TWI224841B - Film ball grid array package structure of an image sensor - Google Patents

Abstract

A film ball grid array package structure of an image sensor comprises an image sensing chip, a flexible substrate and a transparent plate. The flexible substrate is having an opening, a first extend portion and a second extend portion. The opening is exposed a sensing plane of the image sensing chip, and a plurality of bumps form surrounding the opening for electrically connecting to bumps of the image sensing chip. The first extend portion and the second extend portion is flex curling and attaching to back surface of the image sensing chip. The transparent plate is corresponding to the opening and disposed the flexible substrate to prevent the mist or dust invading.

Description

1224841 V. Description of the invention (l) [Technical field to which the invention belongs] The present invention relates to a packaging structure of an image sensor, and more particularly to a thin film ball grid array packaging structure of an image sensor. [Prior art] i ° conventional image sensors have an appropriately protected image sensing wafer, such as complementary metal oxide semiconductor [complementaFy Metal

Oxide Semiconductor 'CM0S], usually the image sensing chip is installed in a grooved ceramic substrate or a lead frame or a hard printed circuit board with a pre-mold, and then a The transparent cover is sealed, and the space in which the image sensing wafer is sealed is usually vacuum or filled with an inert gas to prevent moisture or dust particles from entering. A conventional optical device with a tape and reel package, as disclosed in Chinese Patent Publication No. 484237, please refer to FIG. 1. The optical device with the tape and reel package includes a light sensing chip 110 and a soft circuit 13 ′. The soft circuit substrate 120 has an upper surface 121, a lower surface 122, and a window 123. The base 130 has a groove 131 for receiving the light sensing chip 110. The groove 131 corresponds to the The window 123 of the flexible circuit substrate 120 is located below the lower surface 122 of the flexible circuit substrate 120. Moisture or dust particles infringe the light-sensing chip ii 〇, a transparent cover 14 ′ needs to be combined on the dike 132 of the base i. Since the optical device packaged by the tape is provided with the groove 131 to accommodate the light-sensing The wafer 11 is measured, and the base is the factory 13 ", and the transparent cover 140 is closed. The base 130 is filled with a mold > ", which is thicker and thicker than the flexible circuit board 12 (). The thickness of the packaged optical device package cannot be effectively reduced.

1224841 V. Description of the invention of a non-contact-layer film system (2) In addition, the package chip of China's patented image sensor is bonded to a surface-shaped signal input and the signal must be input to an image sensor chip. The printed sheet with electrical openings on the light-transmitting layer that has signal terminals and signal input ends must be transparently prepared to form the announcement No. 459355 structure and its package light-transmitting layer (that is, the transparent input terminal and the signal output terminal. After the connection, the circuit board is brushed, so the light layer side is transmitted to the double-sided electrical transmission method of the double-sided electrical conduction method. The cover is imaged. It is based on the circuit board of the transmission path of the chip layer, and can be used to reveal that an image-sensitive layer is interconnected with the wire and the light-transmitting output end is caused by the The light-transmitting layer is measured on the surface of the glass when the glass is difficult to form. Summary of the invention The main purpose of the present invention is a lattice array packaging structure, which is used to provide a flexible film of an image sensor. An extension portion and a second extension portion, wherein the first extension portion and the back surface are adhered to the base to sense the image of the thin film chip of the image sensor ball grid array package image sensor to replace the image sensing method The hair system includes an image sensing crystal system formed with a plurality of extensions and a measuring surface, and a thin shadow image sensing film of a conventional device for a wafer. The projection wafer has a plurality of convex wafers. The substrate has the opening to display the second extension. The thickness of the protective structure of the image sensing chip is a ball grid array that seals an opening, and an image sensing part is wound to the back of the wafer, and reduces the flexible substrate and a sensing surface and a piece. The second extension portion is flexible, wherein the back surface and the sensing plate have an opening structure, a transparent sheet, a peripheral opening on the measuring surface, and the image sensing.

