TW498558B - Photodetector structure and the packaging method thereof - Google Patents

Abstract

The present invention are a photodetector structure and the packaging method thereof, which is for receiving the optical signal and converting the optical signal into electrical signal to be transmitted to the circuit board, which comprises: a substrate having a first surface and a second surface, the first surface has a signal input terminal, the second surface has a signal output terminal to be connected to the circuit board; a photodetecting chip disposed on the first surface of the substrate and forming electrical connection with the substrate; a translucent layer bonded to the first surface of the substrate, whose center portion has a concave groove, and the photodetecting chip disposed on the substrate is located in the concave groove of the translucent layer, so that the photodetecting chip can receive the optical signal through the translucent layer. Thus, the receiving function of optical signal is enhanced, the consumed material is saved, so as to reduce the manufacturing cost.

Description

558 V. Description of the invention (1)

The present invention is a light sensing structure and its packaging method. It is an addition (1) of the main case No. 88 1 1 3497 patent, and particularly refers to a kind = more convenient, and can save the amount of materials, and Achieved reduced production ^

Press the button. Generally, a sensor can be used to sense a signal. The signal may be a light signal or a sound signal. The sensor in this case is used to receive a light signal or an image signal. After receiving the optical signal, the optical signal can be converted into an electrical signal through the optical sensing state, and transmitted to the circuit board through the substrate ^, please refer to Figure 1. The package of the conventional optical sensor includes ... A ceramic magnetic material is provided as the substrate 10. The ceramic magnetic material can increase the heat dissipation effect and seal S'birth '. A spacer is provided on the side of the substrate. 2 • The light sensing chip 14 is placed on the substrate 1. 〇, and then place the transparent glass 丨 6 on the spacer =, and cover the light sensing chip 14 to complete the packaging of the light sensor. In order to achieve a good heat dissipation effect and high sealing performance, the above-mentioned conventional light sensor structure and its packaging method are selected as ceramic substrates. Because of its high cost, it must be manufactured in a single piece. It is not easy, which makes the production cost higher.

Therefore, the mother case patent No. 88 1 1 3497 in this case can solve the above-mentioned conventional shortcomings. The mother case includes: a transparent glue 丨 8, a light sensing chip U is disposed under the transparent glue 18, and & A substrate 20, which is placed under the gelatin 18 and the light-sensing wafer i9, so that the light-sensing wafer j9 is packaged between the transparent glue 18 and the substrate 20. If so, the mother case is more convenient in manufacturing , Can reduce the process, and reduce production costs. In order to improve the quality of the package, the present invention is directed to the package.

498558 V. Description of Invention (2) The proposal was improved to make it lower in production cost. The main packaging method of the present invention has one. Another packaging method of the present invention has a cost purpose. To achieve the above purpose, the method includes: forming a first surface of a substrate with better light transmittance and less material usage, and further reducing the purpose of providing a light-sensing high light-receiving rate, and the purpose of the image is to provide a light-sensing The effect of saving material consumption is measured, and the knot of the transmitter reaches the reduced structure and its stronger structure and its low production output. The first system of the substrate is used to glue the groove, and the groove is set in the groove. Make it so, so that it can get a deeper understanding of the invention. Figure 1 is a customary figure. Figure 2 is a master plan. Figure 3 is the present invention. Please refer to the light on the surface of the substrate to sense the light. The light sensor of the present invention is provided with a light sensor. The light sensor of the present invention is provided with a first signal input terminal, which is connected to the circuit board; Below the packaged product, the junction surface of a preferred optical sensor and a second surface sensing chip are electrically connected, and the central chip thereof is located on the light-transmitting layer connected to the thin light-transmitting structure and the second surface of the package side. , Is provided to the system; a transparent layer, formed on a substrate surface, a central portion shaped light-sensing chip receives the light transmissive information located by the transparent layer of the light-transmitting layer thinner reception quality. The drawing and description of the embodiment are sectional views of the structure of the device. Sectional view of the structure of the device. Sectional view of the structure of the tester. The structure of the light sensor of the present invention includes:

Formed with a layer of indentation. Optical signal

_ A substrate 22, which is provided with a first surface 24 and a second surface 26, a signal input terminal 28 is formed at the tenth, and the second surface 26 is formed with a 1 = output terminal 30 for connecting with a circuit board (not shown in the figure) ) Connection, the signal output ★ 3υ is a ball grid array metal ball (Bail Grid Array), a light salt test chip 32 is an image sensor chip, which is provided with an upper surface 'and dead surface%, the upper surface 34 is provided with a plurality of Each pad 38 ·, and the lower surface 36 is adhered to the first surface of the substrate 22 by the spotting layer 40. The first end 44 of the plurality of f wires 42 is electrically connected to the welding pad 38 of the light sensing chip 32, and the second end 46 thereof is electrically connected to the signal input bay 28 of the substrate 22, so that the light sensing chip 32 and the substrate 22 It is electrically connected, and the electric signal is transmitted to the substrate 22. A light-transmitting layer 48 is in the shape of a door, and a groove 50 is formed in a central portion thereof, and pillars 52 are formed around the light-transmitting layer 48 to adhere to the first surface 24 of the substrate 22. An adhesive tape (not shown) is adhered to the substrate 22 and the light-sensing wafer 32 not placed on the substrate 22 is located in the groove 50 of the light-transmitting layer 48, so that the light-sensing wafer 32 can pass through The light transmitting layer 48 receives a light signal. The light-transmitting layer 48 is a transparent colloid and can be made by injection molding or compression molding. If so, a groove 50 is formed in the central portion of the light-transmitting layer 48, so that the light-sensing chip 32 can receive the light signal through the thinner transmissive layer 48 and obtain a better signal transmission. Therefore, in the package structure You can get a better quality. In addition, the gate structure formed by the light-transmitting layer 48 uses less g material, which can effectively save costs. The packaging method of the light sensor of the present invention includes the following steps

Drawing No. illustrates the conventional substrate 10, the spacer 12, the light-sensitive β wafer 1 4 glass, glass 16 mother case transparent glue 18 498558 V. Description of the invention (4) Provide a substrate 22 having a first surface 24 and a 26, the first A surface 24 is formed with a signal input terminal 28, and a second signal output terminal 30 is formed. A light-sensing wafer 32 is provided, which is arranged on the substrate 22 and 24, and a plurality of wires 42 are electrically connected to the substrate 22 to provide a light-transmissive layer 4 with a groove 50 in the central portion of the first surface 24 and an adhesive 24 The light sensor disposed on the substrate 22 is received in the groove 50 of the light transmitting layer 48, so that the light sensor chip 32 can receive the light signal. 'Therefore, it is not necessary to separately manufacture the spacer spacer 12 during the package manufacturing process, and it is better than the conventional ceramic magnetic substrate 丨 package f proposed in the detailed description of the preferred embodiment ^ to explain the invention The technical content is not intended to be an embodiment of the present invention, and implementation of various changes made in accordance with the spirit of the present invention and the following applications is within the scope of the present invention. 3 Light-sensing wafer 1 9 The second surface The first surface formed by the surface 2 6 〇 It is on the substrate 22 The wafer 3 2 is in the right position. ^ The examples are only limited in scope 498558

498558 Brief description of drawings Figure 1 is a sectional view of the structure of a conventional light sensor. Figure 2 is a cross-sectional view of the structure of the mother case light sensor. Figure 3 is a cross-sectional view of the structure of the light sensor of the present invention. Figure No. illustrates a conventional substrate 10, a spacer 12, a light sensing wafer 1 4 glass 16 a mother case transparent glue '18 a light sensing wafer 1 9 a substrate 2 0 a case substrate 2 2 First surface 24 Second surface 26 Signal input terminal 2 8 Signal output terminal 3 0 Photo sensor chip 3 2 Upper surface 3 4 Lower surface 36 Pad 3 3 Adhesive layer 40 498558

Page 11

Claims (1)

498558 Patent application scope 1 · A structure of a light sensor, which is used to receive light signals and convert the light signals into electrical signals and transmit them to the circuit board, including: a substrate, which is provided with a signal input terminal A groove is formed, and a light signal is formed in the groove of the light-transmitting layer. 2. Grid Array on the second surface of the patented substrate (such as the Grid Array on the second surface of the patent application) 〇 3. Photosensitive chip on the patented scope is an image 4. Photometric chip on the patented scope is covered by 5. As the patented light transmission layer It is a door shape 6. · If the patent application scope, the light-transmitting layer is a transparent adhesive 7. If the patent application scope, the light-transmitting layer is a first surface and a second surface, the first surface shape, the second A signal is formed on the surface: a loyal terminal for connecting with the circuit board; a light sensing chip is disposed on the first surface of the substrate to form an electrical connection with the substrate; a light-transmitting layer is used for Adhered to the first surface of the substrate, a central portion of the light sensing chip disposed on the substrate is positioned so that the light sensing chip can receive the light sensor according to item 1 through the light transmitting layer Structure, wherein the signal output end is a ball grid array metal ball (the structure of the light sensor described in Ba 1 1 Item 1, wherein the sensor chip. The structure of the light sensor described in Item 1, The wire is electrically connected to the substrate. The structure of the light sensor, wherein a groove is formed in a central portion thereof. The structure of the light sensor according to item 1, wherein the body. The structure of the light sensor according to item 5, One of the transparent colloids. Page 12 498558 __ Case No. 88113497A01 9 / year is 9 4 Amendment __ VI. Patent application scope 8 · The structure of the light sensor as described in item 1 of the patent application scope, wherein the light transmission with grooves The layers are formed by injection or compression molding. 9. The structure of the light sensor according to item 1 of the scope of the patent application, wherein the light-transmitting layer is adhered to the substrate with an adhesive material or an adhesive tape (Tape). 1 0 · —A method for packaging a light sensor, comprising the following steps: A substrate is provided, the substrate has a first surface and a second surface, the first surface is formed with a signal input terminal, and the second surface is formed There is a signal output terminal; a light sensing chip is provided, which is arranged on the first surface of the substrate to form an electrical connection with the substrate; a light transmitting layer with a groove in the center is adhered to the first of the substrate On the surface, the light-sensing chip disposed on the substrate is located in the groove of the light-transmitting layer, so that the light-sensing chip can receive light signals through the light-transmitting layer. 1 1 · The method for packaging a light sensor as described in Item 10 of the scope of patent application, wherein the signal output end of the second surface of the substrate is a Ball Grid Array 〇1 2 · As applied The packaging method of the light sensor described in the patent item No. 0, wherein the light sensor chip is an image sensor chip. 1 3. The method for packaging a light sensor as described in item No. 0 of the patent application scope, wherein the light sensing chip is electrically connected to the substrate through a wire. 14. The method for packaging a light sensor as described in Item 10 of the scope of patent application, wherein the light-transmitting layer is in the shape of a door, and a groove is formed in a central portion thereof. 1 5 · The method for packaging a light sensor as described in item 1 of the scope of patent application, with 498558 Amendment No. 88113497A01 〒 / June > 7th 6. In the scope of patent application, the transparent layer is a transparent colloid. 16. The method for packaging a light sensor according to item 14 of the scope of patent application, wherein the light-transmitting layer in the shape of a door is a transparent colloid. 1 7. The method for packaging a light sensor as described in item 10 of the scope of patent application, wherein the light-transmitting layer having the groove is formed by injection or compression molding. 1 8. The method for packaging a light sensor as described in item 10 of the scope of patent application, wherein the light-transmitting layer is adhered to the substrate with an adhesive material or an adhesive tape. Page 14