TW478136B - Stacked package structure of image sensor - Google Patents

Abstract

The stacked package structure of image sensor of the present invention is provided to package the image sensor chip and integrated circuit in the same package simultaneously, which comprises a first substrate; a second substrate is fixed on the first substrate to form a groove with the first substrate; an integrated circuit disposed on the substrate and located in the groove, thereby forming an electrical connection with the substrate; an image sensor chip disposed on the second substrate; a transparent layer for covering the top of the image sensor chip, so that the image sensor chip can receive the image signal through the translucent layer, and convert the image signal into electrical signal to be transmitted to the substrate. Thus the image sensor and the integrated circuit can be integrated and stacked.

Description

478136 V. Description of the invention α) The present invention is a stacked package structure of an image sensor, and particularly refers to a package for integrating integrated circuits and image sensing chips with different functions in a package, which can reduce packaging A substrate and a packager that integrates processing units with different functions and image sensing chips. Press, the general sensor is used to measure a signal, the signal can be a light signal or a sound signal, the sensor in this case is used to receive an image signal, and convert the image signal into an electrical signal and transfer it to the printed circuit board on. Generally, an image sensor is used to receive an image signal, convert the image signal into an electrical signal and transfer it to a printed circuit board, and then electrically connect with other integrated circuits to make it have different functional requirements. For example, it is electrically connected to a digital signal processor to process signals generated by the image sensor, or it can be electrically connected to a microcontroller (CPU) or a central processing unit (CPU). And produce different functional requirements. However, the conventional image sensors are individually packaged. Therefore, various integrated circuits with which they are used must also be separately packaged, and the packaged image sensors and various integrated circuits are electrically connected to the printed circuit board. , And then the electrical connection is integrated and used by wires. In this way, each integrated circuit and the image sensor must be individually packaged using a substrate and a package, resulting in a cost that cannot be effectively reduced. When each integrated circuit is arranged on a printed circuit board, the printed circuit is required. The area of the board must be large, and it cannot meet the requirements of light, thin and short. In view of this, the inventor has invented a stacked package structure of the image sensor of the present invention, which can effectively solve the above-mentioned defects in the use of the image sensor

89043.ptd Page 7 478136 V. Description of the invention (2) Point. The mounting structure of the present invention has the mounting structure of the present invention, which has the mounting structure of the present invention, can reduce the mounting structure of the present invention, and can achieve the above-mentioned purpose of reducing the image sense, and the power test chip and the integrated circuit can be simultaneously sealed. A first substrate provided with a main purpose is to provide an image sensor with the effect of reducing the packaging component, so that the packaging cost is reduced. Another object is to provide a reduced production process of the image sensor to make it easier to manufacture. Furthermore, another object is to provide an area size of a low image sensing product of an image sensor. Another object is to provide a packaging and testing cost of the image sensor. The invention is characterized in that a plate is formed on the second surface of the side; a second base signal output terminal of the first meter is installed in a package body, including a first surface and a first surface formed with the first surface; The signal transmission is used for electrical connection to the input end, and the printed stacked seal reduces the stack seal. The stacking seal is the opposite of the image sensing surface of the second circuit board. The second circuit board is provided with an upper surface and a lower surface, and the lower surface of the second substrate is fixed on the first surface of the first substrate and the first base groove. It is formed on the first surface of the substrate and the signal input end plate of the first surface of the substrate is formed with a recess and a body integrated in the groove and electrically connected; an image sensing chip, It is disposed on the upper surface of the second substrate; and

89043.ptd Page 8 478136 V. Description of the invention (3) A light-transmitting layer covering the image-sensing chip so that the image-sensing chip can receive the image signal through the light-transmitting layer and convert the image signal The electric signal is transmitted to the substrate. If so, the image sensing chip and the integrated circuit can be integrated and stacked to achieve the above purpose. This case can be further understood through the following drawings and detailed description: FIG. 1 is a first embodiment of a stacked package structure of an image sensor of the present invention. FIG. 2 is a second embodiment of a stacked package structure of an image sensor of the present invention. FIG. 3 is a third embodiment of the stacked package structure of the image sensor of the present invention. FIG. 4 is a fourth embodiment of the stacked package structure of the image sensor of the present invention. Please refer to FIG. 1, which is a first embodiment of a stacked package structure of an image sensor of the present invention. The stacked package structure includes: a first substrate 10 provided with a first surface 12 and a first surface 12; The second surface 14 on the opposite side, a signal input terminal 16 is formed on the first surface 12 of the substrate 10, and a signal output terminal 18 is also formed on the second surface 14. The signal output terminal 18 is a ball. A grid array metal ball is used to be electrically connected to the printed circuit board 20 to transmit the signal of the substrate 10 to the printed circuit board 20; a second substrate 22 is provided with an upper surface 24 and a lower surface 26, the second The lower surface 24 of the substrate 22 is fixed on the first surface 12 of the first substrate 10, and a groove 2 8 is formed with the first substrate 10; the integrated circuit 30 is a signal processing unit [such as, Digital Signal Processor, Micro Processor, or Central Processing Unit (CPU), etc.], which is provided on the substrate 10