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The contact pads of the opening of the sensing surface of the day-to-day film are electrically connected to the bumps, and the first extension is attached to the image sensing chip to protect the image sensing chip, and Reduce the thickness of the package structure. In addition, the other ends of the wires and the plurality of external pads are connected to the external pad extensions and the second extensions, and the second extensions are formed with multiple pads. The external pads are planted with a multiple circuit board, and the transparent sheet is a counter substrate to prevent water vapor or dust particles. [Embodiment] A plurality of contact pads are formed around the periphery, and the image sensing chip The parts and the second extension are bent and turned to the back 'to replace the conventional base, and the flexible substrate is formed with a plurality of lines at one end of the flexible film substrate of the image sensor. Contact pads, 'the external pads are provided in a plurality of openings in the first extension of the flexible substrate, to expose the external solder balls for direct assembly outside The opening is fixed to the flexible intrusion.

With reference to the drawings, the present invention will be illustrated by the following embodiments. According to the first specific embodiment of the present invention, please refer to the second item. A thin film ball grid array package structure including a shadow image, a flexible substrate 220, and a transparent sheet 230. The image sensing chip 210 is a charge coupled device (Charged Coupie)

Device, CCD] or a complementary metal oxide semiconductor CCo.ple.entary Metal 0xide Semiconductor >], the image sensing chip 21 has a sensing surface 211 and a back surface 212, and the periphery of the sensing surface 211 A plurality of bumps 213 are formed. The bumps 213 are gold bumps or tin-lead bumps. The flexible substrate 22 is made of a material.

Page 81224841 V. Description of the invention (4) The quality system is polyimide (PI), and its thickness is generally 0.050 mm, 0.038 mm, or 0.025 mm. The flexible substrate 220 It has an opening 221, a first extending portion 222, and a second extending portion 223. The opening 221 exposes the sensing surface 2π of the image sensing chip 2 丨 0, and a periphery of the opening 221 is formed. A plurality of contact pads 224, the contact pads 224 are bonded to the bumps 2 1 3 and are electrically connected to the image sensing chip 2 1 0, preferably, the image sensing chip 2 0 A first sealant 241 is formed on the measurement surface 211 and is a liquid-coated non-conductive adhesive. The first sealant 241 is ring-shaped and is disposed around the sensing surface 21 ι and covers the bumps 213. The stresses of the bumps 2 1 3 and the contacts 2 2 4, the first extending portion 222 and the second extending portion 223 of the flexible substrate 220 are flexed to the back of the image sensing chip 2 1 0 2 1 2, and then use an adhesive layer 250 provided between the back surface 212 of the image sensing chip 21 〇 and the flexible substrate “0” to extend the first extension The extension portion 222 and the second extension portion 223 are attached to the back surface 212 of the image sensing chip 21o. In addition, the flexible substrate 220 is formed with a plurality of lines 2 2 5, and the flexible substrate 2 2 0 is formed with A plurality of lines 2 2 5 and a plurality of external pads 226. One end of the lines 225 is connected to the contact pads 226, and the other ends of the lines 2 2 5 are connected to the external pads 2 2 6 and the external pads. 226 is provided on the first extension portion 222 and the second extension portion 223, and the first extension portion 222 and the second extension portion 223 of the flexible substrate 220 are formed with a plurality of openings 227 to expose The external pads 226, the external pads 2 2 6 are implanted with a plurality of solder balls 2 60, and the first ends 226 and the second ends 227 of the lines 2 2 5 are electrically connected to the The image sensing chip 21-0 and Rongzhi Zhiqiu 2 60 are used to transmit the signal of the image sensing chip 2 1 0 to

Page 9 1224841 V. Description of the invention (5) External circuit board (not shown), in this embodiment, the thickness of the transparent sheet 230 is 0.5 mm, and the transparent sheet 230 corresponds to the flexibility The opening 221 of the substrate 220 is fixed to the flexible substrate 220 with a second sealant 242 provided between the flexible substrate 220 and the transparent sheet 230. The second seal Glue 242 is selected from the group consisting of Photocurab 1 e Paste, B-Stage curing glue and thermal curing glue, and is looped around the opening 2 2 1 of the flexible substrate 2 2 0. Prevent moisture or dust particles from invading, thereby damaging the image sensing chip 21.

