TW503574B - Packaging structure of image sensor and its packaging method of the same - Google Patents

Abstract

nable the image sensor chip to receive image signals via the transparent layer and convert the image signals into electrical signals for being transferred to the printed circuit board via the soft circuit board.

Description

503574 V. Description of the invention (1) The present invention relates to a packaging structure of a wheat image sensor and a packaging method thereof, particularly to a packaging structure of an image sensor made in a flip-chip form, which can simplify the production process. And reduce manufacturing costs. , Press, the general sensor is used to measure a signal, the signal can be a light signal or a sound signal, the sensor in this case is used to receive an image signal, and ^ the image signal is converted into a electrical signal and passed to the printed circuit On the board. Please refer to FIG. 1 for a cross-sectional view of a conventional image sensor, which includes:

There is a substrate 10, which is made of ceramic magnetic material, and has a gas inlet terminal 12 and a signal output terminal 14 at its periphery. The signal output terminal 14 is for electrically connecting the printed circuit board 16. The substrate 10 is formed with a space_8. The spacer 18 is arranged in the upper chamber 20 of the substrate 10; an image sensing wafer 22 is arranged on the substrate 10, and is formed between the substrate i and the spacer 18 In the accommodating chamber 20, a plurality of wires 24 $] = on the signal pads 2 6 of the image sensing chip 2 2 and the signal wheel entry end of the substrate 10, so that the substrate 10 and the image sensing chip 2 2 Form an electrical connection. A transparent glass 28 is fixed on the spacer 18 so that the image sensing chip 22 can receive the image signal through the transparent glass 28 and convert the image signal into an electrical signal and transmit it to the signal input terminal 12 of the substrate 10. The electric signal is transmitted to the signal output terminal 14 through the signal input terminal 12 of the base signal, and the signal output terminal 14 is transmitted to the printed circuit board 16. The package structure of the above-mentioned image sensor has many components and the production process is more complicated. Furthermore, the substrate 10 is made of ceramic magnetic material, and its price is

503574 V. Description of the invention (2) It is quite expensive, and it is difficult to cut the ceramic magnetic material during manufacture, so it must be manufactured separately, and its manufacturing cost is relatively high. In view of this, the inventor has invented the packaging structure and packaging method of the image sensor of the present invention, which can improve the shortcomings of the image sensor, make it more convenient to manufacture, and can greatly reduce the production cost. The main object of the present invention is to provide a packaging structure for an image sensor, which has the effect of reducing packaging components and reducing packaging costs. Another object of the present invention is to provide a method for packaging an image sensor, which has a simplified production process and makes it more convenient to manufacture. In order to achieve the above-mentioned object and effect, the present invention is characterized in that an image sensing chip is directly packaged on a flexible circuit board in a flip-chip manner, without using a substrate as a signal transmission medium, and includes: an image sensing chip A plurality of electronic circuits are formed thereon, and each electronic circuit is provided with a solder pad; a flexible circuit board is provided with an upper surface and a lower surface, and the lower surface is relative to the position of each solder pad of the image sensing chip A signal input terminal is formed to be electrically connected to a corresponding solder pad of the image sensor, and each signal input terminal is electrically connected to a signal output terminal to be electrically connected to the printed circuit board; and a transparent An optical layer covers the upper surface of the flexible circuit board, so that the image sensing chip can receive image signals through the transparent layer, convert the image signals into electrical signals, and transmit the signals to the printed circuit through the flexible circuit board. board. A signal input terminal and a signal output terminal are provided on the signal output terminal, and the signal output terminal is used for electrically connecting the printed circuit board. If so, it can improve the disadvantages of high packaging cost and complicated production of conventional image sensors, and achieve the efficacy and purpose of the present invention.

