printed board includes a board, an integrated circuit, and an image sensing chip. The board has a first surface on which a signal input terminal is formed, and a second surface on which a signal input terminal and a signal output terminal are formed, and is electrically connected to a printed circuit board.
The image sensing chip is located on the integrated circuit and is electrically connected to a signal input terminal formed on a substrate. The integrated circuit is disposed on a second surface of the substrate and is electrically connected to a signal output terminal formed on the second surface of the substrate. Then, the transparent layer covers the image sensing chip, and the image sensing chip receives the image signal through the transparent layer and converts the image signal into an electric signal transmitted to the substrate.

Thus, the image sensing chip of the image sensing product and the integrated circuit are packaged together.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS As shown in FIG. 1, a stack package structure of an image sensor comprises a substrate 10, an integrated circuit 22, an image sensing chip 26, a projection layer 30, and a transparent layer 32.
It has.

The substrate 10 has a first surface 12 and a second surface 14 opposite the first surface 12. First surface 12 of substrate 10
A signal input terminal 16 is formed on the substrate 10 to transmit a signal from the image sensing chip 26 to the substrate 10. A signal input terminal 17 is provided on the second surface 14 for transmitting a signal from the integrated circuit 22 to the substrate 10,
The second surface 14 is further provided with a signal output terminal 18, which is a metal lead frame and is electrically connected to the printed circuit board 20. Thus, the substrate 10
Is transmitted to the printed circuit board 20.

The integrated circuit 22 is a digital signal processor, microprocessor, CPU or similar signal processing unit. The integrated circuit 22 is mounted on the second surface 14 of the substrate 10 and is electrically connected to signal input terminals 17 on the second surface 14 of the substrate 10 via a plurality of wire-bonded wires 24. Thus, the integrated circuit 22 is electrically connected to the substrate 10. A mold resin 25 seals over the integrated circuit 22 to form a plurality of wires 24.
Is protected.

The image sensing chip 26 is mounted on the substrate 10
2 is arranged on the first surface 12 of the substrate 10 and wire-bonded to the signal input terminal 16 of the first surface 12 of the substrate 10.
8 for electrical connection. Thereby, the image sensing chip 26 transmits a signal to the substrate 10. On the other hand, the integrated circuit 22 is a digital signal processor that processes signals from the image sensing chip 26 and transmits the processed signals to the printed circuit board 20.

The projection layer 30 has a frame structure.
0 surrounding the image sensing chip 26.

The transparent layer 32 is a transparent glass covering the projection layer 30 and is disposed on the projection layer 30 to cover the image sensing chip 26. Accordingly, the image sensing chip 26 receives the image signal via the transparent layer 32 and converts the image signal into an electric signal sent to the substrate 10.

FIG. 2 is a sectional view of a second embodiment of the present invention. A cavity 34 is formed in the second surface 14 of the substrate 10, and the signal input terminal 17 of the second surface 14 of the substrate 10 is formed.
Are electrically connected via a plurality of wires 24 by wire bonding. Mold resin 25 is integrated circuit 2
2 is covered to protect the plurality of wires 24. The signal output terminals 18 on the second surface 14 of the substrate 10 are electrically connected to a printed circuit board 20 in the form of metal balls arranged in a BGA format.

The image sensing chip 26 is mounted on the substrate 10
The first surface 12 of the substrate 10 is disposed on the first surface 12 of the substrate 10.
Are electrically connected to a plurality of signal input terminals 16 via a plurality of wires 24 by wire bonding. Therefore, the image sensing chip 26 is electrically connected to the substrate 10 and transmits a signal to the substrate 10.

FIG. 3 shows a flip chip type system.
The bonding pads of the integrated circuit 22 are shown having metal connection points 36 electrically connected to the signal input terminals 17 on the second surface 14 of the substrate 10. Thus, the integrated circuit 22 is electrically connected to the substrate 10. The signal output terminal 18 is a metal ball arranged in a BGA format for electrically connecting to the printed circuit board 20.

The image sensing chip 26 is mounted on the substrate 10
And electrically connected to the signal input terminal 16 of the substrate 10 by wire 24 by wire bonding. Accordingly, the image sensing chip 26 is electrically connected to the substrate 10 and sends a signal to the substrate 10.