The opening 221 of the flexible substrate 220 is used to expose the sensing surface 2 11 of the image sensing chip 2 10, and the first and second extensions 222 and 223 of the flexible substrate 2 2 0 are rolled. It is wound around the back surface 21 2 of the image sensing chip 21 0 and adhered to the back surface 21 2 of the image sensing chip 21 0 to replace the conventional base to protect the image sensing chip 21 0 and reduce the image feeling. The thickness of the thin film ball grid array package structure of the tester.

According to a second embodiment of the present invention, please refer to FIG. 3, a thin film ball grid array packaging structure of an image sensor mainly includes an image sensing chip 310, a flexible substrate 320, and a transparent sheet 33. The image sensing chip 3100 has a sensing surface 3 丨! And a back surface 3 丨 2, a plurality of bumps 313 are formed around the sensing surface 3i, the flexible substrate 320 has an extension 3 21, and the extension 3 21 is bent to the The back surface 31 2 ′ of the image sensing wafer 3 j 〇 is further provided with an adhesive layer 35 between the back surface 3 丨 2 of the image sensing wafer 3 丨 0 and the flexible substrate 320. 321 is attached to the back surface 312 of the image sensing chip 310. The flexible substrate 3 20 is formed with a plurality of contact pads 322, a plurality of lines 323, and a plurality of external pads.

1224841 Five 'invention description (6) 324, the contact pads 322 are connected to the bumps 313, one end of the lines 323 is connected to the contact pads 322, and the other end of the lines 323 is connected to the external Pads 324, and the external pads 324 are disposed on the extension portion 321. In this embodiment, the sensing surface 3 11 of the image sensing chip 3 1 0 is formed with a first sealant 341 and a second sealant. 342, the first sealant 341 covers the bumps 3 1 3 to disperse the stress of the bumps 3 1 3 and the contact pads 322, and the second sealant 342 is provided on the flexibility Between the substrate 32 and the transparent sheet 330, the transparent sheet 330 is fixed on the flexible substrate

3 2 0 ′ to seal the sensing surface 311 of the image sensing chip 31 0 to prevent moisture or dust particles from intruding and damaging the image sensing chip 3 j 〇. The protection scope of the present invention shall be determined by the scope of the appended patent application. Any changes and modifications made by those skilled in the art without departing from the spirit and scope of the present invention shall fall within the protection scope of the present invention. . 1224841 Brief Description of Drawings [Simplified Illustration of Drawings] Figure 1 · = Republic of China Patent Bulletin No. 48423 Sectional Schematic Diagram of Tape and Reel Packaging Device · Figure 2: According to the first of the present invention—the thin film ball grid Array Seal / Image Detector Figure 3: Schematic cross-sectional view of the first seal and structure according to the present invention; and the thin film ball grid array seal ^ = embodiment, a schematic cross-sectional view of a dry package structure of an image sensor. Brief description of component symbols: 11 0 light sensor chip 122 lower surface 132 bank 212 back 2 2 2 first extension 2 2 5 circuit 31 2 back 120 soft circuit board ι21 upper surface 123 window 130 base 131 concave tongue 1 4 0 Transparent cover 210 image sensing chip 211 sensing surface 21 3 bump 2 2 1 opening 224 contacts 塾 227 opening 242 second sealant 220 flexible substrate 2 2 3 second extension 2 2 6 external pad 230 transparent sheet 2 41 first sealant 2 5 0 adhesive layer 260 solder ball 31 〇 image sensing chip 311 sensing surface