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V. Description of the invention (4) The first surface 12 is located in the groove 2 8 and is electrically connected to the signal input terminal 16 of the substrate 10 through a wire by means of a metal wire 32. If so, an integrated body The circuit 30 will be electrically connected to the substrate 10, an image sensing wafer 34, which is disposed on the upper surface 24 of the second substrate 22, and is electrically connected to the substrate by a metal wire 36. The signal input terminal 16 of 丨 〇 makes the image sensing chip 26 to be electrically connected to the substrate 10, and transmits the number of the image sensing chip 26 to the substrate 10. If the integrated circuit 30 is a digital signal processor (Digital Signal Processor), it can be used to process the signals of the image sensing chip 34 and pass it to the circuit board 20; a flange layer 38 is frame-shaped The structure is provided on the first surface 12 of the first substrate, and is used to surround the integrated circuit 30 and the image sensing chip 34; and a light-transmitting layer 40, which is a light-transmitting glass, is "Cover on the flange layer" is used to seal the image sensing chip 34 and the integrated circuit 30, so that the image sensing chip 34 can receive the image signal through the light transmitting layer 40 and convert the image signal into telecommunications The number is transferred to the first substrate.

Please refer to FIG. 2 ′, which is a second embodiment of the present invention, wherein the upper surface 24 of the second substrate 22 is formed with a signal input terminal 4 2, and the lower surface 26 thereof is disposed on the first surface of the first substrate 10. 12 and a groove 28 is formed with the first substrate 10, the integrated circuit 3 0 is disposed on the first surface 丨 2 of the first substrate 丨 0 and is located in the groove 2 8 ′ by the metal wire 3 2 is electrically connected to the signal input terminal 16 of the third substrate 10 in a wired manner. The image sensing chip 34 is disposed on the upper surface 2 4 of the second substrate 2 2 and is electrically connected to the signal input of the second substrate 2 4 by a wire through a wire 36.

89043.ptd Page 10 478136 V. Description of the invention Terminal 4 2 and the convex surface 24 are on. The transparent transmission of the image film 3 4 can be transmitted to the second base circuit 30 to receive the video message 4 6 for the chip 34 and the light-transmitting layer. Because the light rate is strong, the circuit 30 can be used as a whole. Use the substrate for the image. ί. The image (5) and the second base edge layer 38 are used to pass the light layer 40 as a sensing wafer through the light-transmitting layer to the second picture 3, and the plate 2 2 is sealed with a number, And see Figure 4. It is fixed to the first integrated circuit to receive the image and the door is transparent, so that the structure on the image is combined with the material plate 22 of the sensing chip 10 to form an electrical connection. The frame structure is arranged on the integrated circuit 30 and the image sensing transparent glass 34, and the integrated circuit 40 receives the image on the substrate 22. Wherein, the light-transmitting surface 24 converts the image-sensing image signal into a light-transmitting layer 40 that is coated on the two substrates 22-30. The gelatin transmissive image sensor chip combination, in this package, 3 4 and the integrated electricity, can effectively reduce its coverage on the road 30, seal the signal, and make the layer 40 transparent and the image sensor chip. 3 4 is transparently switched to the upper surface of the gate-shaped transparent glue for signal signal 2 4 so that the image light layer 40 has a thickness of 3 4 and can receive the image of the image. It has a low-level image sensing second substrate 2 as the road 30 2 The upper wafer 3 4 is surrounded by the flange layer 38, and the image sensor crystal image signal is converted into a colloid, which covers the test wafer 34 and the integrated body passes through the transparent colloid and has a supporting pillar. , And the image sensing chip 3 4 is transmitted through a thinner, so that it transmits a stronger image. The advantages of the test chip 3 4 and the integrated product: combined packaging can reduce the production of the product. The sensor chip 3 4 and the integrated circuit 30 are integrated and packaged, which can reduce the