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The image sensing chip 30 is provided with an upper surface 32 and 34, and a plurality of sub-circuits formed on the upper surface 32 are provided with a solder pad 36, and each solder 38 (Gold Bump). A flexible circuit board 40, which is provided with an upper and lower surface 44 opposite to the image sensor chip 30, and also has an input terminal 46, which is used to be electrically connected to a metal contact 38 on 36. Each signal input is flexible. A central portion of a signal 40 on the lower surface 44 of the circuit board 40 has a signal input terminal which is more than the image sensing chip. 4 6 is a metal contact 3 located at the periphery of the hollow hole 50 0 3 8 when electrically connected to a flexible circuit. The chip 30 can be formed by a hollow slot electronic circuit (not shown in the figure: a surface 4 2 is formed on the 3 6 and each of the bonding pads 36 6-bit image sensing chip terminal 4 6 is electrically connected to the output terminal 48. The soft 30 is The small cutout is exposed when the signal output 50 of the image board 50 is exposed. Each metal connection surface 44 on the lower surface forms a solder joint of 30 formed at the circuit board slot 50 and senses the input end of the chip. 46 A transparent layer 5 2 is transparent glass, which is adhered to the upper surface 4 2 of the flexible circuit board 40, and covers the hollow groove 50 of the flexible circuit board 40, and the image sensing chip 30 can Receive the image signal through the transparent layer 5 2 and send the image signal

89040.ptd Page 7 503574 V. Description of Invention (4) The signal is converted into a signal. Please refer to FIG. 3. When the present invention is packaged, first, the chip 30 is electrically connected to the flexible circuit board 4 in a flip-chip manner, so that its point 38 and the input terminal 46 of the flexible circuit board 40 are electrically connected to each other. Adhesive holds it firmly. Then, the light-transmitting layer 5 2 is filled with an adhesive circuit board 40, and then a packaging layer 56 is used to fill the periphery of the image-sensitive light-transmitting layer 52, and the flexible circuit board 40 and the image sensor are sealed to protect the flexibility. The circuit board 40 and the image sensing chip. If so, the image sensing chip 30 must be connected through the light-transmitting layer 5 2 and convert the image signal into an electrical signal and pass it to the flexible electrical signal input terminal 4 6 ′, and then pass from the signal input terminal 4 6 to the signal. See Figure Fourth, the completed image sensor is placed in the gap 60 formed by the printing, and the signal of the flexible circuit board 40 is connected to the printed circuit board 5 8 so that the image sensor chip layer 5 2 receives the image signal The image signal is converted into a telecommunication signal and transmitted to the signal input terminal 36 of the flexible circuit board 40, and then the signal wheel output terminal 48 of the board 40 is transmitted to the printed circuit board 58. With the combination of the above structures, the image sensing crystal and the packaging method of the present invention have the following advantages: 1. The flexible circuit board 40 is used as the signal of the image sensing chip 30, and the conventional substrate 10 can be omitted. Components can reduce production costs2. As the components of the conventional substrate 10 are omitted, the volume of the shadow package can be light, thin and short. 3. Since the flexible circuit board 40 can be easily cut, the metal on the image sensor can be connected, and it can be connected to the soft test chip 30 and the chip 30 to 30 to 30 to electrically connect the image receiving circuit. Board 4 0 signal output terminal 4 8. Brush the circuit board 5 8 The output end 48 transmits electricity 3 0 After transmitting the light, the electricity passes the package structure of the flexible circuit to transfer the medium, 〇 Multiple images like the sensor

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503574 V. Description of the invention (5) The sensors are packaged at the same time, and then cut into a single package, so its mass manufacturing cost is low. The specific embodiments provided in the detailed description of the preferred embodiments are merely for easy explanation of the technical content of the present invention, and are not intended to limit the present invention to the embodiments in a narrow sense. Various implementations are within the scope of the present invention.

