TW200723512A - An image sensor package - Google Patents

An image sensor package

Info

Publication number
TW200723512A
TW200723512A TW094143652A TW94143652A TW200723512A TW 200723512 A TW200723512 A TW 200723512A TW 094143652 A TW094143652 A TW 094143652A TW 94143652 A TW94143652 A TW 94143652A TW 200723512 A TW200723512 A TW 200723512A
Authority
TW
Taiwan
Prior art keywords
image sensor
substrate
sensor package
chip
glass
Prior art date
Application number
TW094143652A
Other languages
Chinese (zh)
Inventor
Ming-Hsiang Cheng
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW094143652A priority Critical patent/TW200723512A/en
Publication of TW200723512A publication Critical patent/TW200723512A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)

Abstract

An image sensor package comprises a substrate, a chip, a glass and a lens module. The substrate has a cavity in an upper surface thereon and the chip sets in the cavity. The glass has a lower surface which is disposed a redistribution layer, and the lower surface electrically connected to the upper surface of the substrate and the chip by way of the redistribution layer. The lens module jointed on the substrate to package the chip and the glass.
TW094143652A 2005-12-09 2005-12-09 An image sensor package TW200723512A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094143652A TW200723512A (en) 2005-12-09 2005-12-09 An image sensor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094143652A TW200723512A (en) 2005-12-09 2005-12-09 An image sensor package

Publications (1)

Publication Number Publication Date
TW200723512A true TW200723512A (en) 2007-06-16

Family

ID=57912268

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094143652A TW200723512A (en) 2005-12-09 2005-12-09 An image sensor package

Country Status (1)

Country Link
TW (1) TW200723512A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI479644B (en) * 2009-04-10 2015-04-01 Hynix Semiconductor Inc Image sensor module
CN106653783A (en) * 2015-11-04 2017-05-10 豪威科技股份有限公司 Wafer level method for encapsulating camera module and related camera module

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI479644B (en) * 2009-04-10 2015-04-01 Hynix Semiconductor Inc Image sensor module
CN106653783A (en) * 2015-11-04 2017-05-10 豪威科技股份有限公司 Wafer level method for encapsulating camera module and related camera module
CN106653783B (en) * 2015-11-04 2021-11-23 豪威科技股份有限公司 Wafer level method for packaging camera module and related camera module

Similar Documents

Publication Publication Date Title
SG148130A1 (en) Cmos image sensor chip scale package with die receiving through-hole and method of the same
WO2008112128A3 (en) Light emitting diode for harsh environments
TW200607028A (en) Image sensor module packaging structure and method thereof
EP2396820A4 (en) Image and light sensor chip packages
TW200727501A (en) Image sensor module and method for manufacturing the same
TW200608499A (en) Sensor package
SG146570A1 (en) Image sensor module having build-in package cavity and the method of the same
TW200634940A (en) Sensor semiconductor device and method for fabricating the same
WO2009041767A3 (en) Led package and back light unit using the same
TW200727461A (en) Semiconductor device and production method thereof
TW200721400A (en) Cavity chip package
TW200618266A (en) Optical device
EP1633002A3 (en) Semiconductor device, semiconductor module, and manufacturing method of semiconductor device
WO2005057672A3 (en) Surface mount light emitting chip package
SG143208A1 (en) Image sensor module
WO2004023564A3 (en) Optoelectronic semiconductor device and method of manufacturing such a device
TW200631188A (en) Optoelectronic package with wire-protection lid
TW200605335A (en) Multi chip image sensor package module
TW200638496A (en) Package structure of photo sensor and manufacturing method thereof
TW200627555A (en) Method for wafer level package
WO2009031258A1 (en) Crystal device and method for manufacturing crystal device
WO2006132795A3 (en) A light-emitting device module with a substrate and methods of forming it
TW200733030A (en) Light source driving device with light sensor module and electronic device using the same
TW200723512A (en) An image sensor package
TW200705964A (en) Solid-state imaging device