The projection layer 30 has a frame structure.
0 on the first surface 12 surrounding the image sensing chip 26.

The transparent layer 32 is a transparent glass, and the projection layer 3
0 and covers the image sensing chip 26. As a result, the image sensing chip 26 receives the image signal via the transparent layer 32 and
Into electrical signals that are transmitted to

[0025]

As described above, the present invention has the following excellent points. 1. Since the image sensing chip 26 and the integrated circuit 22 are integrally packaged, the material for forming the substrate 10 can be reduced, and therefore, the manufacturing cost of the image sensing product can be reduced. 2. Since the image sensing chip 26 and the integrated circuit 22 are integrally packaged, the area of the image sensing product can be reduced. 3. Since the image sensing chip 26 and the integrated circuit 22 are packaged integrally, there is only one package body. Therefore, only one test facility needs to be used, and the test cost can be reduced. 4. Since the image sensing chip 26 and the integrated circuit 22 are packaged integrally, the two chips are packaged by only one packaging process. Therefore, the package cost can be effectively reduced.

The above description relates to the embodiments of the present invention, and does not limit the scope of the present invention. Any modification or alteration of details that can be made based on the present invention is not limited to the scope of the present invention. Shall belong to

[Brief description of the drawings]

FIG. 1 is a view showing a stack package structure of an image sensor according to a first embodiment of the present invention.

FIG. 2 is a view illustrating a stack package structure of an image sensor according to a second embodiment of the present invention;

FIG. 3 is a view showing a stack package structure of an image sensor according to a third embodiment of the present invention;

[Explanation of symbols]

 Reference Signs List 10 substrate 22 integrated circuit 26 image sensing chip 30 projection layer 32 transparent layer 12 first surface 14 second surface 16 signal input terminal 17 signal input terminal 18 signal output terminal 20 substrate 24 wire 28 wire 32 transparent layer 30 projection layer

Continuation of the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat II (Reference) H01L 27/14 H01L 25/14 Z 31/02 H04N 5/335 (72) Inventor Chen Wen Ying Yasukazu Takekita, Hsinchu County, Taiwan No. 84 (72) Inventor What Mengnan No. 84, Taihe Road, Takeboku, Taiwan, Hsinchu County, Taiwan No. 84 (72) Inventor No. 84, Taiwa Road, Takehoku, Taiwan, Hsinchu County, Taiwan No. 84, Taihe Road (72) Inventor Huang Yi Jing, No. 84, Taiwa Road, Takehoku, Taiwan Hsinchu County No. 84, Kazuta, Kitaichi F-term (reference) 4M118 AA10 AB01 BA04 HA02 HA21 HA25 HA30 5B047 BB01 BC01 5C024 CY47 EX21 EX24 EX25 5C051 AA01 BA02 DB01 DB04 DB05 DB06 DB07 DB35 DC01 DC07 DD01 5F088 BA16 BB03 EA04 EA16 JA10

Claims (4)

[Claims] 1. A stack package structure for electrically connecting an image sensor to a printed circuit board, wherein a first surface on which a signal input terminal is formed, and a signal output terminal electrically connected to the signal input terminal and the printed circuit board are provided. A formed substrate; an image sensing chip disposed on a first surface of the substrate and electrically connected to a signal input terminal of the first surface of the substrate; and an image sensing chip disposed on a second surface of the substrate An integrated circuit electrically connected to a signal input terminal on the second surface of the substrate, and a transparent layer covering the image sensing chip, wherein the image sensing chip is connected to the image through the transparent layer. A stack package structure for an image sensor, comprising: a transparent layer for receiving a signal and converting the signal to an electric signal transmitted to a substrate. 2. The stack package structure of claim 1, wherein the integrated circuit is a signal processing unit. 3. The stack package structure of claim 1, wherein the integrated circuit is electrically connected to a signal input terminal on a second surface of the substrate in a flip-chip manner. 4. The stack package structure according to claim 1, wherein a projection structure is formed on the first surface of the substrate, and a transparent layer is disposed on the projection structure.