89040.ptd Page 9 503574 Brief Description of Drawings Figure 1 is a sectional view of the package structure of a conventional image sensor. FIG. 2 is a cross-sectional view of a packaging structure of the image sensor of the present invention. FIG. 3 is an exploded view of a packaging structure of the image sensor of the present invention. FIG. 4 is an implementation diagram of the packaging structure of the image sensor of the invention. The drawing illustrates the conventional substrate 10 signal input terminal 1 2 signal output terminal 1 4 circuit board 1 6 spacer 1 8 accommodating chamber 20 image sensor chip 2 2 wire 2 4 solder pad 2 6 transparent glass 2 8 image of the present invention Sensing chip 3 0 upper surface 3 2 lower surface 34 solder pad 36 metal contact 3 8 flexible circuit board 4 0 upper surface 42

89040.ptd Page 10 503574 Brief description of the drawing Lower surface 44 Signal input terminal 4 6 Signal output terminal 4 8 Hollow groove 50 Light transmitting layer 5 2 Adhesive 54 Encapsulation layer 5 6 Printed circuit board 5 8 Notch 60

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Claims (1)

503574 1. An image sensing circuit board, including a package structure of a detector, which is used to be electrically connected to a printed circuit. An image sensing chip is formed with a plurality of electronic circuits, and each electronic circuit is provided with a The circuit board 'is provided with an upper surface and a lower surface. The following table forms a signal output for each pad position of the sensing chip and is connected to a pad corresponding to the image sensor, and each electrical connection. At the output end of a signal wheel, it is used to be electrically connected to the opposite input end of the printed flexible electrical surface. A signal brush circuit and a light-transmitting sensing crystal are converted into 2. As claimed in the 3. As stated in the engraved sheet 4. If you apply it, you can use it as the same as 5. · If you apply it, the softness can be used to input the end plate, and the layer, the sheet can be used for electrical signals, the patented light-transmitting layer, the patented flexible electrical slot, and the image. Patented image-sensing soft electricity Patented image-sensing circuit board covers the upper surface of the flexible circuit board so that the image receives the image signal through the light-transmitting layer and transmits the image signal to the printing through the flexible circuit board Board. The package structure of the image sensor described in the first item of the scope is a transparent glass. The package structure of the image sensor described in the first item of the scope, the circuit board has a hollow slot, and the signal input ends form a margin, so that the flexible circuit board is electrically connected to the image sensing crystal sensing chip by the hollow The groove is exposed. The package structure of the image sensor described in item 1 of Xiaosewei, each of the pads of the test chip is formed with metal contacts, and is electrically connected with the signal input terminal of the circuit board. In the package structure of the image sensor described in the first item of the scope, a sealant layer is formed between the test chip and the light-transmitting layer to seal the electrical connection with the image sensor chip. Page 12 5035 ^ 74 -——? H ^ \ 'yk ^ ΐ ±) 4P l ^ Tnwmlm-A method for packaging an image sensor, which includes the following steps: Provide an image sensing chip with a plurality of An electronic circuit having a solder pad on each of the electronic circuits; a flexible circuit board is provided on which a signal input end is formed corresponding to each of the hard pad positions of the image sensing chip, and the flexible circuit board is provided with a signal input terminal; The signal input terminal is electrically connected to the pad of the image sensing chip; a light transmitting layer is provided to cover the image sensing chip, so that the image sensing chip can receive the image signal through the light transmitting layer. 7. The method for packaging an image sensor as described in item 6 of the scope of the patent application, wherein the flexible circuit board is electrically connected to the image sensing chip and can be fixed by an adhesive. 8 · The method for packaging an image sensor as described in item 6 of the scope of the patent application, wherein the flexible circuit board has a hollow slot, and the signal inputs < the input end is jealous of the peripheral edge of the hollow slot, so that the flexible circuit The board is electrically connected to the image sensor; when the film is filmed, the image sensor chip is exposed through the hollow slot. ~ "Say 9 · The method for packaging an image sensor as described in item 6 of the scope of patent application, wherein a metal < contact is formed at each pad position of the image sensing chip, to communicate with the flexible circuit The signal input terminal of the board is electrically connected. · Use 10. The image sensor described in item 6 of the scope of patent application, wherein the light-transmitting layer is a light-transmitting glass. Go to '11. If the scope of patent application is No. 6 The sealing of the image sensor according to the above item, wherein a sealing rubber is formed between the image sensing chip and the light-transmitting layer, and the electrical connection between the flexible circuit board and the image sensing chip is i for