89043.ptd Page 11 478136 V. Description of the Invention (6). Area of image sensing products. 3. The image sensor chip 34 and the integrated circuit 30 are integrated and packaged. Because there is only one package, only one set of test fixture is needed, which can reduce the test cost. 4. The image sensor chip 34 and the integrated circuit 30 are integrated and packaged, so the two chips need only be packaged in one package, which can effectively reduce the packaging cost. The specific embodiments provided in the detailed description of the preferred embodiments are merely-for easy explanation of the technical content of the present invention, and are not intended to limit the present invention in a narrow sense-to the embodiments. The implementation of various changes in the circumstances is within the scope of the present invention.

89043.ptd Page 12 478136 Brief Description of Drawings Figure 1 shows the first embodiment of the stacked package structure of the image sensor of the present invention. FIG. 2 is a second embodiment of a stacked package structure of an image sensor of the present invention. FIG. 3 is a third embodiment of the stacked package structure of the image sensor of the present invention. FIG. 4 is a fourth embodiment of the stacked package structure of the image sensor of the present invention. The drawing illustrates the first substrate 10 first surface 12 second surface 14 signal input terminal 16 ball grid array metal ball 1 8 printed circuit board 20 second substrate 22 upper surface 24 lower surface 26 groove 2 8 integrated circuit 30 metal wire 32 image sensing chip 34 metal wire 36 flange layer 38 light transmitting layer 40 signal input terminal 42 support post 46

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Claims (1)

478136 VI. Application for patent scope 1. A stacked package structure of an image sensor, which is used to be electrically connected to a printed circuit board, including: a first surface on the side; a first substrate, which is provided with a first A surface and a surface opposite to the first surface, the first surface is formed with a signal input terminal, and the second is formed with a signal output terminal for electrically connecting to a second substrate of the printed circuit, which is provided with an upper surface and a lower surface The lower surface of the second base is fixed on the first surface of the first substrate, and a groove is formed with the first substrate. An integrated circuit is formed in the groove, and the circuit is arranged on the substrate. On the first surface, an electrical connection is formed in parallel with the signal input terminal of the first surface of the substrate, and the sensing crystal is replaced with electricity 2. If applied, its metal ball 3 • If applied, its image sense 4. Such as The image sensing chip is disposed on the upper surface of the second substrate; the light-transmitting layer covers the image-sensing chip so that the image sheet can receive the image signal through the light-transmitting layer and the image signal Signal Transfer to the substrate. In the stacked package structure of the image sensor described in item 1 of the patent, the signal output terminal of the second surface of the first substrate is a ball grid array for electrical connection to the printed circuit board. In the stacked package structure of the image sensor described in the first item of the patent scope, a signal input terminal is formed on the upper surface of the second substrate for electrically connecting the test chip to the signal input terminal. Please stack the package structure of the image sensor described in item 1 of the patent scope 89043.ptd Page 14 478136/3 Amend / Modify / Add Case No. 89128464 ^ Vehicle (> VI. Application for Advising ---- Make 'The image sensor chip is electrically connected to the signal wheel of the first substrate ^ 5 · The stacked package structure of the image sensor as described in item 1 of the scope of patent application, wherein the integrated circuit is a signal processing unit. 6 · The image sense as described in item 5 of the scope of patent application The stacked package structure of the sensor, wherein the signal processing unit is a digital signal processor (Digital Signal 1 P r cess), which is used to process the signal of the image sensing chip. The stacked package structure of the image sensor according to the above item, wherein the signal processing unit is a micro controller. 8 · The stacked package structure of the image sensor according to item 5 of the patent application scope, wherein The signal processing unit is a central processing unit (CPU). 9 · The stacked package structure of the image sensor as described in item 1 of the scope of patent application, wherein the light-transmitting layer is light-transmissive glass. I 0 1 item In the stacked package structure of the image sensor, a flange layer is formed on the peripheral edge of the upper surface of the second substrate, and the light-transmitting layer is disposed on the flange layer. The stacked package structure of the image sensor, wherein the light-transmitting layer is a transparent colloid. Σ 12 · The stacked package structure of the image sensor according to item 11 of the patent application scope, wherein the transparent colloid has an The support frame is used to be fixed on the upper surface of the second substrate. Page 15 20〇〇1.23 · 015