Page 12 1224841 Brief description of the drawing 3 1 3 Bump 320 Flexible substrate 321 Extension 322 Contact pad 323 Circuit 324 External pad 330 Transparent sheet 341 First sealant 342 Second sealant 3 5 0 Adhesive layer ί ί

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Claims (1)

1224841 VI. Scope of patent application [Scope of patent application] 1. Thin film ball grid array package structure, including: a surface, which has a sensing surface and a corresponding back to a frame; a plurality of bumps are formed in the periphery; the second extension It has -open °, -first extension, and -testing surface, in which the opening corresponds to the sensor of the image sensor chip. Two contact pads are formed around the two Γ, and these contact pad shirts = ~ The bumps of the shirt-like sensor chip are electrically connected, the first extension = the second extension is flexed and attached to the image-sensing chip of the • transparent sheet, which corresponds to the opening The flexible substrate and a plurality of solder balls are fixed on the first extension and the second extension * Sp 〇2 The film of the image sensor as described in the first scope of the patent application In the ball grid array package structure, a first sealant is formed on the sensing surface of the image sensing chip, and the first sealant is arranged around the sensing surface and covers the bumps. 3. The thin film ball grid array packaging structure of the image sensor as described in item 2 of the patent application scope, wherein the first sealant is a liquid-coated non-conductive adhesive. 4. The thin film ball grid array packaging structure of the image sensor as described in item 1 of the scope of the patent application, further comprising a second sealant, which is arranged at the opening of the flexible substrate, and Flexible substrate and the transparent sheet Page 14 1224841 6. The scope of patent application. 5. The thin film ball grid array packaging structure of the image sensor as described in item 4 of the scope of the patent application, wherein the second sealant is selected from the group consisting of Photocurable Past and B-Stage. Curing glue and heat curing glue. 6. The thin film ball grid array packaging structure of the image sensor according to item 1 of the patent application scope, further comprising an adhesive layer, which is disposed on the back surface of the image sensing chip and the flexible substrate. Between the first extension and the second extension. 7. The thin film ball grid array packaging structure of the image sensor according to item 1 of the scope of the patent application, wherein the flexible substrate is formed with a plurality of lines and a plurality of external pads, and one end of the lines is connected to the The other end of the contact pad is connected to the external pads, and the external pads are disposed on the first extension portion and / or the first extension portion, and the first extension portion and the first extension portion of the flexible substrate. A plurality of openings are formed to expose the external pads. A thin film ball grid array packaging structure for an image sensor, comprising: an image sensing chip having a sensing surface and a corresponding back surface; a plurality of bumps are formed on the periphery of the sensing surface; π λ, ^ flexible substrate, which has an extension, the flexible substrate does not have a plurality of contact pads, and these contact pads are electrically connected to the image sensing chip: Hai: the bump is electrically connected ' The extension is flexed and attached to the image transparent sheet, and ## is fixed to avoid the flexible substrate. 1224841 9 The structure of the "image 1 seal" in item 8 of the patent scope of claim π, wherein the -s-sealant of the image sensing chip covers the bumps. The image sense described in 10 arrays The film ball grid conductivity of the detector = the first sealant is a liquid-coated non-11 sealant, which is disposed in the 12-array package structure, and further includes a first reversible substrate and the transparent sheet. 'The film of the image sensor according to item 丨 丨 of the scope of patent application :: column packaging structure' wherein the second sealant is selected from the group consisting of Photocurable past and B-Stage Cured glue 0 1 3. The thin film ball grid array packaging structure of the image sensor as described in item 8 of the patent application scope, further comprising an adhesive layer, which is disposed on the back surface of the image sensing chip and the Between the extensions of the flexible substrate. 1 4. The thin film ball grid array packaging structure of the image sensor as described in item 8 of the patent application scope, wherein the flexible substrate is formed with a plurality of lines and a plurality of external connections. Pad, one end of the lines is connected to the contacts One end of the plurality of external connection pads, the plurality of external pads are provided on the extension portion. Page 16 ** 丨 -j