TW200509330A - Film ball grid array package structure of an image sensor - Google Patents

Film ball grid array package structure of an image sensor

Info

Publication number
TW200509330A
TW200509330A TW092122846A TW92122846A TW200509330A TW 200509330 A TW200509330 A TW 200509330A TW 092122846 A TW092122846 A TW 092122846A TW 92122846 A TW92122846 A TW 92122846A TW 200509330 A TW200509330 A TW 200509330A
Authority
TW
Taiwan
Prior art keywords
opening
package structure
grid array
image sensor
ball grid
Prior art date
Application number
TW092122846A
Other languages
Chinese (zh)
Other versions
TWI224841B (en
Inventor
Ming-Liang Huang
Vincent Tu
Yau-Rung Lee
Original Assignee
Chipmos Technologies Inc
Chipmos Technologies Bermuda
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chipmos Technologies Inc, Chipmos Technologies Bermuda filed Critical Chipmos Technologies Inc
Priority to TW92122846A priority Critical patent/TWI224841B/en
Application granted granted Critical
Publication of TWI224841B publication Critical patent/TWI224841B/en
Publication of TW200509330A publication Critical patent/TW200509330A/en

Links

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)

Abstract

A film ball grid array package structure of an image sensor comprises an image sensing chip, a flexible substrate and a transparent plate. The flexible substrate is having an opening, a first extend portion and a second extend portion. The opening is exposed a sensing plane of the image sensing chip, and a plurality of bumps form surrounding the opening for electrically connecting to bumps of the image sensing chip. The first extend portion and the second extend portion is flex curling and attaching to back surface of the image sensing chip. The transparent plate is corresponding to the opening and disposed the flexible substrate to prevent the mist or dust invading.
TW92122846A 2003-08-20 2003-08-20 Film ball grid array package structure of an image sensor TWI224841B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW92122846A TWI224841B (en) 2003-08-20 2003-08-20 Film ball grid array package structure of an image sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW92122846A TWI224841B (en) 2003-08-20 2003-08-20 Film ball grid array package structure of an image sensor

Publications (2)

Publication Number Publication Date
TWI224841B TWI224841B (en) 2004-12-01
TW200509330A true TW200509330A (en) 2005-03-01

Family

ID=34568485

Family Applications (1)

Application Number Title Priority Date Filing Date
TW92122846A TWI224841B (en) 2003-08-20 2003-08-20 Film ball grid array package structure of an image sensor

Country Status (1)

Country Link
TW (1) TWI224841B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI395301B (en) * 2005-07-12 2013-05-01 Fairchild Semiconductor Folded frame carrier for mosfet bga

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI395301B (en) * 2005-07-12 2013-05-01 Fairchild Semiconductor Folded frame carrier for mosfet bga

Also Published As

Publication number Publication date
TWI224841B (en) 2004-12-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees